JP6548963B2 - Method of manufacturing probe, probe, probe laminate, probe assembly, and method of manufacturing probe assembly - Google Patents

Description

  The present invention relates to a method of manufacturing a probe, a probe, a probe stack, a probe assembly, and a method of manufacturing a probe assembly.

  A large number of semiconductor integrated circuits (ICs) are formed on a semiconductor wafer, and then separated for use on a chip basis. Prior to chip-to-chip separation, it is common to conduct an electrical test to evaluate performance in order to confirm whether or not the IC is manufactured according to the specification.

  In this electrical test, an electrical connection device for electrically connecting to the electrodes of each test object such as the above-described IC is used. As an electrical connection device, for example, a probe assembly such as a probe card is used. The probe assembly is configured by attaching a plurality of probes on a probe substrate as a substrate. And each to-be-tested object is electrically connected to the tester which is a test means via the probe assembly which is an electrical connection apparatus.

  As a conventional probe used for this probe assembly, for example, a plate-like foot portion, an arm portion provided at the tip end portion of the foot portion, and a tip end portion of the arm portion are provided so as to project And a needle tip portion to be abutted against. The foot portion is an attachment portion to the probe substrate. The arm portion is provided at the tip portion of the foot portion so as to extend laterally along the probe substrate. The needle point portion is provided to protrude in the direction opposite to the probe substrate at the tip end portion of the arm portion. That is, as a conventional probe, one having a plate-like structure as a whole is known (see Patent Document 1).

  The above-mentioned conventional probe integrally forms the foot portion and the arm portion with a metal material excellent in toughness so that when the needle tip portion is pressed against the electrode of the object to be inspected, along with the elastic deformation of the arm portion The tip of the needle can be slid on the electrode of the test object. The sliding of the needle tip portion can scrape the oxide film on the electrode of the object to be inspected. That is, in a probe assembly provided with a conventional probe, an overdrive that causes elastic deformation is applied to the arm portion or the like of the probe. As a result, the oxide film of the electrode can be removed at the tip of the needle tip, and good electrical contact between the probe and the electrode can be realized.

  As a method for producing such a probe, for example, methods for producing a probe as described in Patent Literature 2 and Patent Literature 3 are known. In this conventional method for producing a probe, first, a silicon wafer or the like is used as a base, and the planar shape of the entire probe is simulated with a photosensitive photoresist on the base using a photolithographic technique. The desired metal material is then deposited in the recess on the base, which is mimicked by the resist. After thus forming the probe, the probe can be manufactured by removing the probe from the base.

  FIG. 17 is a schematic plan view showing a plurality of conventional probes formed on a base.

  As shown in FIG. 17, in the conventional probe manufacturing method, a plurality of conventional probes 1000 are formed on the base 1001 so as to be spaced apart from each other. As described above, the probe 1000 has a plate-like foot portion 1002 to be attached to the probe substrate, and an arm portion 1003 provided at the tip of the foot portion so as to extend in the lateral direction along the probe substrate. A probe tip portion 1004 is provided so as to protrude in a direction opposite to the probe substrate and abut on the electrode of the test object, and has a plate-like structure as a whole.

  At this time, in the conventional probe manufacturing method, an etching technique is used to remove each of the formed plurality of probes 1000 from the base 1001. That is, on the surface of the base 1001, a sacrificial layer (not shown) made of a metal material different from the material of the probe, for example, copper is formed. Then, a metal material to be a material of the probe is deposited on the sacrificial layer to form the probe 1000. Then, in the conventional probe manufacturing method, the sacrificial layer is removed by, for example, wet etching using an etching solution. By removing the sacrificial layer, each of the probes 1000 formed on the base 1001 can be peeled therefrom and removed.

JP, 2008-190885, A JP 2008-164575 A JP, 2008-191027, A

  However, in the conventional probe manufacturing method, as shown in FIG. 17, it is usual to collectively form a large number of probes 1000 on a base. The handling of a large number of probes 1000 can be difficult and can reduce the manufacturing yield of the probes.

  In addition, when a probe assembly is to be manufactured by using a large number of manufactured probes 1000 and performing pinning operation at a predetermined position on the probe substrate, there is a problem that the operation time increases.

  Furthermore, due to the increase in the degree of integration of the IC to be inspected, in the manufacture of the probe assembly, it is required to place a large number of probes in a very narrow area on the probe substrate. Is a difficult task.

  Thus, there is a need for a probe that is used in the manufacture of a probe assembly provided with a large number of probes and that eliminates the need for the single step of setting up the probe substrate.

  An object of the present invention is a method of manufacturing a probe that manufactures a large number of probes, which can eliminate the need for the step of setting up a probe substrate for each one of the large number of probes. It is to provide.

  Other objects and advantages of the present invention will become apparent from the following description.

The first aspect of the present invention is
(A1) forming a release layer on a substrate,
(A2) forming a fixed layer in a partial region on the release layer,
(A3) forming a sacrificial layer in the same layer as the fixed layer on the release layer, thereby forming a base layer including the fixed layer and the sacrificial layer;
(A4) forming a plurality of plate-like probes on the base layer to form a probe layer, thereby forming a probe assembly comprising the base layer and the probe layer on the release layer; (A5) removing the probe assembly from the release layer on the substrate;
A first step of manufacturing a plurality of probe conjugates by repeating the above steps (A1) to (A5) in this order a plurality of times;
A second step of manufacturing a first probe laminate in which the plurality of probe assemblies are stacked, and the base layer and the probe layers are alternately stacked;
By removing the sacrificial layer contained in the base layer from the first probe laminate, a second probe laminate is formed by alternately laminating the fixed layer of the base layer and the probe layer. And a third step of
The present invention relates to a method of manufacturing a probe, which comprises a plurality of the probes connected by the fixed layer and spaced apart from each other.

  In the first aspect of the present invention, the fixed layer and the sacrificial layer of the base layer formed in the step (A3) of the first step have the same height on the release layer. Preferably, they are arranged adjacent to each other.

In the first aspect of the present invention, the probe includes a foot portion having an attachment end, a needle tip portion provided with a needle tip at a tip end, and a connecting portion connecting the foot portion and the needle tip portion. A generally plate-like probe having the attachment end at one end and the needle tip at the other end;
In the step (A4) of the first step, preferably, the foot portion of the probe is formed on the fixed layer, and the needle tip portion is formed on the sacrificial layer.

  In the first aspect of the present invention, in the step (A4) of the first step, the arrangement position of each probe is on the base layer so that each of the probes of the probe layer is at a predetermined arrangement position. Preferably, the probe layer is formed to be adjusted.

  In the first aspect of the present invention, it is preferable that the connecting portion of the probe has a spring structure connecting the needle tip portion and the foot portion.

The second aspect of the present invention is
A first step of forming a release layer on a substrate;
Using the substrate on which the release layer is formed, (B1) forming a fixed layer, (B2) forming a sacrificial layer in the same layer as the fixed layer to form a base layer comprising the fixed layer and the sacrificial layer And (B3) forming a plurality of plate-like probes on the base layer to form a probe layer, thereby forming a probe assembly consisting of the base layer and the probe layer. Are repeated a plurality of times in the order of (B1) to (B3) to produce a third probe laminate in which a plurality of probe linked bodies are laminated on the release layer of the substrate. Process,
A third step of manufacturing a fourth probe laminate by removing the third probe laminate from the substrate;
A fifth probe laminate in which the fixed layers of the base layer and the probe layers are alternately laminated by removing the sacrificial layer contained in the base layer from the fourth probe laminate. And forming a fourth step,
The present invention relates to a method of manufacturing a probe, which comprises a plurality of the probes connected by the fixed layer and spaced apart from each other.

