JP2006253254A - Membrane ring with bump and its manufacturing method, and contact board and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To accurately align an anisotropic conductive rubber sheet and a membrane ring with a bump with each other. <P>SOLUTION: The membrane with a bump comprises a membrane 20 wherein a hole 24 is formed for alignment whose relative position is already known with respect to a bump hole, an isolated pad to be brought into contact with the anisotropic conductive rubber sheet, a pad 28 for alignment whose relative position with respect to the isolated pad is already known, and a bump to be brought into contact with a semiconductor device. The hole 24 for alignment and the pad 28 for alignment are aligned with respect to an alignment 44 formed in the anisotropic conductive rubber sheet. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a membrane ring with bumps, a contact board, a method for manufacturing a membrane ring with bumps, and a method for manufacturing a contact board.

In recent years, methods for performing various inspections in a wafer state have been proposed. In this case, the wafer manufactured in the wafer manufacturing process undergoes probe card inspection, burn-in inspection, and final inspection, and the wafer is cut after the final inspection. Of the above-described inspections, probe card inspection is generally from 1 chip to 64 chip multi-measurement, but wafer whole surface batch inspection using a wafer batch probe inspection board has also been proposed. The burn-in inspection is an inspection for performing a high-temperature acceleration test, and conventionally, a burn-in board using a membrane ring with bumps is known (for example, refer to Patent Document 1). This burn-in board is a probe for collectively contacting the entire surface of a semiconductor wafer, and has a structure in which three members of a wiring board, an anisotropic conductive rubber sheet, and a membrane ring with bumps are overlapped. At the time of assembly, an anisotropic conductive rubber sheet is stacked on the wiring substrate, and a membrane ring with bumps is stacked on the anisotropic conductive rubber sheet to integrate them.
JP 2000-39450 A

  Each member constituting the burn-in board is provided with an electrode or a pad at a position corresponding to the pad of the wafer to be measured. When assembling the burn-in board, it is necessary to accurately align and superimpose so that the electrodes or pads of each member are in contact with each other and do not short-circuit with adjacent electrodes or pads. In particular, in the overlapping of the anisotropic conductive rubber sheet and the membrane ring with bumps, the overlapping area between the electrode part of the anisotropic conductive rubber sheet and the isolated pad of the membrane ring with bumps becomes as large as possible, In addition, it is necessary to make the centers of the electrode part and the isolated pad as close as possible.

  However, there is variation in positional accuracy between the electrode portion, the isolated pad, and the bump of the anisotropic conductive rubber sheet. Therefore, it is difficult to make each center completely coincide. Therefore, when assembling, the membrane ring with bumps is stacked on the anisotropic conductive rubber sheet while searching for a better position. At that time, it must be possible to confirm how much the isolated pad and the bump are displaced from the electrode portion of the anisotropic conductive rubber sheet.

  Conventionally, in this superposition, for example, the isolated pad itself is aligned with the electrode portion of the anisotropic conductive rubber sheet that is seen through the membrane of the membrane ring with bumps. However, when alignment is performed in this way, the electrode portion of the anisotropic conductive rubber sheet is covered with the isolated pad with respect to the direction of the line of sight at the time of alignment. Therefore, conventionally, it may be difficult to confirm the position of the electrode portion of the anisotropic conductive rubber sheet. Also, because of the structure of the membrane ring with bumps, there is always an isolated pad on the back side of the bumps, so it was almost impossible to confirm the amount of deviation of the bumps.

  Then, an object of this invention is to provide the membrane ring with a bump, contact board, the manufacturing method of a membrane ring with a bump, and the manufacturing method of a contact board which can solve said subject.

