JP3513248B2 - Electronic component automatic mounting device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component automatic mounting apparatus for picking up desired electronic components from a component supply unit in a predetermined order by a take-out nozzle and mounting them on a printed circuit board.

[0002]

2. Description of the Related Art A device for automatically mounting electronic components of this kind is disclosed in Japanese Patent Laid-Open No.
It is disclosed in Japanese Patent Laid-Open No. 192824. According to this prior art, the data storing the component type and the mounting position for each mounting order is stored in the storage device in the electronic component mounting device, and the electronic component taken out to the ejection nozzle is XY table based on the data. It is moved and attached at the position shown in the data.

In this case, when the thickness differs depending on the component type, it is not possible to mount the component reliably by keeping the descending amount of the take-out nozzle the same. Therefore, the nozzle should descend for each component type. The component thickness data is stored as the data regarding the distance, and the descending of the nozzle is controlled based on this data.

[0004]

However, in the above-mentioned prior art, the height position of the substrate itself is changed when components are mounted and then further components are mounted as shown in FIGS. 9 and 10. Therefore, it is impossible to control the descending amount depending on the thickness data of each part.

Further, depending on the substrate, there is a case where the height position is not constant due to the upward warpage (a state where the central portion is high).

Therefore, an object of the present invention is to make it possible to reliably mount a component even if the height position of the component mounting position is not constant.

[0007]

[0008]

SUMMARY OF THE INVENTION According to the present invention, in an electronic component automatic mounting apparatus for picking up desired electronic components from a component supply unit in a predetermined order by a take-out nozzle and mounting them on a printed circuit board, the components to be mounted on the printed circuit board are Storage means for storing the information of the height position to be mounted for each of a plurality of blocks provided by dividing the entire mounting sequence into parts having the same height where the parts should be mounted, a take-out nozzle and a printed circuit board Relative position changing means for changing the relative position, and changing the relative position in the height direction between the ejection nozzle and the printed board according to the divided blocks based on the stored contents of the storage means, and mounting the parts on the printed board. And a control means for controlling the control. Further, the storage means of the present invention stores information on a height position different from the common height position in each mounting order in the block, and the control means stores the ejection nozzle for each mounting order in the block. Control is performed so as to change the relative position in the height direction between the board and the printed circuit board.

[0009]

[0010]

According to the structure of the present invention, the control means, based on the information of the same height position where the components for each block are to be mounted, stored in the storage means, the relative distance between the ejection nozzle and the printed board in the height direction. The target position is changed and the component is controlled to be mounted on the printed circuit board. According to the configuration of claim 2 , the storage means stores information of a height position different from the common height position in each mounting order in the block, and the control means retrieves in each mounting order in the block. Control is performed so as to change the relative position in the height direction between the nozzle and the printed circuit board.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings.

2 and 3, reference numeral 1 is a Y table which moves in the Y direction by the rotation of the Y-axis motor 2, and 3 is an X table.
This is an XY table that moves in the X and Y directions by moving in the X direction on the Y table 1 by the rotation of the shaft motor 4, and a chip-shaped electronic component 5 (hereinafter referred to as a chip component or component) is mounted. The printed circuit board 6 is fixedly mounted on a fixing means (not shown).

Reference numeral 7 denotes a supply table, on which a large number of component supply devices 8 for supplying the chip components 5 are arranged. Reference numeral 9 denotes a supply base drive motor, which rotates the ball screw shaft 10 to screw the ball screw shaft 10 into a nut 11 which is fixed to the supply base 7.
It is guided by and moves in the X direction. Reference numeral 13 denotes a rotary table that rotates intermittently, and mounting heads 15 having a plurality of suction nozzles 14 are arranged at equal intervals on the outer edge of the table 13 in accordance with the intermittent pitch.