  In the second aspect of the present invention, the fixed layer and the sacrificial layer of the base layer formed in the step (B2) of the second step are disposed adjacent to each other with the same height. Preferably.

In the second aspect of the present invention, the probe includes a foot portion having a mounting end, a needle tip portion provided with a needle tip at a tip end, and a connecting portion for connecting the foot portion and the needle tip portion. A generally plate-like probe having the attachment end at one end and the needle tip at the other end;
In the step (B3) of the second step, preferably, the foot portion of the probe is formed on the fixed layer, and the needle tip portion is formed on the sacrificial layer.

  In the second aspect of the present invention, it is preferable that the connecting portion of the probe has a spring structure connecting the needle tip portion and the foot portion.

  A third aspect of the present invention relates to a probe characterized in that it is produced by any of the method of producing the probe of the first aspect of the present invention and the method of producing the probe of the second aspect of the present invention.

The fourth aspect of the present invention is
(A1) forming a release layer on a substrate,
(A2) forming a fixed layer in a partial region on the release layer,
(A3) forming a sacrificial layer in the same layer as the fixed layer on the release layer, thereby forming a base layer composed of the fixed layer and the sacrificial layer on the release layer;
(A4) forming a plurality of plate-like probes on the base layer to form a probe layer, thereby forming a probe assembly including the base layer and the probe layer on the substrate; A5) A first step of manufacturing a plurality of probe assemblies by repeating the process of removing the probe assembly from the substrate a plurality of times in this order;
A second step of manufacturing a first probe laminate in which the plurality of probe assemblies are stacked, and the base layer and the probe layers are alternately stacked;
Manufactured according to a manufacturing method including a third step of removing the sacrificial layer contained in the base layer from the first probe stack,
The present invention relates to a probe laminate including a plurality of the probes in which the fixed layer and the probe layer of the base layer are alternately stacked and connected by the fixed layer and spaced apart from each other.

  In the fourth aspect of the present invention, the fixed layer and the sacrificial layer of the base layer formed in the step (A3) of the first step have the same height on the release layer. Preferably, they are arranged adjacent to each other.

The fifth aspect of the present invention is
A first step of forming a release layer on a substrate;
Using the substrate on which the release layer is formed, (B1) forming a fixed layer, (B2) forming a sacrificial layer in the same layer as the fixed layer to form a base layer comprising the fixed layer and the sacrificial layer And (B3) forming a plurality of plate-like probes on the base layer to form a probe layer, thereby forming a probe assembly consisting of the base layer and the probe layer. Are repeated a plurality of times in the order of (B1) to (B3) to produce a third probe laminate in which a plurality of probe linked bodies are laminated on the release layer of the substrate. Process,
A third step of manufacturing a fourth probe laminate by removing the third probe laminate from the substrate;
And a fourth step of removing the sacrificial layer contained in the base layer from the fourth probe laminate.
The present invention relates to a probe laminate including a plurality of the probes in which the fixed layer and the probe layer of the base layer are alternately stacked and connected by the fixed layer and spaced apart from each other.

  In the fifth aspect of the present invention, the fixed layer and the sacrificial layer of the base layer formed in the step (B2) of the second step are disposed adjacent to each other with the same height. Preferably.

  A sixth aspect of the invention relates to a probe assembly characterized in that it comprises a probe according to the third aspect of the invention.

  A seventh aspect of the present invention relates to a method of manufacturing a probe assembly characterized by using any of the probe laminate of the fourth aspect of the present invention and the probe laminate of the fifth aspect of the present invention.

  According to the present invention, there is provided a method of manufacturing a probe for manufacturing a large number of probes, wherein the probe setting operation for each one of the large number of probes can be made unnecessary. Provided.

It is a top view which illustrates the probe manufactured by the manufacturing method of the probe of a 1st embodiment of the present invention. It is a top view showing one probe layer manufactured by a manufacturing method of a probe of a 1st embodiment of the present invention. It is a front view showing an example of a probe layered product manufactured by a manufacturing method of a probe of a 1st embodiment of the present invention. It is a flowchart explaining the manufacturing method of the probe of a 1st embodiment of the present invention. It is process drawing explaining the (A1) process of the 1st process of the manufacturing method of the probe of 1st Embodiment of this invention. It is process drawing explaining the (A2) process of the 1st process of the manufacturing method of the probe of 1st Embodiment of this invention. It is process drawing explaining the (A3) process of the 1st process of the manufacturing method of the probe of 1st Embodiment of this invention. It is process drawing explaining the (A4) process of the 1st process of the manufacturing method of the probe of 1st Embodiment of this invention. It is a schematic plan view which shows the probe formed on the base layer at the process of (A4) of the 1st process of the manufacturing method of the probe of 1st Embodiment of this invention. It is process drawing explaining the (A5) process of the 1st process of the manufacturing method of the probe of 1st Embodiment of this invention. It is a schematic plan view which shows the probe coupling body obtained at the (A5) process of the 1st process of the manufacturing method of the probe of 1st Embodiment of this invention. It is process drawing explaining the 2nd process (S2) of the manufacturing method of the probe of a 1st embodiment of the present invention. It is a flowchart explaining the manufacturing method of the probe of a 2nd embodiment of the present invention. It is process drawing explaining the 2nd process of the manufacturing method of the probe of a 2nd embodiment of the present invention. It is a side view which shows typically the probe assembly of 3rd Embodiment of this invention. It is process drawing explaining the manufacturing method of the probe assembly of 4th Embodiment of this invention. It is a typical top view showing a plurality of conventional probes formed on a pedestal.

  Hereinafter, embodiments of the present invention will be described using drawings as appropriate.

Embodiment 1
<Producing Method 1>
The method of manufacturing a probe according to the first embodiment of the present invention is a method of manufacturing a probe that manufactures a plurality of probes spaced apart from one another.

  FIG. 1 is a plan view illustrating a probe manufactured by the method of manufacturing a probe according to the first embodiment of the present invention.

  As shown in FIG. 1, a probe 1 manufactured by the method of manufacturing a probe according to the first embodiment has a foot 3 having a mounting end 2, a needle tip 5 at which a needle tip 4 is provided at the tip, and a foot It is comprised including the connection part 6 which connects 3 and the needle point part 5. FIG. The probe 1 has an attachment end 2 used for attaching the probe 1 at one end, and a needle tip 4 at the other end to have a plate-like structure as a whole.

  In the probe 1, the attachment end 2 is used for attachment to a probe substrate (not shown) which is a substrate, for example, for the manufacture of a probe assembly (not shown). That is, the probe 1 is erected at a predetermined position on the probe substrate by using the end face of the foot portion 3 as the attachment end 2, and is used for the configuration of the probe assembly.

  Further, in the probe 1, the needle point 4 of the needle point portion 5 is used to be in contact with an electrode of a test object (not shown) such as an IC to realize an electrical connection. And the connection part 6 of the probe 1 has a spring structure which connects the needle tip part 5 and the foot part 3. For example, as shown in FIG. 1, the connecting portion 6 has a structure that simulates a shape obtained by planarly viewing a helical structure of a compression coil spring, that is, a structure in which an S-shape bends in the extending direction. It can have such a shape.

  In the method of manufacturing a probe according to the first embodiment, a plurality of probes 1 having the above-described structure are manufactured collectively. More specifically, in the method for manufacturing a probe according to the first embodiment, for example, a probe layer including a plurality of plate-like probes 1 connected by one fixed layer and arranged to be separated from each other on the same plane. Form Then, a plurality of the probe layers are stacked together with the fixed layer to form a probe laminate in which the fixed layer and the probe layer are alternately stacked. By the manufacture of the probe laminate, a plurality of probes 1 arranged apart from one another are manufactured collectively as an element constituting the probe laminate.

