JP2006261209A - Collet for sucking component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a suction collet having no risk of interfering with the package side even if the overall size of a device is reduced by forming a package in small size without reducing the size of a component such as a piezoelectric element. <P>SOLUTION: The suction collet 51 for sucking a component 32 to the lower end of the body 52 has a ventilation way 58 penetrating the interior of the body. Lower end face of the body where the ventilation way opens is a predetermined open face defined by a plurality of inclining faces 54, 54 and 57, 57. The body is provided with an outline removing portion 56 such that at least a part of the outer circumference of the body is arranged on the inside of the outer edge of the component at at least the lower end of the body under a state where the component 32 is sucked to the lower end of the body. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an adsorption jig for adsorbing a component as a workpiece in a component mounting process or the like, and more particularly to an adsorption jig for a component suitable for transferring a component to a narrow housing portion in a package. is there.

In recent years, piezoelectric devices in which a piezoelectric element such as a piezoelectric vibrating piece or a surface acoustic wave chip is housed in a package have been widely used in electronic parts and communication parts such as a mobile phone and a television receiver. Such a piezoelectric device employs a structure in which a piezoelectric element is accommodated in a rectangular package and hermetically sealed.
In the manufacturing process of such a piezoelectric device, when an electronic component such as a piezoelectric element is accommodated and fixed in a package, a component suction jig called “collet” is used (Patent Document). 1).

FIG. 11 is a schematic plan view of a conventional piezoelectric device 1, showing an example in which a piezoelectric device is accommodated by forming a package that is substantially the same as the package of the piezoelectric device described in Patent Document 1 into a small size.
In the figure, the piezoelectric device 1 is an example in which a surface acoustic wave device (SAW (Surface Acoustic Wave) device) such as a resonator or a bandpass filter is configured.
This piezoelectric device accommodates, for example, a surface acoustic wave chip 5 which is a piezoelectric element in a rectangular accommodating portion 3 formed in a ceramic rectangular package 2.
The surface acoustic wave chip 5 has a pair of interdigital electrodes or comb electrodes (hereinafter referred to as “IDT (Inter Digital Transducer)”) 6, 6 and IDTs 6, 6 on one side (active surface) of the piezoelectric substrate 8. Reflectors 7, 7 are formed so as to be sandwiched from each other.

As shown in FIGS. 11 and 12, step portions 4 and 4 extending in the length direction of the accommodating portion 3 are formed at both ends in the width direction of the rectangular accommodating portion 3 of the package 2. The upper surfaces of the portions 4 and 4 are divided into several parts as shown in FIG.
The electrode pads of the step portions 4 and 4 can be connected to the terminals of the IDTs 6 and 6 of the surface acoustic wave chip 5 by wire bonding.
As a result, a drive voltage is applied from the external terminal (not shown) of the package 2 to the electrode pads of the step portions 4 and 4 and transmitted to the IDTs 6 and 6.

Here, in the manufacturing process of the piezoelectric device 1, when the surface acoustic wave chip 5 is bonded to the housing portion 3 of the package 2, an adhesive or the like is applied to the exposed bottom portion inside the housing portion 3, The surface acoustic wave chip 5 is placed from above and the adhesive is cured.
In order to transfer the surface acoustic wave chip 5 in order to accommodate the surface acoustic wave chip 5 in the package 2, a collet 10 as a suction jig as shown in FIG. 12 is used.
The collet 10 is for adsorbing and holding the surface acoustic wave chip 5 at the lower end of the main body 11 with a negative pressure. As described above, the surface acoustic wave chip 5 is provided on one surface (active surface) of the piezoelectric substrate. Since an electrode such as IDT is formed on the surface of the piezoelectric element, if the main body 11 is in contact with the upper surface of the piezoelectric element, the electrode may be damaged.

