JP2006229244A - Automatic mounting apparatus for electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an automatic mounting apparatus for electronic components, capable of surely mounting the electronic components even if heights of mounting positions of the electronic components are not constant such as the case that the electronic component is mounted on the upper surface of an electronic component already mounted on a printed board. <P>SOLUTION: In a step of mounting an electronic component on the upper surface of the other electronic component already mounted on a printed board, the position and the height of mounting the electronic component in mounting data for the step stored in a RAM 31 are different from those in other steps. In this case, if height data of the upper surface of the electronic component already mounted on the printed board are inputted in H data, a stroke motor 115 is controlled by a CPU 30 according to the height directed by the H data in such a way that a suction nozzle is moved downward to the height directed by the H data by each step. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electronic component automatic mounting apparatus that takes out a desired electronic component from a component supply unit in a predetermined order with an extraction nozzle and mounts the electronic component on a printed board.

  This kind of electronic component automatic mounting apparatus is disclosed in Japanese Patent Laid-Open No. 5-192824.

  According to this prior art, the data storing the component type and mounting position for each mounting order is stored in the storage device in the electronic component mounting apparatus, and the electronic component taken out to the extraction nozzle is stored in the XY table based on the data. It moves and is attached at the position shown in the data.

In this case, if the thickness varies depending on the part type, it is impossible to mount the parts reliably if the amount of lowering the extraction nozzle is always the same. The part thickness data is stored, and the lowering of the nozzle is controlled based on this data.
JP-A-5-192824

  However, in the prior art, as shown in FIG. 9 and FIG. 10, when the component is mounted after the component is mounted, the height position of the board itself is changed, so the thickness of each component is changed. The amount of descent cannot be controlled depending on the data.

  Further, depending on the substrate, the height position may not be constant due to upward warping (in a state where the central portion is high).

  In view of the above, an object of the present invention is to make it possible to reliably mount a component even if the height position at which the component is to be mounted is not constant.

  Therefore, according to a first aspect of the present invention, there is provided an electronic component automatic mounting apparatus in which a desired electronic component is taken out from a component supply unit in a predetermined order by a take-out nozzle and is mounted on a printed board. Storage means for storing horizontal position information on the top, information on the height position of the top surface of the electronic component already mounted on the printed circuit board on which the electronic component is mounted, and information on the thickness of the component of the electronic component, and an extraction nozzle Relative position changing means for changing the relative position of the printed circuit board, horizontal position information on the printed circuit board on which the electronic component stored in the storage means is mounted, mounted on the printed circuit board on which the electronic component is already mounted The horizontal direction and height direction of the take-out nozzle and the printed circuit board based on the information on the height position of the upper surface of the electronic component and the information on the thickness of the electronic component To change the relative positions of which characterized in that a control means for controlling so as to mount the component on a printed board.

  According to the electronic component automatic mounting apparatus of the first invention, the horizontal position information to be mounted on the printed circuit board specified for each mounting order and stored in the storage means and the upper surface of the electronic component already mounted on the printed circuit board. Since the change of the relative position between the nozzle and the printed circuit board is controlled based on the height position information, the electronic component is mounted on the upper surface of the electronic component already mounted on the printed circuit board. Even when the height position is not constant, it is possible to reliably mount the component using the information on the height position to be mounted stored in the storage means.

  Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.

  2 and 3, reference numeral 1 denotes a Y table that moves in the Y direction by the rotation of the Y-axis motor 2. Reference numeral 3 denotes a movement in the X direction on the Y table 1 by the rotation of the X-axis motor 4. As a result, the printed circuit board 6 on which the chip-like electronic component 5 (hereinafter referred to as a chip component or a component) is mounted is fixed and mounted on a fixing means (not shown).

  Reference numeral 7 denotes a supply table, on which a number of component supply devices 8 for supplying chip components 5 are arranged. Reference numeral 9 denotes a supply table drive motor. When the ball screw shaft 10 is rotated, the supply table 7 is guided to the linear guide 12 via a nut 11 which is screwed to the ball screw shaft 10 and fixed to the supply table 7. Move in the X direction. Reference numeral 13 denotes a rotary table that rotates intermittently. On the outer edge of the table 13, mounting heads 15 having a plurality of suction nozzles 14 are arranged at equal intervals according to the intermittent pitch.

  I is a suction station that is a stop position of the mounting head 15 where the suction nozzle 14 picks up and picks up the component 5 from the supply device 8 by intermittent rotation of the rotary table 13, and the suction nozzle 14 picks up the component 5 at the suction station I. To do.

  Reference numeral 16 denotes a component recognition device that recognizes the position shift of the component 5 attracted by the suction nozzle 14 by imaging the lower surface of the component 5 with a camera in a predetermined visual field range and recognizing the imaged screen. Is provided.