  FIG. 2 is a plan view showing one probe layer manufactured by the method for manufacturing a probe of the first embodiment of the present invention.

  As shown in FIG. 2, one probe layer 11 includes, for example, a plurality of probes 1 spaced apart on the same plane. The plurality of probes 1 constituting the probe layer 11 are arranged on the same plane, with the respective foot portions 3 connected by one fixed layer 12.

  FIG. 3: is a front view which shows an example of the probe laminated body manufactured by the manufacturing method of the probe of 1st Embodiment of this invention.

  As shown in FIG. 3, the probe layer 11 is stacked on another probe layer 11 via a fixed layer 12 containing a plurality of probes 1 and connecting them. As a result, the probe laminate 13 (a second probe laminate to be described later) is formed from the plurality of probe layers 11.

  And, in the method of manufacturing the probe of the first embodiment, by manufacturing the probe laminate 13 illustrated in FIG. 3, it is possible to collectively manufacture a plurality of probes 1 connected by the fixed layer 12 and separated from each other. it can.

  The plurality of probes 1 included in the manufactured probe laminate 13 are collectively erected on a probe substrate (not shown) by using the attachment ends 2 of the respective foot portions 3 to manufacture a probe assembly. can do.

  Below, the manufacturing method of the probe of 1st Embodiment of this invention is demonstrated.

  FIG. 4 is a flowchart explaining the method of manufacturing a probe according to the first embodiment of the present invention.

  As shown in FIG. 4, the method of manufacturing the probe according to the first embodiment includes a first step (S1), a second step (S2), and a third step (S3) which are outlined next. Is configured.

  In the first step (S1), the second step (S2) and the third step (S3), a plurality of probes 1 shown in FIG. 1 etc. are arranged on the fixed layer 12 so as to be separated from each other Therefore, the probes 1 can be formed at one time.

[First Step (S1)]
In the first step (S1), the following (A1) steps (S1-1) to (A5) steps (S1-5) are repeated a plurality of times in this order, and a probe serving as a precursor of the probe laminate 13 described above It is a process of manufacturing only a desired number of linked bodies.

[(A1) process]
Step of Forming Peeling Layer on Substrate (S1-1: Peeling Layer Forming Step)
[(A2) process]
(A1) A step of forming a fixed layer in a partial region on the release layer formed in the step (S1-2: fixed layer forming step)
[(A3) process]
By forming a sacrificial layer that is the same as the fixed layer formed in step (A2) in the region where the fixed layer is not formed on the release layer formed in step (A1), the fixed layer and the fixed layer are formed on the release layer. Step of forming a base layer comprising a sacrificial layer (S1-3: step of forming base layer)
[(A4) process]
(A3) A plurality of plate-like probes are formed spaced apart from each other on the base layer formed in the step (A3), and a probe including the base layer and the plurality of probes disposed thereon is formed on the substrate. A step of forming a probe assembly consisting of layers (S1-4: probe assembly forming step)
[(A5) process]
(A4) A step of removing the probe assembly formed in the step from the substrate (S1-5: probe assembly removal step)

  In this first step (S1), as shown in FIG. 4, after (A5) step (S1-5), the number of probe conjugates desired in the determination step (S1-6) of (A6) is A determination is made as to whether it has been manufactured. If it is determined that the number of probes produced is less than the desired number (S1-6: No), the process returns to the step (A1) (S1-1), and the step (A1) (S1-1). ) To (A5) Steps (S1-5) are repeated in this order.

  Thereafter, in the judgment step (S1-6) of (A6) after the step (A5) step (S1-5), when it is judged that the number of manufactured probe conjugates is a desired number (S1-6: YES ), To the next second step (S2).

[Second step (S2)]
The second step (S2) is a first probe laminate in which the plurality of probe assemblies manufactured in the first step (S1) described above are stacked, and base layers and probe layers are alternately stacked. It is a process of forming.

[Third step (S3)]
In the third step (S3), the fixed layer and the probe layer of the base layer are removed by removing the sacrificial layer contained in the base layer from the first probe laminate manufactured in the second step (S2) described above. And a step of forming a second probe laminate in which the first and second probes are alternately laminated.

  Below, each process of the 1st process (S1)-3rd process (S3) which comprises the manufacturing method of the probe of 1st Embodiment is demonstrated in more detail using drawings etc. FIG. In the following description, components common to the probe 1, the probe layer 11 and the probe laminate 13 in FIGS. 1 to 3 described above are given the same reference numerals.

[First Step (S1)]
In the first step (S1) constituting the method for producing a probe of the first embodiment, it is determined that the desired number of probe conjugates are produced in the determination step of step (A6) (S1-6) described above The above-mentioned steps (A1) to (A5) are repeated until the desired number of probe conjugates are produced.

((A1) process)
FIG. 5: is process drawing explaining the (A1) process of the 1st process (S1) of the manufacturing method of the probe of 1st Embodiment of this invention.

  In the (A1) step of the first step (S1), as shown in FIG. 5, a silicon crystal substrate whose surface is mirror-finished by etching is prepared as a substrate 31. Then, a peeling layer 32 is formed on the surface of the substrate 31 which is a silicon crystal substrate.

  The formation of the release layer 32 on the substrate 31 can be performed using, for example, a dry film resist. The dry film resist is usually a film type resist material provided with a three-layer structure consisting of a cover film, a resist layer and a carrier film. At the time of formation of the peeling layer 32, the cover film of the dry film resist is peeled and laminated on the substrate 31. Then, the carrier film of the dry film resist can be peeled off, and the resist layer of the dry film resist left on the substrate 31 can be used as the peeling layer 32.

  In addition to copper, it is also possible to select and use an etchable metal material such as an alloy of copper and nickel for forming the peeling layer 32. When copper is used to form the peeling layer 32, it can be formed, for example, by sputtering or the like. In that case, prior to growing the peeling layer 32 made of copper, for example, an adhesion layer (not shown) such as nickel is sputtered on the substrate 31 to promote the growth of the peeling layer 32. It can be formed uniformly.

  As described later, in the method of manufacturing a probe according to the first embodiment, the sacrificial layer can be formed using a metal material that can be etched in the step (A3) of the first step (S1). . In that case, it is preferable to use different metal materials provided with etching characteristics different from those of the peeling layer 32 and the sacrificial layer so that only the peeling layer 32 can be selectively etched out of the peeling layer 32 and the sacrificial layer.

((A2) process)
FIG. 6: is process drawing explaining the (A2) process of the 1st process of the manufacturing method of the probe of 1st Embodiment of this invention.

  In the (A2) step of the first step, as shown in FIG. 6, the fixing layer 12 is formed on a partial region of the release layer 32 on the substrate 31.

  The fixed layer 12 is an insulation used to connect the respective foot portions 3 of the plurality of probes 1 spaced apart on the same plane to each other to form one probe layer 11 as shown in FIG. 2 described above. Component of the

  Therefore, as shown in FIG. 6, the fixing layer 12 is provided, for example, in a partial region of the end of the peeling layer 32 so that the foot portions 3 of the plurality of probes 1 can be arranged later.

  In addition, the fixed layer 12 is required to connect the plurality of probes 1 of the probe layer 11 and to have a performance not to be removed together at the time of peeling of the peeling layer 32 and a sacrificial layer described later.

