JP2006253278A - High frequency module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve a problem that high frequency signals leak from gaps between a substrate and a case of a high frequency module. <P>SOLUTION: The high frequency module comprises a substrate 21 where an electronic component 22 including a high frequency oscillator is mounted on the upper surface, an electrode 24 led out of the electronic component 22 and also provided at the lower surface of the substrate 21, and a metal case 30 covering the substrate 21. The case 30 hermetically seals the upper part of the substrate 21 including the electronic component 22 and the side surface of the substrate 21, and the end of the case 30 is formed with a fitting part 31 mounted to a master substrate 25. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a high-frequency module used in a high-frequency device or the like.

  Hereinafter, a conventional high-frequency module will be described. The conventional high-frequency module has a configuration as shown in FIGS. In FIG. 11, 1 is a board | substrate with which the electronic component 2 containing a high frequency oscillator was mounted | worn on the upper surface. Reference numeral 3 denotes a pattern laid on the upper surface of the substrate 1 and connected to the electronic component 2, and the pattern 3 is led to the electrode 4 provided on the side surface of the substrate 1.

  Reference numeral 5 denotes a metal case. The case 5 is pushed down in the direction of arrow 6 to cover the upper portion of the substrate 1. Reference numeral 7 denotes an attachment portion provided on the side surface 5 a of the case 5, and is attached to the pattern 8 provided on the side surface of the substrate 1 with solder.

  9 is a convex portion provided on the side surface 5a of the case 5, and when the case 5 is mounted on the substrate 1, the end of the case 5 comes into contact with the pattern 3 and shorts to the ground. It is to prevent. That is, by having this convex part 9, as shown in FIG. 12, a gap 10 is generated between the substrate 1 and the side surface 5a of the case 5, and insulation between the pattern 3 and the end of the case 5 is obtained. Yes.

As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
JP 2002-9207 A

  However, in such a conventional high-frequency module, a gap 10 is generated between the substrate 1 and the tip of the side surface 5a of the case 5 due to the convex portion 9, and the high-frequency signal 11 leaks from the gap 10, and this high-frequency module There has been a problem of disturbing the high-frequency device to which the module is mounted.

  In order to prevent such leakage of the high-frequency signal 11, as shown in FIG. 13, in the high-frequency device in which the high-frequency module 13 is mounted on the upper surface of the parent substrate 12, the metal is further sealed to cover the high-frequency module 13. In some cases, the case 15 is covered. However, such a configuration requires a large space for mounting the high-frequency module 13.

  Accordingly, the present invention has been made to solve such problems, and an object of the present invention is to provide a high-frequency module having a small space and excellent shielding performance.

  In order to achieve this object, the present invention seals the upper part of the board including the electronic components and the side face of the board together in the case of the high-frequency module and attaches the end part of the case to the parent board. Is provided. Thereby, the initial purpose can be achieved.

  According to the present invention, the case of the high-frequency module seals both the upper side of the board including the electronic components and the side surface of the board, and the end of the case is provided with a mounting portion for mounting to the parent board. In the case, the upper side of the substrate including the electronic component and the side surface of the substrate are sealed together in the case, so that the high frequency signal in the high frequency module does not leak. That is, the shielding performance is improved.

  Further, since there is no need to double-shield the case as in the conventional case, the space on the parent substrate can be reduced.

  Furthermore, since it can be firmly attached to the parent substrate at the attachment portion, unnecessary stress is not applied to the substrate on which the electronic component is attached.

  Furthermore, since there is no need for double shielding as in the prior art, the number of manufacturing steps can be reduced and the cost can be reduced.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
FIG. 1 is a cross-sectional view of the high-frequency module according to Embodiment 1 of the present invention. In FIG. 1, reference numeral 21 denotes a substrate. On the upper surface of the substrate 21, an electronic component 22 is mounted on a copper foil pattern 23 with solder 20. The pattern 23 is led to the back surface (lower surface) of the substrate 21 through a through hole (which may be a conductor and does not need to be a through hole), and is connected to an electrode 24 provided on the back surface of the substrate 21. Yes. The electrode 24 is connected to a copper foil pattern 26 formed on the upper surface of a parent substrate 25 constituting a high-frequency device or the like by solder 27.

