JP2004356687A - Manufacturing method for piezoelectric vibration device and piezoelectric vibration device manufactured by the method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To much more enhance the reliability of electric connection of circuit components such as a piezoelectric diaphragm or an IC by adopting a cleaning method by dry etching to thereby eliminate a problem of a short-circuit of a miniaturized low profile piezoelectric vibration device to a ceramic multilayer board. <P>SOLUTION: The piezoelectric vibration device is manufactured in the steps of :forming the ceramic multilayer board 1 having a mount base 13 on which a piezoelectric vibrator is to be mounted and a side wall 14 surrounding the mount base, forming electrode terminals 16, 16 on the mount base in a state of being isolated from the side wall, and manufacturing the ceramic multilayer board wherein a via-hole introduced to the bottom side of the ceramic multilayer board is formed to each electrode terminal of the mount base; applying dry etching to each electrode terminal from an opening of the ceramic multilayer board; and mounting the piezoelectric vibrator for electrically connecting a piezoelectric vibrator 3 to each electrode terminal of the mount base via a conductive adhesive member. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method of manufacturing a piezoelectric vibrating device such as a piezoelectric vibrator, a piezoelectric filter, and a piezoelectric oscillator used in a communication device such as a mobile phone or an electronic device, and a piezoelectric vibrating device manufactured by the method.
[0002]
[Prior art]
2. Description of the Related Art Piezoelectric vibrating devices, for example, crystal oscillators are used in various fields as reference frequency sources for electronic devices and the like because they can stably obtain a high-precision oscillation frequency. As a conventional example, a configuration of a crystal oscillator using a crystal resonator (crystal plate) will be described as an example. In Patent Literature 1, a ceramic multilayer substrate is used, an oscillation circuit IC is arranged below the inside of the ceramic multilayer substrate, a quartz oscillator is supported and fixed above the IC, and hermetically sealed by seam welding. Things. Such a configuration has a relatively small number of parts due to the customization of the IC, is a simple configuration, and contributes to cost reduction.
[0003]
Such an IC is connected to the electrode terminals formed on the ceramic multilayer substrate using a wire bonding method or using a face-down bonding method via a metal bump (such as Au). , And are electrically connected to a crystal oscillator, external terminals, and the like.
[0004]
At this time, if dust or a solvent adheres to the electrode terminal surface of the ceramic multilayer substrate and is contaminated, the bonding strength of the above-described wire bonding and metal bumps is extremely reduced. Before connecting to the electrode terminals of the ceramic multilayer substrate, it is necessary to clean the electrode terminal surfaces. As a method of cleaning the electrode terminals, there are a wet cleaning method such as an alkali cleaning method and a cleaning method using a dry etching method such as a plasma etching method. The method has been generalized.
[0005]
However, for example, in the method using plasma etching, accelerated argon ions, oxygen ions, and the like are physically collided with the electrode terminal surface to cut the electrode terminal surface, thereby exposing the metal surface of the uncontaminated electrode terminal. Therefore, there is a problem that, during cleaning, electrode chips are scattered and re-adhered (sputtered) to a surface on which electrode terminals are not formed.
[0006]
This electrode dust reattachment does not remain on the surface facing the irradiation source of argon ions or oxygen ions, but does not remain on the surface orthogonal to the irradiation source (for example, the surface of the side wall) or disobeys the irradiation source. Since the ions do not collide with the surface, the scattered electrode dust is reattached (sputtered) and remains.
[0007]
Conventionally, in order to solve this problem, the electrode dust is covered with a mask member so as not to adhere again.
[0008]
[Patent Document 1]
JP-A-2002-158558
[Problems to be solved by the invention]
However, with the recent reduction in size and height of electronic components, the size of piezoelectric vibration devices has also been reduced, and the storage space for ceramic multilayer substrates and the spacing between electrode terminals have also been reduced. For this reason, when dry-etching these ceramic multilayer substrate members, it is becoming difficult to cover them with a mask member, and it is difficult to completely prevent reattachment of the scattered electrode dust. Then, there is a problem that a short circuit between the electrode terminals occurs due to the reattachment of the electrode waste remaining on the side wall. In particular, a piezoelectric oscillator having a storage space only on one surface of a ceramic multilayer substrate, in which an IC and a piezoelectric vibrator are vertically arranged close to each other in the storage space, is susceptible to the above-mentioned problem.