  Therefore, for the formation of the fixed layer 12, it is preferable to use a patternable ceramic or a heat-curable resin composition. In addition, for example, it is also possible to use a photosensitive resin composition capable of patterning using light. In such a case, the photosensitive resin composition is applied onto the release layer 32 using, for example, a coating method such as spin coating, and then exposure and development are performed to perform desired patterning. Thereafter, the fixing layer 12 can be formed in a partial region of the peeling layer 32 by heating or the like.

((A3) process)
FIG. 7: is process drawing explaining the (A3) process of the 1st process of the manufacturing method of the probe of 1st Embodiment of this invention.

  In the (A3) step of the first step, as shown in FIG. 7, the sacrificial layer 33 is formed in the region where the fixed layer 12 is not formed on the release layer 32 so as to be the same layer as the fixed layer 12. Then, in the step (A3), the fixed layer 12 and the base layer 34 composed of the sacrificial layer 33 in the same layer as the fixed layer 12 are formed on the release layer 32.

  In the base layer 34, the fixed layer 12 and the sacrificial layer 33 are preferably formed such that at least a part of the end portions facing each other are in contact with each other. And in the base layer 34, it is preferable that there is no gap between the fixed layer 12 on the release layer 32 and the sacrificial layer 33 or is very small.

  Moreover, in the base layer 34, it is preferable that the fixed layer 12 and the sacrificial layer 33 have the same thickness as each other. The fixed layer 12 and the sacrificial layer 33 preferably have the same height on the release layer 32.

  Therefore, in the step (A3) of the first step, a polishing step is provided after the formation of the sacrificial layer 33 so that the fixed layer 12 and the sacrificial layer 33 have the same height on the release layer 32. Is preferred.

  From the above, in the step (A3) of the first step, it is preferable that the fixed layer 12 and the sacrificial layer 33 of the base layer 34 formed there be arranged adjacent to each other with the same thickness. The base layer 34 having such a structure can improve the smoothness of the side surface of the plate-like probe 1 on the base layer 34 side to be formed later.

((A4) process)
FIG. 8: is process drawing explaining the (A4) process of the 1st process of the manufacturing method of the probe of 1st Embodiment of this invention.

  In the (A4) step of the first step, as shown in FIG. 8, the plate-like probe 1 is formed on the base layer 34. More specifically, the connection portion 6 and the needle tip portion 5 of the probe 1 are formed on the sacrificial layer 33 of the base layer 34, and the foot portion 3 is formed on the fixed layer 12 of the base layer 34. At this time, a part of the foot portion 3 on the side of the connecting portion 6 is disposed on the sacrificial layer 33 in the same manner as the connecting portion 6 and the like. Then, in the step (A4), a probe connector 35 composed of the base layer 34 and the probe layer 11 including a plurality of probes 1 is formed on the peeling layer 32 on the substrate 31.

  FIG. 9 is a schematic plan view showing the probe formed on the base layer in the step (A4) of the first step of the method for producing a probe of the first embodiment of the present invention.

  As shown in FIG. 9, in the step (A4), a plurality of plate-like probes 1 are formed on the base layer 34 composed of the fixed layer 12 and the sacrificial layer 33 so as to be separated from each other. Thereby, a probe layer 11 including a plurality of probes 1 is formed. Then, in the step (A4), a probe connector 35 composed of the base layer 34 and the probe layer 11 including the plurality of probes 1 is formed on the peeling layer 32 on the substrate 31 (not shown in FIG. 9).

  Although FIG. 9 shows a state in which three probes 1 are arranged on the base layer 34, the number is arbitrary. It is possible to handle the probe 1 in a state in which plural bodies are arranged on the base layer 34.

  The formation of the probe 1 in the step (A4) can be described in more detail, for example, according to the following method.

  First, a photoresist material made of a photosensitive material is applied on the base layer 34 to a uniform thickness by spin coating, for example. Thereby, a uniform photosensitive resist layer (not shown) is formed on the entire surface of the substrate 31. This resist layer is subjected to selective exposure using a mask (not shown) and exposure of a desired portion according to the pattern, and then developed. The mask has a pattern corresponding to the overall planar shape including the plurality of spaced apart probes 1.

  By transferring the pattern of the mask to the resist layer, a resist layer having a recess (not shown) is formed on the base layer 34 on the substrate 31. The recess of the resist layer has a planar shape corresponding to the overall planar shape of the plurality of probes 1 as described above. And the part corresponding to each probe 1 of the recess of a resist layer has each part corresponding to the planar shape of the foot part 3 which has the attachment end 2 shown in FIG. 1, the needle tip part 5, and the connection part 6 Is configured. The resist layer forms a resist pattern that exposes the base layer 34 on the bottom of the recess.

  Next, in step (A4), a probe material is deposited, for example, by plating in the recess of the above-described resist layer. As a result, in the step (A4), in the recess of the resist layer, the probes 1 are fixedly formed on the base layer 34 and arranged to be separated from each other.

  As the above-mentioned probe material, only one kind of material can be used, or different kinds of materials can be used in combination. For example, when using a metal material as a probe material, a single metal can be used, and an alloy can also be used. Specific examples of the metal material that can be used for the probe material include single metals such as nickel, gold, silver, tin, zinc, rhodium, and tungsten. In addition, it is possible to cite, for example, an alloy such as a nickel-phosphorus alloy, or an alloy formed by combining a plurality of single metals or alloys thereof, or the like.

  Next, after forming a plurality of probes 1 on the base layer 34 so as to be separated from each other, in the step (A4), removal of the resist layer having the above-described recess is performed. As a result, in the step (A4), as shown in FIG. 9, the plurality of probes 1 are formed so as to be fixed on the base layer 34 and arranged to be separated from each other. More specifically, the connection portion 6 and the needle tip portion 5 of each probe 1 are formed on the sacrificial layer 33 of the base layer 34, and the foot portion 3 is formed on the fixed layer 12 of the base layer 34. At this time, a part of the foot portion 3 on the side of the connecting portion 6 is disposed on the sacrificial layer 33 in the same manner as the connecting portion 6 and the like. Then, on the peeling layer 32 on the substrate 31, a probe connection body 35 composed of the base layer 34 and the probe layer 11 including the plurality of probes 1 can be formed.

((A5) process)
FIG. 10: is process drawing explaining the (A5) process of the 1st process of the manufacturing method of the probe of 1st Embodiment of this invention.

  In the (A5) step of the first step, the probe connector 35 on the substrate 31 shown in FIGS. 8 and 9 is removed from the substrate 31 to obtain the probe connector 35 as shown in FIG.

  FIG. 11 is a schematic plan view showing the probe assembly obtained in the step (A5) of the first step of the method of manufacturing a probe according to the first embodiment of the present invention.

  As shown in FIG. 11, in the probe connector 35 obtained in the step (A5), a plurality of probes 1 are provided on the base layer 34 so as to be fixed and separated from each other. More specifically, the connection portion 6 and the needle tip portion 5 of each probe 1 are disposed on the sacrificial layer 33 of the base layer 34, and the foot portion 3 is disposed on the fixed layer 12 of the base layer 34. At this time, a part of the foot portion 3 on the side of the connecting portion 6 is disposed on the sacrificial layer 33 in the same manner as the connecting portion 6 and the like.

  In the step (A5), removal of the probe connector 35 from the substrate is performed by etching. That is, in order to remove the probe connector 35 from the substrate 31, an etching process (wet etching process) using an etching solution is performed to remove the peeling layer 32 between the base layer 34 and the substrate 31. . By this etching process, it is removed from the substrate 31 to obtain a probe connector 35 as shown in FIG.

  At this time, as described above, the peeling layer 32 and the sacrificial layer 33 are made of different materials having different etching characteristics so that only the peeling layer 32 can be selectively etched away while leaving the sacrificial layer 33. Therefore, in the probe connector 35 removed from the substrate 31, the sacrificial layer 33 is stably left.

