JP2001007167A - Manufacture of substrate for inspection - Google Patents

Abstract

PROBLEM TO BE SOLVED: To securely connect the probe terminal provided on a membrane sheet and the wiring layer of a wiring board. SOLUTION: On the edge of a wiring board 10, there are four positioning means 13 in the plane direction or the like which determine the position in the plane direction of a membrane sheet 11 with high accuracy, a positioning means 14 in the peripheral direction which determines the position of the membrane sheet 11 in the peripheral direction with high accuracy, and two securing means 15 or the like which secure the membrane sheet 11 to the wiring board 10. After determining the position in the plane direction of the membrane sheet 11 relative to the wiring board 10 by using the positioning means 13 in the plane direction, the position in the peripheral direction of the membrane sheet 11 relative to the wiring board 10 is determined by using the positioning means 14 in the peripheral direction, and then the membrane sheet 11 is secured to the wiring board 10 by using the securing means 15.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of applying a voltage to each inspection electrode of a plurality of semiconductor integrated circuit elements formed on a semiconductor wafer to change the electrical characteristics of the plurality of semiconductor integrated circuit elements in a wafer state. The present invention relates to a method for manufacturing an inspection substrate for inspecting all at once.

[0002]

2. Description of the Related Art Conventionally, in a semiconductor integrated circuit device, after a semiconductor integrated circuit element and a lead frame are electrically connected by a bonding wire, the semiconductor integrated circuit element and a lead of the lead frame are sealed with resin or ceramic. It was supplied in a state where it was mounted on a printed circuit board.

However, in response to demands for miniaturization and cost reduction of electronic equipment, a method of mounting a semiconductor integrated circuit element on a circuit board in a bare chip state as cut out from a semiconductor wafer has been developed. For this reason, it is desired to reduce the inspection cost of bare chips and to supply bare chips of guaranteed quality at low prices.

[0004] Therefore, it has been proposed to burn-in semiconductor wafers collectively, and has been attracting attention as an effective method for reducing inspection costs and supplying bare chips whose quality is guaranteed.

For this reason, a plurality of semiconductor integrated circuits formed on a semiconductor wafer are formed using a test substrate having probe terminals connected to respective test electrodes of a plurality of semiconductor integrated circuit elements formed on the semiconductor wafer. Inspection methods for performing burn-in on circuit elements at once in a wafer state are being put to practical use.

Hereinafter, a conventional inspection substrate will be described with reference to FIG.
Description will be made with reference to (a) and (b). FIG.
5A shows a planar structure of the inspection substrate, and FIG. 5B shows a cross-sectional structure taken along line Vb-Vb in FIG. 5A.

Wiring board 1 having a wiring layer formed on the upper surface
A membrane sheet 3 is disposed on the upper surface of the semiconductor sheet with an anisotropic conductive rubber sheet 2 interposed therebetween. On the upper surface of the membrane sheet 3, each inspection electrode of a plurality of semiconductor integrated circuit elements formed on a semiconductor wafer is provided. And a number of probe terminals (not shown) connected to the probe terminals.

[0008] The peripheral edge of the membrane sheet 3 is fixed to a fixing ring 4. The fixing ring 4 is fixed to the wiring board 1 by a tape 5 having heat resistance, so that the membrane sheet 3 is fixed to the wiring board 1. Is held in.

The back surface (lower surface) of the probe terminal provided on the membrane sheet 3 and the wiring layer of the wiring board 1 are electrically connected via the anisotropic conductive rubber sheet 2.
In the anisotropic conductive rubber sheet 2, the conductive particles are provided continuously in a direction perpendicular to the in-plane direction, or the conductive wires are provided so as to extend in a direction perpendicular to the in-plane direction. The probe terminals and the wiring layer are electrically connected via the anisotropic conductive rubber sheet 2.

An operator visually or by using a microscope so that the back surface of the probe terminal of the membrane sheet 3 and the wiring layer of the wiring board 1 are electrically connected through the anisotropic conductive rubber sheet 2. The alignment of the membrane sheet 3 with the anisotropic conductive rubber sheet 2 and the wiring board 1 is performed.

[0011]

However, as described above, a method of aligning the membrane sheet 3 with the anisotropic conductive rubber sheet 2 and the wiring board 1 visually or by using a microscope. According to this, it is difficult to reliably connect a large number of probe terminals provided on the membrane sheet 3 to the wiring layer of the wiring board 1. In particular, as the number of test electrodes formed on the semiconductor wafer increases and the pitch of the test electrodes and thus the pitch of the probe terminals become smaller, each probe terminal of the membrane sheet 3 is connected to each of the wiring substrates 1. It becomes impossible to reliably connect to the wiring layer.

