JP2006257153A - Resin composition for copper foil with resin and method for producing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a copper foil with resin provided with a resin layer having both a low percentage of water absorption and high heat resistance. <P>SOLUTION: The resin composition used for forming a resin layer of a copper foil with resin having the resin layer on the surface thereof comprises a polycarboxylic acid anhydride, a phenoxy resin and an epoxy resin. The method for producing the resin composition comprises reacting a polycarboxylic acid anhydride with a phenoxy resin to perform ring-opening addition of the polycarboxylic acid to a hydroxy group of the phenoxy resin, and then adding an epoxy resin. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a resin composition, a method for producing the resin composition, and a copper foil with a resin obtained using the resin composition. In particular, it is related with the resin composition used for manufacture of the copper foil with a resin excellent in the moisture absorption resistance and the heat-resistant characteristic.

  The copper foil with resin is provided with a resin layer that constitutes the insulating layer of the printed wiring board on the surface of the copper foil. The resin composition is applied to the surface of the copper foil, dried, and then applied to the surface of the copper foil. A semi-cured resin layer is formed. And this copper foil with resin can form an insulating layer and a conductor layer at the same time with one sheet, and it is possible to manufacture a printed wiring board without using a prepreg and copper foil in a separated state. As a new material, it has been well received in the market.

  As disclosed in Patent Document 1, the resin composition used for the resin layer structure of the resin-coated copper foil is mainly composed of an epoxy resin with a long track record as an insulating layer component material of a printed wiring board and its curing agent. Commonly used as an ingredient. However, the epoxy resin used for the resin layer structure of the resin-coated copper foil is generally a low-molecular compound, and has a drawback that the fluidity becomes large at the time of heat compression during pressing and the thickness accuracy of the insulating layer is poor. . In order to solve this problem, a resin layer of a copper foil with a resin by adding a polyvinyl acetal resin having a molecular weight significantly higher than that of an epoxy resin and excellent in compatibility with the epoxy resin as disclosed in Patent Document 2 A method for controlling the fluidity of the liquid has been proposed.

  However, the polyvinyl acetal resin also has a drawback of low heat resistance. Therefore, when a printed wiring board is manufactured using a resin-coated copper foil in which a resin layer is formed using a resin composition containing a polyvinyl acetal resin as a main component, soldering existing in the manufacturing process of the printed wiring board, etc. There has been a problem in that the durability against heat treatment is reduced.

  In order to solve such a problem, as disclosed in Patent Document 3, it has been proposed to improve by using a urethane resin as a crosslinking agent for a polyvinyl acetal resin. Since the polyvinyl acetal resin contains alcoholic hydroxyl groups repeatedly arranged in the molecule, the hydroxyl groups and the isocyanate groups of the urethane resin react and crosslink to provide sufficient heat treatment such as soldering. This is because it becomes a cured resin having heat resistance to withstand.

  Furthermore, as disclosed in Patent Document 4, a functional group having reactivity with an epoxy resin such as a carboxyl group is introduced into the molecule of the polyvinyl acetal resin to crosslink the epoxy resin as a main component, A method for improving heat resistance has also been proposed. This is because the hydroxyl group of the polyvinyl acetal resin is alcoholic, has low reactivity with the epoxy group, and the polyvinyl acetal resin and the epoxy resin do not substantially cause a direct crosslinking reaction. However, polyvinyl acetal resin is made from polyvinyl alcohol produced from polyvinyl acetate, but when producing polyvinyl acetate, vinyl acetate monomer and vinyl monomer having a carboxyl group such as acrylic acid or crotonic acid are used as monomer components. When polyvinyl acetate obtained by copolymerizing is used as a starting material, a polyvinyl acetal resin having a carboxyl group in the molecule can be obtained. Moreover, since polyvinyl acetal resin is excellent in flexibility in addition to the function of controlling the resin fluidity described above, it is excellent in that it has a high effect of preventing cracks and resin layer peeling that occur in the resin layer of the resin-coated copper foil. ing.

  As described above, there are many advantages by using the polyvinyl acetal resin as a part of the resin composition constituting the resin layer of the resin-coated copper foil.

JP-A-5-304360 Japanese Patent Laid-Open No. 9-246730 JP-A-8-204343 Japanese Patent Laid-Open No. 11-5828

  However, the following problems arise when the polyvinyl acetal resin is used as a resin composition constituting the resin layer of the resin-coated copper foil. Polyvinyl acetal resin has a high water absorption rate due to its molecular structure, and there are many cases where changes in electrical and mechanical properties due to water absorption are problematic.