  When the release layer 32 is formed using a dry film resist, the sacrificial layer 33 can be formed using, for example, copper. In addition, when the release layer 32 is formed using, for example, copper, the sacrificial layer 33 can be formed using, for example, a dry film resist.

  By selecting such constituent materials for the peeling layer 32 and the sacrificial layer 33, the probe connection body 35 including the fixed layer 12, the sacrificial layer 33 and the plurality of probes 1 is removed from the substrate 31 and stably manufactured. can do.

((A6) process)
Next, in step (A6), as described above, it is determined whether the desired number of probe connectors 35 have been manufactured. At this time, the desired number of probe connectors 35 manufactured can be several thousands to several tens of thousands.

  Then, if the number of probe connectors 35 produced is smaller than the desired number, the process returns to the above-described (A1) step again, and (A1) steps (S1-1) to (A5) steps (S1-5) The respective steps are repeated in this order. Thereafter, in the step (A6) after the step (A5) step (S1-5), when it is determined that the number of probes connected 35 has reached the desired number, the next second step (S2) is performed. Proceed to).

[Second step (S2)]
FIG. 12: is process drawing explaining the 2nd process (S2) of the manufacturing method of the probe of 1st Embodiment of this invention.

  The 2nd process (S2) which constitutes the manufacturing method of the probe of a 1st embodiment piles up a plurality of probe coupling bodies 35 manufactured at the 1st process (S1) mentioned above. Then, a first probe laminate 36 in which a base layer 34 composed of the fixed layer 12 and the sacrificial layer 33 and a probe layer 11 including a plurality of probes 1 are alternately stacked is manufactured.

  FIG. 12 schematically shows a state in which three probe couplers 35 are stacked and viewed from the front side which is the tip 4 side of the probe 1. The number of stacked layers of the probe connector 35 is not limited to three as shown in FIG. 12, but is arbitrary, and can be, for example, on the order of tens to tens of thousands.

[Third step (S3)]
The third step (S3) constituting the method of manufacturing a probe according to the first embodiment includes each probe connection constituting the first probe laminate 36 manufactured in the second step (S2) described above. The sacrificial layer 33 contained in the base layer 34 of the body 35 is removed. The removal of the sacrificial layer 33 can be performed collectively for the plurality of sacrificial layers 33 by selective etching by wet etching or peeling treatment by a peeling agent.

  Then, the probes 1 constituting the respective probe layers 11 are arranged such that the foot portions 3 are fixedly connected by the fixing layer 12 constituting the base layer 34 and are separated from each other. Thus, the probe laminate 13 shown in FIG. 3 is formed as a second probe laminate in which the fixed layers 12 of the base layer 34 and the probe layers 11 are alternately laminated.

  By manufacturing the probe laminate 13, a plurality of probe layers 11 in which a plurality of probes 1 are arranged on the same plane can be stacked, and the plurality of probes 1 can be manufactured in a block shape. And a plurality of block-like probes 1 can be handled collectively.

  A plurality of probes 1 constituting the manufactured probe laminate 13 are mounted on the probe substrate (not shown) collectively using the attachment ends 2 of the respective foot portions 3, and a probe assembly described later Can be manufactured. That is, for each of the plurality of probes 1 contained, the probe laminate 13 can eliminate the need for a single pinning operation on the probe substrate, and can manufacture a probe assembly.

  In the probe manufacturing method of the first embodiment described above, in the first step (S1), the probe connector 35 composed of the base layer 34 including the fixed layer 12 and the sacrificial layer 33 and the probe layer 11 is desired. The number of manufactured Next, they were stacked in a second step (S2) to produce a first probe laminate 36 shown in FIG. 12 in which the base layers 34 and the probe layers 11 are alternately stacked. Thereafter, in the third step (S3), the sacrificial layer 33 included in the base layer 34 of each probe connector 35 is collectively removed to form the probe laminate 13 shown in FIG.

  At this time, in the method of manufacturing a probe according to the first embodiment, it is also possible to form the probe laminate 13 shown in FIG. 3 by a method different from the above. In another example of the method, a plurality of probe combinations in which the sacrificial layer 33 of the base layer 34 is removed in the first step to form only the fixed layer 12 and the probe layer 11 are manufactured. Then, they can be stacked in a second step to form the probe stack 13 shown in FIG. In another example of the method of manufacturing a probe according to the first embodiment, the probe stack 13 shown in FIG. 3 can be formed directly without going through the above-described third step (S3).

  In that case, in the first step (S1), after the step (A4) of forming the probe linked body 35 on the release layer 32 on the substrate 31 (S1-4: probe linked body forming step), the probe linked body Before removing the substrate 35 from the substrate 31, a process of removing only the sacrificial layer 33 from the base layer 34 is newly provided. Then, in a state in which the base layer 34 is only the fixing layer 12, a probe consisting of the fixing layer 12 and the probe layer 11 in the same step as the above-mentioned (A5) step (S1-5: probe connected body removing step). Remove the connector from the substrate 31. Thereafter, in the second step, the probe laminate 13 shown in FIG. 3 can be formed by stacking a plurality of probe linked bodies composed of the fixed layer 12 and the probe layer 11.

  Further, in the method of manufacturing the probe of the first embodiment, in FIG. 3, the tips 4 of the plurality of probes 1 are arranged at equal intervals. However, it is also possible to adjust the arrangement position of the probe tip 4 of the probe 1 in accordance with the electrode arrangement of a test object (not shown) such as an IC.

  In that case, in the step (A4) of the first step described above, the arrangement position of each probe 1 is adjusted on the base layer 34 so that each probe 1 constituting the probe layer 12 has a predetermined arrangement. The probe layer 12 is formed. That is, the arrangement position of each probe 1 is adjusted on the base layer 34 so that the arrangement position of the probe tip 4 of the probe 1 is adjusted according to the electrode arrangement of the inspection object described above, and the probe layer 12 is formed. Be done.

  In addition to the method of adjusting the arrangement position of the probe 1 in the step (A4) of the first step, the needle of the probe 1 by the method of adjusting the height of the base layer 34 in the step (A3) of the first step The placement position of tip 4 can be adjusted.

  Thus, by adjusting the arrangement position of the needle tip 4 of the probe 1 to manufacture the probe laminate 13, a plurality of blocks are formed in the probe assembly (not shown) using the probe laminate 13. The probes 1 of the present invention can come in contact with the electrodes of the object under test collectively.

  As described above, in the method for manufacturing a probe according to the first embodiment, by manufacturing the probe laminate 13, a plurality of probe layers 11 formed by arranging a plurality of probes 1 on the same plane can be stacked, and a plurality of layers can be obtained. The probe 1 can be manufactured in block form. Then, a plurality of block-shaped probes 1 can be handled collectively as a component of the probe laminate 13.

  Therefore, each of the plurality of probes 1 does not require a single pointing operation on the probe substrate, and the probe assembly can be manufactured quickly and easily.

  Then, when the probe tip 4 of the needle tip portion 5 is pressed against the electrode of the test object by the spring action derived from the spring structure of the connecting portion 6, the probe 1 is accompanied by the elastic deformation of the connecting portion 6. The needle tip 4 can be biased toward the electrode of the test subject. As a result, the probe 1 can realize highly reliable electrical connection between the tip 4 of the tip 5 and the electrode of the object under inspection by the spring action of the connecting portion 6.