Further, the membrane sheet 3 positioned with respect to the anisotropic conductive rubber sheet 2 and the wiring board 1
Is fixed to the wiring board 1 by the tape 5, but during the transportation of the inspection substrate or during the burn-in inspection of the semiconductor integrated circuit device using the inspection substrate in the burn-in apparatus, the membrane sheet 3 Is displaced with respect to the wiring board 1.

Further, the operation of fixing the membrane sheet 3 to the wiring board 1 with the tape 5 requires a lot of time, and there is a problem in the durability of the tape 5.

Further, the membrane sheet 3 and the wiring board 1
Is exposed to a high temperature at the time of burn-in, the probe terminals of the membrane sheet 3 and the wiring layer of the wiring board 1 are displaced due to a difference in the coefficient of thermal expansion between the membrane sheet 3 and the wiring board 1. However, there is a problem that a stable contact cannot be obtained.

Since the membrane sheet 3, the anisotropic conductive rubber sheet 2 and the wiring board 1 are positioned relative to each other by using a jig, after being assembled as an inspection board, the inspection board and the semiconductor There is a problem that a lot of time is required until the wafer is aligned with the wafer.

Further, there is a problem that the inspection board formed by assembling the membrane sheet 3, the anisotropic conductive rubber sheet 2 and the wiring board 1 is warped.

In view of the above, it is a first object of the present invention to reliably connect a probe terminal provided on a membrane sheet to a wiring layer of a wiring board, and to provide a wiring between a probe terminal of the membrane sheet and a wiring board. The second object is to prevent the layers from being displaced from each other, and the third object is to simplify the mutual positioning of the wiring board, the anisotropic conductive rubber sheet and the membrane sheet. It is a fourth object of the present invention to be able to correct the warpage of the substrate.

[0018]

A first method of manufacturing a test substrate according to the present invention achieves the first object, and includes a method of manufacturing a plurality of semiconductor integrated devices formed on a semiconductor wafer. The present invention is directed to a method of manufacturing a test substrate for applying a voltage to each test electrode to collectively test the electrical characteristics of the plurality of semiconductor integrated circuit devices in a wafer state. A membrane sheet having probe terminals at positions corresponding to the electrodes for wiring is placed on a wiring board on which a wiring layer is formed and a plane direction positioning means for positioning the position of the membrane sheet in the plane direction with high precision at the periphery is provided. Arranging the membrane sheet in the plane direction with respect to the wiring board by using the plane direction positioning means; and fixing the membrane sheet to the wiring board. It is equipped with a door.

According to the first method of manufacturing the inspection board, the position of the membrane sheet in the plane direction is accurately determined by using the plane direction positioning means provided on the peripheral portion of the wiring board. Can be reliably connected to a large number of probe terminals provided on the wiring board and the wiring layer of the wiring board. Also, even if the number of test electrodes formed on the semiconductor wafer increases and the pitch of the test electrodes and thus the pitch of the probe terminals decreases,
The probe terminals of the membrane sheet and the wiring layer of the wiring board can be reliably connected.

In the first method of manufacturing a test substrate, the planar direction positioning means is a positioning pin or hole,
Holes or pins corresponding to the positioning pins or holes are provided on the peripheral edge of the membrane sheet, and the holes or pins of the membrane sheet are fitted into the positioning pins or holes of the wiring board to thereby form the membrane. It is preferable to position the sheet in the plane direction with respect to the wiring board.

In this way, the probe terminals of the membrane sheet and the wiring layer of the wiring board can be easily and reliably connected.

A second method of manufacturing a test substrate according to the present invention achieves the first object, and comprises applying a voltage to each test electrode of a plurality of semiconductor integrated devices formed on a semiconductor wafer. To inspect the electrical characteristics of a plurality of semiconductor integrated circuit elements in a wafer state at the same time. Disposing a membrane sheet having probe terminals on a wiring board on which a wiring layer is formed and having a circumferential positioning means for positioning a circumferential position of the membrane sheet at a peripheral edge with high accuracy; Using a positioning means, the step of circumferentially positioning the membrane sheet with respect to the wiring board,
Fixing the membrane sheet to the wiring board.

According to the second method of manufacturing the inspection board, the circumferential position of the membrane sheet is accurately positioned using the circumferential positioning means provided on the peripheral edge of the wiring board. Can be reliably connected to a large number of probe terminals provided on the wiring board and the wiring layer of the wiring board. Further, even if the number of test electrodes formed on the semiconductor wafer increases and the pitch of the test electrodes and thus the pitch of the probe terminals decrease, the probe terminals of the membrane sheet and the wiring layer of the wiring board can be reliably connected. Can be connected.