Therefore, in the collet 10, the main body 11 has the following structure.
That is, the air passage 12 extends in the vertical direction inside the main body 11 and sucks air in the direction of the arrow. An opening 13 of the air passage 12 is formed at the lower end of the main body 11 so that the surface acoustic wave chip 5 is adsorbed to the lower end of the main body 11.
The lower end of the main body 11 is not a horizontal surface but inclined surfaces 14, 14, and the inclined surfaces 14, 14 come into contact with the ridge portion at the upper end of the surface acoustic wave chip 5 to be attracted. The electrode part is not damaged.

JP 2001-257221 A

By the way, in recent years, the piezoelectric device 1 has been reduced in size and thickness, and the size of the package for accommodating the piezoelectric element has been 3.8 mm × 3.8 mm, which was conventionally about 4.8 mm × 5.2 mm. There is a demand for further downsizing.
For this reason, as described above, when the piezoelectric element is accommodated in the accommodating portion 3 of the package 2 using the collet, the following restrictions are generated.

That is, even if the package size is reduced, it is difficult to easily reduce the size of the piezoelectric element such as the surface acoustic wave chip or the piezoelectric vibrating piece described above.
For example, since the number of comb-shaped electrode fingers of IDTs 6 and 6 is determined by the frequency, the surface acoustic wave chip 5 is difficult to reduce the dimension in the chip length direction.
In particular, in the configuration of FIG. 11 and FIG. 12, stepped portions 4, 4 project inward from the wall surface of the package in the accommodating portion 3 of the package 2.
For this reason, as shown in FIG. 12, if there is a protruding portion at the lower end of the collet 10 as indicated by the symbol K <b> 1, there is a possibility of interfering with the stepped portion 4.
Therefore, when the size of the package 2 is further reduced, the clearance becomes smaller than that in the case of FIG. 12, so that the conventional suction jig interferes with the package side and cannot be used.

  The object of the present invention is to solve the above-mentioned problems and to interfere with the package side even if the package is formed in a small size without downsizing parts such as a piezoelectric element and the entire device is downsized. It is to provide a suction jig without the above.

According to the first aspect of the present invention, there is provided a component adsorption jig for adsorbing a component to the lower end of the main body, and having a ventilation passage penetrating through the inside of the main body. In the state where the lower end surface where the air passage opens is a predetermined opening surface composed of a plurality of inclined surfaces and the component is adsorbed to the lower end of the main body, at least the lower end portion of the main body This is achieved by the component suction jig provided with the outer shape removing portion in the main body so that at least a part of the outer periphery is disposed inside the outer edge of the component.
According to the configuration of the first invention, the suction jig of the present invention sucks air through an air passage that penetrates the main body, and sucks and holds the part to be sucked on the lower end of the main body by negative pressure. Since the lower end surface of the main body is not a horizontal surface but an open surface formed by a plurality of inclined surfaces, the lower end surface of the main body does not contact the surface of the component and is held in contact with the ridge portion of the component. For this reason, the electrode on the surface of the component is not damaged. Moreover, in the suction state of the component, at least a part of the lower end of the main body is the outer shape removal portion, and is disposed inside the outer edge of the component, so when the main body enters the package housing portion or the like Even if there is not enough clearance around, there is no interference with the package side.
Thus, it is possible to provide an adsorption jig that does not interfere with the package side even if the package is formed in a small size without reducing the size of components such as piezoelectric elements and the entire device is downsized. .

According to a second aspect of the present invention, in the configuration of the first aspect, the component adsorption jig is a jig that adsorbs a piezoelectric element and transfers it to a package. It is formed corresponding to a step portion for providing an electrode pad in the package.
According to the configuration of the second invention, when the component is mounted in the package, the outer shape removing portion of the main body of the suction jig is provided corresponding to the step portion even if the step portion is formed in the package. If it is, it will not interfere with the stepped portion protruding inside the package.