Second Embodiment
<Producing Method 2>
In the method of manufacturing a probe according to the first embodiment described above, a plurality of probe linked bodies 35 shown in FIG. 10 and the like are manufactured by the first step (S1) described above. Subsequently, the first probe laminate 36 was manufactured in the above-described second step (S2), and the probe laminate 13 was manufactured in the above-described third step (S3) to obtain a plurality of probes 1.

  In the present invention, the method of producing the probe laminate 13 shown in FIG. 3 is not limited to the method of producing the probe of the first embodiment described above.

  For example, a plurality of probe connectors 35 are stacked on the substrate 31 on which the peeling layer 32 is formed. Thereafter, the plurality of probe connectors 35 are integrally removed from the substrate 31. It is also possible to implement another method of removing the sacrificial layer 33 to produce the probe stack 13.

  Hereinafter, a method of manufacturing a probe according to the second embodiment of the present invention corresponding to the above-described other method will be described.

  FIG. 13 is a flowchart for explaining a method of manufacturing a probe according to the second embodiment of the present invention.

  As shown in FIG. 13, the method of manufacturing a probe according to the second embodiment includes the following first step (S11) to fourth step (S14). Then, the probe layer 11 shown in FIG. 2 and the probe laminate 13 shown in FIG. 3 are manufactured in the same manner as the method of manufacturing the probe of the first embodiment described above. As a result, a plurality of probes 1 shown in FIG. 1 and the like can be disposed to be separated from each other and collectively formed. As shown in FIG. 1 and the like, the probe 1 to be formed includes a foot portion 3 having an attachment end 2, a needle tip portion 5 provided with a needle tip 4 at its tip, a foot portion 3 and a needle tip portion 5 It comprises including the connection part 6 connected. The connecting portion 6 has a spring structure connecting the needle tip portion 5 and the foot portion 3. Then, as described above, the probe 1 has the attachment end 2 used for attaching the probe 1 at one end, and the needle tip 4 at the other end to have a plate-like structure as a whole. Have.

  Therefore, in the following description, the same components as those of the probe 1, the probe layer 11 and the probe laminate 13 in FIGS. 1 to 3 described above and the components of the method of manufacturing the probe of the first embodiment are common. About the component, the same code | symbol is attached | subjected and the overlapping description is abbreviate | omitted.

[First Step (S11)]
The first step (S11) of the method of manufacturing the probe of the second embodiment is a step of forming a peeling layer on the substrate, and the step (S1) of the first step (S1) of the method of manufacturing the probe of the first embodiment. A1) It becomes a process similar to a process (S1-1: exfoliation layer formation process).

  That is, the first step (S11) is the same as the step (A1) of the first step (S1) of the method of manufacturing the probe of the first embodiment shown in FIG. That is, in the first step (S11), as the substrate 31, for example, a silicon crystal substrate whose surface is mirror-finished by etching is prepared, and the peeling layer 32 is formed on the substrate 31. As described above, the peeling layer 32 can be formed, for example, using a dry film resist, and in addition to copper, select and use an etchable metal material such as an alloy of copper and nickel. Is also possible.

[Second step (S12)]
In the second step (S12) of the method of manufacturing a probe according to the second embodiment, a plurality of probe connectors 35 are stacked on the release layer 32 of the substrate 31 manufactured in the above-described first step (S11). The third probe laminate 41 is manufactured.

  FIG. 14: is process drawing explaining the 2nd process of the manufacturing method of the probe of 2nd Embodiment of this invention.

  The second step (S12) of the method for manufacturing a probe according to the second embodiment uses the substrate 31 on which the peeling layer 32 is formed, and performs the following (B1) steps (S12-1) to (B3) steps (S12-) This is a process of repeating 3) a plurality of times in this order. Then, it is possible to laminate and manufacture a desired plurality of stages of probe connectors 35 on the peeling layer 32 of the substrate 31.

(B1) Step Using the substrate 31 on which the release layer 32 is formed in the first step (S11) described above, a step of forming the fixed layer 12 in a partial region on the release layer 32 (S12-1: fixed layer Formation process)
Step (B2) By using the substrate 31 on which the fixed layer 12 is formed in the step (B1), the sacrificial layer 33 is formed in the same layer as the fixed layer 12 in the region on the release layer 32 where the fixed layer 12 is not formed. Forming the base layer 34 including the fixed layer 12 and the sacrificial layer 33 on the release layer 32 (S12-2: base layer forming step)
Step (B3) Step On the base layer 34 formed in the step (B2), a plurality of plate-like probes 1 are formed to be separated from each other to form a probe layer 11 including the plurality of probes 1. Step of forming a probe connector 35 composed of the layer 34 and the probe layer 11 (S12-3: probe connector forming step)

  The above-mentioned (B1) step (S12-1: fixed layer forming step) is the (A2) step (S1-2) of the first step (S1) of the method of manufacturing the probe of the first embodiment of FIG. 6 described above. This step is the same as the fixed layer forming step). Further, the above-mentioned step (B2) (S12-2: base layer forming step) is the step (A3) (S1-step) of the first step (S1) of the method of manufacturing the probe of the first embodiment of FIG. 7 described above. 3: The same step as the base layer forming step).

  Further, the above-mentioned step (B3) (S12-3: a step of forming a probe connection body) is the step (A4) (S1) of the first step (S1) of the method of manufacturing the probe of the first embodiment of FIG. -4: This step is the same as the step of forming a probe conjugate.

  For example, in the step (B1) of the second step (S12), as shown in FIG. 6, in the step (S12-1), the fixed layer 12 is peeled off so that the foot portions 3 of the plurality of probes 1 can be arranged later. It is provided in a partial area of the layer 32. In addition, the fixing layer 12 is required not to be removed together at the time of peeling of the peeling layer 32 and the sacrificial layer later.

  In the step (B12) (S12-2), as shown in FIG. 7, the sacrificial layer 33 is formed in the same area as the fixed layer 12 in the region where the fixed layer 12 is not formed on the release layer 32. Then, a base layer 34 composed of the fixed layer 12 and the sacrificial layer 33 is formed.

  At this time, in the base layer 34, the fixed layer 12 and the sacrificial layer 33 are preferably formed such that at least a part of the end portions facing each other are in contact with each other. And in the base layer 34, it is preferable that there is no gap between the fixed layer 12 on the release layer 32 and the sacrificial layer 33 or is very small.

  Moreover, in the base layer 34, it is preferable that the fixed layer 12 and the sacrificial layer 33 have the same thickness as each other. The fixed layer 12 and the sacrificial layer 33 preferably have the same height on the release layer 32.

  Therefore, in the (B2) step (S12-2), a polishing step is provided after the formation of the sacrificial layer 33 so that the fixed layer 12 and the sacrificial layer 33 have the same height on the release layer 32. Is preferred.

  From the above, in the (B2) step (S12-2), it is preferable that the fixed layer 12 and the sacrificial layer 33 of the base layer 34 formed there be adjacent to each other with the same height. The base layer 34 having such a structure can improve the smoothness of the side surface of the plate-like probe 1 on the base layer 34 side to be formed later.

  Further, in the step (B3) (S12-3), as shown in FIG. 8, the plate-like probe 1 is formed on the base layer 34. More specifically, the connection portion 6 and the needle tip portion 5 of the probe 1 are formed on the sacrificial layer 33 of the base layer 34, and the foot portion 3 is formed on the fixed layer 12 of the base layer 34. At this time, a part of the foot portion 3 on the side of the connecting portion 6 is disposed on the sacrificial layer 33 in the same manner as the connecting portion 6 and the like.

