JP2005311048A - Electronic component, oscillator, and communication equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To configure electronic components which can be surface-mounted on a mounted substrate for realizing electric connection between a circuit in a shielded space and the outside, and to provide an oscillator equipped with its structure, and communication equipment equipped with them. <P>SOLUTION: An electrode for circuit element mounting or an electrode for circuit formation are arranged on the upper and lower faces of a laminate substrate 1, a terminal electrode 16 conducted to an electrode on a mounted substrate is arranged at the peripheral edge, and caps 2 and 3 are mounted on the upper and lower faces of the substrate 1. The line conductor 20 of the internal layer of the substrate 1 can conduct between the terminal electrode 16 and the electrode in a shield space constituted of the caps 2 and 3 and a ground electrode 13. Thus, it is possible to realize surface mounting on the mounted substrate by the terminal electrode 16. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electronic component in which a circuit element is mounted on a substrate and a circuit portion is shielded, an oscillator, and a communication device including them.

  Conventionally, in order to package a circuit board and a circuit element such as a dielectric resonator mounted on the circuit board, a ceramic package having a recess for housing the circuit element is used. For example, Patent Document 1 discloses a dielectric resonator device in which a substrate on which circuit elements are mounted is housed in a ceramic package, and a metal lid is disposed on the ceramic package at a predetermined interval from the substrate.

  An example of the configuration of this type of electronic component is shown in FIG. In FIG. 10, various electrode patterns are formed on the upper and lower surfaces of the substrate, and a plurality of circuit elements are mounted to constitute a VCO (voltage controlled oscillator) module 50, and the dielectric resonator 4 is attached to the lower surface. In the case 51 made of alumina ceramic, the VCO module 50 is housed and the metal lid 52 is attached to the upper portion so that a predetermined space is formed between the VCO module 50 and the metal lid 52. 1 recess 54 is formed. A recess 53 is formed in accordance with the structure in which the dielectric resonator 4 protrudes from the lower surface of the substrate of the VCO module 50.

  Patent Document 2 discloses a configuration in which a dielectric filter using a coaxial dielectric resonator is covered with a lid and fixed with solder.

  Patent Document 3 discloses that a metal lid is used in a crystal oscillator.

Further, Patent Document 4 discloses a structure that shields an electromagnetic field by providing shield covers on the upper and lower surfaces of a substrate.
JP 2001-332912 A JP-A-7-142906 JP 2002-185256 A Japanese Utility Model Publication No. 7-27194

  In the structure of the electronic component shown in Patent Document 1, ceramics such as alumina are used to form a cavity structure, and thus there is a problem that the material cost and processing cost increase. Since the structure is such that the substrate is housed in a ceramic package, there is a problem that the package is large in size and it is difficult to reduce the size because it is made of ceramic. In addition, when a dielectric resonator is mounted on a substrate, and the substrate is bonded to the package by a method such as soldering, the bonding area between the substrate and the package is large, so voids are likely to occur and the wet spread is insufficient. Since the joining state varies, there is a problem that variations in electrical characteristics and a decrease in the yield rate are likely to occur.

  In the structure of the electronic component shown in Patent Document 2 and Patent Document 3, the upper part of the circuit element mounted on the substrate is covered with a metal lid, but this is necessary when a complete shield is provided. A problem arises when applied to an electronic component for a mounting board. Further, it cannot be applied to a structure in which circuit elements are mounted on both sides of a substrate.

  In the configuration of the electronic component disclosed in Patent Document 4, signal input / output cannot be performed between the circuit in the upper and lower shield covers and the outside, and it can be applied to the electronic component mounted on the mounting board. Can not.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an electronic component that can be mounted on a surface of a mounting board and a structure thereof that solves the above-described problems and enables electrical connection between a circuit in a shielded space and the outside. Another object of the present invention is to provide an oscillator and a communication device including them.