According to a third aspect of the present invention, in the configuration of the second aspect, the component suction jig is a jig for transferring the piezoelectric element into the rectangular accommodating portion of the package, and the main body is formed in a substantially rectangular shape. The outer shape removing portion is formed in at least a pair of diagonal positions of the lower end portion of the main body.
According to the configuration of the third invention, the outer shape removing portion is formed at least a pair of diagonal positions of the lower end portion of the rectangular main body of the suction jig. For example, when projecting portions such as steps in the package are combined, the main body can suck the components and enter the package without interfering with the package side.

According to a fourth aspect of the invention, in the configuration of the third aspect of the invention, the outer shape removing portion is formed at each corner of the lower end portion of the main body.
According to the configuration of the fourth aspect of the invention, by forming the outer shape removing portion not at each corner of the rectangular main body of the suction jig, the main body can be prevented from further interfering with the package side.

According to a fifth aspect of the present invention, in the configuration of the second aspect, the component suction jig is a jig for transferring the piezoelectric element into the rectangular accommodating portion of the package, and the main body is formed in a substantially rectangular shape. The outer shape removing portion is formed in an intermediate portion between a pair of opposite sides of the lower end portion of the main body.
According to the configuration of the fifth invention, even if the stepped portion is formed and protruded in the vicinity of the middle of the rectangular accommodating portion of the package, the middle portion of the pair of opposite sides of the lower end portion of the main body of the suction jig is By forming the outer shape removing portion, the stepped portion of the package and the main body do not interfere with each other.

FIG. 1 is a schematic plan view with a lid removed showing an embodiment of a piezoelectric device as an object to be manufactured using a suction jig, which will be described later, according to an embodiment of the present invention, and FIG. It is a line cut end view, and a lid is added.
As shown in these drawings, the piezoelectric device 30 includes a surface acoustic wave chip 32 as a piezoelectric element that is a component housed in a rectangular package 31 that is a housing. As shown in FIG. 1, the surface acoustic wave chip 32 includes a piezoelectric substrate 37, IDT electrodes 35 and 35 of IDT (comb-shaped electrodes) which are interdigital electrodes, and a reflector.

1 and 2, a package 31 is a box-shaped container formed by, for example, molding a ceramic green sheet that is an insulating material.
Specifically, as shown in FIG. 2, a plurality of substrates obtained from green sheets, in this embodiment, a first substrate 41, a second substrate 42, and a third substrate 43 are stacked in order from the bottom. After that, it is formed by sintering.
The package 31 has a rectangular accommodating portion 38, and a lid 39 is joined to the upper end of the package 31 via a seam ring 47 and hermetically sealed.
Electrode pads 34, 34 are formed on the stepped portions 33, 33 formed on the inner periphery of the package 31 by a method such as forming a film made of a conductive metal. The electrode pads 34, 34 are For example, it is connected to mounting electrodes 45 and 45 (external electrodes) formed to be exposed on the bottom surface of the package 31 through conductive through holes or the like.

As shown in FIG. 2, the surface acoustic wave chip 32 as a component is bonded to the inner bottom surface of the rectangular accommodating portion 38 of the package 31 using, for example, an adhesive 46. The electrode terminals 35a and 35a of the surface acoustic wave chip 32 are electrically connected to the electrode pads 34 and 34 of the package 31 by wire bonding as illustrated.
As shown in FIGS. 1 to 3, stepped portions 33 and 33 are formed in a rectangular accommodating portion 38 by a second substrate 42 of the laminated substrates.

That is, the rectangular accommodating portion 38 is formed by removing the material inside the second substrate 42 and the third substrate 43. In this case, with respect to the second substrate 42, step portions 33 and 33 are formed at one diagonal portion (diagonal position) of the rectangular accommodating portion 38.
For this reason, as shown in FIG. 1, in the rectangular accommodating portion 38 of the package 31, when the piezoelectric element 32 is accommodated, the clearance C <b> 1 is extremely small at a location close to the stepped portion 33.