  As described above, in the step (B12) (S12-3), as shown in FIG. 9, the plurality of plate-like probes 1 are formed on the base layer 34 so as to be separated from each other. A probe layer 11 including 1 is formed. And (B3) process (S12-3) forms the probe coupling body 35 which consists of the base layer 34 and the probe layer 11 containing the some probe 1 on the peeling layer 32 on the board | substrate 31. FIG.

  Then, in the second step (S12), as shown in FIG. 13, after (B3) step (S12-3), the number of probe conjugates desired in the determination step (S12-4) of (B4) A determination is made as to whether or not is produced on the release layer 32 of the substrate 31.

  If the number of probe linkages 35 produced is less than the desired number (S12-4: NO), the process returns to the (B1) step (S12-1) again, and the (B1) step (S12-1) to (S12-1) B3) Each step of step (S12-3) is repeated in this order. Then, a plurality of probe connectors 35 are stacked and manufactured on the peeling layer 32 of the substrate 31.

  In the (B1) steps (S12-1) to (B3) steps (S12-3) of the repeated second step (S12), in the second and subsequent (B1) steps (S12-1), fixation is performed. The layer 12 is formed on the probe layer 11 of the probe connector 35 formed in the previous step (B3) step (S12-3). Similarly, in the second and subsequent (B2) steps (S12-2), the sacrificial layer 33 is the probe layer 11 of the probe connector 35 formed in the previous (B3) step (S12-3). Formed on.

  More specifically, in the (B1) step (S12-1) of the second and subsequent times of the repeated second step (S12), the fixed layer 12 is formed of the probe connector 35 formed in the previous round. It is formed on the arrangement region of the foot portion 3 of the probe 1 in the probe layer 11. In the second and subsequent (B2) steps (S12-2), the connection portion 6 and the tip of the probe 1 of the probe layer 11 of the probe connection body 35 formed in the previous step is the sacrificial layer 33. It is formed on the arrangement area of the part 5.

  Therefore, in the second and subsequent steps of the repeated second step (S12), the fixed layer 12 and the sacrificial layer 33 of the base layer 34 are formed on the probe layer 11 of the probe connector 35 formed in the previous round. Preferably, they are arranged adjacent to each other with the same height.

  Thus, in the second step (S12), the steps (B1) to (S12-1) to (B3) are repeated a plurality of times in this order. Then, as described above, the third probe laminate 41 configured by laminating a plurality of probe linked bodies 35 including the base layer 34 and the probe layer 11 on the peeling layer 32 of the substrate 31 is manufactured.

  Then, if it is determined in the determination step (S12-4) of (B4) after the step (B12) step (S12-3) that it is determined that the number of manufactured probe conjugates 35 has reached the desired number (S12) -4: YES), proceed to the next third step (S13).

[Third step (S13)]
The third step (S13) of the method of manufacturing a probe according to the second embodiment uses the third probe laminate 41 manufactured in the second step (S12) described above, and then the substrate 31 is removed and the fourth step is performed. Manufacturing a probe laminate of

  The removal of the substrate 31 from the third probe laminate 41 is performed by the same method as the step (A5) of the first step (S1) of the method of manufacturing the probe of the first embodiment shown in FIGS. 10 and 11. It can be carried out. That is, in the third probe laminate 41 of FIG. 14, the removal of the substrate 31 is performed by the same etching process as the (A5) step of the first step (S1) of the method of manufacturing the probe of the first embodiment described above. It can be carried out. This etching process provides a fourth probe laminate.

  The fourth probe laminate has a structure similar to that of the first probe laminate 36 shown in FIG. Therefore, in the probe manufacturing method of the second embodiment, the first probe laminate 36 shown in FIG. 12 and the like can be manufactured as the fourth probe laminate in the third step (S13).

[Fourth step (S14)]
The 4th process (S14) which constitutes the manufacturing method of a probe of a 2nd embodiment removes sacrificial layer 33 from the 4th probe layered product. That is, in the fourth step (S14), the base layer 34 of the probe connector 35 is produced from the fourth probe laminate formed by laminating the plurality of probe connectors 35 manufactured in the third step (S13). The sacrificial layer 33 included in the The removal of the sacrificial layer 33 can be performed by selective etching by wet etching or a peeling process by a peeling agent, as in the third step (S3) of the method of manufacturing a probe according to the first embodiment described above. Then, the plurality of sacrificial layers 33 can be performed collectively.

  Then, the probes 1 constituting the respective probe layers 11 are arranged such that the foot portions 3 are fixedly connected by the fixing layer 12 and connected, and are separated from each other. Thus, the probe shown in FIG. 3 as a fifth probe laminate formed of the fixed layer 12 constituting the base layer 34 and the probe layer 11 and alternately laminated. The laminate 13 can be formed.

  A plurality of probes 1 constituting the manufactured probe laminate 13 are mounted on the probe substrate (not shown) collectively using the attachment ends 2 of the respective foot portions 3, and a probe assembly described later Can be manufactured. That is, for each of the plurality of probes 1 contained, the probe laminate 13 can eliminate the need for a single pinning operation on the probe substrate, and can manufacture a probe assembly.

  As described above, in the method of manufacturing a probe according to the second embodiment, by manufacturing the probe laminate 13, a plurality of probe layers 11 formed by arranging a plurality of probes 1 on the same plane can be overlapped, and a plurality of The probe 1 can be manufactured in block form. Then, the plurality of block-shaped probes 1 can be handled collectively as a component of the probe laminate 13.

  Therefore, each of the plurality of probes 1 does not require a single pointing operation on the probe substrate, and the probe assembly can be manufactured quickly and easily.

  In FIG. 3, although the tips 4 of the plurality of probes 1 are arranged at equal intervals, as in the method of manufacturing the probe according to the first embodiment described above, an object to be inspected such as an IC (shown It is also possible to adjust the placement position of the tip 4 of the probe 1 in accordance with the electrode placement of For example, in addition to the method of adjusting the arrangement position of the probe 1 in the step (B3) of the second step, the needle of the probe 1 by the method of adjusting the height of the base layer 34 in the step (B2) of the second step The placement position of tip 4 can be adjusted. Thus, by adjusting the arrangement position of the needle tip 4 of the probe 1 to manufacture the probe laminate 13, a plurality of blocks are formed in the probe assembly (not shown) using the probe laminate 13. The probes 1 of the present invention can come in contact with the electrodes of the object under test collectively. At this time, in the probe 1, the connection portion 6 connecting the foot portion 3 and the needle tip portion 5 has a spring structure, so that good contact with the electrode of the test object can be realized.

Third Embodiment
<Probe Assembly>
The probe assembly of the third embodiment of the present invention is characterized by including the probe 1 of FIG. 1 manufactured by the method of manufacturing the probe of the first embodiment described above or the method of manufacturing the probe of the second embodiment. .

  The probe assembly of the third embodiment is, as described later, the probe laminate 13 of FIG. 3 manufactured by any of the method of manufacturing the probe of the first embodiment and the method of manufacturing the probe of the second embodiment. Manufactured using

  FIG. 15 is a side view schematically showing a probe assembly according to a third embodiment of the present invention.

  As shown in FIG. 15, in the probe assembly 100 according to the third embodiment, a wiring board 112 having a circular plan shape as a whole, and a rectangular planar probe board attached to the center of the lower surface 112a of the wiring board 112. And a plurality of probes 1 attached to one surface 114 a of the probe substrate 114.

  In probe assembly 100, each probe 1 stands with its foot portion 3 on the respective connection (not shown) of the corresponding conductive path (not shown) formed on one surface 114a of probe substrate 114. It is installed and fixed.