In order to solve the above problems, the present invention has the following configuration.
(Configuration 1) A membrane ring with bumps for handling a contact portion in a contact board used for conducting an electrical test of a large number of semiconductor devices formed on a wafer, and the relative positions of the bump holes and the bump holes are known. This is an isolated pad for contacting a membrane formed through the alignment hole and a conductive member having conductivity in a direction perpendicular to the main surface, at the position of the bump hole on one surface of the membrane. The isolated pad formed on one side of the membrane and surrounding the alignment hole, the alignment pad having a known relative position with respect to the isolated pad, and the state connected to the isolated pad via the bump hole The semiconductor formed on the opposite side of the membrane from the isolated pad And a bump is brought into contact with the device, the alignment holes and alignment pad is aligned to the alignment portion formed on the conductive member. The contact board is, for example, a wafer batch contact board.

  If comprised in this way, the position of the isolation pad and bump on a membrane sheet with a bump, and the electrode part of an electroconductive member by matching the position of the alignment hole and the pad for alignment, and the position of the alignment part of an electroconductive member The position of can be adjusted appropriately. In addition, it is possible to simultaneously check how many isolated pads and bumps on the membrane sheet with bumps are present from the electrode portion of the conductive member. Therefore, the conductive member and the membrane ring with bumps can be superimposed with high accuracy. This also makes it possible to improve assembly accuracy and increase work efficiency. The bump is not formed at the position of the alignment hole. The alignment pad may be a dummy pad that does not contact other conductors.

  (Configuration 2) The conductive member is an electrode portion for contacting the isolated pad, and an electrode portion protruding toward the isolated pad at a position corresponding to the isolated pad and an alignment portion whose relative position with respect to the electrode portion is known The alignment hole is aligned with the alignment portion of the conductive member so that the centers thereof overlap each other, and the alignment pad is formed so as to surround the alignment hole with a gap therebetween. The edge of the alignment pad on the alignment hole side is aligned with the outer edge of the alignment portion of the conductive member. If comprised in this way, when the membrane ring with a bump and a conductive member are piled up for position alignment, it can prevent that the alignment part of a conductive member is covered with the pad for alignment.

  (Configuration 3) A contact board used for conducting an electrical test of a plurality of semiconductor devices formed on a wafer, the bumped membrane ring according to any one of Configurations 1 to 3, and the bumped membrane ring A conductive member having conductivity in a direction perpendicular to the main surface, and a wiring substrate superimposed on the conductive member so as to face the membrane ring with bumps across the conductive member. If comprised in this way, the effect similar to the structure 1 can be acquired.

  (Configuration 4) A method of manufacturing a membrane ring with bumps that handles a contact portion of a contact board used for conducting an electrical test of a semiconductor device formed on a wafer, and a metal layer is formed on one surface The membrane is prepared, and a bump hole and an alignment hole positioned with reference to the bump hole are formed by penetrating the membrane. At the bump hole position on the surface of the membrane where the metal layer is not formed The bump for contacting the semiconductor device is formed so as to be connected to the metal layer through the bump hole, and the metal layer is patterned to contact the conductive member having conductivity in the direction perpendicular to the main surface. An isolated pad is formed at the position of the bump hole, and the alignment is set with reference to the isolated pad. Forming a pad on the position surrounding the alignment holes. In this way, the same effect as in Configuration 1 can be obtained.

  (Configuration 5) Bump holes and alignment holes are formed at positions set using the same coordinate system, and isolated pads and alignment pads are formed at positions set using the same coordinate system. In this way, the relative position of the alignment hole with respect to the bump hole and the relative position of the alignment pad with respect to the isolated pad can be appropriately set.

  (Configuration 6) A method of manufacturing a contact board used for conducting an electrical test of a plurality of semiconductor devices formed on a wafer, the direction perpendicular to the main surface in which an alignment portion for alignment is formed A conductive member having electrical conductivity and a wiring board are prepared, and a membrane ring with bumps is manufactured by the method for manufacturing a membrane ring with bumps according to Configuration 4 or 5, and the conductive members are stacked on the wiring board, and alignment is performed. The hole for alignment and the alignment pad are aligned with the alignment portion of the conductive member, and the membrane ring with bumps is further stacked on the conductive member. In this way, the same effects as those of Configuration 4 or 5 can be obtained.

  According to the present invention, the conductive member and the membrane ring with bumps can be overlapped with high accuracy.