[0010]
The present invention has been made in order to solve the above-mentioned problems, and a cleaning method by dry etching that does not require a post-cleaning step and has no danger of secondary contamination is adopted. Method of manufacturing piezoelectric vibration device capable of eliminating the problem of short circuit to ceramic multilayer substrate and further improving the reliability of electrical connection of circuit elements such as piezoelectric vibration plates and ICs, and a piezoelectric device manufactured by the method. It is intended to provide a vibration device.
[0011]
[Means for Solving the Problems]
The present invention provides a method for manufacturing a piezoelectric vibration device, comprising: a ceramic multilayer substrate having electrode terminals formed by electrically connecting piezoelectric vibrators. A ceramic mounting board for mounting the chips, and a ceramic multilayer substrate having side walls surrounding the mounting bases, and forming electrode terminals in an upper part of the mounting base in a state of being separated from the side walls. After a step of manufacturing a ceramic multilayer substrate formed with vias leading to the bottom surface side of the ceramic multilayer substrate in the electrode terminals, a step of dry-etching each of the electrode terminals from an opening of the ceramic multilayer substrate; and The piezoelectric vibrator is manufactured through a piezoelectric vibrator mounting step of electrically connecting the piezoelectric vibrator to each electrode terminal of the mounting base via a conductive bonding material.
[0012]
Further, as set forth in claim 2, a piezoelectric vibrator, an IC constituting a piezoelectric oscillation circuit together with the piezoelectric vibrator, and a ceramic multi-layer substrate on which electrode terminals formed by electrically connecting these are formed. A method for manufacturing a piezoelectric vibrating device, comprising: a ceramic multi-layer substrate including a storage section for mounting an IC, a mounting table for mounting a piezoelectric vibrator, and a side wall surrounding the storage section and the mounting table. Forming, forming an electrode terminal on the upper part of the housing part, forming an electrode terminal on the mounting table in a state of being separated from the side wall, and leading each electrode terminal of the mounting table to the bottom side of the ceramic multilayer substrate. A step of dry-etching each of the electrode terminals from the opening of the ceramic multilayer substrate after the step of manufacturing the ceramic multilayer substrate having vias formed therein; An IC mounting step of electrically connecting the IC via a metal bump or a metal wire, and a piezoelectric vibrator mounting step of electrically connecting the piezoelectric vibrator to each electrode terminal of the mounting table via a conductive bonding material And manufactured through the following.
[0013]
According to a third aspect of the present invention, there is provided a piezoelectric vibrator, an IC that forms a piezoelectric oscillation circuit together with the piezoelectric vibrator, and a ceramic multilayer substrate on which electrode terminals for electrically connecting these are formed. A method for manufacturing a piezoelectric vibrating device, comprising: a ceramic multi-layer substrate including a storage section for mounting an IC, a mounting table for mounting a piezoelectric vibrator, and a side wall surrounding the storage section and the mounting table. Forming an electrode terminal on the upper part of the storage part in a state of being separated from the side wall, and forming an electrode terminal on an upper part of the mounting table in a state of being separated from the side wall, and forming a ceramic multilayer substrate on each of the electrode terminals. After the step of manufacturing a ceramic multilayer substrate formed with vias extending to the bottom surface side of the ceramic multilayer substrate, dry etching the electrode terminals from the opening of the ceramic multilayer substrate. And an IC mounting step of electrically connecting the IC via a metal bump or a metal wire to each of the electrode terminals of the storage section, and connecting the piezoelectric vibrator to each of the electrode terminals of the mounting table via a conductive bonding material. It is characterized by being manufactured through a piezoelectric vibrator mounting step of electrically connecting.
[0014]
According to a fourth aspect of the present invention, in the above-described manufacturing method, the method further comprises a lid body for sealing the ceramic multilayer substrate, wherein a metal film for sealing is formed on a sidewall of the ceramic multilayer substrate. A method for manufacturing a piezoelectric vibrating device, comprising: after a piezoelectric vibrator mounting step of electrically connecting a piezoelectric vibrator to each electrode terminal of the mounting base via a conductive bonding material, And a step of covering the upper part of the metal film on the side wall with a lid and hermetically sealing the lid.