A third method of manufacturing a test substrate according to the present invention achieves the second object, and comprises applying a voltage to each test electrode of a plurality of semiconductor integrated devices formed on a semiconductor wafer. To inspect the electrical characteristics of a plurality of semiconductor integrated circuit elements in a wafer state at the same time. Disposing a membrane sheet having probe terminals at a predetermined position in a central portion of a wiring board having a wiring layer formed thereon and having a fixing means for fixing the membrane sheet with high precision at a peripheral portion; Fixing to the wiring board.

According to the third method for manufacturing a substrate for inspection, since the fixing means is provided on the periphery of the wiring board, the membrane sheet can be fixed to the wiring board with high accuracy and reliability. At the same time, it is possible to prevent a situation in which the probe terminals of the membrane sheet and the wiring layer of the wiring board are displaced during the transportation of the inspection substrate or during the inspection process for the semiconductor wafer.

Further, since the membrane sheet is securely fixed to the wiring board, the probe terminals of the membrane sheet and the wiring layer of the wiring board are displaced even if the coefficient of thermal expansion between the membrane sheet and the wiring board is different. Never.

Therefore, a stable contact between the probe terminal of the membrane sheet and the wiring layer of the wiring board can be secured.

In the first to third methods for manufacturing a test substrate, it is preferable that the wiring substrate comprises a rigid substrate having rigidity and a thin substrate having a wiring layer and integrated with the rigid substrate.

In this case, by forming the rigid substrate from a material having a low thermal expansion coefficient, the thermal expansion of the wiring substrate can be suppressed.

In this case, the thin substrate is provided with electronic components electrically connected to the wiring layer, and the rigid substrate is provided with a storage portion capable of storing the electronic components. It is preferable that the electronic component is integrated with the substrate while being stored in the storage section.

This eliminates the need to provide electronic components on the surface of the wiring board, thus improving the degree of freedom in designing the wiring layer on the surface of the wiring board.

A fourth method of manufacturing a test substrate according to the present invention achieves the above third object, and comprises applying a voltage to each test electrode of a plurality of semiconductor integrated devices formed on a semiconductor wafer. To inspect the electrical characteristics of a plurality of semiconductor integrated circuit elements in a wafer state in a batch, and to provide a method of manufacturing an inspection substrate, having a wiring layer on an assembly substrate having positioning pins, A step of disposing a wiring board having a positioning hole at a position corresponding to the positioning pin with the positioning pin inserted through the positioning hole; and a step of disposing an anisotropic conductive rubber sheet at a predetermined position on the wiring board. Disposing a membrane sheet having a probe terminal at a position corresponding to each inspection electrode of a plurality of semiconductor integrated circuit elements at a predetermined position on the conductive rubber sheet; After assembling the test substrate by integrating the rubber sheet and the membrane sheet, and a step of removing the substrate the inspection from the assembly board.

According to the fourth inspection board manufacturing method, the wiring board can be easily and reliably positioned with respect to the assembly board by inserting the positioning pins of the assembly board into the positioning holes of the wiring board. By positioning the conductive rubber sheet and the membrane sheet with respect to the assembly substrate, the mutual positioning of the wiring board, the anisotropic conductive rubber sheet and the membrane sheet can be performed easily and without relying on an operator's visual observation or a microscope. It can be performed reliably.

A fifth method of manufacturing a test substrate according to the present invention achieves the third object, and comprises applying a voltage to each test electrode of a plurality of semiconductor integrated devices formed on a semiconductor wafer. To inspect the electrical characteristics of a plurality of semiconductor integrated circuit elements in a wafer state at once by applying a wiring layer to a predetermined position on an assembly substrate having positioning pins. Arranging the wiring board having the, and, on the wiring board, the anisotropic conductive rubber sheet in a state where the positioning pins are inserted into the positioning holes of the anisotropic conductive rubber sheet having the positioning holes at positions corresponding to the positioning pins. By arranging, the step of positioning the anisotropic conductive rubber sheet with respect to the wiring board and the step of corresponding to the inspection electrodes of the plurality of semiconductor integrated circuit elements at predetermined positions on the anisotropic conductive rubber sheet. A step of arranging a membrane sheet having a probe terminal at a position, and a step of removing the inspection board from the assembly board after assembling the inspection board by integrating the wiring board, anisotropic conductive rubber sheet and the membrane sheet. It has.

