JP2004048078A - Electronic component automatic mounting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To allow a component mounting to be carried out reliably even if a height of a position at which the component is to be mounted is not regular. <P>SOLUTION: When there is a difference between the position of the other step and a step wherein the mounting data is reserved in RAM 31 for mounting an electronic component 5, a stroke motor 115 is controlled by CPU 30 according to the height indicated in H data in a state in which the data of the height is input to H data, and a suction nozzle 14 is moved downward to a height indicated in H data each step. <P>COPYRIGHT: (C)2004,JPO

Description

The present invention relates to an automatic electronic component mounting apparatus that takes out a desired electronic component from a component supply unit in a predetermined order by a take-out nozzle and mounts the electronic component on a printed circuit board.

An electronic component mounting apparatus of this type is disclosed in Japanese Patent Application Laid-Open No. 5-192824.

According to this conventional technique, data storing the component type and the mounting position for each mounting order is stored in a storage device in the electronic component mounting apparatus, and the electronic component picked up by the take-out nozzle has an XY table based on the data. It moves and is attached to the position shown in the data.

In this case, if the thickness differs for each type of component, it is impossible to reliably mount the component if the descending amount of the take-out nozzle is always the same. Is stored, and the lowering of the nozzle is controlled based on this data.
JP-A-5-192824

However, in the prior art, when a component is further mounted after the component is mounted as shown in FIGS. 9 and 10, the height position of the substrate itself changes, so that the thickness of each component is reduced. The descent amount cannot be controlled depending on the data.

Also, depending on the substrate, the height position may not be constant due to upward warping (the center is high).

Therefore, an object of the present invention is to ensure that components can be mounted even when the height of the position where the components are to be mounted is not constant.

Therefore, a first aspect of the present invention provides an automatic electronic component mounting apparatus that takes out desired electronic components from a component supply unit in a predetermined order by a take-out nozzle and mounts the components on a printed circuit board. Storage means for storing information and information on the height position to be mounted; relative position changing means for changing the relative position between the take-out nozzle and the printed circuit board; and a horizontal position to be mounted on the printed circuit board stored in the storage means. Control means for changing the relative position of the take-out nozzle and the printed circuit board in the horizontal direction and the height direction based on the information and the information of the height position to be mounted, and controlling the mounting of the component on the printed circuit board. It is characterized.

According to the electronic component automatic mounting apparatus of the first aspect, the nozzle and the nozzle based on the horizontal position information to be mounted and the height position information to be mounted on the printed circuit board specified in each mounting order and stored in the storage means. Since the change of the relative position with respect to the printed circuit board is controlled, even if the height position of the position to be mounted is not constant depending on the state of the board surface or the like, the information on the height position to be mounted stored in the storage means is used. Parts can be reliably mounted.

Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.

2 and 3, reference numeral 1 denotes a Y table that moves in the Y direction by rotation of a Y-axis motor 2, and 3 denotes a movement in the X direction on the Y table 1 by rotation of an X-axis motor 4. As a result, the printed circuit board 6 on which the chip-shaped electronic components 5 (hereinafter, referred to as chip components or components) are mounted is fixedly mounted on fixing means (not shown).

Reference numeral 7 denotes a supply table on which a number of component supply devices 8 for supplying the chip components 5 are provided. Reference numeral 9 denotes a supply stand drive motor, which rotates the ball screw shaft 10 so that the supply stand 7 is guided by the linear guide 12 via a nut 11 screwed into the ball screw shaft 10 and fixed to the supply stand 7. To move in the X direction. Reference numeral 13 denotes a rotary table which rotates intermittently. At the outer edge of the table 13, mounting heads 15 having a plurality of suction nozzles 14 are arranged at equal intervals in accordance with an intermittent pitch.

A suction station I is a stop position of the mounting head 15 where the suction nozzle 14 sucks and picks up the component 5 from the supply device 8 due to the intermittent rotation of the rotary table 13, and the suction nozzle 14 sucks the component 5 at the suction station I. I do.

Reference numeral 16 denotes a component recognition device for recognizing a positional shift of the component 5 to be suctioned by the suction nozzle 14 by using a camera to image the lower surface of the component 5 in a predetermined visual field range and performing recognition processing on the captured screen. It is provided in.

The position at which the mounting head 15 next to the recognition station II stops is the angle correction station III, and the angle amount for correcting the angular displacement of the chip component 5 based on the recognition result of the recognition device 16 is added to the predetermined angle amount. The head rotating device 17 rotates the mounting head 15 in the θ direction by an angle amount. The θ direction is a direction that rotates around the axis of the nozzle 14 that extends in the up-down direction.

The next stop position after the angle correction station III is the mounting station IV, and the component 5 to be sucked by the suction nozzle 14 of the station IV is mounted on the substrate 6 by lowering the mounting head 15.

Numeral 20 denotes an elevating rod which moves up and down, engages with an oscillating lever 21 of the component supply device 8 and oscillates to intermittently feed a component storage tape (not shown) in which the chip components 5 are sealed at a predetermined interval according to the interval. The chip component 5 is supplied to the component suction position of the suction nozzle 14. Reference numeral 22 denotes a tape reel for winding the component storage tape (not shown).

Next, a mechanism for raising and lowering the mounting head 15 in the mounting station IV will be described with reference to FIGS.