[0015]
According to a fifth aspect of the present invention, in the above-described manufacturing method, the dry etching step is performed by cleaning electrode terminals of the ceramic multilayer substrate by plasma etching.
[0016]
Further, as set forth in claim 6, a piezoelectric vibration device manufactured by the above-described method for manufacturing a piezoelectric vibration device.
[0017]
【The invention's effect】
According to claims 1 and 2 of the present invention, an electrode terminal is formed on an upper portion of the mounting table in a state of being separated from a side wall of the ceramic multilayer substrate, and the electrode terminal is connected to a bottom surface of the ceramic multilayer substrate via a via. Since it is led to the side, the periphery of the surface of the electrode terminal is surrounded by a ceramic base portion, and the electrode terminal does not contact the side wall.
[0018]
For this reason, when each electrode terminal of the ceramic multilayer substrate is dry-etched, not only the contaminants on the electrode terminal surface can be removed and the electrode terminal surface can be activated, but also the electrode dust is formed on the side wall orthogonal to the dry etching source. Even if the reattachment remains, there is no short circuit between the electrode terminals formed on the mounting table due to the reattachment of the electrode dust.
[0019]
According to the third aspect of the present invention, an electrode terminal is formed on the upper part of the storage part in a state of being isolated from the side wall of the ceramic multilayer substrate, and an electrode terminal is formed on the mounting table in a state of being isolated from the side wall. In addition, since each of the electrode terminals is led out to the bottom surface side of the ceramic multilayer substrate via a via, the surface of each of the electrode terminals is surrounded by a ceramic base portion, and the step portion of the side wall and the mounting table is formed. The electrode terminal does not come into contact with the electrode.
[0020]
For this reason, when each electrode terminal of the ceramic multilayer substrate is dry-etched, not only the contaminants on the electrode terminal surface can be removed and the electrode terminal surface can be activated, but also the electrode dust is formed on the side wall orthogonal to the dry etching source. Even if the reattachment remains, there is no short circuit between the electrode terminals formed on the storage unit or the mounting table due to the reattachment of the electrode dust.
[0021]
According to claim 4 of the present invention, in addition to the above-mentioned functions and effects, when each electrode terminal of the ceramic multilayer substrate is dry-etched, contaminants on the electrode terminal surface are removed and the electrode terminal surface is activated. In addition to the above, even if the electrode dust reattachment remains on the side wall orthogonal to the dry etching source, each electrode terminal and the upper part of the side wall formed on the storage unit or the mounting table by the electrode dust reattachment There is no short circuit with the metal film for sealing formed on the substrate.
[0022]
Therefore, according to claims 1 to 4 of the present invention, a cleaning method by dry etching which does not require a post-cleaning step and has no risk of secondary contamination is adopted, and a ceramic multilayer of a piezoelectric vibration device which is reduced in size and height is reduced. A method of manufacturing a piezoelectric oscillator that eliminates the problem of short circuit to a substrate and further improves the reliability of electrical connection of circuit elements such as a piezoelectric diaphragm and an IC can be obtained. In addition, a cleaning device can be simplified because a short circuit at the time of dry etching can be performed without using a mask.
[0023]
According to the fifth aspect of the present invention, in addition to the above-described functions and effects, a cleaning method by dry etching that does not require a post-cleaning step and has no risk of secondary contamination can be easily realized by plasma etching.
[0024]
According to claim 6 of the present invention, since the piezoelectric vibrating device is manufactured by the above-described method, the size and height of the piezoelectric vibrating device can be easily reduced, and the distance between each electrode terminal and each electrode can be reduced. Piezoelectric vibration that has no problem of short circuit between the terminal and the sealing metal film formed on the upper part of the side wall, and further improves the reliability of electrical connection of circuit elements such as piezoelectric vibrating plates and ICs Device is obtained.
[0025]
BEST MODE FOR CARRYING OUT THE INVENTION
An embodiment of the present invention will be described with reference to a schematic drawing taking a crystal oscillator as an example. 1 is an exploded perspective view of a crystal oscillator according to an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line AA of FIG. 1, and FIG. 3 is a top view of a ceramic multilayer substrate. It is.