According to the fifth method of manufacturing the inspection board, the positioning pin of the assembly board is inserted into the positioning hole of the anisotropic conductive rubber sheet, so that the anisotropic conductive rubber sheet can be easily mounted on the assembly board. And because it can be positioned reliably,
By positioning the wiring board and the membrane sheet with respect to the assembling board, the wiring board, the anisotropic conductive rubber sheet and the membrane sheet can be easily and reliably positioned relative to each other without a visual check by an operator or relying on a microscope. be able to.

A sixth method of manufacturing an inspection substrate according to the present invention achieves the third object, and comprises applying a voltage to each inspection electrode of a plurality of semiconductor integrated devices formed on a semiconductor wafer. To inspect the electrical characteristics of a plurality of semiconductor integrated circuit elements in a wafer state at once by applying a wiring layer to a predetermined position on an assembly substrate having positioning pins. Arranging a wiring board having, and arranging an anisotropic conductive rubber sheet at a predetermined position on the wiring board; and, on the anisotropic conductive rubber sheet, each inspection electrode of a plurality of semiconductor integrated circuit elements. By arranging the membrane sheet with the positioning pins inserted through the positioning holes of the membrane sheet having the probe terminals at the corresponding positions and having the positioning holes at the positions corresponding to the positioning pins After positioning the membrane sheet with respect to the anisotropic conductive rubber sheet, assembling the wiring board, the anisotropic conductive rubber sheet and the membrane sheet to assemble the inspection board, and removing the inspection board from the assembly board And a process.

According to the sixth inspection board manufacturing method, the membrane sheet can be easily and reliably positioned with respect to the assembly board by inserting the positioning pins of the assembly board into the positioning holes of the membrane sheet. By positioning the substrate and the anisotropic conductive rubber sheet with respect to the assembling substrate, the mutual positioning of the wiring substrate, the anisotropic conductive rubber sheet and the membrane sheet can be performed easily and visually without relying on the operator or relying on a microscope. It can be performed reliably.

A seventh method of manufacturing a substrate for inspection according to the present invention achieves the fourth object, wherein a voltage is applied to each inspection electrode of a plurality of semiconductor integrated devices formed on a semiconductor wafer. For manufacturing a test substrate for collectively testing the electrical characteristics of a plurality of semiconductor integrated circuit elements in a wafer state by applying a pressure, and an assembly substrate having a screw member that advances and retreats in a direction perpendicular to the substrate surface. Arranging a rigid substrate having a screw hole screwed with a screw member, and a wiring substrate having a wiring layer, an anisotropic conductive rubber sheet, and a plurality of semiconductor integrated circuit elements on the rigid substrate. A step of sequentially arranging a membrane sheet having a probe terminal at a position corresponding to each test electrode, and a step of assembling a test board by integrating a rigid substrate, a wiring board, an anisotropic conductive rubber sheet and a membrane sheet. Removing the test board from the test board by correcting the warp of the test board by screwing the screw member of the test board into the screw hole of the rigid board and moving the test board relative to the test board. Have.

According to the seventh manufacturing method of the inspection board, the screw member provided on the assembly board is screwed into the screw hole of the rigid board and is advanced and retracted with respect to the assembly board, so that the warping of the inspection board is achieved. After the correction, the board for inspection is removed from the board for assembly, so that the warpage of the board for inspection can be easily and reliably corrected.

[0040]

DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) Hereinafter, an inspection substrate and a method for manufacturing the same according to a first embodiment of the present invention will be described with reference to FIG.

As shown in FIG. 1, a membrane sheet 11 is disposed on a wiring board 10 having a wiring layer via an anisotropic conductive rubber sheet (not shown). The membrane sheet 11 has a probe terminal 11a at a position corresponding to each inspection electrode of a plurality of semiconductor integrated circuit devices to be inspected.
1 is held by a rigid ring 12.

At the periphery of the wiring board 10, there are provided, for example, four plane-direction positioning means 13 for positioning the position of the membrane sheet 11 in the plane direction with high accuracy (range of several μm to several tens μm). Each planar direction positioning means 13 includes a fixed portion 13a fixed to the wiring board 10 and a movable portion 13b having a sharp tip and screwed to the fixed portion 13a, and fixes the movable portion 13b. Part 1
When rotated with respect to 3a, the movable portion 13b is
Move forward and backward.

Therefore, the position of the membrane sheet 11 in the plane direction with respect to the wiring board 10 can be accurately positioned by adjusting the rotation direction and the rotation amount of each movable portion 13b of the four plane direction positioning means 13, for example. it can. In addition, about the number of the plane direction positioning means 13,
The position of the membrane sheet 11 in the planar direction with respect to the wiring board 10 can be selected within a range where positioning can be performed with high accuracy.