  Reference numeral 30 denotes a metal case that covers and covers the upper surface including the electronic component 22 mounted on the upper surface of the substrate 21 and the side surface 21 a of the substrate 21. A flange-like attachment portion 31 is formed at the end of the side surface 30 a of the case 30 by being bent horizontally with respect to the parent substrate 25. The attachment portion 31 is formed with a rough surface so that good soldering can be performed. In addition, by forming both the top surface and the side surface 30a of the case 30 as sparse surfaces, the surface area can be increased and the heat dissipation effect can be enhanced.

  Further, the side surface 30 a of the case 30 and the side surface 21 a of the substrate 21 are fixed by solder 33. The attachment portion 31 is firmly fixed to the copper foil pattern 34 laid on the parent substrate 25 with solder 35. As described above, since the attachment portion 31 is fixed to the parent substrate 25, even if stress is applied to the parent substrate 25, no stress is applied to the substrate 21 or the electronic component 22. An oscillation circuit for outputting a high frequency signal composed of the electronic component 22 is provided in the substrate 21.

  As described above, in the high-frequency module according to the present embodiment, since the substrate 21 and the electronic component 22 are sealed by the case 30, there is no gap between the high-frequency module and the parent substrate 25. The output high frequency signal is prevented from leaking to the parent substrate 25 side. That is, a high frequency module with good shielding performance can be obtained.

  Further, since the case 30 is completely sealed, it is not necessary to use another shield case as in the prior art, and the number of manufacturing steps can be saved.

  Furthermore, since it is not necessary to use a double shield in the case as in the prior art, it is possible to reduce the space on the parent substrate 25 and reduce the cost.

  FIG. 2 is a plan view of the high-frequency module, and an attachment portion 31 for fixing to the parent substrate 25 is formed over the entire surface of the case 30. Therefore, it is firmly attached to the parent substrate 25. The case 30 is integrally formed using a metal drawing technique.

  As described above, since the hook-shaped attachment portion 31 is formed over the entire surface, the high-frequency module can be securely and firmly attached to the parent substrate 25.

(Embodiment 2)
FIG. 3 is a cross-sectional view of the high-frequency module according to Embodiment 2 of the present invention. In FIG. 3, reference numeral 41 denotes a substrate, and an electronic component 42 is mounted on a copper foil pattern 43 with solder 40 on the upper surface of the substrate 41. The pattern 43 is led out to the back surface of the substrate 41 through a through hole, and is connected to an electrode 44 provided on the back surface of the substrate 41. This electrode 44 is connected to a copper foil pattern 46 formed on the upper surface of a parent substrate 45 constituting a high frequency device or the like by solder 47.

  Reference numeral 50 denotes a metal case that covers and covers the upper surface including the electronic component 42 mounted on the upper surface of the substrate 41 and the side surface 41 a of the substrate 41. A mounting portion 51 perpendicular to the parent substrate 45 is formed at the end of the side surface 50 a of the case 50. The attachment portion 51 has a rough surface so that good soldering can be performed. In addition, by forming both the top surface and the side surface 50a of the case 50 as sparse surfaces, the surface area can be increased and the heat radiation effect can be enhanced. Further, the tip 51a of the mounting portion 51 has a particularly high density compared to the others, so that the solder adheres securely.

  Further, the side surface 50 a of the case 50 and the side surface 41 a of the substrate 41 are fixed with solder 53. The mounting portion 51 is fixed to a copper foil pattern 54 laid on the parent substrate 45 with solder 55. As described above, since the mounting portion 51 is fixed to the parent substrate 45, even if stress is applied to the parent substrate 45, the substrate 41 and the electronic component 42 are not stressed. An oscillation circuit that outputs a high-frequency signal composed of the electronic component 42 is configured in the substrate 41.