Reference numeral I denotes a suction station where the suction nozzle 14 sucks and picks up the component 5 from the supply device 8 by intermittent rotation of the rotary table 13 and at which the mounting head 15 is stopped. Adsorb 5

Reference numeral 16 denotes a component recognition device for recognizing the displacement of the component 5 attracted by the suction nozzle 14 by recognizing the lower surface of the component 5 by a camera in a predetermined visual field range and recognizing the imaged screen. -Provided in Option II.

Next mounting head 1 of recognition station II
The position where 5 is stopped is the angle correction station III, and the head rotation device 17 is an angle amount that takes into account a predetermined angle amount for correcting the angular position deviation of the chip component 5 due to the recognition result of the recognition device 16. Wearing head 15
Rotate in the θ direction. The θ direction is the direction of rotation around the axis of the nozzle 14 extending in the vertical direction.

The next stop position after the angle correction station III is the mounting station IV, and the component 5 to be picked up by the suction nozzle 14 of the station IV on the board 6.
Are mounted by lowering the mounting head 15.

Reference numeral 20 denotes an up-and-down moving rod, which engages with a swing lever 21 of the component supply device 8 to swing the component storage tape (not shown) in which the chip components 5 are enclosed at predetermined intervals according to the spacing. The chip component 5 is supplied to the component suction position of the suction nozzle 14 by intermittent feeding. 22 is a tape reel around which the component storage tape (not shown) is wound.

Next, a mechanism for raising and lowering the mounting head 15 in the mounting station IV will be described with reference to FIGS.

Reference numeral 53 denotes an elevating block having a U-shaped cross section, which is arranged at a portion where the cylindrical cam 29 is cut out in the mounting station and moves up and down along a guide 54 attached to the support plate 109. Is attached to its upper end.

The protrusion 57 at the lower part of the elevating block 53 is at the extended position of the cylindrical cam 29 at the ascending position of the elevating block 53, and when the turntable 13 is rotated, the cam follower 26,
27 is arranged so that it can be transferred between the upper and lower sides of the projecting piece 57.

A rail 110 is attached to the upper end of the elevating plate 55, and a guide portion 111 is horizontally movable along the rail 110.
A movable body 56 having a rear surface of FIG. 5 is movable in the vertical and horizontal directions. A pair of rollers 112 is rotatably attached to the front surface of the moving body 56, and sandwiches a vertically extending vertical guide piece 114 formed at the right end of the stroke varying plate 113 in FIG. The moving body 5
6 is guided by the guide piece 114 and moves up and down. As a result, the rail 110 and the lift plate 55 also move up and down.

A stroke motor 115 rotates a ball screw 116 to move the variable plate 113 attached to a nut 117 with which the ball screw 116 is fitted, right and left along a guide 118. By the movement of the variable plate 113, the moving body 56 moves along the rail 110 to the positions shown in FIGS. 4 and 5, for example, via the rollers 112 sandwiching the guide pieces 114.

Reference numeral 119 denotes a cam follower 12 pivotally supported at one end of a cam lever 121 rotatable about a support shaft 120.
The link lever 12 is a cam that engages with the second lever 121 to swing the lever 121, and is pivotally supported at the other end of the lever 121 when the lever 121 swings by the rotation of the cam 119.
A vertical swing lever 124 pivotally supported by the other end of the link lever 123 via 3 swings around a support shaft 125.

An engaging piece 126 formed on the lever 124
5, a cam follower 127 rotatably attached to the rear surface of the moving body 56 in FIG. 5 is pulled and engaged with a tension spring 128 stretched between the rail 110 and the support base 28. Therefore, the moving body 56 moves up and down along the guide piece 114 whose position in the left-right direction is determined by the rotation of the stroke motor 115 caused by the swing of the lever 124.