Hereinafter, embodiments according to the present invention will be described with reference to the drawings.
FIG. 1 shows an example of the configuration of a burn-in board 10 according to an embodiment of the present invention. FIG. 1A is a cross-sectional view showing how the members of the burn-in board 10 overlap. The burn-in board 10 is a wafer inspection probe that is used to perform a burn-in test on a large number of semiconductor devices formed on a wafer, and is an example of a membrane ring (membrane ring with bumps) 12 and a conductive member. An anisotropic conductive rubber sheet 14 and a wiring board 16 are provided. The burn-in board 10 is an example of a contact board. The burn-in test is an example of an electrical test.

  The membrane ring 12 is a member that takes charge of the contact portion in the burn-in board 10, and includes a membrane 20 and a plurality of bumps 30, isolated pads 26, and alignment pads 28.

  The membrane 20 is a light-transmitting thin film that can be seen through the back side, and is formed of a polyimide film or the like. A plurality of bump holes 22 and alignment holes 24 are formed in the membrane 20. The bump hole 22 is a through hole used for forming the bump 30, and is formed at a position corresponding to each pad of the semiconductor device on the wafer to be measured. The alignment hole 24 is a through hole that serves as a reference for alignment between the membrane ring 12 and the anisotropic conductive rubber sheet 14, and is formed at a predetermined position with a relative position to the bump hole 22.

  The bumps 30 are terminals that are brought into contact with the pads of the semiconductor device, and are formed at the positions of the respective bump holes 22. In this example, the bump 30 is connected to an isolated pad 26 formed on the opposite side of the membrane 20 via the bump hole 22.

  The isolated pad 26 is a terminal for making contact with the anisotropic conductive rubber sheet 14, and is formed at the position of each bump hole 22 on the surface of the membrane 20 on the anisotropic conductive rubber sheet 14 side. The alignment pad 28 is a dummy pad that serves as a reference for alignment between the membrane ring 12 and the anisotropic conductive rubber sheet 14. An alignment hole is formed on the surface of the membrane 20 on the anisotropic conductive rubber sheet 14 side. 24, a relative position with respect to the isolated pad is formed at a known predetermined position.

  The anisotropic conductive rubber sheet 14 is a sheet-like connecting component for connecting the membrane ring 12 and the wiring board 16, and has a plurality of electrode portions 42 and alignment portions 44. The anisotropic conductive rubber sheet 14 has conductivity in a direction perpendicular to the main surface, and is formed of, for example, a silicon resin in which metal particles are embedded in a portion corresponding to the electrode portion 42.

  The electrode part 42 is a terminal for contacting the isolated pad 26 of the membrane ring 12 and the wiring board 16, and protrudes up and down toward the isolated pad 26 and the wiring board 16 at a position corresponding to each isolated pad 26. It is formed as follows. In this example, the area of the contact portion of the electrode portion 42 is smaller than the area of the contact portion of the isolated pad 26. A contact part is a surface which opposes the other party's pad or electrode part, for example. If comprised in this way, sufficient contact area can be ensured with respect to the electrode part 42 of high resistance compared with a metal etc.

  The alignment portion 44 is a convex portion serving as a reference for alignment between the membrane ring 12 and the anisotropic conductive rubber sheet 14. The alignment portion 44 is formed at a known predetermined position relative to the electrode portion 42 so as to face the alignment hole 24 and the alignment pad 28 when the membrane ring 12 and the anisotropic conductive rubber sheet 14 are overlapped. Has been.

  The wiring board 16 is a multilayer wiring board facing the membrane ring 12 with the anisotropic conductive rubber sheet 14 interposed therebetween. A plurality of substrate electrodes 46 are formed on the wiring substrate 16 at positions corresponding to the electrode portions 42 of the anisotropic conductive rubber sheet 14.

  Here, in assembling the burn-in board 10, the membrane ring 12, the anisotropic conductive rubber sheet 14, and the wiring substrate 16 are overlaid with the bumps 30 facing upward, for example. In this case, the direction of the line of sight of the assembly operator is as shown by the arrow in the figure.