  As described above, in the high frequency module according to the present embodiment, since the substrate 41 and the electronic component 42 are sealed with the case 50, there is no gap between the high frequency module and the parent substrate 45, and the oscillation circuit The output high frequency signal prevents leakage to the parent substrate 45 side. That is, a high frequency module with good shielding performance can be obtained.

  Further, since the case 50 is completely sealed, it is not necessary to use another shield case as in the prior art, and the number of manufacturing steps can be saved.

  Furthermore, since it is not necessary to use a double shield in the case as in the prior art, it is possible to reduce the space on the parent substrate 45 and reduce the cost.

  FIG. 4 is a plan view of the high-frequency module, and an attachment portion 51 for fixing to the parent substrate 45 is formed over the entire surface of the case 50. In this case 50, since the attachment portion 51 is formed perpendicular to the parent substrate 45, the attachment space to the parent substrate 45 can be made smaller than in the first embodiment. Further, since the surface of the mounting portion 51 is formed to be a sparse surface, a strong connection can be made between the parent substrate 45 and no stress is applied to the substrate 41 and the electronic component 42. The case 50 is also formed integrally with the mounting portion 51.

(Embodiment 3)
FIG. 5 is a block diagram of a high-frequency module according to Embodiment 3 of the present invention. In FIG. 5, reference numeral 60 denotes a metal case, which corresponds to the case 30 in the first embodiment or the case 50 in the second embodiment. A high-frequency module formed of electronic components is provided on the substrate in the case 60.

  In this high-frequency module, 61 is an input terminal to which a high-frequency signal is input, and this input terminal 61 is connected to a high-frequency filter 62. The output of the high frequency filter 62 is connected to the high frequency amplifier 63. The output of the high frequency amplifier 63 is connected to one input of the mixer 65 via the interstage filter 64. The other input of the mixer 65 is connected to the output of a local oscillator 66 that outputs a high-frequency oscillation signal. The output of the mixer 65 is connected to the output terminal 68 through the intermediate frequency filter 67.

  Reference numeral 69 denotes a data input terminal. The data input terminal 69 is connected to the data terminal of the PLL circuit 70. The output of the local oscillator 66 is connected to the input of the PLL circuit 70, and the output of the PLL circuit 70 is connected to the input of the local oscillator 66 and also to the control terminal of the interstage filter 64. .

  The operation of the high-frequency module configured as described above will be described below. The television signal reception band of the television signal input to the input terminal 61 is selected by the high frequency filter 62. Then, after the television signal is amplified by the high frequency amplifier 63, the television signal input by the interstage filter 64 is tuned.

  Next, the desired signal is selected by the output signal output from the local oscillator 66. The selected desired signal is output from the output terminal 68 via the intermediate frequency filter 67. That is, the signal is selected by controlling the oscillation frequency of the local oscillator 66 by a signal input from the data input terminal 69.

  At this time, the local oscillator 66 outputs a high-frequency signal for tuning. The case 60 is sealed so that this high frequency signal does not leak from the case 60. Therefore, if the high frequency module of the present embodiment is used, the high frequency device or the like is not disturbed.

  In addition, this high frequency module is arrange | positioned as follows. That is, the input terminal 61 is provided in the vicinity of one end of a substrate 71 (not shown) mounted in the case 60, and the output terminal 68 is provided in the vicinity of the other end of the substrate 71. By arranging in this way, high-frequency insulation (isolation) between the input terminal 61 and the output terminal 68 is improved.

  The local oscillator 66 is provided between the input terminal 61 and the output terminal 68 and in the vicinity of the case 60. The inductor that defines the oscillation frequency of the local oscillator 66 is formed of a copper foil pattern, and the ground side is disposed in the vicinity of the case 60.

  By arranging in this way, the ground of the local oscillator 66 is strengthened and the distance from the input terminal 61 and the output terminal 68 is increased. That is, the fundamental frequency output from the local oscillator 66 and its harmonics can be prevented from leaking from the high frequency module.