A circumferential positioning means 14 for positioning the circumferential position of the membrane sheet 11 with high accuracy (range of several μm to several tens of μm) is provided on the peripheral edge of the wiring board 10.
Is provided. The circumferential positioning means 14 includes a protrusion 14a projecting outward from the rigid ring 12, a screw 14b rotatably held by the protrusion 14a and extending to both sides from the protrusion 14a, and both ends of the screw 14b. And a fixing portion 14c fixed to the wiring board 10 and screwed to the wiring board 10. When the screw portion 14b is rotated with respect to the fixing portion 14c, the screw portion 14b moves in the circumferential direction. The rigid ring 12 is connected to the wiring board 1
0 moves in the circumferential direction.

Therefore, by adjusting the rotation direction and the rotation amount of the screw portion 14b of the circumferential positioning means 14, the position of the membrane sheet 11 in the circumferential direction with respect to the wiring board 10 can be accurately determined.

Further, for example, two fixing means 15 for fixing the membrane sheet 11 to the wiring board 10 are provided at a peripheral portion of the wiring board 10. The fixing means 15 includes a fixing portion 15 a having a through hole at a position corresponding to the female screw portion provided on the wiring board 10, and a protrusion 15 b extending from the fixing portion 15 a onto the rigid ring 12.
The fixing portion 15a is formed by a screw member inserted through the through hole of the fixing portion 15a.
Is fixed to the wiring board 10, the projection 15b presses the rigid ring 12 against the wiring board 10, so that the rigid ring 1
The membrane sheet 11 held by the wiring board 1
Fixed to 0.

Hereinafter, the membrane sheet 11 is connected to the wiring board 1
A method for fixing the membrane sheet 11 to the wiring board 10 after positioning with respect to 0 will be described.

First, the position of the membrane sheet 11 in the plane direction with respect to the wiring board 10 is accurately determined using the plane direction positioning means 13, and then the wiring board 1 of the membrane sheet 11 is positioned using the circumferential direction positioning means 14.
The position in the circumferential direction with respect to 0 is positioned with high accuracy.

Next, the wiring board 1 of the membrane sheet 11
The membrane sheet 11 is fixed to the wiring board 10 using the fixing means 15 in a state where the positioning is performed in the plane direction and the circumferential direction with respect to 0.

(Second Embodiment) Hereinafter, an inspection substrate and a method of manufacturing the same according to a second embodiment of the present invention will be described.
This will be described with reference to FIGS.

In the first embodiment, the membrane sheet 11
Is a method of positioning and fixing the rigid ring 12 holding the peripheral portion of the membrane sheet 11 with respect to the wiring board 10 so that the membrane sheet 11 is positioned and fixed with respect to the wiring board 10. In this method, the membrane sheet 11 is directly positioned and fixed to the wiring board 10.

As shown in FIG. 2A, a membrane sheet 21 is disposed on a wiring board 20 having a wiring layer, and the membrane sheet 21 includes a plurality of semiconductor integrated circuit elements to be inspected. The probe terminals 21a are provided at positions corresponding to the respective test electrodes. The material of the membrane sheet 21 is not particularly limited, but is preferably a material having an insulating property, easy to form holes, and having a thermal expansion coefficient close to that of the semiconductor wafer and the wiring substrate 20.

For example, a pair of positioning pins 22 project from the peripheral edge of the wiring board 20, and an elliptical first pin is located at a position corresponding to the positioning pins 22 on the peripheral edge of the membrane sheet 21. A positioning hole 23A and a perfect circular second positioning hole 23B are provided.

Accordingly, when the first and second positioning holes 23A and 23B of the membrane sheet 21 are inserted into the corresponding positioning pins 22 of the wiring board 20, the positioning of the membrane sheet 21 with respect to the wiring board 20 in the planar direction and the circumferential direction is performed. Is performed.

Further, for example, 4
Screw holes (not shown) are provided, and a through hole 24 is formed at a position corresponding to each screw hole of the wiring board 20 at a peripheral portion of the membrane sheet 21. When the screw member inserted into the through hole 24 of the sheet 21 is screwed into the screw hole of the wiring board 20, the membrane sheet 21 is fixed to the wiring board 20.

(Third Embodiment) Hereinafter, an inspection substrate and a method of manufacturing the same according to a third embodiment of the present invention will be described.
This will be described with reference to FIG.

FIG. 3 shows a wiring board 30 according to the third embodiment.
The wiring substrate 30 has a rigid substrate 31 having rigidity, a wiring layer (not shown) formed on the surface, and is adhered to one surface of the rigid substrate 31. A first thin substrate 32 and a second thin substrate 33 attached to the other surface of the rigid substrate 31.