The engagement piece 126 swings between the position indicated by the solid line in FIGS. 4 and 5 and the position indicated by the chain double-dashed line by the rotation of the cam 119. The surface to be engaged is horizontal, and at this position, the height of the moving body 56, that is, the elevation block 53 does not change regardless of the position of the guide piece 114 due to the rotation of the motor 115, and the followers 26 and 27 move the cylindrical cams. It is possible to transfer between 29 and the lifting block 53. Further, the lower limit position of the moving body 56, that is, the elevating block 53 changes depending on the position of the guide piece 114 in the left-right direction.
The vertical stroke of will change.

The lower limit position of the swing of the engaging piece 126 is always the same at the position of the chain double-dashed line in FIGS. 4 and 5, and since the contact surface of the cam follower 127 is linear, there is the cam follower 127. When the moving body 56 moves downward in the position, the increase in the descending stroke when the moving body 56 moves in the horizontal direction by the rotation of the motor 115 is proportional to the moving distance of the moving body 56 in the horizontal direction. Then changes linearly. Therefore, the vertical stroke of the suction nozzle 14 can be easily controlled.

The rotation of the cam 119 keeps the block 53 in the ascending state until the mounting head 15 of the previous station moves to the mounting station and stops, and the mounting head 15 moves to the mounting station and stops. It is configured to descend from the position of the turntable 13 and to rise until the next turntable 13 rotates.

Even in the suction station I, the mounting head 15 is moved up and down by a similar mechanism.

Further, the suction nozzle 14 is constantly urged by a compression spring (not shown) in a downward direction with respect to the mounting head, and the nozzle 14 abuts the substrate 5 in a state of sucking the component 5 and thereafter further mounts the mounting head. By lowering 15 by a predetermined amount, the spring is compressed by a predetermined amount, the shock is absorbed, and the component 5 is mounted on the substrate 6 with a predetermined pressing force.

Next, the control block of the automatic electronic component mounting apparatus will be described with reference to FIG.

Reference numeral 30 denotes a CPU which, based on the data stored in the RAM 31, generally controls the component mounting operation of the electronic component automatic mounting apparatus in accordance with the program stored in the ROM 32. CPU 33 has an interface 33
And, the controlled objects such as the X-axis motor 4, the Y-axis motor 2 and the stroke motor 115 are connected via the drive circuit 35.

The mounting data shown in FIGS. 7 and 8 is RAM3.
The data is stored in the data No. 1 and the component 5 is mounted in the order of the steps of the data. In the data, the X data and the Y data indicate the mounting position on the substrate 6, the θ data indicates the angular position to be mounted, and the supply stand on which the component supply device 8 of the component type to be extracted is mounted for component extraction. The position on 7 is shown.

The numbers in the control command (column indicated by C in FIG. 8) are numbers assigned to each block by dividing the step into a plurality of blocks, and the block corresponds to, for example, steps M3 and M4 in FIG. It is divided by the line drawn between them. The data of FIG. 8 is for one unit board 34 shown in FIG.
The position for every 4 is specified in FIG. That is, it is shown as the position of the origin of each unit substrate 34 with respect to the origin position in the substrate 6 for each step of FIG. 7.

The same number as the block number of the control command in FIG. 8 is marked in FIG. 9 and FIG.
Respectively form the same block.

The parts 8 are first mounted in the unit board in the order of steps (A1, A2, A3) in FIG. 7 in the order of steps (M1, M2 ...) In FIG. In the case of this embodiment, the same block is mounted continuously.

As shown in FIG. 10, the component 5 of the block of block number 1 is completely covered by the component 5 of the block of block number 3, and the mounting heights are different.

Therefore, in the H data, the height data of the mounting surface at the position where the component 5 is to be mounted is stored.
The mounting surface of the substrate 6 is normally a flat surface, but as shown in FIG. 9 and FIG. In some cases, the central portion of the substrate 6 is warped rather than the side portions. The height data of the mounting surface is usually the height data of the upper surface of the substrate. However, when mounting on the already mounted component 5, the height data of the upper surface of the component 5 already attached is used. The data.