  Therefore, for example, if the positions of the bumps 30, the isolated pads 26, and the electrode portions 42 are directly aligned, for example, the electrode portions 42 are hidden by the isolated pads 26, making it difficult to confirm the positions of the electrode portions 42. Therefore, with such a method, there is a possibility that alignment cannot be performed with sufficient accuracy.

  On the other hand, in this example, the alignment hole 24 and the alignment pad 28 are aligned with the alignment portion 44 of the anisotropic conductive rubber sheet 14. In this case, since the bump 30 is not formed in the alignment hole 24, the position of the alignment portion 44 can be appropriately confirmed through the alignment hole 24. The alignment pad 28 is formed so as to surround the alignment hole 24 and does not overlap the alignment hole 24, so that the alignment portion 44 is not hidden. Therefore, according to this example, the membrane ring 12 and the anisotropic conductive rubber sheet 14 can be appropriately aligned.

  FIG. 1B shows an example of a position where the alignment hole 24 and the alignment pad 28 are formed. In this example, the membrane 20 is stretched around a circular ring 32.

  The alignment hole 24 and the alignment pad 28 are formed, for example, at eight positions 102 in the outer periphery near the ring 32. The alignment portion 44 in the anisotropic conductive rubber sheet 14 is formed at a position corresponding to each position 102. If comprised in this way, position alignment can be performed appropriately. The assembly operator may perform alignment using the alignment holes 24 and the alignment pads 28 formed at some positions 102 of the eight locations.

  FIG. 2 shows an example of detailed configurations of the alignment hole 24, the alignment pad 28, and the alignment unit 44. In this example, the alignment portion 44 of the anisotropic conductive rubber sheet 14 has a cylindrical shape and is formed with no positional deviation with respect to the electrode portion 42. The electrode part 42 and the alignment part 44 are formed simultaneously in the same process, for example.

  The alignment hole 24 is a round laser hole and is formed by the same method as the bump hole 22 (see FIG. 1). In this example, the bump hole 22 and the alignment hole 24 are formed in a series of operations in the same process, respectively, at positions set using the same coordinate system. In this case, since the alignment hole 24 is processed at the same time as the bump hole 22 in which the bump 30 is formed, the alignment hole 24 is formed without positional deviation with respect to the bump 30.

  The alignment holes 24 thus formed are aligned with the alignment portion 44 of the anisotropic conductive rubber sheet 14 so that their centers overlap each other. Thereby, the bump 30 and the electrode part 42 (refer FIG. 1) of the anisotropic conductive rubber sheet 14 can be aligned appropriately.

  The alignment pad 28 is a dummy pad formed of the same metal layer as the isolated pad 26 (see FIG. 1). In this example, the alignment pad 28 and the isolated pad 26 are respectively formed at positions set using the same coordinate system by patterning at the same time, for example, by a photolithography process. For this reason, the alignment pad 28 is formed without misalignment with respect to the isolated pad 26.

  In this example, the alignment hole 24 is surrounded by a plurality of alignment pads 28. The plurality of alignment pads 28 are arranged around the alignment hole 24 while being separated from each other. Each alignment pad 28 has a shape in which a portion overlapping the alignment portion 44 is removed from the fan shape centered on the alignment hole 24, and a gap corresponding to the alignment portion 44 is provided between the alignment pads 44. 24 is surrounded. If comprised in this way, it can prevent that a metal layer remains in the part which covers the hole 24 for alignment in patterning. Therefore, the alignment pad 28 can be patterned with high accuracy.

  The alignment pad 28 thus formed is aligned with the alignment portion 44 so that the edge portion on the alignment hole 24 side is aligned with the outer edge of the alignment portion 44. Thereby, the isolated pad 26 and the electrode part 42 of the anisotropic conductive rubber sheet 14 can be appropriately aligned. Further, it is possible to prevent the alignment portion 44 from being obscured by the alignment pad 28.