[0026]
The crystal oscillator comprises a ceramic multilayer substrate 1, an IC 2 housed in the ceramic multilayer substrate, a crystal vibrating plate (piezoelectric vibrator) 3, and a metal lid 4 hermetically sealing the ceramic multilayer substrate.
[0027]
The ceramic multilayer substrate 1 is made of ceramics such as alumina, and has a configuration in which it is opened upward as a whole, and has two-step concave portions. The lower concave portion 11 is a storage portion for the IC 2, and an upper concave portion 12 for storing the crystal vibrating plate 3 and a mounting table 13 for mounting the crystal vibrating plate 3 are formed above the lower concave portion 11. A side wall 14 is formed around the mount 12 and the mounting table 13.
[0028]
A plurality of electrode terminals 15, 15,... Electrically connected to the IC 2 while being separated from the side wall 14 and the mounting table 13 are formed on the bottom surface of the recess 11. In addition, two electrode terminals 16, 16 that are electrically connected to the quartz plate 3 while being separated from the side wall 14 are formed. Each of the electrode terminals is led out to the bottom surface side of the ceramic multilayer substrate by a via 17 and necessary connections are made.
[0029]
Further, a metal film 18 for sealing is formed on the side wall 14 of the ceramic multilayer substrate, and a plurality of castellations (not shown) are provided on a side surface of the ceramic multilayer substrate. External electrode terminals 19 (only some of which are shown) are formed on the bottom surface of the ceramic multilayer substrate, and output terminals, power supply terminals, and ground terminals of a crystal oscillation circuit composed of a crystal oscillator and an IC inside the ceramic multilayer substrate are provided. Has been withdrawn accordingly.
[0030]
The electrode terminal, the metal film, and the external electrode terminal include a metallized layer made of tungsten or the like and a metal layer formed on the metallized layer. The metal layer is made of, for example, nickel plating and an extremely thin gold plating on the nickel plating.
[0031]
A plurality of electrode pads (not shown) are formed on the bottom surface of the IC 2, and the IC 2 is face-down bonded to the plurality of electrode terminals 15 via a gold bump (metal bump) B, for example. And electrically mounted inside the recess 11 of the ceramic multilayer substrate. These connections can also be made by wire bonding of gold or the like.
[0032]
The quartz vibrating plate 3 is formed of a rectangular AT-cut quartz plate, and although not shown, an excitation electrode and each lead electrode are formed on the front and back surfaces by a thin film forming means such as a vacuum evaporation method or a sputtering method. , 16 are electrically connected via, for example, a silicon-based conductive resin adhesive D, and are mounted on the mounting table 13 of the ceramic multilayer substrate and inside the recess 12.
[0033]
The metal cover 4 has a structure in which nickel is plated on the front and back of a metal plate such as Kovar, and is joined to the metal film 18 around the opening of the ceramic multilayer substrate by means of seam welding or the like. Seal tightly. The metal film 18 is electrically connected to the ground terminal, and has an electromagnetic shield configuration.
[0034]
In the above-described embodiment, the plurality of electrode terminals 15, 15,... Of the concave portion and the electrode terminals 16, 16 of the mounting base are not only separated from the side wall 14 but also from the step 131 of the mounting base 13. It may be formed.
[0035]
Next, a method for manufacturing the above-described crystal oscillator will be described with reference to the drawings. 4 to 8 are views showing the steps of manufacturing the crystal oscillator according to the embodiment of the present invention.
[0036]
-Manufacturing process of ceramic multilayer substrate (Fig. 4)-
The ceramic multilayer substrate includes a plate-shaped ceramic green sheet G1 constituting a bottom surface, a plate-shaped ceramic green sheet G2 laminated on the ceramic green sheet G1 and having an IC mounting area G21 on the upper surface, and a ceramic green sheet G2. A frame-shaped ceramic green sheet G3 having a region G31 (mounting base 13) on which a quartz vibrating plate is mounted on the upper surface of the sheet G2 and a cutout region G32 (recess 11) in which ICs are accommodated, and a sidewall region G33. And a frame-shaped ceramic green sheet G4 having a side wall region G41 laminated on the upper portion of the ceramic green sheet G3 and having a metal lid mounted thereon, and a cutout region G42 (recess 12) for accommodating a quartz diaphragm. Of at least four layers. The outer dimensions of each of these green sheets are substantially the same, and a semicircular notch that forms the castellation (not shown) is formed at a corner or an end.