This H data indicates that the height of the standard upper surface of the substrate is 0.
However, as shown in FIG. 8, no data is entered in the step of mounting at the standard height, and the data is entered only when the height is not the standard height. I am doing it. Alternatively, 0 may be input even in the standard case, and in this case, 0 may be automatically given from the beginning, and the height may be changed only in the step to be changed. Further, the RAM 31 stores component data (not shown), and component thickness data for each component type.

The operation will be described below with the above configuration.

The automatic operation of the electronic component automatic mounting apparatus is performed by operating an operation unit (not shown).

The CPU 30 is stored in the RAM 31 as shown in FIG.
And the suction operation of the component 5 is controlled according to the mounting data shown in FIG. 8, but the head 15 that moves the supply base 7 according to the data of component extraction of the step to be removed and stops the component supply device 8 in the adsorption station I. Of the component 5 by the nozzle 14 when the head 15 is moved up and down.
Are vacuum-adsorbed.

Next, after the suction nozzle 14 takes out the component 5, the rotary table 13 intermittently rotates and the mounting head 15 reaches the next station. At this time, in the suction station I, the component 5 of step M2 is similarly sucked.

Next, due to the intermittent rotation of the rotary table 13 thereafter, the positional deviation of the component 5 is recognized by the component recognition device 16 in the recognition station II, and then the angular position and the position in the XY directions are corrected and mounted. Station I
At V, it is mounted on the printed circuit board at a position in which the position of step A1 of FIG. 6 is added to the positions of X data and Y data of FIG.

The mounting operation will be described.

While the mounting head 15 moves to the mounting station IV from the previous station, the CPU 3
0 reads the H data of the next mounting step, reads the component thickness of the component type supplied by the component supply device 8 indicated by the data from the component extraction data of the step from the component data (not shown), and indicates the height indicated by the H data. Then, the height is calculated by adding the difference between the standard component thickness and the component thickness of the isoelectric component 5, and the stroke motor 115 is rotated so that the calculated amount is added to the standard descending stroke. The position of the cam follower 127 on the engagement piece 126 is positioned. That is, as shown in FIGS. 9 and 10, the H data is added when the recess is mounted, and the calculated stroke is increased, and the stroke is decreased when the component is thick.

As a result, next, in the mounting station IV, the vertical swing lever 124 swings by the rotation of the cam 119, the stroke lifting plate 55 calculated is lowered, and the mounting head 15 and the suction nozzle 14 are mounted on the mounting surface. And the component 5 is mounted on the substrate 6 with a predetermined pressing force by descending the height and the component thickness.

Further, if the stroke data to be lowered is set for each component type instead of the data of the component thickness, the pushing pressure is changed depending on the size or material of the component 5 even if the component thickness is the same. It can be changed at any time, and even in this case, by setting the H data as shown in FIG. 8, even if the height of the mounting surface is changed, the H data can be pushed in with the pressure to be pushed outward.

In this embodiment, the mounting data is set as shown in FIG. 8. However, as shown in FIG. 14, when the area A of the substrate 6 is higher than the area B of the other area by H1, it is convex. .), Mounting data P1 for the area A is created as shown in FIG. 11, and the height H1 (or the downward direction is defined as a plus direction) is collectively set in step M0 of the H data.
If H1) is set, the CPU 30 controls the stroke of the stroke motor 115 in the same manner as described above with the H data of all steps of the mounting data P1 as H1. In this case, the mounting data P2 shown in FIG. 12 is created for the area B, 0 is set in step M0 thereof, and the mounting is performed at the normal height. Mounting data P1
And the mounting data P2 is the board type AAA together with the operation data (data such as the dimensions of the board 6 is stored).
NC data indicating In this case, if there is a step whose height is to be changed in the area B, the H data of that step may be input as shown in FIG. 15, for example. This is the mounting data P shown in FIG.
1 is also applicable, and the height of only the step can be changed by inputting the H data of each step, but in the case of FIG. 11, the value of the H data set individually is the upper surface of the area B. May be used as a reference, or a value added to the value set in step M0 of area A may be used.