  This problem can be improved by using a phenoxy resin having a repeating hydroxyl group in the molecule instead of the polyvinyl acetal resin as in the case of the polyvinyl acetal resin. It was difficult to introduce such a functional group other than a hydroxyl group, and it was difficult to achieve both low water absorption and high heat resistance.

  From the above, in the market, a demand for a resin-coated copper foil provided with a resin layer that achieves both low water absorption and high heat resistance has been increasing.

  Thus, as a result of intensive studies, the present inventors have come to the idea of adopting the resin composition described below, a method for producing the resin composition, and a copper foil with resin.

Resin-coated copper foil: A resin composition used to form a resin layer of a resin-coated copper foil provided with a resin layer on the surface of the copper foil, containing an anhydride of a polyvalent carboxylic acid, a phenoxy resin, and an epoxy resin It is the resin composition characterized by having performed.

  In the resin composition according to the present invention, the polyvalent carboxylic acid anhydride is a component that contributes as a curing agent for the epoxy resin, and is phthalic anhydride, maleic anhydride, trimellitic anhydride, pyromellitic anhydride It is preferable to use an acid, tetrahydroxyphthalic anhydride, hexahydroxyphthalic anhydride, methylhexahydroxyphthalic anhydride, nadic acid, or methylnadic acid.

  In the resin composition according to the present invention, the acid anhydride is preferably contained in an amount of 0.01 mol to 0.5 mol with respect to 1 mol of the hydroxyl group contained in the phenoxy resin.

  And in the resin composition which concerns on this invention, it is preferable to use what is synthesize | combined by reaction of bisphenol and a bivalent epoxy resin as a phenoxy resin.

  Furthermore, in the resin composition according to the present invention, the phenoxy resin is preferably used in an amount of 3 to 30 parts by weight when the total amount of the resin composition is 100 parts by weight.

  In the resin composition according to the present invention, the epoxy resin is preferably an epoxy resin that is epoxidized using a compound having two or more glycidyl groups in the molecule.

Method for producing resin composition: A method for producing a resin composition used for forming a resin layer of a resin-coated copper foil, wherein the resin composition reacts with an anhydride of a polyvalent carboxylic acid and a phenoxy resin. It is preferable to employ a production method characterized by being obtained by adding an epoxy resin after ring-opening addition of a polyvalent carboxylic acid to a hydroxyl group of a phenoxy resin.

Resin-coated copper foil: A resin-coated copper foil is obtained by applying the resin composition to the surface of the copper foil and drying it to form a semi-cured resin layer. This resin-attached copper foil is frequently used particularly for printed wiring board production.

  The resin composition according to the present invention is characterized in that it does not contain a conventionally used polyvinyl acetal resin, and is used for forming a resin layer of a resin-coated copper foil. And the resin composition which concerns on this invention is excellent in a moisture absorption characteristic, is a low water absorption, and is equipped with a high temperature heat-resistant characteristic simultaneously. Considering that the resin-coated copper foil used in the resin composition is used in a printed wiring board, the characteristics concerned prevent the moisture absorption deterioration of the printed wiring board and result in the solder bath generated by absorbing moisture. Generation | occurrence | production of the solder blister when immersed can prevent generation | occurrence | production of the delamination of a multilayer printed wiring board effectively.

  Further, the manufacturing method of the resin composition according to the present invention needs to adopt the manufacturing procedure described later, but in the manufacturing process, there is no difficulty in terms of manufacturing technology, and the present invention can be easily performed. The resin composition according to the above can be produced.

  Moreover, the resin-coated copper foil obtained by coating the resin composition according to the present invention on the surface of the copper foil is suitable for printed wiring board applications, and without using an insulating layer constituent material such as a prepreg, the surface of the inner layer core material. Further, an insulating layer and a conductor layer for forming a circuit can be formed.

<Resin-coated copper foil according to the present invention>
The copper foil with resin according to the present invention is provided with a resin layer on the surface of the copper foil, and the resin layer uses a resin composition containing an anhydride of a polyvalent carboxylic acid, a phenoxy resin, and an epoxy resin. It is characterized by being formed. Compared with the resin composition used for the structure of the resin layer of the conventional resin-coated copper foil, the characteristic of such a composition is that polyvinyl acetal resin is not included. By not using the polyvinyl acetal resin, the moisture absorption resistance and the heat resistance can be improved. Hereinafter, each element of the component will be described.