[0037]
On the front and back surfaces of the ceramic green sheet G1, patterns of external connection terminals (not shown), patterns of these external connection terminals, patterns of electrode terminals of an IC described later, and patterns of electrode terminals of a crystal unit are connected. Metallization is formed on the circuit pattern P1 to be formed by a method such as screen printing. Necessary connections are made between these external connection terminals and circuit patterns via the castellations and vias.
[0038]
In the ceramic green sheet G2, a pattern P2 of the electrode terminals of the IC, a through hole S21 for leading the pattern of the electrode terminals of the IC to the circuit pattern, and an electrode terminal pattern of the crystal unit described later are added to the circuit pattern. Metallization is formed by a technique such as screen printing on a through hole S22 to be derived and a through hole S23 for deriving a pattern of a sealing metal film described above into the circuit pattern. At this time, the pattern of the electrode terminals of the IC is formed in advance so as not to be in contact with a cutout region G32 of the ceramic green sheet G3 described later.
[0039]
The ceramic green sheet G3 includes a pattern P3 of electrode terminals of the crystal unit, a through hole S31 for leading the pattern of the electrode terminals of these crystal units to the circuit pattern (the through hole S22), and a sealing described later. Metallization is formed by a technique such as screen printing on a through hole S32 for leading a pattern of a metal film for use to the circuit pattern (the through hole S23). At this time, the pattern of the electrode terminals of the crystal unit is formed in advance so as not to be in contact with the side wall region G41 of the ceramic green sheet G4 described later.
[0040]
In the ceramic green sheet G4, a pattern P4 of a metal film for sealing and a through hole S4 for leading the pattern of the metal film for sealing to the circuit pattern (the through hole S32) are formed by a method such as screen printing. A metallization is formed.
[0041]
The via hole is filled with a metallizing material to form a via.
The ceramic green sheets G1 to G4 configured as described above are laminated, fired integrally, and a metal film is plated on each metallized pattern to complete the ceramic multilayer substrate.
[0042]
-Cleaning process by dry etching (Fig. 5)-
By plasma etching, accelerated argon ions and oxygen ions are caused to physically collide with the surface of each electrode terminal (15, 15,..., And 16, 16) from the opening of the ceramic multilayer substrate, and Cleaning is performed by shaving the surface of the electrode terminal and exposing the metal surface of the electrode terminal that is not contaminated. Thereby, the surface of each electrode terminal is activated. At this time, the ceramic surface having a molecular weight larger than that of the argon ions is hardly cut, and the metal electrode terminal surfaces are cut.
[0043]
-IC mounting process (Fig. 6)-
Gold bumps B are bonded to the electrode pads on the bottom surface side of the IC 2, and are arranged corresponding to the plurality of electrode terminals 15, 15... Formed on the bottom surface of the concave portion of the ceramic multilayer substrate. Are electrically connected by applying face-down bonding (applying ultrasonic waves to the gold surfaces of the electrode terminals and the gold bumps while applying a load to the ceramic multilayer substrate by the bonding tool). It is mounted inside the recess 11 of the ceramic multilayer substrate.
[0044]
In the case of employing the wire bonding method, after the IC is die-bonded to the concave portion, the electrode pad on the IC upper surface and the electrode terminal are electrically connected by bonding a metal wire such as gold.
[0045]
-Crystal vibrating piece mounting process (Fig. 7)-
A silicon-based conductive resin adhesive is applied to the upper part of each of the electrode terminals 16 and 16 of the mounting table, and a lead-out electrode portion of the quartz vibrating plate 3 is mounted on the upper part by contacting the upper part thereof. By hardening the resin adhesive D, it is electrically and mechanically connected.
[0046]
-Airtight sealing process (Fig. 8)-
A metal lid 4 is placed over the metal film 18 on the side wall, and the edge of the lid is moved on each side while applying a current to the metal roller, and is hermetically sealed by seam sealing. .