  (1) In the electronic component of the present invention, the first and second main surfaces are provided with electrodes including circuit element mounting electrodes or circuit forming electrodes, and peripheral electrode portions are provided with terminal electrodes that conduct to the electrodes on the mounting substrate. A cap joint portion is provided around the circuit element mounting electrode or the circuit forming electrode of the electrodes on the first and second main surfaces, and the circuit element mounting electrode or the circuit forming electrode and the terminal electrode A circuit board mounted on the circuit element mounting electrode on the circuit board, and a flange part joined to the cap joint part of the first and second main surfaces And two metal caps on the upper and lower sides.

  (2) Further, in the electronic component of the present invention, in (1), a portion along the periphery of the substrate is used as the cap joint portion on the first main surface, and a cap joint portion on the lower surface is provided inside the cap joint portion on the upper surface. The ground electrode is formed on the substantially entire surface from the cap joint portion on the lower surface.

  (3) In addition, the electronic component of the present invention is characterized in that in (2), a conduction path is formed to connect the cap joint portion of the first main surface and the ground electrode of the second main surface at a plurality of locations. Yes.

  (4) Moreover, the electronic component of this invention uses the laminated substrate which has an electrode layer inside as said board | substrate in (1)-(3), provides the said line conductor in the inner layer of a laminated board, and has a terminal electrode laminated substrate It is characterized by being formed on the end face.

  (5) The electronic component of the present invention is characterized in that, in (1) to (4), a ground electrode is formed around the inner-layer line conductor, and the ground electrode and the line conductor constitute a coplanar line. It is said.

  (6) The oscillator according to the present invention includes a negative resistance element and a dielectric resonator mounted on the second main surface of the substrate as circuit elements of the electronic components of (1) to (5), As a part of the electrode, a line coupled to the dielectric resonator is formed on the first main surface, and a negative resistance element is connected to the line.

  (7) A communication device according to the present invention includes the electronic component or the oscillator having the above-described configuration.

  (1) Caps are bonded to the first and second main surfaces of the substrate, respectively, so that the circuit elements mounted on the first and second main surfaces of the substrate and circuit element mounting electrodes or circuit forming electrodes are used. The circuit is shielded by a space formed by a metal cap spaced a predetermined distance from the first and second main surfaces of the substrate. In addition, the circuit element mounting electrode or circuit forming electrode is electrically connected to the terminal electrode of the substrate by a line conductor, so that the space shielded by the cap can be electrically connected to the outside and mounted. Since the solder fillet can be formed on the terminal electrode portion during surface mounting on the substrate, surface mounting becomes possible.

  (2) The cap of the first main surface is joined at a portion along the periphery of the substrate, and the cap of the second main surface is joined to the inner side thereof, whereby the second main surface is mounted on the mounting substrate. In this case, since a relatively wide area around the cap joint portion of the second main surface becomes a mounting surface on the mounting substrate, surface mounting becomes easy. Moreover, since the ground electrode is formed around the cap joint portion of the second main surface, the shield structure can be maintained. Also, when the recess or opening is provided in the mounting substrate so that the cap of the second main surface does not interfere, the recess or opening may be small.

  (3) Propagation of electromagnetic waves in the in-plane direction of the substrate is prevented by conducting the connection between the cap joint portion of the first main surface and the ground electrode of the second main surface through a conduction path at a plurality of locations. The shielding effect can be enhanced.

  (4) By providing a line conductor that conducts between the circuit element mounting electrode or the circuit forming electrode and the terminal electrode in the inner layer of the laminated substrate, the first and The conduction between the shield space and the terminal electrode by the cap of the second main surface can be achieved.

  (5) A coplanar line is constituted by the line conductor of the inner layer and the surrounding ground electrode, so that a predetermined line is obtained while suppressing interference with other circuits in the shield space by the caps of the first and second main surfaces. The signal can be propagated through the impedance line.