In such a case, the suction jig of the present embodiment can suitably transfer the piezoelectric element 32 that is a suction target component.
As shown in FIG. 3, the collet 51 serving as a suction jig is rotated in the direction indicated by the arrow B in a state where the piezoelectric element 32 is sucked. After the orientation of the element 32 is adjusted, the element 32 is lowered and mounted on the adhesive 46 described with reference to FIG. 2, and the adhesive is cured to be joined.
Thereafter, as described above, the terminal portions 35a and 35a of the IDT of the piezoelectric element 32 are electrically connected to the electrode pads 34 and 34 of the step portions 33 and 33 on the package side by wire bonding. After the adhesive is cured, after the piezoelectric element 32 is mounted, the lid 39 of FIG. 2 is airtightly bonded, for example, in a nitrogen atmosphere.

Here, in the above process, the collet 51 as the first embodiment of the suction jig for sucking the piezoelectric element 32 is configured as shown in FIG.
Here, as described with reference to FIG. 1, the piezoelectric element 32 is cured so as to be in contact with or in contact with the active surface because an electrode such as IDT is formed on the active surface of the piezoelectric substrate 37. If the tool is used, the electrode of the piezoelectric element 32 is damaged.
Therefore, the collet 51 is configured to come into contact with the outer peripheral ridge of the rectangular piezoelectric element 32.

A schematic perspective view of the collet 51 of the first embodiment is shown in FIG.
In the figure, a collet 51 includes a rectangular body made of, for example, a metal such as super steel or cemented carbide (such as a Wc-Co alloy), that is, a polygonal main body 52 and a vent pipe 53 connected to the center of the main body 52. And a vent path 58 that communicates with the vent pipe 53 and penetrates the main body 52 in the vertical direction and has an opening 59 at the bottom of the main body 52. A vacuuming means such as a vacuum pump is connected to the other end of the vent pipe 53.
Furthermore, a plurality of inclined surfaces are formed on the bottom of the main body 52.
Of these, the inclined surfaces 54, 54 are arranged such that the upper sides thereof are the positions of the openings 59, respectively, and reach the respective lower sides while being gradually inclined in directions away from each other along the width direction of the main body 52.
The inclined surfaces 57 and 57 have upper ends at the height of the opening 59, respectively, and are configured to reach the respective lower sides while being gradually inclined in directions away from each other along the length direction of the main body 52. As a result, the lower end surface of the main body 52 has a concave central portion, that is, a high position in FIG. 3, and is an open surface that protrudes downward toward the periphery.
In addition, the pair of diagonal portions at the lower end of the main body 52 are cut off obliquely to form chamfered portions or outer shape removing portions 56 and 56 from which portions protruding as outer shapes are removed. In FIG. 3, for convenience of understanding, a portion indicated by a chain line is a region virtually showing a region removed from the main body 52 based on a rectangle.

Thus, the collet 51 forms a negative pressure region around the opening 59 at the lower end of the main body 52 by sucking air from the ventilation path 58 via the ventilation pipe 53. As a result, the piezoelectric element 32 is adsorbed to the lower end of the main body 52. At this time, the lower surface of the main body 52 is formed by a plurality of inclined surfaces 54, 54, 57, 57 that are inclined inward toward the central portion. The piezoelectric element 32 does not come into contact with or come into contact with the active surface which is the upper surface in the drawing.
That is, the lower side portion of each inclined surface is in contact with the ridge line portion of the outer edge of the piezoelectric element 32, so that the electrode such as IDT formed on the active surface of the piezoelectric element 32 is not touched and is damaged. There is no fear.