  Further, it is important that the chip parts connected to this pattern are reflow soldered. By reflow soldering, the position of the chip component is fixed at a fixed position by a self-alignment effect. That is, the length of the pattern connected to the chip component is constant, and the value of the inductor is constant, so that adjustment of the inductor is not necessary.

(Embodiment 4)
In the fourth embodiment, in the high-frequency module in which the upper side (including the electronic component) and the side surface of the substrate on which the electronic component is mounted are covered with a metal case, the entire surface (excluding the electrode) of the substrate is covered with copper foil. The ground pattern formed in (1) is provided. As a result, the entire high-frequency module (both six surfaces) is shielded, which further improves the shielding performance. In addition, about the same thing as Embodiment 1-3, the same code | symbol is attached | subjected and description is simplified.

  FIG. 6 is a cross-sectional view of the high-frequency module according to Embodiment 4 of the present invention. In FIG. 6, reference numeral 81 denotes a substrate, and an electronic component 42 is mounted on a copper foil pattern 43 with solder 40 on the upper surface of the substrate 81. The pattern 43 is led out to the back surface of the substrate 81 through the through hole 82 and is connected to an electrode 83 provided on the back surface of the substrate 81. A copper foil ground pattern 84 is provided on the entire back surface of the substrate 81 except for the electrodes 83.

  Reference numeral 50 denotes a metal case that covers and covers the back surface including the electronic component 42 mounted on the upper surface of the substrate 81 and the side surface 81 a of the substrate 81. The side surface 50 a of the case 50, the side surface 81 a of the substrate 81, and the ground pattern 84 are fixed with solder 85.

  FIG. 7 is a plan view of the high-frequency module as viewed from the back side.

  Thus, the high-frequency module in the present embodiment is shielded on all surfaces by the case 50 and the ground pattern 84. Therefore, the shielding performance of the high-frequency module is improved as compared with those of the first and second embodiments. Further, since the electrode 83 and the ground pattern 84 provided on the back surface of the substrate 81 have the same thickness, the size of the high frequency module does not increase.

  FIG. 8 is a cross-sectional view of another example of the high-frequency module. FIG. 8 differs from FIG. 6 in that a multilayer substrate is used as the substrate 86. That is, only the electrode 83 is provided on the back surface of the substrate 86, and the ground pattern 87 is provided in the inner layer of the substrate 86. Therefore, the back surface of the high frequency module is formed of an insulator except for the electrode 83, and a wiring pattern can be provided on the lower side of the high frequency module on the parent substrate.

  The ground pattern 87 is fixed to the side surface 50 a of the case 50 with solder 85. The ground pattern 87 is preferably formed in the next layer on the lower surface of the substrate 86. Further, when an electronic circuit is formed in the inner layer between the ground pattern 87 layer and the upper surface layer, further miniaturization can be realized.

(Embodiment 5)
In the fifth embodiment, the mounting position of the case on the substrate will be described. FIG. 9 is a cross-sectional view of the high-frequency module according to the first example. In FIG. 9, reference numeral 101 denotes a case, and a substrate 102 is attached to the case 101. An electrode 103 is provided on the lower surface of the substrate 102, and a solder ball 104 is attached to the electrode 103.

  On the other hand, a mounting portion 105 is formed at the end of the side surface 101 a of the case 101, and the size 106 from the lower end of the mounting portion 105 and the lower surface of the substrate 102 are both equal. As a result, the substrate 102 is separated from the parent substrate (not shown) by the height of the solder ball 103. Therefore, the shielding property between the high frequency module and the parent substrate is improved.

  Reference numeral 107 denotes a tongue piece (used as an example of a locking portion) provided on the side surface 101a of the case 101, and this tongue piece 107 regulates the degree of penetration of the substrate 102 into the case 101. By having the tongue piece 107, the positioning of the substrate 102 insertion becomes easy, and the productivity is improved.