  As described above, according to this example, since the alignment hole 24 and the alignment pad 28 can be simultaneously aligned with the alignment portion 44, how much each of the bump 30 and the isolated pad 26 with respect to the electrode portion 42 is provided. At the same time. Therefore, alignment of the membrane ring 12 and the anisotropic conductive rubber sheet 14 can be performed with high accuracy. In addition, this makes it possible to improve assembly accuracy and increase work efficiency.

  FIG. 2 shows a case where the alignment hole 24, the alignment pad 28, and the alignment portion 44 are neatly deviated for the sake of simplicity. However, in actual products, it is normal that the respective positions are slightly shifted, and in this case, the present invention is particularly effective.

  Hereinafter, an example of a method for manufacturing the burn-in board 10 will be described. Note that conditions and process details other than those described below may be the same as or similar to those of known burn-in boards.

  In this example, first, the wiring board 16 and the anisotropic conductive rubber sheet 14 are prepared. The wiring board 16 is, for example, a multilayer wiring board that is the same as or similar to a known wiring board. The anisotropic conductive rubber sheet 14 has the same or similar configuration as the known anisotropic conductive rubber sheet except that the alignment portion 44 is formed at a predetermined position, for example. The alignment portion 44 is formed at the same time as the electrode portion 42 at the same time as the electrode portion 42. In addition, the shape of the alignment part 44 and the electrode part 42 may be the same, and may differ.

  Subsequently, the membrane ring 12 is manufactured. In the manufacture of the membrane ring 12, first, a membrane 20 having a metal layer formed on one surface is prepared. The membrane 20 is, for example, a polyimide film (for example, a thickness of 12 to 50 μm) having the same or similar configuration as a known membrane, and is stretched around a circular SiC ring having a diameter of about 8 inches, for example. The metal layer formed on the membrane 20 is, for example, a copper foil having a thickness of 18 μm.

  Next, using an excimer laser, for example, bump holes 22 and alignment holes 24 having a diameter of about 30 μm are formed. By forming the bump hole 22 and the alignment hole 24 in the same process, the alignment hole 24 is positioned with respect to the bump hole 22.

  Next, an electrode is connected to the metal layer on the membrane 20 and electroplating is performed to form bumps 30 at the positions of the respective bump holes 22 on the surface where the metal layer is not formed. Thereby, the bump 30 is formed so as to be connected to the metal layer via the bump hole 22.

  The electroplating is Ni plating, for example. In this case, the bump 30 is made of Ni. During the electroplating, the alignment hole 24 is covered with a protective film such as a resist film. Therefore, the bump 30 is not formed at the position of the alignment hole 24. Similarly, the portion of the metal layer on the membrane 20 other than the connection portion with the electrode is also covered with the protective film.

  Next, the isolated pad 26 and the alignment pad 28 are formed by a photolithography process for the metal layer on the membrane 20. In this example, the isolated pad 26 is formed at the position of each bump hole 22. The alignment pad 28 is formed at a position surrounding the alignment hole 24. By patterning simultaneously with the isolated pad 26, the alignment pad 28 is set with reference to the isolated pad 26.

  Subsequently, the membrane ring 12, the anisotropic conductive rubber sheet 14, and the wiring board 16 are assembled. In assembly, first, the anisotropic conductive rubber sheet 14 is overlaid on the wiring board 16 in the same manner as in a known method, for example. Next, the alignment hole 24 and the alignment pad 28 in the membrane ring 12 are aligned with the alignment portion 44 of the anisotropic conductive rubber sheet 14, and the membrane ring 12 is placed on the anisotropic conductive rubber sheet 14. Repeat. In this way, the burn-in board 10 can be manufactured appropriately.

  The present invention has been described using the embodiment of the burn-in board. Is not limited. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above embodiment. It is apparent from the description of the scope of claims that embodiments with such changes or improvements can be included in the technical scope of the present invention.