Further, since the mounting order is divided into blocks, the area A shown in FIG. 14 is one component, and even when other components are mounted on the area A, components of the size of the area A Can be controlled to be mounted in one of the steps of the mounting data P2.

Further, in this embodiment, the stroke of the mounting head 15 is changed according to the H data. However, a mechanism for moving the table on which the substrate 6 is placed up and down is provided, and the substrate 6 side is moved up and down by the H data. The pressing force to the component 5 may be set to a predetermined value by moving the component 5.

In this embodiment, the electronic component automatic mounting apparatus for mounting the electronic component on the printed circuit board has been described. However, in order to temporarily fix the electronic component on the printed circuit board, the adhesive is applied to the substrate before mounting the electronic component. Also in an adhesive coating device that discharges and coats with a coating nozzle that moves up and down with respect to the substrate, H data similar to that of FIG. 8 or FIG. 11 and FIG. You may control so that it may change according to the unevenness | corrugation of.

[0053]

[0054]

As described above, according to the present invention, when one part of the board has a height different from that of the other part, the mounting order of the part is divided into blocks and the same height of the different parts is provided. Data can be set in a lump and data setting can be simplified. Also, if there is a step in which you want to change the height in the same height area, that is, if there is a mounting order for changing the height position in the block,
It suffices to input the data of the height position, the storage means stores the information of the height position different from the common height position in the individual mounting order in the block, and the control means stores the mounting order in the block. The relative position in the height direction between the ejection nozzle and the printed circuit board can be changed every time.

[Brief description of drawings]

FIG. 1 is a diagram showing a control block of an electronic component automatic mounting apparatus.

FIG. 2 is a plan view of an electronic component automatic mounting device.

FIG. 3 is a side view of an electronic component automatic mounting device.

FIG. 4 is a front view showing a lifting mechanism of a mounting head.

FIG. 5 is a front view showing a lifting mechanism of a mounting head.

FIG. 6 is a side view showing a lifting mechanism of a mounting head.

FIG. 7 is a diagram showing mounting data.

FIG. 8 is a diagram showing mounting data.

FIG. 9 is a plan view showing a printed circuit board.

FIG. 10 is a side view showing a printed circuit board.

FIG. 11 is a diagram showing mounting data.

FIG. 12 is a diagram showing mounting data.

FIG. 13 is a diagram showing the entire NC data.

FIG. 14 is a plan view showing a printed circuit board.

FIG. 15 is a diagram showing mounting data.

[Explanation of symbols]

2 Y-axis motor (relative position changing means) 4 X-axis motor (relative position changing means) 5 Chip-shaped electronic components 6 printed circuit boards 14 Adsorption nozzle (take-out nozzle) 30 CPU (control means) 31 RAM (storage means) 115 Stroke motor (relative position changing means)

Claims (2)

(57) [Claims] 1. An electronic component automatic mounting apparatus for picking up desired electronic components from a component supply unit in a predetermined order by a take-out nozzle and mounting them on a printed circuit board.
The total mounting sequence of the parts should be the same height at which the parts should be mounted.
Storage means for storing information on the height position to be mounted for each of a plurality of blocks divided and provided for each portion , and relative position changing means for changing the relative position between the takeout nozzle and the printed circuit board. Dividing the relative position in the height direction between the ejection nozzle and the printed circuit board based on the stored contents of the storage means
And a control means for controlling the mounting of the component on the printed circuit board by changing it according to the selected block . 2. The storage means is an individual unit in the block.
The information about the height position different from the common height position in the mounting sequence.
Information is stored, and the control means sets the mounting order in the block.
The relative position in the height direction between the ejection nozzle and the printed circuit board for each
The control is performed so that the position is changed.
Electronic component automatic mounting device described in.