[0047]
By manufacturing the crystal oscillator as described above, it is possible not only to remove the contaminants on the surface of each of the electrode terminals and activate the electrode terminal surface, but also to form the electrode on the side wall surface or the step portion of the mounting table. Even if the reattachment of the dust remains, between the electrode terminals formed on the storage section or the mounting table, or between the electrode terminals formed on the storage section or the mounting table and the upper part of the side wall due to the reattachment of the electrode waste. There is no short-circuit with the metal film for sealing formed at all.
In the above embodiment, the present invention is not limited to the above embodiment, and may have a configuration as shown in FIGS. FIG. 9 is a top view of a ceramic multilayer substrate showing a modification of the present embodiment, and FIG. 10 is a sectional view showing another embodiment. The same parts are denoted by the same reference numerals and the description is omitted.
[0049]
In the modification of FIG. 9, similarly to the previous embodiment, the upper surface of the mounting table 13 is electrically connected to the crystal vibrating plate 3 while being separated from the side wall 14 and the step 131 of the mounting table 13. One electrode terminal 16 is formed. However, a part of each of the plurality of electrode terminals 15, 15,... Electrically connected to the IC is brought close to the mounting table 13 and the side wall 14, and the leading ends 151 of these electrode terminals are It is formed so as to be planarly isolated from the lead-out end 151 of another adjacent electrode terminal. That is, the lead-out end 151 of the electrode terminal is bent and led out so as to be separated in a plane. Those not separated in a plane are formed in a state of being separated from the mounting table 13 and the side wall 14 as in the above embodiment, and are led out by vias.
[0050]
In the embodiment of FIG. 9, the electrode terminals connected to the IC have a smaller area than the electrode terminals 16 and 16 electrically connected to the crystal unit, and the distance between the electrode terminals and the metal film 18 for sealing is also small. is there. Therefore, when these configurations are employed, even if dry etching is performed, reattachment of electrode scraps due to plasma etching remains, and the sealing material formed between the electrode terminals or on each electrode terminal and the upper portion of the side wall is formed. There is no short circuit with the metal film. Further, in this embodiment, as shown in FIG. 10, a step portion 132 which is made of the same ceramic layer as the mounting table 13 and has no electrode formed on the upper surface is provided. Even if the electrode chips are scattered radially, the step 132 serves as a barrier, preventing the electrode chips from re-adhering to the upper side wall portion of the step and preventing a short circuit from the electrode terminal 151 to the metal film 18. Can be prevented. It has a more effective configuration.
[0051]
In the embodiment shown in FIG. 11, the mounting tables 13 and 13 for holding the quartz vibrating plate are provided at both ends, and gold wire bonding W is used for connecting the IC. Not only that, the present embodiment is different from the above-described embodiment in that the recess 11 is formed so as to be isolated from the step portion of the recess 11 serving as an IC storage portion.
[0052]
In each of the above embodiments, the sealing configuration is not limited to a direct seam in which a metal lid is seam-sealed directly on a metal film, but may be a seam-sealed via a Kovar ring. The invention is not limited to this, and beam sealing (laser beam, electron beam), glass sealing, or the like may be used. Further, although plasma etching has been described as an example of dry etching, an ion milling method, dry etching using reactive gas ions, or the like may be used. The piezoelectric vibrator may be made of not only a crystal vibrator but also a piezoelectric single crystal material such as piezoelectric ceramics or LiNbO3.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view of a crystal oscillator according to an embodiment of the present invention.
FIG. 2 is a sectional view taken along line AA of FIG. 1 in an assembled state.
FIG. 3 is a top view of the ceramic multilayer substrate.
FIG. 4 is a diagram illustrating a manufacturing process of the crystal oscillator according to the embodiment of the present invention.
FIG. 5 is a view illustrating a manufacturing process of the crystal oscillator according to the embodiment of the present invention.
FIG. 6 is a diagram illustrating a manufacturing process of the crystal oscillator according to the embodiment of the present invention.
FIG. 7 is a diagram illustrating a manufacturing process of the crystal oscillator according to the embodiment of the present invention.
FIG. 8 is a diagram illustrating a manufacturing process of the crystal oscillator according to the embodiment of the present invention.
FIG. 9 is a top view of a ceramic multilayer substrate showing a modification of the embodiment of the present invention.