In addition, the pair of diagonal portions at the lower end of the main body 52 are cut off obliquely to form an outer shape removing portion or chamfered portions 56, 56, so that the diagonal portions protrude outward from the piezoelectric element 32. There is nothing to do.
Therefore, as can be understood from FIG. 3, the front-side outer shape removing portion 56 in the figure of the main body 52 is positioned with respect to the step portion 33 protruding in the rectangular accommodating portion 38 of the package 31. There is no interference with the step 33. In this manner, the collet 51 does not protrude outside the piezoelectric element 32 that is the adsorbed component at the location where the package 31 has only the narrow clearance C1 described with reference to FIG. The piezoelectric element 32 can be suitably accommodated in the rectangular accommodating portion 38 of the package 31 without any problem.
Thus, according to the first embodiment, the collet 51 avoids the stepped portion 33 protruding into the package 31 even when the package 31 is downsized without reducing the piezoelectric element 32 as a component. The piezoelectric element 32 can be transferred.

FIG. 4 shows a second embodiment of the suction jig.
FIG. 4A is a schematic plan view of a collet 51-1 as the second embodiment, FIG. 4B is a schematic front view thereof, FIG. 4C is a schematic bottom view thereof, and FIG. Is a schematic side view thereof.
In the figure, the collet 51-1 is similar to the collet 51 described with reference to FIG. 3, and the same components are denoted by the same reference numerals, and redundant description is omitted.

This collet 51-1 is different from the collet 51 in FIG. 3 in the number of inclined surfaces constituting the lower end surface of the main body 52. That is, the collet 51 in FIG. 3 has two or more types of inclined surfaces (inclined surfaces 54, 57, etc.), whereas in this collet 51-1, the lower end surface of the main body 52 is an inclined surface in two pairs. 54, 54 only.
Therefore, as shown in FIG. 4 (d), the collet 51-1 has a large side surface portion of the main body 52. Therefore, the possibility of interference is reduced accordingly. Except for such effects, the collet 51-1 can exhibit the same effects as those of the first embodiment.

Next, a suction jig according to a third embodiment suitable for manufacturing the piezoelectric device 30-1 as shown in FIG. 5 will be described.
The piezoelectric device 30-1 in FIG. 5 has substantially the same configuration as the piezoelectric device 30 in FIG. 1, and the portions denoted by the same reference numerals have a common configuration. The piezoelectric device 30-1 in FIG. 5 differs from the piezoelectric device 30 in FIG. 1 in the case of the piezoelectric device 30-1, in a rectangular housing portion 38 of a rectangular package 31, a pair of sides facing each other. In this regard, step portions 33 and 33 are formed at substantially the center thereof, and electrode pads 34 and 34 are provided on the upper surface thereof.

For this reason, the collet 61 as the suction jig according to the third embodiment is configured as shown in FIG. In FIG. 6, the portions denoted by the same reference numerals as the collet 51 in FIG. 3 have a common configuration, and therefore, overlapping description will be omitted, and hereinafter, differences will be mainly described.
6 (a) is a schematic plan view of a collet 61 as a third embodiment, FIG. 6 (b) is a schematic front view thereof, FIG. 6 (c) is a schematic bottom view thereof, and FIG. It is a schematic side view.

In the figure, the inclined surfaces 54, 54, 57, 57 constituting the lower end surface of the main body 52 of the collet 61 are the same as those in the first embodiment, but in this embodiment, FIG. 6 (a) and FIG. As is clear from the above, notch-shaped outer shape removal portions 66 and 66 are formed at the center portions of the pair of opposite sides 63 and 63 of the rectangular main body 52 so as to reduce the width of the main body 52 of the collet 61. Is formed. The outer shape removing portions 66 and 66 are provided on the long side of the main body 52, but are not limited to the long side. The positions where the outer shape removing parts 66 and 66 are provided are positions corresponding to the stepped parts 33 and 33 when the parts to be attracted are transferred to the package 31 of FIG.
Thus, the collet 61 of the present embodiment also exhibits the same effects as the first embodiment.