It is a figure showing an example of composition of burn-in board 10 concerning one embodiment of the present invention. FIG. 1A is a cross-sectional view showing how the members of the burn-in board 10 overlap. FIG. 1B shows an example of a position 102 where the alignment hole 24 and the alignment pad 28 are formed. 4 is a diagram illustrating an example of detailed configurations of an alignment hole 24, an alignment pad 28, and an alignment unit 44. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Burn-in board, 12 ... Membrane ring, 14 ... Anisotropic conductive rubber sheet, 16 ... Wiring board, 20 ... Membrane, 22 ... Bump hole, 24 ... Alignment Hole, 26 ... isolated pad, 28 ... alignment pad, 30 ... bump, 32 ... ring, 42 ... electrode part, 44 ... alignment part, 46 ... substrate electrode , 102 ... position

Claims (6)

A bumped membrane ring that handles a contact portion in a contact board used for electrical testing of a large number of semiconductor devices formed on a wafer,
A membrane formed by penetrating a bump hole and an alignment hole having a known relative position with respect to the bump hole;
An isolated pad for contacting a conductive member having conductivity in a direction perpendicular to the main surface, the isolated pad formed at the position of the bump hole on one surface of the membrane;
An alignment pad having a known relative position with respect to the isolated pad, which is formed so as to surround the alignment hole, on the one surface of the membrane;
A bump formed on the surface of the membrane opposite to the isolated pad in a state of being connected to the isolated pad through the bump hole, and contacting the semiconductor device;
The membrane ring with bumps, wherein the alignment hole and the alignment pad are aligned with an alignment portion formed on the conductive member. The conductive member is
An electrode part for contacting the isolated pad, the electrode part protruding toward the isolated pad at a position corresponding to the isolated pad;
The relative position with respect to the electrode portion is known, and the alignment portion,
The alignment hole is aligned with the alignment portion of the conductive member such that the centers of the alignment holes overlap each other.
The alignment pad is formed so as to surround the alignment hole with a gap in between, and an edge of the alignment pad on the alignment hole side is formed on an outer edge of the alignment portion of the conductive member. The membrane ring with bumps according to claim 1, wherein the membrane ring is aligned with respect to the membrane ring. A contact board used for electrical testing of a large number of semiconductor devices formed on a wafer,
Bumped membrane ring according to claim 1 or 2,
A conductive member having conductivity in a direction perpendicular to the main surface, superimposed on the membrane ring with bumps,
A contact board comprising: a wiring board superimposed on the conductive member so as to face the membrane ring with bumps across the conductive member. A method for manufacturing a membrane ring with bumps that handles a contact portion in a contact board used for conducting an electrical test of a plurality of semiconductor devices formed on a wafer,
Prepare a membrane with a metal layer on one side,
A bump hole and an alignment hole positioned with reference to the bump hole are formed through the membrane,
Forming a bump in contact with the semiconductor device at the position of the bump hole on the surface of the membrane where the metal layer is not formed, so as to be connected to the metal layer via the bump hole,
By patterning the metal layer, an isolated pad for contacting a conductive member having conductivity in a direction perpendicular to the main surface is formed at the position of the bump hole, and the position is set with reference to the isolated pad. A method for producing a membrane ring with bumps, wherein an alignment pad is formed at a position surrounding the alignment hole. The bump hole and the alignment hole are respectively formed at positions set using the same coordinate system,
The method for manufacturing a membrane ring with bumps according to claim 4, wherein the isolated pad and the alignment pad are formed at positions set using the same coordinate system. A method of manufacturing a contact board used for conducting an electrical test of a plurality of semiconductor devices formed on a wafer,
A conductive member having conductivity in a direction perpendicular to the main surface, on which an alignment portion for alignment is formed, and a wiring board are prepared,
A membrane ring with bumps is manufactured by the method for manufacturing a membrane ring with bumps according to claim 4 or 5,
The conductive member is overlaid on the wiring board,
The contact board manufacturing method, wherein the alignment hole and the alignment pad are aligned with the alignment portion of the conductive member, and the bumped membrane ring is further stacked on the conductive member.

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