On the back surface of the first thin substrate 32, an electronic component 34 electrically connected to the wiring layer on the front surface side, for example, a connector to be connected to an inspection device is attached. A storage section 35 capable of storing the electronic component 34 is provided, and the first thin substrate 32 is attached to the rigid substrate 31 in a state where the electronic component 34 is stored in the storage section 35.

According to the third embodiment, the electronic components 34 can be accommodated inside the wiring board 30 by forming the accommodating portions 35 in accordance with the number and the mounting positions of the electronic components 34. That is, a wiring layer connected to the probe terminals of the membrane sheet or a wiring layer connected to the external device is formed on the surface of the first and second thin substrates 32 and 33 that is not attached to the rigid substrate 31. Since it can be provided, the degree of freedom in designing the wiring layer on the surface of the wiring board is improved.

The first and second thin substrates 32, 33
Is limited by the thermal expansion of the rigid substrate 31, so if the rigid substrate 31 is formed of a material having a low coefficient of thermal expansion,
Even if the wiring board 30 is exposed to a high temperature inside the burn-in device, the thermal expansion of the wiring board 30 can be suppressed, so that the positional displacement between the probe terminals of the membrane sheet fixed to the wiring board 30 and the inspection electrodes of the semiconductor wafer. Can be prevented.

Even if the wiring board 30 is exposed to a high temperature,
Since the rigid substrate 31 suppresses the warpage of the wiring board 30, the wiring board 30 is less likely to be warped.
Contact failure between the probe terminal of the membrane sheet fixed to the semiconductor wafer and the inspection electrode of the semiconductor wafer can be prevented.

(Fourth Embodiment) Hereinafter, an inspection substrate and a method of manufacturing the same according to a fourth embodiment of the present invention will be described.
This will be described with reference to FIG.

As shown in FIG. 4, a pair of positioning pins 41 are provided on the surface of the assembly substrate 40, for example.

On the surface of the assembly substrate 40, the rigid substrate 4
2, a wiring board 43, an anisotropic conductive rubber sheet 44, and a membrane sheet 45 are sequentially placed, and positioning pins 41 of an assembly board 40 are provided with positioning holes provided in a rigid board 42; , A positioning hole provided in the first rigid ring 46 that holds the peripheral edge of the anisotropic conductive rubber sheet 44, and a second hole that holds the peripheral edge of the membrane sheet 45. Positioning holes provided in the rigid ring 47 are sequentially inserted. Thus, the rigid substrate 42, the wiring substrate 43, the anisotropic conductive rubber sheet 44, and the membrane sheet 45 are placed in a state where they are positioned with respect to the assembly substrate 40.

In this state, the rigid board 42 and the wiring board 4
3. When the first rigid ring 46 and the second rigid ring 47 are integrated, the rigid substrate 42, the wiring substrate 43, the anisotropic conductive rubber sheet 44, and the membrane sheet 45 are integrated while being positioned with respect to each other. Therefore, an integrated inspection substrate composed of these is obtained.

A warp correcting board 48 having a gap forming ring 48a for forming a gap with the assembling board 40 is provided on the back side of the assembling board 40. A screw member 49 protruding toward the rigid substrate 42 is fixed to the center of 48. The screw member 49 extends through a hole formed in the assembly substrate 40, and a distal end of the screw member 49 is screwed into a female screw portion 42 a formed on the rigid substrate 42.

When the screw member 49 is rotated clockwise, the central portion of the rigid substrate 42 and the central portion of the warp correction substrate 48 receive a recoil approaching, and the peripheral portion of the rigid substrate 42 separates from the assembly substrate 40. When the screw member 49 is rotated counterclockwise while moving in the direction (direction approaching the wiring board 43), the central portion of the rigid substrate 42 and the central portion of the warp correction substrate 48 receive a recoil which is separated from each other, and Since the peripheral portion of the board 42 moves in a direction approaching the assembly board 40 (a direction away from the wiring board 43), the warpage of the rigid board 42 and thus the inspection board can be corrected.

The rigid substrate 31 in the third embodiment
The material constituting the rigid substrate 42 in the fourth embodiment is preferably a material having rigidity and a small coefficient of thermal expansion, such as a 42 alloy, an invar alloy, or an invar alloy.

[0069]

According to the first or second method of manufacturing the inspection board according to the present invention, even if the pitch of the inspection electrodes and thus the pitch of the probe terminals are reduced, the wiring between the probe terminals of the membrane sheet and the wiring board is reduced. The layers can be reliably connected.

According to the third method of manufacturing the inspection board according to the present invention, the displacement between the membrane sheet and the wiring board is prevented, and the stable connection between the probe terminals of the membrane sheet and the wiring layer of the wiring board is prevented. Contact can be secured.