  It is important to improve the shielding performance that the tongue 107 is bent too much so as not to form a gap with the lower portion 101b of the side surface 101a of the case 101.

  The case 101 can be applied to the case 30 in the first embodiment and the case 50 in the second embodiment. Further, the substrate 102 can be applied to the substrate 21 in the first embodiment and the substrate 41 in the second embodiment.

  FIG. 10 is a cross-sectional view of the high-frequency module according to the second example. In FIG. 10, reference numeral 111 denotes a case, and a substrate 112 is attached to the case 111. An electrode 113 is provided on the lower surface of the substrate 112.

  On the other hand, a mounting portion 115 is formed at the end of the side surface 111 a of the case 111, and the dimension 116 from the electrode 113 formed on the lower end of the mounting portion 115 and the lower surface of the substrate 112 is made equal. Thus, when the high frequency module is mounted on the parent substrate, the height dimension 118 can be reduced by the amount of the solder ball 104 shown in FIG.

  Reference numeral 117 denotes a half punch (used as an example of a locking portion) provided on the side surface 111a of the case 111. The half punch 117 regulates the intrusion of the substrate 112 into the case 111. By having the half punch 117, the positioning of the substrate 112 is facilitated, and the productivity is improved.

  The case 111 can be applied to the case 30 in the first embodiment and the case 50 in the second embodiment. Further, the substrate 112 can be applied to the substrate 21 in the first embodiment and the substrate 41 in the second embodiment.

  Since the high frequency module of the present invention has good shielding properties, it can be used for high frequency devices and the like.

Sectional drawing of the high frequency module in Embodiment 1 of this invention Same as above, top view Sectional drawing of the high frequency module in Embodiment 2 Same as above, top view Block diagram of high-frequency module according to Embodiment 3 Sectional drawing of the high frequency module in Embodiment 4 Same as above, top view Sectional view of a high-frequency module according to another example Sectional drawing of the high frequency module by the 1st example in Embodiment 5 same as the above Sectional view of the high-frequency module according to the second example Side view of conventional high-frequency module Same as above, sectional view Same as above, mounting cross section on parent board

Explanation of symbols

21 Substrate 22 Electronic component 24 Electrode 25 Parent substrate 30 Case 31 Mounting part

Claims (10)

A substrate on which an electronic component including a high-frequency oscillator is mounted; an electrode that is led out from the electronic component and provided on a lower surface of the substrate; and a metal case that covers the substrate; The high-frequency module in which the upper portion of the substrate including the electronic component and the side surface of the substrate are sealed together, and an attachment portion for attachment to the parent substrate is provided at an end portion of the case. The high-frequency module according to claim 1, wherein the attachment portion is formed horizontally with respect to the parent substrate. The high-frequency module according to claim 1, wherein the attachment portion is formed perpendicular to the parent substrate. The high-frequency module according to claim 1, wherein the attachment portion is formed with a sparse surface. The high-frequency module according to claim 1, wherein the lower surface of the substrate is formed with a ground pattern on the entire surface excluding the electrodes. The high-frequency module according to claim 1, wherein a multilayer substrate is used as the substrate, and a ground pattern is provided on an inner layer of the multilayer substrate. 2. The high frequency module according to claim 1, wherein a solder ball is mounted on an electrode provided on the lower surface of the substrate, and the lower end of the solder ball and the lower end of the mounting portion of the case are both equal in distance from the lower surface of the substrate. The high frequency module according to claim 1, wherein a locking portion for locking the substrate is provided on a side surface of the case. An input terminal to which a high-frequency signal is input, a high-frequency signal input to this input terminal is supplied to one input, and a mixer to which the output of the local oscillator is connected to the other input; The high frequency module according to claim 1, wherein an output terminal to which an output is supplied is mounted on the substrate. The input terminal is provided near one end of the board, the output terminal is provided near the other end of the board, and the local oscillator is provided between the input terminal and the output terminal and in the vicinity of the case. The high frequency module according to claim 9.

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