  As the polyhydric carboxylic acid anhydride used in the present invention, products marketed as epoxy resin curing agents can be used. For example, use phthalic anhydride, maleic anhydride, trimellitic anhydride, pyromellitic anhydride, tetrahydroxyphthalic anhydride, hexahydroxyphthalic anhydride, methylhexahydroxyphthalic anhydride, nadic acid, methyl nadic acid, etc. Can do.

  The phenoxy resin here is synthesized by a reaction between bisphenol and a divalent epoxy resin. In the present invention, a commercially available phenoxy resin can be used as it is. Specifically, bisphenol A, bisphenol F, bisphenol S, tetrabromobisphenol A, 4,4′-dihydroxybiphenyl, HCA (9,10-Dihydro-9-Oxa-10-Phosphophenanthrene-10-Oxide) and hydroquinone Bisphenol obtained as an adduct with quinones such as naphthoquinone can be used.

  And it is preferable to use the epoxy resin epoxidized using the compound which has a 2 or more glycidyl group in a molecule | numerator for the epoxy resin used in combination. That is, as long as it has two or more glycidyl groups in the molecule and is epoxidized using a compound, bisphenol A type epoxy resin, o-cresol novolac type epoxy resin, triglycidyl isocyanurate, N, N-di- Any of glycidyl amine compounds such as glycidyl aniline, glycidyl ester compounds such as tetrahydrophthalic acid diglycidyl ester, and brominated epoxy resins such as tetrabromobisphenol A type epoxy resin can be used. These epoxy resins may be used alone or in combination of two or more.

  In the case of a bisphenol type epoxy resin, a bisphenol type epoxy resin obtained by epoxidizing the bisphenol compound with epichlorohydrin is particularly preferably used. It is excellent in quality stability in terms of the balance between moisture absorption resistance and heat resistance of the product. The bisphenol and epoxy resin described above may be used singly or in combination of two or more.

  The amount of each component in the resin composition constituting the resin layer of the resin-attached copper foil will be described. The acid anhydride used in the resin composition according to the present invention is preferably 0.01 mol to 0.5 mol with respect to 1 mol of the hydroxyl group contained in the phenoxy resin. If it is less than 0.01 mol, the ratio of the phenoxy resin not involved in crosslinking with the epoxy resin increases, and the effect of improving the heat resistance cannot be exhibited sufficiently. On the other hand, use of an acid anhydride exceeding 0.5 mol has no effect on the resin fluidity, and there is no meaning to use an amount exceeding this, and unreacted residual acid anhydride is not removed in the next step after the reaction. It is not preferable because it may sublimate in the dryer in a certain coating drying process to contaminate the inside of the dryer and cause product contamination. More preferably, it is 0.05 mol to 0.3 mol. This is because the effect of improving heat resistance can be ensured, and at the same time, unreacted residual acid anhydride can be almost eliminated.

  The proportion of the phenoxy resin is preferably 3 to 30 parts by weight when the total amount of the resin composition is 100 parts by weight. When the amount is less than 3 parts by weight, the effect of controlling the fluidity of the resin cannot be exhibited. On the other hand, when the amount exceeds 30 parts by weight, the amount of the epoxy resin added in the resin composition is relatively reduced, so that the heat resistance and adhesiveness are lowered. More preferably, the content is 5 to 25 parts by weight. This is because the fluidity control of the resin can be ensured, and at the same time, the heat resistance and adhesiveness can be substantially eliminated.

  Furthermore, the proportion of the epoxy resin (including the curing agent and the curing accelerator) is preferably 30 to 90 parts by weight when the total amount of the resin composition is 100 parts by weight. When the amount is less than 30 parts by weight, the amount of epoxy resin added is relatively reduced, and heat resistance and adhesiveness are lowered. On the other hand, if it exceeds 90 parts by weight, it becomes difficult to control the fluidity of the resin in relation to the phenoxy resin content. More preferably, it is 40 to 80 parts by weight. This is because the fluidity control of the resin can be ensured, and at the same time, the heat resistance and adhesiveness can be almost completely eliminated.