According to the fourth to sixth manufacturing methods of the inspection board according to the present invention, the mutual positioning of the wiring board, the anisotropic conductive rubber sheet and the membrane sheet can be performed without relying on the operator's eyes or a microscope. It can be performed simply and reliably.

According to the seventh method of manufacturing a substrate for inspection according to the present invention, it is possible to easily and surely correct the warpage generated in the substrate for inspection.

[Brief description of the drawings]

FIG. 1 is a plan view showing a method for manufacturing an inspection substrate according to a first embodiment of the present invention.

FIGS. 2 (a) and 2 (b) show a method for manufacturing an inspection substrate according to a second embodiment of the present invention, wherein FIG. 2 (a) is a plan view and FIG. It is sectional drawing of the IIb line.

FIG. 3 is a cross-sectional view illustrating a method for manufacturing an inspection substrate according to a third embodiment of the present invention.

FIG. 4 is a cross-sectional view illustrating a method for manufacturing an inspection substrate according to a fourth embodiment of the present invention.

FIGS. 5A and 5B show a conventional inspection substrate,
(A) is a plan view, (b) is Vb− in (a).
It is sectional drawing of the Vb line.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Wiring board 11 Membrane sheet 11a Probe terminal 12 Rigid ring 13 Planar positioning means 13a Fixed part 13b Movable part 14 Circumferential positioning means 14a Projecting part 14b Screw part 14c Fixed part 15 Fixing means 15a Fixed part 15b Projecting part 20 Wiring board 21 Membrane sheet 22 Locating pin 23A First locating hole 23B Second locating hole 24 Through-hole 30 Wiring board 31 Rigid board 32 First thin board 33 Second thin board 34 Electronic component 35 Housing 40 Assembly board 41 Positioning Pin 42 Rigid substrate 42a Female screw part 43 Wiring substrate 44 Anisotropic conductive rubber sheet 45 Membrane sheet 46 First rigid ring 47 Second rigid ring 48 Warp correcting substrate 48a Ring for forming gap 49 Screw member

 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Tomoyuki Nakayama 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor Kenro Minori 1006 Kadoma Kadoma Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd. F term (reference) 2G011 AA21 AB06 AB08 AC06 AC14 AE03 4M106 AA01 BA01 BA14 CA70 DD01 DD10 DD11 DD13 DD30

Claims (10)