FIG. 7 shows a fourth embodiment of the suction jig.
FIG. 7A is a schematic plan view of the collet 61-1 as the fourth embodiment, FIG. 7B is a schematic front view thereof, FIG. 7C is a schematic bottom view thereof, and FIG. Is a schematic side view thereof.
In the figure, the collet 61-1 is similar to the collet 61 described with reference to FIG. 6, and the same components are denoted by the same reference numerals, and redundant description is omitted.

The collet 61-1 is different from the collet 61 in FIG. 6 in the number of inclined surfaces constituting the lower end surface of the main body 52. That is, the collet 61 in FIG. 6 has two or more types of inclined surfaces (inclined surfaces 54, 57, etc.), whereas in the collet 61-1, the lower end surface of the main body 52 is an inclined surface having two pairs. 54, 54 only.
Accordingly, as shown in FIG. 7 (d), the collet 61-1 has a large side surface portion of the main body 52. Therefore, the possibility of interference is reduced accordingly. Except for such effects, the collet 61-1 can exhibit the same effects as those of the third embodiment.

Next, a suction jig according to a fifth embodiment suitable for manufacturing the piezoelectric device 30-2 as shown in FIG. 8 will be described.
The piezoelectric device 30-2 in FIG. 8 has substantially the same configuration as that of the piezoelectric device 30 in FIG. 1, and the portions denoted by the same reference numerals have a common configuration. The piezoelectric device 30-2 in FIG. 8 is different from the piezoelectric device 30 in FIG. 1 in the case of the piezoelectric device 30-2, in the rectangular accommodating portion 38 of the rectangular package 31, all of the four corners thereof. Steps 33, 33, 33, 33 are formed at the locations, and electrode pads are provided on part or all of the upper surface. Since it is complicated, the illustration of the electrode pad is omitted.

For this reason, the collet 71 as the suction jig according to the fifth embodiment is configured as shown in FIG. In FIG. 9, since the location which attached | subjected the code | symbol same as the collet 51 of FIG. 3 is a common structure, the overlapping description is abbreviate | omitted and it demonstrates centering on difference below.
FIG. 9A is a schematic plan view of a collet 71 as a fifth embodiment, FIG. 9B is a schematic front view thereof, FIG. 9C is a schematic bottom view thereof, and FIG. It is a schematic side view.

In the figure, the inclined surfaces 54, 54, 57, 57 constituting the lower end surface of the main body 52 of the collet 71 are the same as those in the first embodiment, but in this embodiment, FIG. 9A and FIG. As is clear from the above, outer shape removal portions 76, 76, 76, 76 are formed so as to chamfer the corner portions protruding from the four corners of the rectangular main body 52. That is, as compared with the first embodiment, the first embodiment forms the outer shape removing portion in the pair of diagonal portions of the main body 52, whereas in the present embodiment, all the diagonal portions are formed. The outer shape removal part is formed. As is apparent from the description of FIG. 8, each outer shape removing portion is provided corresponding to each step portion 33, 33, 33, 33 of the rectangular accommodating portion 38 of the package 31.
Thus, the collet 71 of the present embodiment also exhibits the same operational effects as the first embodiment.

FIG. 10 shows a sixth embodiment of the suction jig.
10A is a schematic plan view of a collet 71-1 as a sixth embodiment, FIG. 10B is a schematic front view thereof, FIG. 10C is a schematic bottom view thereof, and FIG. Is a schematic side view thereof.
In the figure, the collet 71-1 is similar to the collet 71 described in FIG. 9, and the same components are denoted by the same reference numerals and redundant description is omitted.

This collet 71-1 differs from the collet 71 in FIG. 9 in the number of inclined surfaces constituting the lower end surface of the main body 52. That is, the collet 71 in FIG. 9 has two or more types of inclined surfaces (inclined surfaces 54, 57, etc.), whereas in this collet 71-1, the lower end surface of the main body 52 has two pairs of inclined surfaces. 54, 54 only.
Therefore, as shown in FIG. 10 (d), the collet 71-1 has a large side surface portion of the main body 52. Therefore, the possibility of interference is reduced accordingly. Except for such an effect, the collet 71-1 can exhibit the same effect as the fifth embodiment.