<The manufacturing method of the resin composition which concerns on this invention>
The method for producing a resin composition used for forming a resin layer of a resin-coated copper foil comprises reacting a polycarboxylic acid anhydride with a phenoxy resin to open the polycarboxylic acid with respect to the hydroxyl group of the phenoxy resin. After the addition, a manufacturing method characterized by being obtained by adding an epoxy resin must be adopted. That is, the mixing order of the polycarboxylic acid anhydride, the phenoxy resin, and the epoxy resin is important.

  Here, in order to make it easy to understand the method for producing the resin composition according to the present invention, the production of the resin composition used for the configuration of the resin layer of the resin-coated copper foil disclosed in Patent Document 3 will be described. The basic composition of the resin composition disclosed in Patent Document 3 is that it contains a polyvinyl acetal resin, a urethane resin as a crosslinking agent, and an epoxy resin. At this time, as shown in FIG. 2, considering the three-dimensional structure of the polyvinyl acetal resin 10, —OH groups 11 and —COOH groups 12 exist as side chains. The —OH group 11 reacts with and bonds to the isocyanate group of the urethane resin. Then, the -COOH group 12 reacts with the epoxy resin and reacts with the resin composition. That is, since the reaction site of the urethane resin and the epoxy resin with respect to the polyvinyl acetal resin is different, in such a case, there is no problem even if three types of polyvinyl acetal resin, urethane resin, and epoxy resin are mixed and reacted simultaneously. However, since the polyvinyl acetal resin used here contains alcoholic hydroxyl groups repeatedly arranged in the molecule, it has high hygroscopicity, and a resin layer that achieves both low water absorption and high heat resistance is used as a copper layer. It becomes difficult to form on the surface of the foil.

  Therefore, in the method for producing a resin composition according to the present invention, a resin composition obtained by the following production method is adopted on the premise that the resin composition does not use a polyvinyl acetal resin. The resin composition according to the present description uses a phenoxy resin as a main agent, and first performs ring-opening addition of a polyvalent carboxylic acid anhydride to a hydroxyl group of the phenoxy resin. The phenoxy resin has —OH groups 11 as side chains of the steric structure of the phenoxy resin 1 as schematically shown in FIG. When the polyhydric carboxylic acid anhydride 2 (maleic anhydride is illustrated in FIG. 1) is added to the —OH group 11 by ring-opening addition, the three-dimensional structure of FIG. Become.

The site of the -COOH of _-CO 2 (COOH) group 12 in FIG. 1 (2) is to serve as reaction sites with the epoxy resin. The reason why the acid anhydride and the phenoxy resin are reacted first is that the acid anhydride has a function as a curing agent for the epoxy resin. This is because the reaction takes priority and the amount of acid anhydride added to the hydroxyl group of the phenoxy resin cannot be controlled.

  The reaction of the phenoxy resin and the acid anhydride in the method for producing the resin composition according to the present invention is performed by first dissolving the phenoxy resin in a solvent that is capable of dissolving the phenoxy resin and is not reactive with the acid anhydride. After being dissolved in, acid anhydride is added. Examples of such a solvent include dimethylformamide and cyclopentanone. The concentration of the phenoxy resin is suitably 10% to 40% by weight with respect to the solvent from the viewpoint of viscosity and reaction efficiency, and the reaction conditions are determined in view of the boiling point of the solvent used. Specifically, it is appropriate that the general reaction temperature is about 60 ° C. to 150 ° C., and the reaction time is about 30 minutes to 120 minutes. The reaction end point can be determined by IR analysis of the reaction product and confirming the disappearance of the peak corresponding to the acid anhydride.

  Therefore, in the method for producing a resin composition according to the present invention, a ring-opening addition of a polyvalent carboxylic acid anhydride is performed on a hydroxyl group of a phenoxy resin, and then an epoxy resin is blended to produce a resin composition. . In this way, without using a polyvinyl acetal resin that is inferior in moisture absorption resistance, it exhibits moisture absorption characteristics with extremely low water absorption, excellent heat resistance characteristics, and a resin suitable for constituting a resin layer of a resin-coated copper foil. The production of the composition becomes possible.

  The concept regarding the acid anhydride, the phenoxy resin, and the epoxy resin that can be used in the method for producing the resin composition according to the present invention is as described above, and a redundant description thereof is omitted here.

