JP2006237303A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2006237303A5 JP2006237303A5 JP2005050215A JP2005050215A JP2006237303A5 JP 2006237303 A5 JP2006237303 A5 JP 2006237303A5 JP 2005050215 A JP2005050215 A JP 2005050215A JP 2005050215 A JP2005050215 A JP 2005050215A JP 2006237303 A5 JP2006237303 A5 JP 2006237303A5
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- semiconductor
- semiconductor thin
- semiconductor device
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 37
- 239000010409 thin film Substances 0.000 claims 24
- 239000000758 substrate Substances 0.000 claims 6
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims 1
- 238000005253 cladding Methods 0.000 claims 1
- 239000012535 impurity Substances 0.000 claims 1
- 230000001678 irradiating effect Effects 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005050215A JP4731949B2 (ja) | 2005-02-25 | 2005-02-25 | 半導体装置、ledヘッド、及びこれを用いた画像形成装置 |
| US11/363,292 US7361935B2 (en) | 2005-02-25 | 2006-02-23 | Semiconductor device, LED print head, that uses the semiconductor, and image forming apparatus that uses the LED print head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005050215A JP4731949B2 (ja) | 2005-02-25 | 2005-02-25 | 半導体装置、ledヘッド、及びこれを用いた画像形成装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006237303A JP2006237303A (ja) | 2006-09-07 |
| JP2006237303A5 true JP2006237303A5 (enExample) | 2008-02-07 |
| JP4731949B2 JP4731949B2 (ja) | 2011-07-27 |
Family
ID=36931272
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005050215A Expired - Fee Related JP4731949B2 (ja) | 2005-02-25 | 2005-02-25 | 半導体装置、ledヘッド、及びこれを用いた画像形成装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US7361935B2 (enExample) |
| JP (1) | JP4731949B2 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7180099B2 (en) * | 2002-11-11 | 2007-02-20 | Oki Data Corporation | Semiconductor apparatus with thin semiconductor film |
| JP4347328B2 (ja) * | 2006-09-12 | 2009-10-21 | 株式会社沖データ | 半導体装置、ledヘッドおよび画像形成装置 |
| JP2009238893A (ja) * | 2008-03-26 | 2009-10-15 | Oki Data Corp | 半導体装置、光プリントヘッドおよび画像形成装置 |
| JP2010171376A (ja) * | 2008-12-26 | 2010-08-05 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体発光素子 |
| JP4871978B2 (ja) | 2009-07-10 | 2012-02-08 | 株式会社沖データ | 半導体装置、及び光プリントヘッド |
| WO2014100795A1 (en) | 2012-12-21 | 2014-06-26 | Hunter William L | Stent graft monitoring assembly and method of use thereof |
| US20170196509A1 (en) | 2014-06-25 | 2017-07-13 | Canary Medical Inc. | Devices, systems and methods for using and monitoring heart valves |
| US10524694B2 (en) | 2014-06-25 | 2020-01-07 | Canaray Medical Inc. | Devices, systems and methods for using and monitoring tubes in body passageways |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4527179A (en) * | 1981-02-09 | 1985-07-02 | Semiconductor Energy Laboratory Co., Ltd. | Non-single-crystal light emitting semiconductor device |
| US5177500A (en) * | 1991-09-11 | 1993-01-05 | Eastman Kodak Company | LED array printhead with thermally coupled arrays |
| US5408105A (en) * | 1992-02-19 | 1995-04-18 | Matsushita Electric Industrial Co., Ltd. | Optoelectronic semiconductor device with mesa |
| JPH1063807A (ja) | 1996-08-23 | 1998-03-06 | Hitachi Ltd | カード型情報制御装置 |
| TW410478B (en) * | 1998-05-29 | 2000-11-01 | Lucent Technologies Inc | Thin-film transistor monolithically integrated with an organic light-emitting diode |
| JP4365530B2 (ja) * | 1998-09-10 | 2009-11-18 | ローム株式会社 | 半導体発光素子およびその製法 |
| JP2000208822A (ja) * | 1999-01-11 | 2000-07-28 | Matsushita Electronics Industry Corp | 半導体発光装置 |
| US6614056B1 (en) * | 1999-12-01 | 2003-09-02 | Cree Lighting Company | Scalable led with improved current spreading structures |
| EP1199611A3 (en) * | 2000-10-18 | 2004-09-22 | Oki Data Corporation | Image forming apparatus |
| JP3690655B2 (ja) * | 2001-02-28 | 2005-08-31 | 京セラ株式会社 | Ledアレイ |
| US7180099B2 (en) * | 2002-11-11 | 2007-02-20 | Oki Data Corporation | Semiconductor apparatus with thin semiconductor film |
| JP2004179641A (ja) | 2002-11-11 | 2004-06-24 | Oki Data Corp | 半導体装置、光プリントヘッド、及び画像形成装置 |
| JP2004179646A (ja) * | 2002-11-13 | 2004-06-24 | Oki Data Corp | 半導体複合装置、光プリントヘッド、及び画像形成装置 |
| JP4020838B2 (ja) * | 2003-07-14 | 2007-12-12 | 三洋電機株式会社 | 発光素子アレイ及び光プリントヘッド |
-
2005
- 2005-02-25 JP JP2005050215A patent/JP4731949B2/ja not_active Expired - Fee Related
-
2006
- 2006-02-23 US US11/363,292 patent/US7361935B2/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2016500925A5 (enExample) | ||
| CN102176461B (zh) | Led半导体及led半导体的应用 | |
| CN101064330B (zh) | 复合半导体装置、led打印头及图像形成设备 | |
| KR101608868B1 (ko) | 조리개를 포함하는 발광다이오드 어레이, 이를 이용한 라인 프린터 헤드 및 발광다이오드 어레이의 제조방법 | |
| CN101950753B (zh) | 半导体器件、光学打印头和图像形成装置 | |
| JP2012513667A (ja) | オプトエレクトロニクス投影装置 | |
| JP2014216588A (ja) | 発光装置、その製造方法、画像表示装置、及び画像形成装置 | |
| US20160172528A1 (en) | Light receiving/emitting element and sensor device using same | |
| CN110121782A (zh) | 显示装置及其制造方法 | |
| CN101047174A (zh) | 复合半导体器件、led头、和图像形成装置 | |
| WO2017010701A1 (ko) | ZnO 투명 전극을 포함하는 발광 소자 | |
| JP2006237303A5 (enExample) | ||
| US8134164B2 (en) | Semiconductor device, optical print head and image forming apparatus | |
| CN114667554A (zh) | 显示基板以及显示装置 | |
| CN108008570B (zh) | 显示装置 | |
| JP2023099396A5 (enExample) | ||
| JP2006245557A5 (enExample) | ||
| JP2013211355A (ja) | 3端子発光素子、3端子発光素子アレイ、プリントヘッドおよび画像形成装置 | |
| JP2004249626A (ja) | 発光素子アレイチップおよび光書込みヘッド | |
| JP4731949B2 (ja) | 半導体装置、ledヘッド、及びこれを用いた画像形成装置 | |
| JP7013888B2 (ja) | 被駆動素子チップの製造方法並びに被駆動素子チップ、露光装置及び画像形成装置 | |
| JP2007288027A5 (enExample) | ||
| JP5197107B2 (ja) | 発光素子、これを備える発光素子アレイおよび、発光素子アレイを備える画像形成装置 | |
| TW200910629A (en) | Multi-wavelength LED array package module and method for packaging the same | |
| KR102320797B1 (ko) | 발광 소자 |