JP2841855B2 - Electronic component mounting method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to an electronic component mounting method, and measures the deflection of a substrate from below when elevating a nozzle to mount an electronic component on the substrate. This is to eliminate mounting errors.

(Prior Art) As shown in FIG.
To the positioning unit 102, and the nozzle of the transfer head 103
The electronic component P sucked by the nozzle 104 is mounted on the substrate 101 by moving the 104 up and down.

In this case, if the substrate 101 is bent, the ascending / descending stroke of the nozzle 104 will be disturbed, and a mounting error will occur.
The substrate 101 is supported from below by the backup pin 105,
Correction of the warp is performed to maintain the flatness of the substrate 101.

(Problems to be Solved by the Invention) However, in the above-mentioned conventional means, it is necessary to change the type and arrangement of a large number of backup pins 105 in accordance with the type change of the substrate 101, and in particular, it is necessary to transfer electronic components to the front and back of the substrate 101. In the case of mounting on both sides, the arrangement must be set so that the backup pin 105 does not hit the electronic components on the back side, so the setup change is extremely troublesome, and there is a problem that requires a lot of labor and labor .

Further, the force by which the backup pin 105 corrects the deflection of the substrate 101 is small, and in particular, when the substrate 101 is bent in an upwardly convex shape as indicated by a chain line, there is a problem that the correction force cannot be expected at all or hardly expected. .

Accordingly, an object of the present invention is to provide an electronic component mounting method that can solve the problems of the conventional means.

(Means for Solving the Problems) According to the present invention, an electronic component is mounted on a substrate positioned at a positioning portion by adsorbing an electronic component to a nozzle and moving the nozzle up and down. In a method, the height of the lower surface of the substrate at the mounting position of the electronic component is measured by a height measuring device, and the height of the mounting position of the upper surface of the substrate is obtained by adding the thickness of the substrate to the measurement result,
The vertical stroke of the nozzle is determined.

(Operation) In the above configuration, before mounting the electronic component on the substrate by moving the nozzle up and down, the height of the lower surface of the substrate at this mounting position is measured by a measuring device. Since the thickness of the substrate is known, the height of the mounting position of the substrate can be determined by adding the thickness of the substrate to the measured height of the lower surface. Therefore, based on the measurement result, control is performed so that the vertical stroke of the nozzle becomes the optimum stroke, and the electronic component is mounted on the substrate.

(Example) (Example 1) Next, an example of the present invention will be described with reference to the drawings.

FIG. 1 is a side view of the electronic component mounting apparatus. Reference numeral 1 denotes a substrate, which is positioned by being clamped by a positioning unit 2. Reference numerals 3 and 4 denote XY tables on which a transfer head 5 is provided. Reference numeral 6 denotes a nozzle of the transfer head 5, which sucks the electronic component P and transfers it to the substrate 1.

Reference numeral 7 denotes a laser device as a height measuring device provided below the substrate 1 and is mounted on XY tables 8 and 9.

In the above configuration, when the XY tables 3 and 4 are driven, the transfer head 5 moves in the XY direction, and the electronic components P mounted on the tape feeder, the tube feeder, the tray feeder, and the like are mounted on the substrate 1. Prior to this,
When the XY tables 8 and 9 are driven, the laser device 7
Moves right below the mounting position, and measures the height of the lower surface b of the substrate 1 corresponding to the mounting position a. The thickness t of the substrate 1 is known, and thus the height of the upper surface of the substrate 1 at the mounting position a is determined by adding the thickness t to the measured height of the lower surface b. Then, the result is fed back to the lifting / lowering means of the nozzle 6 to correct the lifting / lowering stroke of the nozzle 6 and raise / lower the nozzle 6, whereby the electronic component P can be mounted on the substrate 1 with an optimum stroke.

According to this means, the height of the mounting position a of each electronic component P is determined each time immediately before the mounting of each electronic component P, so that the substrate 1 has an upward convex shape as shown by a chain line. Regardless of the deformation, the electronic component P can be mounted with an optimum stroke.

In addition, as shown in FIG.
When the electronic component P is mounted on the back surface of the substrate 1, the mounting is performed by adding the thickness of the electronic component P and the thickness t of the substrate 1 to the measured height of the lower surface c of the electronic component P. The height of the upper surface of the substrate 1 at the position a is determined.

In this case, the height of the mounting position a can be approximately calculated by measuring the height of the lower surface near the electronic component P as shown in FIG.

Embodiment 2 In FIG. 4, the transfer head 5 is a rotary head 11.
It is attached to. The positioning unit 2 is an XY table
13 is placed. The electronic component P is mounted on the substrate 1 by the rotation of the rotary head 11 by the index rotation.
Is mounted at a predetermined mounting position a on the substrate 1.

The position where the nozzle 6 moves up and down is constant, and therefore the laser device 7 is fixed below the substrate 1 corresponding to the position where the nozzle 7 moves up and down.

Also in this case, the electronic component P is moved up and down the nozzle 6
Immediately before mounting the electronic component P on the substrate 1, the height of the lower surface b of the substrate 1 is measured, and the vertical stroke of the nozzle 6 is corrected in the same manner as in the above embodiment. In addition, as shown in FIG. 5, when the bond B is applied to the substrate 1 from the nozzle 21 of the dispenser 20, this means detects the bending of the substrate 1 and adjusts the vertical stroke of the nozzle 21. Can also be applied. 22 is an XY for moving the dispenser 20 in the XY direction.
It is a table.

(Effects of the Invention) As described above, according to the present invention, backup pins can be made unnecessary, and therefore, as in the conventional means, the work of replacing the backup pins can be made unnecessary according to the type change of the substrate, and each electronic device can be replaced. Since the height of the component mounting position can be formed each time immediately before each electronic component is mounted, the electronic component can be reliably mounted on the substrate by optimally adjusting the up / down stroke of the nozzle.

[Brief description of the drawings]

1 shows an embodiment of the present invention, FIG. 1 is a side view of an electronic component mounting apparatus, FIGS. 2 and 3 are partial side views, FIG. 4 is a side view of another embodiment, FIG. 5 is a side view of another embodiment, and FIG. 6 is a side view of a conventional means. DESCRIPTION OF SYMBOLS 1 ... Substrate 2 ... Positioning part 5 ... Transfer head 6 ... Nozzle 7 ... Height measuring device

Claims (1)

(57) [Claims] An electronic component mounting method, wherein an electronic component is attracted to a nozzle and the nozzle is moved up and down so that the electronic component is mounted on a substrate positioned at a positioning portion. The height of the lower surface of the substrate at the mounting position is measured by a height measuring device, the thickness of the substrate is added to the measurement result, the height of the mounting position of the upper surface of the substrate is obtained, and the elevating stroke of the nozzle is determined. An electronic component mounting method characterized by doing so.