<Manufacture of copper foil with resin>
Here, the resin composition described above is applied to the surface of the copper foil, and no particular limitation is required regarding the method of drying. Therefore, the resin composition is coated on the surface of the copper foil using an edge coater, gravure coater, spin coater, etc., and heat-dried in a heating furnace to form a semi-cured resin layer to form a resin-coated copper foil To do. A copper-clad laminate is produced using this resin-coated copper foil in the same manner as a normal copper foil, and a printed wiring board is obtained by performing etching or the like using this copper-clad laminate. For example, a resin-coated copper foil according to the present invention is laminated with a predetermined inner layer core material, subjected to hot forming press processing, and subjected to processes such as circuit formation and formation of a via hole by a laser to obtain a multilayer printed wiring board. Is also possible.

  As a phenoxy resin, 20 g of phenototo YP-55 (trade name) manufactured by Toto Kasei Co., Ltd. (equivalent to both 20-fold parts of the total amount) was heated and dissolved together with 80 g of dimethylformamide. When the phenoxy resin was completely dissolved and the temperature of the solution reached 80 ° C., 3 g of trimellitic anhydride was added and reacted for 30 minutes while maintaining 80 ° C. At this time, the molar ratio of the hydroxyl group of the phenoxy resin to the acid anhydride in trimellitic anhydride is 1: 0.2. After 30 minutes of IR analysis of the reaction product, the peak due to the acid anhydride disappeared completely, confirming that the reaction was complete.

  40g of this reaction product, Japan Epoxy Resin Epicoat 1001 (trade name) which is a bisphenol A type epoxy resin, 35g of Epiklon N-680 (trade name) made by Dainippon Ink and Chemicals which is a cresol novolak type epoxy resin, and curing of the epoxy resin As an agent, 2 g of Curazole C17Z (trade name), which is an imidazole compound manufactured by Shikoku Kasei Kogyo, was added and dissolved. After the epoxy resin and the like were dissolved, the mixture was cooled to room temperature, and methyl ethyl ketone was added so that the solid content in the blend was 50% to obtain a resin varnish.

  As a phenoxy resin, 25 g of phenototo YP-55 (trade name) manufactured by Toto Kasei Co., Ltd. (equivalent to both 25-fold parts of the total amount) was dissolved by heating together with 90 g of dimethylformamide. When the phenoxy resin was completely dissolved and the temperature of the solution reached 80 ° C., 1 g of maleic anhydride was added, and the mixture was reacted for 30 minutes while maintaining 80 ° C. At this time, the molar ratio of the hydroxyl group of the phenoxy resin to the acid anhydride in trimellitic anhydride is 1: 0.1. After 30 minutes of IR analysis of the reaction product, the peak due to the acid anhydride disappeared completely, confirming that the reaction was complete.

  37g of this reaction product, Japan Epoxy Resin Epicoat 1001 (trade name) which is a bisphenol A type epoxy resin, 35g of Epiklon N-680 (trade name) made by Dainippon Ink and Chemicals which is a cresol novolac type epoxy resin, and curing of the epoxy resin As an agent, 2 g of Curazole C17Z (trade name), which is an imidazole compound manufactured by Shikoku Kasei Kogyo, was added and dissolved. After the epoxy resin and the like were dissolved, the mixture was cooled to room temperature, and methyl ethyl ketone was added so that the solid content in the blend was 47% to obtain a resin varnish.

Comparative example

(Comparative Example 1)
A resin varnish was obtained in the same manner as in Example 1, except that the addition of trimellitic anhydride used in Example 1 was omitted.

(Comparative Example 2)
Instead of the phenoxy resin YP-55 used in Example 1, a polyvinyl butyral resin Denka Butyral 6000C manufactured by Denki Kagaku Kogyo was used, and the resin varnish was prepared in the same manner as in Example 1 except that the solid content of the resin varnish was changed to 30%. Got.

(Comparative Example 3)
A resin varnish was obtained in the same manner as in Example 1 except that instead of trimellitic anhydride used in Example 1, the urethane resin Coronate AP-StableM manufactured by Japan Polyurethane Industry, which is a urethane resin, was used.

  A method for evaluating the resin varnishes obtained in Example 1, Example 2 and Comparative Examples 1 to 3 will be described.

<Creation of copper foil with resin>
The varnish was applied to a roughened surface of an electrolytic copper foil having a thickness of 18 μm using a bar coder. The resin thickness at this time was set to 50 μm after drying. After coating, the mixture was allowed to stand at room temperature to disperse the solvent, and then placed in a hot air oven at 160 ° C. for 2 minutes to semi-cure the resin to obtain a resin-coated copper foil.