[Claims] An inspection device for applying a voltage to each inspection electrode of a plurality of semiconductor integrated devices formed on a semiconductor wafer to inspect the electrical characteristics of the plurality of semiconductor integrated circuit devices collectively in a wafer state. A method of manufacturing a substrate, comprising: forming a membrane sheet having probe terminals at positions corresponding to respective inspection electrodes of the plurality of semiconductor integrated circuit elements, forming a wiring layer on a peripheral portion of the membrane sheet in a plane direction of the membrane sheet; Disposing on a wiring board having a planar direction positioning means for positioning the position of the membrane sheet with high precision; and, using the planar direction positioning means, to position the membrane sheet in a planar direction with respect to the wiring board, Fixing the membrane sheet to the wiring board. 2. The planar direction positioning means is a positioning pin or a hole, and a hole or a pin corresponding to the positioning pin or the hole is provided in a peripheral portion of the membrane sheet. 2. The inspection device according to claim 1, wherein the membrane sheet is positioned in a planar direction with respect to the wiring board by fitting a hole or a pin of the sheet into a positioning pin or hole of the wiring board. 3. Substrate manufacturing method. 3. An inspection device for applying a voltage to each inspection electrode of a plurality of semiconductor integrated devices formed on a semiconductor wafer and inspecting electrical characteristics of the plurality of semiconductor integrated circuit devices collectively in a wafer state. A method of manufacturing a substrate, comprising: a membrane sheet having a probe terminal at a position corresponding to each inspection electrode of the plurality of semiconductor integrated circuit elements, wherein a wiring layer is formed and a circumferential direction of the membrane sheet is Arranging the membrane sheet on the wiring board with the circumferential positioning means for positioning the position of the membrane sheet with high accuracy, and using the circumferential positioning means, Fixing the membrane sheet to the wiring board. 4. An inspection device for applying a voltage to each inspection electrode of a plurality of semiconductor integrated devices formed on a semiconductor wafer and inspecting electrical characteristics of the plurality of semiconductor integrated circuit devices collectively in a wafer state. A method of manufacturing a substrate, comprising: forming a membrane sheet having a probe terminal at a position corresponding to each inspection electrode of the plurality of semiconductor integrated circuit elements; A step of arranging the membrane sheet at a predetermined position in a central portion of the wiring board having fixing means for fixing the membrane sheet to the wiring board by the fixing means. Production method. 5. The wiring substrate according to claim 1, wherein the wiring substrate comprises a rigid substrate having rigidity, and a thin substrate having the wiring layer and integrated with the rigid substrate.
The method for manufacturing an inspection substrate according to any one of the above items. 6. The thin substrate is provided with an electronic component electrically connected to the wiring layer, and the rigid substrate is provided with a storage portion capable of storing the electronic component. The method according to claim 5, wherein the thin substrate is integrated with the rigid substrate in a state where the electronic component is housed in the housing. 7. An inspection device for applying a voltage to each inspection electrode of a plurality of semiconductor integrated devices formed on a semiconductor wafer and inspecting electrical characteristics of the plurality of semiconductor integrated circuit devices collectively in a wafer state. A method of manufacturing a board, comprising: a wiring board having a wiring layer and having a positioning hole at a position corresponding to the positioning pin on an assembly board having the positioning pin, wherein the positioning pin is inserted through the positioning hole. Arranging the anisotropic conductive rubber sheet at a predetermined position on the wiring board; and inspecting each of the plurality of semiconductor integrated circuit elements at a predetermined position on the anisotropic conductive rubber sheet. Arranging a membrane sheet having a probe terminal at a position corresponding to the electrode for use, and integrating and inspecting the wiring board, the anisotropic conductive rubber sheet and the membrane sheet After assembling the substrate, method of manufacturing a testing board, characterized in that it comprises the step of removing the substrate the inspection from the assembly board. 8. An inspection device for applying a voltage to each inspection electrode of a plurality of semiconductor integrated devices formed on a semiconductor wafer and inspecting electrical characteristics of the plurality of semiconductor integrated circuit devices collectively in a wafer state. A method of manufacturing a board, comprising: arranging a wiring board having a wiring layer at a predetermined position on an assembly board having positioning pins; and forming a positioning hole on the wiring board at a position corresponding to the positioning pin. Positioning the anisotropic conductive rubber sheet with respect to the wiring board by disposing the anisotropic conductive rubber sheet in a state where the positioning pins are inserted through the positioning holes of the anisotropic conductive rubber sheet. A membrane having a probe terminal at a predetermined position on the anisotropic conductive rubber sheet and at a position corresponding to each inspection electrode of the plurality of semiconductor integrated circuit elements Arranging the wiring board, the anisotropic conductive rubber sheet and the membrane sheet, assembling an inspection board, and then removing the inspection board from the assembly board. A method for manufacturing an inspection substrate, comprising: 9. An inspection device for applying a voltage to each inspection electrode of a plurality of semiconductor integrated devices formed on a semiconductor wafer and inspecting electrical characteristics of the plurality of semiconductor integrated circuit devices in a wafer state collectively. A method of manufacturing a board, comprising: arranging a wiring board having a wiring layer at a predetermined position on an assembly board having positioning pins; and arranging an anisotropic conductive rubber sheet at a predetermined position on the wiring board. A step of, on the anisotropic conductive rubber sheet, a membrane sheet having a probe terminal at a position corresponding to each test electrode of the plurality of semiconductor integrated circuit elements and having a positioning hole at a position corresponding to the positioning pin. By arranging the membrane sheet in a state where the positioning pins are inserted into the positioning holes, the anisotropic conductive rubber sheet of the membrane sheet And positioning the wiring substrate, the anisotropic conductive rubber sheet and the membrane sheet together to assemble an inspection board, and then removing the inspection board from the assembly board. A method for manufacturing an inspection substrate, comprising: 10. A test for applying a voltage to each test electrode of a plurality of semiconductor integrated devices formed on a semiconductor wafer to collectively test the electrical characteristics of the plurality of semiconductor integrated circuit devices in a wafer state. A method of manufacturing a substrate, comprising: disposing a rigid substrate having a screw hole screwed with the screw member on an assembly substrate having a screw member that advances and retreats in a direction perpendicular to the substrate surface; A step of sequentially arranging a wiring board having a wiring layer, an anisotropic conductive rubber sheet, and a membrane sheet having a probe terminal at a position corresponding to each inspection electrode of the plurality of semiconductor integrated circuit elements, Assembling a rigid board, a wiring board, an anisotropic conductive rubber sheet and a membrane sheet to assemble an inspection board; and screwing a screw member of the assembly board into a screw hole of the rigid board. Removing the inspection substrate from the assembly substrate after correcting the warpage of the inspection substrate by moving the substrate forward and backward with respect to the assembly substrate. Production method.