  As described above, each probe 1 is manufactured by any of the method of manufacturing the probe of the first embodiment and the method of manufacturing the probe of the second embodiment. Therefore, each of the probes 1 has a fixed layer for connecting them in the foot portion 3, but illustration is omitted in FIG. Also, as described above, in the probe assembly 100 of the third embodiment, after the probe 1 is attached to the probe substrate 114 using the probe laminate 13 of FIG. 3, the fixing layer 12 is removed and the probe 1 is fixed. A structure without the layer 12 is also possible.

  In the probe assembly 100, the probe substrate 114 is fixed to the wiring substrate 112 with the surface opposite to the one surface 114a on which the probe 1 is provided facing the lower surface 112a of the wiring substrate 112.

  The wiring substrate 112 is made of an electrically insulating material in which a conductive path (not shown) is incorporated. A large number of tester lands (not shown) serving as connection ends to a tester (not shown) are provided on the periphery of the upper surface of the wiring substrate 112. Each probe 1 of the probe substrate 114 attached to the wiring substrate 112 passes through the corresponding conductive path of the probe substrate 114 and the corresponding conductive path in the wiring substrate 112 to the corresponding tester land of the wiring substrate 112 described above. Connected. Thus, each probe 1 is electrically connected to the above-described tester through the corresponding tester land of the wiring substrate 112.

  Then, the probe assembly 100 is used in an electrical test for testing an object to be inspected (not shown) such as an IC. The object to be inspected is electrically connected to a tester, which is a test means, through a probe assembly 100, which is an electrical connection device.

  In the probe assembly 100, when the needle tip of the needle tip 5 is pressed against the electrode of the test object by the spring action derived from the spring structure of the connection portion 6, the probe 1 elastically deforms the connection portion 6. Accordingly, the needle tip of the needle tip 5 can be biased toward the electrode of the test object. As a result, the probe 1 can realize highly reliable electrical connection between the needle tip of the needle tip 5 and the electrode of the test object by the spring action of the connecting portion 6.

Fourth Embodiment
<Method of Manufacturing Probe Assembly>
In the method of manufacturing a probe assembly of the fourth embodiment of the present invention, the probe lamination of FIG. 3 manufactured by any of the method of manufacturing the probe of the first embodiment and the method of manufacturing the probe of the second embodiment described above. The body 13 is used. Then, for example, the probe assembly 100 of the above-described third embodiment shown in FIG. 15 can be manufactured.

  FIG. 16 is a process diagram for explaining a method of manufacturing a probe assembly according to the fourth embodiment of the present invention.

  In the method of manufacturing a probe assembly according to the fourth embodiment, a plurality of probes 1 of FIG. 1 constituting the probe laminate 13 are used collectively. That is, as shown in FIG. 16, a probe laminate 13 composed of a plurality of probes 1 is used, and the attachment end 2 of the foot portion 3 of each of the plurality of probes 1 contained therein is used. Then, for example, the probe laminate 13 can be integrally erected on the probe substrate 114, and can be used for manufacturing the probe assembly 100 of the third embodiment shown in FIG.

  The electrical connection between the respective connection portions (not shown) of the conductive paths (not shown) of the probe substrate 114 and the respective probes 1 constituting the probe laminate 13 is bonding by a conductive bonding material such as solder, laser Can be performed by a method such as welding.

  In the method of manufacturing the probe assembly of the fourth embodiment, it is also possible to remove the fixing layer 12 constituting the probe laminate 13 of FIG. 3 after the probe assembly 100 is manufactured.

  As described above, in the method of manufacturing the probe assembly of the fourth embodiment, the probe assembly 13 eliminates the need for the needle setting operation on the probe substrate 114 for each one of the multiple probes 1 using the probe laminate 13. 100 can be manufactured.

  The scope of rights of the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the present invention.

1, 1000 probe 2 attachment end 3, 1002 foot portion 4 needle tip 5, 1004 needle tip portion 6 connection portion 11 probe layer 12 fixing layer 13 probe laminate 31 substrate 32 peel layer 33 sacrificial layer 34 base layer 35 probe coupled body 36 First probe laminate 41 third probe laminate 100 probe assembly 112 wiring substrate 112 a lower surface 114 probe substrate 114 a surface 1001 base 1003 arm portion

Claims (9)

(A1) forming a release layer on a substrate,
(A2) forming a fixed layer in a partial region on the release layer,
(A3) forming a sacrificial layer in the same layer as the fixed layer on the release layer, thereby forming a base layer including the fixed layer and the sacrificial layer;
(A4) forming a plurality of plate-like probes on the base layer to form a probe layer, thereby forming a probe assembly comprising the base layer and the probe layer on the release layer; (A5) removing the probe assembly from the release layer on the substrate;
A first step of manufacturing a plurality of the probe conjugates by repeating the above steps (A1) to (A5) in this order a plurality of times;
A second step of manufacturing a first probe laminate in which the plurality of probe assemblies are stacked, and the base layer and the probe layers are alternately stacked;
By removing the sacrificial layer contained in the base layer from the first probe laminate, a second probe laminate is formed by alternately laminating the fixed layer of the base layer and the probe layer. And a third step of
A method of manufacturing a probe, comprising: forming a plurality of the probes connected by the fixed layer and spaced apart from each other.   The fixed layer and the sacrificial layer of the base layer formed in the step (A3) of the first step are disposed adjacent to each other with the same height on the release layer. The method for producing a probe according to claim 1, characterized in that The probe includes a foot portion having an attachment end, a needle tip portion having a needle tip at a tip end, and a connection portion connecting the foot portion and the needle tip portion, the attachment end at one end portion A generally plate-like probe having the needle tip at the other end,
In the (A4) step of the first step, the foot portion of the probe is formed on the fixed layer, and the needle tip portion is formed on the sacrificial layer. Or the manufacturing method of the probe as described in 2.   In the step (A4) of the first step, the arrangement positions of the probes are adjusted on the base layer so that the probes of the probe layer are at predetermined arrangement positions, and the probe layers are formed. The method for producing a probe according to any one of claims 1 to 3, characterized in that The method according to claim 3, wherein the connecting portion of the probe has a spring structure connecting the needle tip portion and the foot portion. A first step of forming a release layer on a substrate;
Using the substrate on which the release layer is formed, (B1) forming a fixed layer, (B2) forming a sacrificial layer in the same layer as the fixed layer to form a base layer comprising the fixed layer and the sacrificial layer And (B3) forming a plurality of plate-like probes on the base layer to form a probe layer, thereby forming a probe assembly consisting of the base layer and the probe layer. Are repeated a plurality of times in the order of (B1) to (B3) to produce a third probe laminate in which a plurality of probe linked bodies are laminated on the release layer of the substrate. Process,
A third step of manufacturing a fourth probe laminate by removing the third probe laminate from the substrate;
A fifth probe laminate in which the fixed layers of the base layer and the probe layers are alternately laminated by removing the sacrificial layer contained in the base layer from the fourth probe laminate. And forming a fourth step,
A method of manufacturing a probe, comprising: forming a plurality of the probes connected by the fixed layer and spaced apart from each other.   The fixed layer and the sacrificial layer of the base layer formed in the step (B2) of the second step are arranged to be adjacent to each other with the same height. The manufacturing method of the probe as described in 6. The probe includes a foot portion having an attachment end, a needle tip portion having a needle tip at a tip end, and a connection portion connecting the foot portion and the needle tip portion, the attachment end at one end portion A generally plate-like probe having the needle tip at the other end,
In the step (B3) of the second step, the foot portion of the probe is formed on the fixed layer, and the needle tip portion is formed on the sacrificial layer. The manufacturing method of the probe as described in or 7. The method according to claim 8, wherein the connecting portion of the probe has a spring structure connecting the needle tip portion and the foot portion.

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