FIG. 10 is a sectional view taken along the line BB of FIG. 9;
FIG. 11 is a sectional view of a crystal oscillator according to another embodiment of the present invention.
[Explanation of symbols]
1 ceramic multilayer substrate 2 IC
3 Quartz diaphragm 4 Metal cover B Gold bump D Conductive resin adhesive W Gold wire bonding

Claims (6)

A method for manufacturing a piezoelectric vibration device, comprising: a ceramic multilayer substrate on which an electrode terminal formed by electrically connecting a piezoelectric vibrator; and
Forming a ceramic multi-layer substrate including a mounting table on which the piezoelectric vibrator is mounted, and side walls surrounding the mounting table, forming electrode terminals on the mounting table in a state of being separated from the side walls; After the step of manufacturing a ceramic multilayer substrate formed by forming vias leading to the bottom side of the ceramic multilayer substrate in each of the electrode terminals,
A step of dry-etching each of the electrode terminals from the opening of the ceramic multilayer substrate,
A piezoelectric vibrator mounting step of electrically connecting the piezoelectric vibrator to each electrode terminal of the mounting table via a conductive bonding material. A method for manufacturing a piezoelectric vibrating device comprising a piezoelectric vibrator, an IC that forms a piezoelectric oscillation circuit together with the piezoelectric vibrator, and a ceramic multilayer substrate on which electrode terminals formed by electrically connecting the piezoelectric vibrator and the IC are formed. So,
Forming a ceramic multilayer substrate including a housing for mounting an IC, a mounting table for mounting a piezoelectric vibrator, and a side wall surrounding the housing and the mounting table, and forming an electrode terminal on an upper portion of the housing. Then, a ceramic multilayer substrate is manufactured in which electrode terminals are formed above the mounting base in a state of being isolated from the side walls, and vias leading to the bottom surface side of the ceramic multilayer substrate are formed in the respective electrode terminals of the mounting base. After the process,
A step of dry-etching each of the electrode terminals from the opening of the ceramic multilayer substrate,
An IC mounting step of electrically connecting the IC to each electrode terminal of the storage unit via a metal bump or a metal wire;
A piezoelectric vibrator mounting step of electrically connecting the piezoelectric vibrator to each electrode terminal of the mounting table via a conductive bonding material. A method for manufacturing a piezoelectric vibrating device comprising a piezoelectric vibrator, an IC that forms a piezoelectric oscillation circuit together with the piezoelectric vibrator, and a ceramic multilayer substrate on which electrode terminals formed by electrically connecting the piezoelectric vibrator and the IC are formed. So,
A storage section for mounting an IC, a mounting table on which a piezoelectric vibrator is mounted, and a ceramic multilayer substrate including these storage sections and side walls surrounding the mounting table are formed, and the storage section is separated from the side walls. A ceramic formed by forming an electrode terminal on the top of the substrate, forming an electrode terminal on the mounting table in a state of being separated from the side wall, and forming a via for each of the electrode terminals leading to the bottom side of the ceramic multilayer substrate. After the process of manufacturing the multilayer board,
A step of dry-etching each of the electrode terminals from the opening of the ceramic multilayer substrate,
An IC mounting step of electrically connecting the IC to each electrode terminal of the storage unit via a metal bump or a metal wire;
A piezoelectric vibrator mounting step of electrically connecting the piezoelectric vibrator to each electrode terminal of the mounting table via a conductive bonding material. A lid body sealing the ceramic multilayer substrate, a method of manufacturing a piezoelectric vibration device, wherein a metal film for sealing is formed on the upper side wall of the ceramic laminated substrate,
After the piezoelectric vibrator mounting step of electrically connecting the piezoelectric vibrator to each electrode terminal of the mounting table via a conductive bonding material,
4. The piezoelectric vibrating device according to claim 1, further comprising a step of covering the upper part of the metal film on the side wall of the ceramic multilayer substrate with a lid to hermetically seal the lid. Production method. The method according to any one of claims 1 to 4, wherein the dry etching step comprises cleaning electrode terminals of the ceramic multilayer substrate by plasma etching. A piezoelectric vibration device manufactured by the method for manufacturing a piezoelectric vibration device according to any one of claims 1 to 5.

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