  (6) Since the dielectric resonator is mounted on the second main surface of the substrate and the line coupled to the dielectric resonator is formed on the first main surface, the insulation between the dielectric resonator and the line is achieved by the substrate. As a result, the entire circuit including the dielectric resonator can be accommodated in the shield space by the caps of the first and second main surfaces, and a small-sized oscillator that can be surface-mounted on a mounting board can be configured.

  (7) Since a small electronic component or oscillator is provided, a small and light communication device can be obtained.

The configuration of the VCO according to the first embodiment will be described with reference to FIGS.
FIG. 1 is an exploded perspective view thereof. The VCO includes a laminated substrate (hereinafter simply referred to as “substrate”) 1, a plurality of circuit elements including a dielectric resonator 4 mounted on the substrate 1, an upper cap 2, and a lower cap 3. .

  On the upper surface (first main surface) of the substrate 1, circuit element mounting electrodes for mounting various circuit elements and circuit forming electrodes such as line conductors 19, 20, SL1, and SL2 are formed. A cap joint portion 17 is formed along the periphery of the substrate 1 around the circuit element mounting electrode and the circuit forming electrode. The upper cap 2 is formed by pressing a metal plate, and a flange portion 2f is formed on the periphery thereof. The upper cap 2 is attached to the upper portion of the substrate 1 by soldering the flange portion 2 f to the cap joint portion 17.

  The dielectric resonator 4 shown in FIG. 1 is formed by forming electrodes 41 and 42 with circular electrode openings H facing the upper and lower surfaces of a square plate-shaped dielectric plate 40, respectively, and is a TE010 mode dielectric. Acts as a resonator.

  FIG. 2 is a bottom view of the substrate 1. A ground electrode 13 having an electrode opening H is formed at a substantially central portion of the lower surface (second main surface) of the substrate 1. A part 13 ′ of the ground electrode 13 represented by a broken line in FIG. 2 is a joint portion of the lower cap 3. By joining the flange portion 3 f of the lower cap 3 to this portion, the dielectric resonator 4 is shielded with a predetermined space around the dielectric resonator 4.

  FIG. 3 is a cross-sectional view passing through a substantially central portion of the VCO. The substrate 1 is a laminated substrate (multilayer substrate) in which an inner electrode layer is laminated between two insulating layers 10 and 11. The line conductor 19 formed on the upper surface of the substrate 1 and the line conductor 20 formed on the inner layer are electrically connected by a via hole 14. The end portion of the inner-layer line conductor 20 is electrically connected to the terminal electrode 16 formed on the end surface of the substrate 1. With this structure, a circuit signal in the shield space surrounded by the upper cap 2, the lower cap 3 and the ground electrode 13 is taken out as a terminal electrode of the substrate 1. The terminal electrode 16 is formed up to the lower surface of the substrate 1 to facilitate the formation of a solder fillet during surface mounting.

  A plurality of through holes 18 are formed between the upper surface electrode (cap joint 17 of the upper cap 2 in this example) and the ground electrode 13 on the lower surface so as to be electrically connected to each other at a predetermined interval. Yes. With this structure, the upper cap 2, the lower cap 3, and the ground electrode 13 are set to the same potential (ground connection), and the propagation of the electromagnetic field in the surface direction of the substrate 1 is prevented. Block the binding. The arrangement pitch of the through holes 18 is set to a half wavelength or less of the medium wavelength of the substrate 1 in the use frequency band. This enhances the shielding effect.

  In addition, a ground electrode is formed in the inner layer in a region other than the region facing the formation portion of the line conductor 20 and the electrode opening H on the lower surface. The inner layer ground electrode and the line conductor 20 constitute a coplanar line.

  FIG. 4 is a cross-sectional view showing a state where the VCO is mounted on the mounting board. In the mounting substrate 101, an opening 101h is formed in advance at a place where the VCO 100 is mounted. An electrode for connecting the terminal electrode 16 of the VCO 100 is formed around the opening 101h, and soldered at that portion. At this time, since the terminal electrode 16 is formed on the end face of the substrate 1, a solder fillet S is formed, and reliable surface mounting is possible.