  The position where the mounting head 15 next to the recognition station II stops is the angle correction station III, and the angle amount for correcting the angular position deviation of the chip component 5 due to the recognition result of the recognition device 16 is added to the predetermined angle amount. The head rotating device 17 rotates the mounting head 15 in the θ direction by the angle amount. The θ direction is a direction that rotates around the axis of the nozzle 14 extending in the vertical direction.

  The next stop position next to the angle correction station III is the mounting station IV, and the component 5 to be sucked by the suction nozzle 14 of the station IV is mounted on the substrate 6 by the lowering of the mounting head 15.

  Reference numeral 20 denotes an elevating bar that moves up and down, and is engaged with a swing lever 21 of the component supply device 8 to swing, and a component storage tape (not shown) enclosing the chip component 5 at a predetermined interval is intermittently fed to the interval. The chip component 5 is supplied to the component suction position of the suction nozzle 14. Reference numeral 22 denotes a tape reel on which the component storage tape (not shown) is wound.

  Next, a mechanism for raising and lowering the mounting head 15 at the mounting station IV will be described with reference to FIGS.

  Reference numeral 53 denotes an elevating block having a U-shaped cross section, which is disposed at a portion where the cylindrical cam 29 is cut out at the mounting station, and is provided at an upper end of an elevating plate 55 that moves up and down along a guide 54 attached to the support plate 109. Is attached.

  The projecting piece 57 below the elevating block 53 is at the extended position of the cylindrical cam 29 at the ascending position of the elevating block 53, and the cam followers 26 and 27 can be moved across the projecting piece 57 by rotating the turntable 13. It is made like that.

  Since the rail 110 is attached to the upper end of the elevating plate 55 and the guide portion 111 can move in the horizontal direction along the rail 110, the movable body 56 having the guide portion 111 on the back surface in FIG. It can move left and right. A pair of rollers 112 is rotatably attached to the front side surface of the moving body 56, and sandwiches a vertical guide piece 114 extending in the vertical direction formed on the right end of the stroke variable plate 113 in FIG. The moving body 56 is guided by the guide piece 114 and moves up and down. As a result, the rail 110 and the lifting plate 55 are also lifted and lowered.

  A stroke motor 115 rotates the ball screw 116 and moves the variable plate 113 attached to the nut 117 to which the ball screw 116 is fitted, along the guide 118 to the left and right. Due to the movement of the variable plate 113, the moving body 56 moves along the rail 110 to the position shown in FIGS. 4 and 5, for example, via the roller 112 sandwiching the guide piece 114.

  Reference numeral 119 denotes a cam that engages with a cam follower 122 pivotally supported at one end of a cam lever 121 that can be rotated around a support shaft 120 and swings the lever 121. A vertically swinging lever 124 pivotally supported on the other end of the link lever 123 swings around the support shaft 125 via a link lever 123 pivotally supported on the other end of the lever 121. To do.

  A cam follower 127 rotatably attached to the back surface of the movable body 56 in FIG. 5 is pulled by a tension spring 128 stretched between the rail 110 and the support base 28 on the engagement piece 126 formed on the lever 124. Engaged. Therefore, the movable body 56 moves up and down along the guide piece 114 whose position in the left-right direction is determined by the rotation of the stroke motor 115 by the swing of the lever 124.

  The engagement piece 126 swings between the position of the solid line in FIG. 4 and FIG. 5 and the position of the two-dot chain line by the rotation of the cam 119, but the cam follower 127 engages at the position of the solid line which is the highest position. The surface is horizontal, and the height of the moving body 56, that is, the lifting block 53 does not change regardless of the position of the guide piece 114 due to the rotation of the motor 115, and the followers 26 and 27 are lifted and lowered by the cylindrical cam 29. You can transfer to and from the block 53. Further, the lower limit position of the moving body 56, that is, the elevating block 53 changes depending on the position of the guide piece 114 in the left-right direction, and the up / down stroke of the suction nozzle 14 changes.

  The lower limit position of the swing of the engagement piece 126 is always the same at the position of the two-dot chain line in FIGS. 4 and 5, and the contact surface of the cam follower 127 is linear, so the cam follower 127 is at a position. In this case, the increase in the descending stroke when the moving body 56 moves in the lateral direction by the rotation of the motor 115 is linearly proportional to the moving distance in the lateral direction of the moving body 56 with respect to the stroke in which the moving body 56 descends. Change. For this reason, control of the vertical stroke of the suction nozzle 14 becomes easy.

  The rotation of the cam 119 keeps the block 53 in the raised state until the mounting head 15 of the previous station moves to the mounting station and stops, and moves down and stops after the mounting head 15 moves to the mounting station and stops. The turntable 13 is raised before the next turntable 13 is rotated.

  In the suction station I, the mounting head 15 is moved up and down by a similar mechanism.