The present invention is not limited to the above-described embodiments. Each configuration of each embodiment can be used among the embodiments, and individual configurations can be omitted as appropriate or combined with other configurations not shown.
Further, in the above-described embodiment, a pair of IDTs are formed on the surface acoustic wave chip and the terminals thereof are a pair, but a surface acoustic wave chip including an IDT having a plurality of pairs of terminal portions can be used. In that case, the stepped portion formed in the package accommodating portion is not a pair, but, for example, four or more stepped portions are provided as shown in FIG. In some cases. The parts to be attracted are not limited to the surface acoustic wave chip, and each piezoelectric vibrating piece such as a rectangular AT-cut vibrating piece that is long in one direction, a convex type, a reverse mesa type, or a tuning fork vibrating piece is used. It is good as well. Furthermore, there are cases where each component used for manufacturing a piezoelectric oscillator is transferred by connecting these to an oscillation circuit element or the like.

The schematic plan view which shows an example of the piezoelectric device manufactured using the adsorption jig which concerns on embodiment of this invention. FIG. 2 is a schematic cut end view taken along line AA in FIG. 1. The schematic perspective view which shows a mode that the piezoelectric element which is components is mounted in the package of the piezoelectric device of FIG. 1 using the suction jig of 1st Embodiment. The figure which shows 2nd Embodiment of the adsorption jig of this invention. The schematic plan view which shows the other example of the piezoelectric device used as manufacture object. The figure which shows 3rd Embodiment of the adsorption | suction jig | tool of this invention. The figure which shows 4th Embodiment of the suction jig of this invention. The schematic plan view which shows the other example of the piezoelectric device used as manufacture object. The figure which shows 5th Embodiment of the adsorption jig of this invention. The figure which shows 6th Embodiment of the suction jig of this invention. The schematic plan view which shows an example of the conventional piezoelectric device. FIG. 12 is a schematic cross-sectional view showing how a piezoelectric element is housed in the package of the piezoelectric device of FIG. 11.

Explanation of symbols

  30, 30-1, 30-2 ... piezoelectric device, 31 ... package 31 ... piezoelectric element, 33 ... stepped portion, 34 ... electrode pad, 35 ... IDT electrode, 37. ..Piezoelectric substrates, 51, 51-1, 61, 61-1, 71, 71-1 ... collet (adsorption jig)

Claims (5)

A component adsorption jig for adsorbing components to the lower end of the main body,
An air passage that penetrates the inside of the main body,
The lower end surface of the main body where the air passage opens is a predetermined opening surface composed of a plurality of inclined surfaces,
And in a state where the component is adsorbed to the lower end of the main body, an outer shape removing portion is provided on the main body so that at least a part of the outer periphery of the main body is disposed at an inner side of the outer edge of the component at least at the lower end portion. A component adsorption jig characterized by being provided.   The component adsorption jig is a jig that adsorbs a piezoelectric element and transfers it to a package, and the outer shape removing portion of the main body corresponds to a stepped portion for providing an electrode pad in the package. The component suction jig according to claim 1, wherein the component suction jig is formed.   The component adsorption jig is a jig for transferring the piezoelectric element into the rectangular accommodating portion of the package, the main body is formed in a substantially rectangular shape, and at least a pair of diagonals of the lower end portion of the main body The component suction jig according to claim 2, wherein the outer shape removing portion is formed at a position.   The component suction jig according to claim 3, wherein the outer shape removing portion is formed at each corner of the lower end portion of the main body.   The component adsorption jig is a jig for transferring the piezoelectric element into the rectangular accommodating portion of the package, the main body is formed in a substantially rectangular shape, and a pair of opposed lower ends of the main body are opposed to each other. The component suction jig according to claim 2, wherein the outer shape removing portion is formed at an intermediate portion of the side.

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