  The opening 101h may be rectangular according to the shape of the lower cap 3. However, if the lower cap 3 is not in contact with the terminal electrode 16 and can be soldered to the mounting board, the opening 101h is rectangular. However, the shape is not limited.

  Next, FIG. 5 shows a circuit diagram of the VCO shown in FIG. Each code | symbol in FIG. 5 respond | corresponds to each code | symbol attached | subjected to FIG. This circuit is configured by connecting a reflection amplifier to the line conductor SL1 coupled to the dielectric resonator 4 shown in FIG. That is, in FIG. 5, the gate of the FET is connected to the end of the conductor line SL1. A bias voltage supply circuit including L2, R3, R4, C1, and C2 is connected to the drain of the FET 5, and a bias voltage is supplied from the terminal Tb. An output circuit including L3, R5, and Rb is connected to the source of the FET.

  The other line conductor SL2 coupled to the dielectric resonator 4 is provided with a circuit including R1, L1, and VD1 so that the voltage of the control terminal Tc is applied to the variable capacitance element VD1. Since the band reflection type oscillator oscillates at the resonance frequency of the resonance circuit portion, the oscillation frequency is controlled by applying the voltage of the control terminal Tc to the variable capacitance element VD1.

Next, a VCO according to the second embodiment will be described with reference to FIGS.
FIG. 6 is an exploded perspective view thereof. The difference from the first embodiment is that the substrate 1 is a single layer substrate.

  FIG. 7 is a bottom view of the substrate 1. On the lower surface of the substrate 1, a ground electrode 13 having an electrode opening H at its substantially central portion is formed on substantially the entire surface. A terminal electrode 16 is formed at a predetermined location on the periphery of the lower surface of the substrate 1. The electrode formed on the upper surface of the substrate 1 and the terminal electrode 16 are electrically connected by a via hole 14.

  Thus, by pulling out the predetermined electrode in the shield space by the upper cap 2, the lower cap 3 and the ground electrode 13 to the end of the substrate 1, surface mounting is possible on the mounting substrate.

  The terminal electrode 16 may be formed not only from the lower surface of the substrate 1 but also from the lower surface to the end surface. As a result, as in the case of the first embodiment, a solder fillet is generated and reliable surface mounting becomes possible.

Next, a VCO according to a third embodiment will be described with reference to FIG.
FIG. 8 is an exploded perspective view thereof. In this example, the substrate 1 is a single-layer substrate, and an electrode including a circuit element mounting electrode and a circuit forming electrode is formed on the upper surface. On the lower surface, a ground electrode 13 having an electrode opening H is formed on the substantially entire surface in the same manner as shown in FIG. 2, and a terminal electrode 16 is formed near the end of the substrate 1. The line conductor 19 on the upper surface of the substrate 1 is electrically connected to the terminal electrode 16 formed from the end surface to the lower surface of the substrate 1. Therefore, in order to insulate the cap joint portion 17 from these line conductors 19, a part of the cap joint portion 17 is formed separately. Accordingly, the upper cap 2 is formed with an opening 2 '.

  With this structure, a circuit signal in the shield space surrounded by the upper cap 2, the lower cap 3 and the ground electrode 13 is taken out as a terminal electrode of the substrate 1. Further, since the terminal electrode 16 is formed from the end face to the lower face of the substrate 1, a solder fillet is formed at the time of surface mounting, and mounting becomes easy.