  Further, the suction nozzle 14 is always urged by a compression spring (not shown) in a downward direction with respect to the mounting head, and the nozzle 14 abuts against the substrate 5 in a state where the component 5 is sucked, and then the mounting head 15 is further placed. The spring is compressed by a predetermined amount by being lowered a certain amount, the impact is absorbed, and the component 5 is mounted on the substrate 6 with a predetermined pressing force.

  Next, the control block of the electronic component automatic mounting apparatus will be described with reference to FIG.

  Reference numeral 30 denotes a CPU that performs overall control of operations related to component mounting of the automatic electronic component mounting apparatus according to a program stored in the ROM 32 based on data stored in the RAM 31. Control objects such as the X-axis motor 4, the Y-axis motor 2, and the stroke motor 115 are connected to the CPU 30 via an interface 33 and a drive circuit 35.

  The mounting data shown in FIGS. 7 and 8 is stored in the RAM 31, and the component 5 is mounted in the order of the data steps. In the data, X data and Y data indicate the mounting position on the board 6, θ data indicates the angular position to be mounted, and the supply table on which the component supply device 8 of the component type to be taken out is mounted for component extraction. The position on 7 is shown.

  The numbers in the control commands (indicated by the column C in FIG. 8) are the numbers assigned to each block by dividing the step into a plurality of blocks. The block is assigned between, for example, steps M3 and M4 in FIG. It is divided by the line that is drawn. The data in FIG. 8 is for one unit substrate 34 shown in FIG. 9, and the position of each unit substrate 34 in the substrate 6 is designated in FIG. That is, the position of the origin of each unit substrate 34 is shown as the position of the origin in the substrate 6 at each step of FIG.

  The parts 5 in which the same numbers as the block numbers of the control command in FIG. 8 are shown in FIGS. 9 and 10 form the same block.

  The component 8 is mounted in the order of steps (M1, M2,...) In FIG. 8 on the unit board in the order of steps (A1, A2, A3) in FIG. In the case of the embodiment, the same block is continuously mounted.

  As shown in FIG. 10, the part 5 of the block of block number 1 is completely covered with the part 5 of the block of block number 3, and the mounting height is different.

  For this reason, the height data of the mounting surface at the position where the component 5 is to be mounted is stored in the H data. The mounting surface of the substrate 6 is usually a flat surface, but there is a substrate in which only a part is recessed as shown in FIGS. Moreover, the center part of the board | substrate 6 has curved rather than the side part. The data on the height of the mounting surface is usually the data on the height of the upper surface of the board. However, if the data is to be mounted on the component 5 that has already been mounted, the height of the upper surface of the component 5 that has been attached in advance. It is data.

  This H data is set so that the height of the standard board top surface is 0. However, in the case of the step of mounting at the standard height as shown in FIG. The data is input only when the height is not. Alternatively, even if it is a standard case, 0 may be input. In this case, 0 may be automatically given from the beginning, and the height may be changed only for the step to be changed. The RAM 31 stores component data (not shown) and stores component thickness data for each component type.

  The operation will be described below with the above configuration.

  Automatic operation of the electronic component automatic mounting apparatus is performed by operating an operation unit (not shown).

  The CPU 30 controls the suction operation of the component 5 according to the mounting data shown in FIG. 7 and FIG. 8 stored in the RAM 31, but moves the supply table 7 according to the component extraction data in the step to be taken out, and sucks the component supply device 8. At the station I, the head 15 is stopped at the position where the head 15 is taken out, and the component 15 is vacuum-sucked by the nozzle 14 by raising and lowering the head 15.

  Next, after the suction nozzle 14 picks up the component 5, the rotary table 13 rotates intermittently and the mounting head 15 reaches the next station. At this time, in the suction station I, the component 5 in step M2 is sucked in the same manner.

  Next, due to the subsequent intermittent rotation of the rotary table 13, the position recognition of the component 5 is recognized by the component recognition device 16 at the recognition station II, and then the angular position and the position in the XY direction are corrected, and the mounting station. At IV, it is mounted on the printed circuit board at a position where the position of step A1 in FIG. 6 is added to the position of X data and Y data in FIG.

  The mounting operation will be described.

  While the mounting head 15 is moving to the mounting station IV from the previous station, the CPU 30 reads out the H data of the next mounting step, and the component indicated by the data from the component extraction data of the step. The thickness of the component type supplied by the supply device 8 is read from component data (not shown), and the height obtained by adding the difference between the standard component thickness and the component thickness of the outer component 5 to the height indicated by the H data is calculated. Then, the stroke motor 115 is rotated so that the calculated amount is added to the standard descending stroke, and the position of the cam follower 127 on the engagement piece 126 is determined. That is, as shown in FIGS. 9 and 10, the H data is added when mounting in the recess, the calculated stroke is increased, and the stroke is decreased when the part thickness is thick.