<Creation and evaluation of resin plate>
The two resin-coated copper foils were laminated so that the resin surfaces were in contact with each other, and cured by hot pressing. The curing conditions at this time were 170 ° C. × 60 minutes at a pressure of 20 kgf / cm. After curing, the copper foil was removed by an etching method, and the resin-coated copper foil was laminated again. By repeating this, a resin plate having a thickness of about 1 mm was prepared. And the water absorption of this resin board was measured based on JIS method.

<Evaluation of copper foil with resin>
The resin flowability of the copper foil with resin was measured according to the MIL method.

<Creation of printed wiring board>
The obtained resin-coated copper foil was laminated on a 0.5 mm thick FR-4 grade copper-clad laminate having a 12 μm inner layer circuit that had been blackened using a vacuum press. The press conditions were 170 ° C. × 60 minutes at a pressure of 20 kgf / cm. The solder heat resistance of the printed wiring board provided with the obtained four copper layers was measured according to the JIS method. The results obtained by the above test are summarized in Table 1 below.

  As is clear from the comparison between Examples and Comparative Examples in Table 1, the resin-attached copper foil using the resin composition of the present invention can easily control the resin flow, and absorbs water as the resin composition. It can be seen that the rate is also low. Furthermore, it can be seen that the 260 ° C. solder heat resistance of the printed wiring board produced using this is extremely good.

  The resin composition which concerns on this invention does not contain the polyvinyl acetal resin conventionally used as mentioned above. As a result, the resin composition according to the present invention has excellent moisture absorption resistance and low water absorption, and at the same time has high temperature heat resistance. Resin-coated copper foil provided with a resin layer formed using this resin composition is used for printed wiring boards, and as a result, prevents moisture deterioration of the printed wiring boards and causes defects caused by moisture absorption. Reduced and enables the supply of printed wiring boards with improved heat resistance. Moreover, since the manufacturing method of the resin composition which concerns on this invention can employ | adopt the method which does not have any difficult point in view of the above-mentioned manufacturing technology, it can manufacture the resin composition which concerns on this invention easily.

It is the figure which showed typically the ring-opening addition state of the acid anhydride with respect to the hydroxyl group of the phenoxy resin of the resin composition which concerns on this description. It is the figure which showed typically the coupling | bonding concept of the urethane resin and epoxy resin as a crosslinking agent with respect to the polyvinyl acetal resin in the conventional resin composition.

Explanation of symbols

1 Phenoxy resin 2 Acid anhydride (maleic anhydride)
3 Epoxy resin 10 Polyvinyl acetal resin
11 -OH group 12 -COOH group

Claims (8)

A resin composition used for forming a resin layer of a resin-coated copper foil provided with a resin layer on the surface of a copper foil,
The resin composition comprises a polycarboxylic acid anhydride, a phenoxy resin, and an epoxy resin. Polyhydric carboxylic acid anhydride is a component that contributes as a curing agent for epoxy resin, and is phthalic anhydride, maleic anhydride, trimellitic anhydride, pyromellitic anhydride, tetrahydroxyphthalic anhydride, hexahydroxyphthalic anhydride The resin composition according to claim 1, wherein the resin composition is selected from acid, methylhexahydroxyphthalic anhydride, nadic acid, and methyl nadic acid. The resin composition according to claim 1 or 2, wherein the acid anhydride is contained in an amount of 0.01 mol to 0.5 mol with respect to 1 mol of a hydroxyl group contained in the phenoxy resin. The resin composition according to any one of claims 1 to 3, wherein the phenoxy resin is synthesized by a reaction between bisphenol and a divalent epoxy resin. The resin composition according to any one of claims 1 to 4, wherein the phenoxy resin contains 3 to 30 parts by weight when the total amount of the resin composition is 100 parts by weight. The resin composition according to any one of claims 1 to 3, wherein the epoxy resin is an epoxy resin that is epoxidized using a compound having two or more glycidyl groups in the molecule. A method for producing a resin composition used for forming a resin layer of a resin-coated copper foil,
The resin composition is obtained by reacting an anhydride of a polyvalent carboxylic acid with a phenoxy resin, ring-opening addition of the polyvalent carboxylic acid to a hydroxyl group of the phenoxy resin, and then adding an epoxy resin. A method for producing a resin composition. The copper foil with resin obtained using the resin composition in any one of Claims 1-6.

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