  Next, the configuration of a communication apparatus according to the fourth embodiment is shown in FIG. 9 as a block diagram. This communication device is, for example, a mobile phone terminal. The signal processing circuit 42 outputs a digital signal data string, the band-pass filter 46 removes unnecessary frequency band signals, and the amplifier 47 amplifies the intermediate frequency signal to a predetermined level. The mixer 48 mixes the intermediate frequency signal from the amplifier 47 and the oscillation signal from the oscillator 56. The band pass filter 49 passes the signal in the transmission frequency band out of the output signal from the mixer 48, and the amplifier 50 amplifies the power and transmits it from the antenna 45 through the duplexer 44. The band-pass filter 51 passes only a signal in a predetermined band among the received signals from the duplexer 44, and the amplifier 52 amplifies it to a predetermined level. The mixer 53 mixes the received signal from the amplifier 52 with the signal from the oscillator 56. The band pass filter 54 passes only the received intermediate frequency signal out of the signal from the mixer 53, and the amplifier 55 amplifies it to a predetermined level. The signal processing circuit 42 processes the digital signal data string from the amplifier 55 and outputs it as an audio signal, for example.

The VCO shown in the first to third embodiments is used for the oscillator 56 portion.
In each of the above embodiments, the VCO is taken as an example. However, the shield space having spaces above and below the substrate is provided, and the internal circuit and the external circuit in the shield space are connected via the substrate. The present invention can be similarly applied to any electronic component in which terminal electrodes are formed on the peripheral edge of the substrate.

1 is an exploded perspective view of a VCO according to a first embodiment. Bottom view of the VCO board Cross section of the VCO Sectional view showing the mounting structure of the VCO on the mounting board Circuit diagram of the VCO Exploded perspective view of a VCO according to the second embodiment Bottom view of the substrate used in the VCO Exploded perspective view of a VCO according to a third embodiment The block diagram which shows the structure of the communication apparatus which concerns on 4th Embodiment. An exploded perspective view showing a configuration of a conventional electronic component

Explanation of symbols

1-substrate 2-upper cap 2f-flange 2'-opening 3-lower cap 3f-flange 4-dielectric resonator 10, 11-insulating layer 13-ground electrode 14-via hole 16-terminal electrode 17-cap Junction 18-through hole 19, 20-line conductor 40-dielectric plate 41,42-electrode 100-VCO (electronic component)
101-Mounting board H-electrode opening To-output terminal Tc-control terminal Tb-power supply terminal S-solder fillet SL1, SL2-line conductor

Claims (7)

An electrode including a circuit element mounting electrode or a circuit forming electrode is provided on the first and second main surfaces, and a terminal electrode is provided on the peripheral portion to conduct to the electrode on the mounting substrate, and the electrodes on the first and second main surfaces are provided. A cap joint is provided around the circuit element mounting electrode or the circuit forming electrode, and a line conductor is provided to conduct between the circuit element mounting electrode or the circuit forming electrode and the terminal electrode. A substrate,
A circuit element mounted on the circuit element mounting electrode of the substrate;
Two upper and lower metal caps each having a flange portion joined to the cap joint portion of the first and second main surfaces, and
With electronic components.   The cap joint portion of the first main surface is a portion along the periphery of the substrate, and the cap joint portion of the second main surface is provided on the inner side compared to the cap joint portion of the upper surface, and the second main surface The electronic component according to claim 1, wherein a ground electrode on substantially the entire surface is formed around the cap joint portion.   3. The electronic component according to claim 2, wherein a conduction path is formed between the cap joint portion on the first main surface of the substrate and the ground electrode on the second main surface of the substrate at a plurality of locations.   The electron according to claim 1, wherein the substrate is a multilayer substrate having an electrode layer therein, the line conductor is provided in an inner layer of the multilayer substrate, and the terminal electrode is formed on an end surface of the multilayer substrate. parts.   The electronic component according to claim 1, wherein a ground electrode is formed around the inner-layer line conductor, and a coplanar line is configured by the ground electrode and the line conductor.   6. The electronic component according to claim 1, wherein the circuit element includes a negative resistance element and a dielectric resonator mounted on a second main surface of the substrate, and a part of the circuit forming electrode is the dielectric. An oscillator comprising: a line formed on a first main surface of the substrate coupled to a body resonator; and the negative resistance element connected to the line.   The communication apparatus provided with the electronic component in any one of Claims 1-5, or the oscillator of Claim 6.

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