  As a result, at the next mounting station IV, the up-and-down swing lever 124 is swung by the rotation of the cam 119, and the calculated stroke lifting plate 55 is lowered so that the mounting head 15 and the suction nozzle 14 are at the height of the mounting surface. Then, the component 5 is mounted on the substrate 6 with a predetermined pressing force by lowering the distance corresponding to the component thickness.

  Also, if you set the stroke data to be lowered instead of the component thickness data for each component type, you can change the pressure when you want to change the pressure due to the difference in size or material of the component 5 even if the component thickness is the same. In this case as well, the H data can be set by being pushed in with a pressure that should be pushed outward even if the height of the mounting surface changes by setting the H data as shown in FIG.

  In the present embodiment, the mounting data is set as shown in FIG. 8, but when the area A portion of the substrate 6 is higher by H1 than the other area B portions as shown in FIG. As shown in FIG. 11, the mounting data P1 for the area A is created, and the height H1 (or -H1 if the downward direction is a plus direction) is collectively set in the step M0 of the H data. For example, the CPU 30 controls the stroke of the stroke motor 115 in the same manner as described above by setting the H data of all the steps of the mounting data P1 as H1. In this case, the mounting data P2 shown in FIG. 12 is created for the area B, 0 is set in the step M0, and mounting at a normal height is performed. The mounting data P1 and the mounting data P2 constitute NC data indicating the board type AAA together with operation data (data such as dimensions of the board 6 is stored). In this case, if there is a step in the area B where the height is particularly desired to be changed, the H data of that step may be input as shown in FIG. This also applies to the mounting data P1 shown in FIG. 11, and the height of only that step can be changed by inputting the H data of each step. However, in the case of FIG. The data value may be a value based on the upper surface of area B, or may be a value added to the value set in step M0 of area A.

  In addition, since the mounting order is divided into blocks, the area A shown in FIG. 14 is one component, and even when another component is mounted on the area A, the component having the size of the area A is mounted. Control can be performed by mounting in one of the steps of the data P2.

  In this embodiment, the stroke of the mounting head 15 is changed by H data. However, a mechanism for moving the table on which the substrate 6 is placed up and down is provided, and the substrate 6 side is moved up and down by the H data. Thus, the pressing force on the component 5 may be set to a predetermined value.

  Further, in this embodiment, the electronic component automatic mounting apparatus for mounting the electronic component on the printed board has been described. However, before temporarily mounting the electronic component to temporarily fix the electronic component on the printed board, the adhesive is attached to the substrate. Also in the adhesive application device that applies and discharges by the application nozzle that moves up and down, H data similar to that of FIG. 8 or FIG. 11 and FIG. 12 is provided, and the descending amount of the application nozzle with respect to the printed circuit board is made uneven. You may control to change together.

It is a figure which shows the control block of an electronic component automatic mounting apparatus. It is a top view of an electronic component automatic placement device. It is a side view of an electronic component automatic placement device. It is a front view which shows the raising / lowering mechanism of a mounting head. It is a front view which shows the raising / lowering mechanism of a mounting head. It is a side view which shows the raising / lowering mechanism of a mounting head. It is a figure which shows mounting data. It is a figure which shows mounting data. It is a top view which shows a printed circuit board. It is a side view which shows a printed circuit board. It is a figure which shows mounting data. It is a figure which shows mounting data. It is a figure which shows the whole NC data. It is a top view which shows a printed circuit board. It is a figure which shows mounting data.

Explanation of symbols

2 Y-axis motor (relative position changing means)
4 X-axis motor (relative position changing means)
5 Chip-shaped electronic parts 6 Printed circuit board 14 Suction nozzle (extraction nozzle)
30 CPU (control means)
31 RAM (storage means)
115 Stroke motor (relative position changing means)

Claims (1)

In an electronic component automatic mounting apparatus that takes out a desired electronic component from a component supply unit in a predetermined order with a pickup nozzle and mounts the electronic component on a printed circuit board, horizontal position information on the printed circuit board on which the electronic component is mounted for each mounting order, the electronic The storage means for storing the information on the height position of the top surface of the electronic component already mounted on the printed circuit board on which the component is mounted and the information on the component thickness of the electronic component, and the relative position of the takeout nozzle and the printed circuit board are changed. Relative position changing means, and horizontal position information on the printed circuit board on which the electronic component is stored, stored on the storage means, on the upper surface of the electronic component already mounted on the printed circuit board on which the electronic component is mounted Based on the information on the height position and the information on the thickness of the electronic component, the relative position in the horizontal direction and the height direction of the take-out nozzle and the printed circuit board is changed. Automatic electronic part mounting apparatus characterized by comprising a control means for controlling so as to mount the component on a printed board.

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