Reference numeral 53 denotes a lifting block having a U-shaped cross section. The lifting block 53 is disposed at a portion where the cylindrical cam 29 is cut out at the mounting station, and has an upper end provided on a lifting plate 55 which moves up and down along a guide 54 attached to a support plate 109. Is attached.

The protruding piece 57 at the lower part of the elevating block 53 is located at the extended position of the cylindrical cam 29 at the ascending position of the elevating block 53, and the cam followers 26 and 27 can move over the upper and lower sides of the protruding piece 57 by the rotation of the turntable 13. It has been done.

A rail 110 is attached to the upper end of the elevating plate 55, and the guide portion 111 can move in the horizontal direction along the rail 110. Therefore, the moving body 56 having the guide portion 111 on the rear surface in FIG. It can be moved in the left and right direction. A pair of rollers 112 is rotatably mounted on the front surface of the moving body 56 and sandwiches a vertically extending guide piece 114 formed at the right end of the variable stroke plate 113 in FIG. The movable body 56 is moved up and down by being guided by the guide piece 114. As a result, the rail 110 and the lift plate 55 also move up and down.

Reference numeral 115 denotes a stroke motor which rotates the ball screw 116 to move the variable plate 113 attached to the nut 117 to which the ball screw 116 is fitted, right and left along the guide 118. The moving body 56 moves along the rail 110 to, for example, the position shown in FIGS. 4 and 5 via the roller 112 sandwiching the guide piece 114 by the movement of the variable plate 113.

A cam 119 engages with a cam follower 122 pivotally supported at one end of a cam lever 121 rotatable around a support shaft 120 and swings the lever 121. When the cam 119 rotates, the lever 121 swings. An up / down swing lever 124 pivotally supported by the other end of the link lever 123 via a link lever 123 pivotally supported by the other end of the lever 121 is pivoted about a support shaft 125. I do.

A cam follower 127 rotatably attached to the rear surface of the moving body 56 in FIG. 5 is pulled by an extension piece 128 formed between the rail 110 and the support 28 on the engagement piece 126 formed on the lever 124. Engaged. Accordingly, the movable body 56 moves up and down along the guide piece 114 whose position in the left-right direction is determined by the rotation of the stroke motor 115 due to the swing of the lever 124.

The engagement piece 126 swings between the position indicated by the solid line and the position indicated by the two-dot chain line in FIGS. 4 and 5 due to the rotation of the cam 119, but the cam follower 127 engages at the position indicated by the solid line which is the highest position. The surface is horizontal, and in this position, the height of the moving body 56, that is, the lift block 53 remains unchanged regardless of the position of the guide piece 114 due to the rotation of the motor 115, and the followers 26 and 27 move up and down with the cylindrical cam 29. The user can move between the blocks 53. Further, the lower limit position of the moving body 56, that is, the lifting block 53 changes depending on the position of the guide piece 114 in the left-right direction, and the vertical stroke of the suction nozzle 14 changes.

The lower limit position of the swing of the engagement piece 126 is always the same at the position indicated by the two-dot chain line in FIGS. 4 and 5, and since the contact surface of the cam follower 127 is linear, the cam follower 127 is at the position where the cam follower 127 is located. In this case, when the moving body 56 moves in the horizontal direction due to the rotation of the motor 115 with respect to the stroke in which the moving body 56 descends, the increase in the descending stroke is proportional to the lateral moving distance of the moving body 56 and linearly. Change. Therefore, it is easy to control the vertical stroke of the suction nozzle 14.

Due to the rotation of the cam 119, the block 53 is kept in an up state until the mounting head 15 of the immediately preceding station moves to the mounting station and stops, and then moves down after the mounting head 15 moves to the mounting station and then descends. , Until the next turntable 13 rotates.

The mounting head 15 is moved up and down by the same mechanism in the suction station I.

Further, the suction nozzle 14 is constantly urged by a compression spring (not shown) in a downward direction with respect to the mounting head, so that the nozzle 14 contacts the substrate 5 with the component 5 being sucked, and then the mounting head 15 is further moved. The spring is compressed by a predetermined amount by the constant lowering, the impact is absorbed, and the component 5 is mounted on the substrate 6 with a predetermined pressing force.

Next, a control block of the electronic component automatic mounting apparatus will be described with reference to FIG.

# 30 is a CPU, which performs overall control of component mounting of the electronic component mounting apparatus in accordance with a program stored in the ROM 32 based on data stored in the RAM 31. Control objects such as the X-axis motor 4, the Y-axis motor 2, and the stroke motor 115 are connected to the CPU 30 via an interface 33 and a drive circuit 35.

(7) The mounting data shown in FIGS. 7 and 8 is stored in the RAM 31, and the components 5 are mounted in the order of the data. In the data, X data and Y data indicate a mounting position on the board 6, θ data indicate an angular position to be mounted, and a component supply device 8 on which a component supply device 8 of a component type to be taken out is mounted. The position on 7 is shown.

The number of the control command (the column indicated by C in FIG. 8) is a number assigned to each block by dividing the step into a plurality of blocks, and the block is drawn between steps M3 and M4 in FIG. Are separated by a line. The data in FIG. 8 is for one unit substrate 34 shown in FIG. 9, and the position of each unit substrate 34 in the substrate 6 is designated in FIG. That is, the position of the origin of each unit substrate 34 with respect to the origin position in the substrate 6 is shown for each step in FIG.

部品 The parts having the same numbers as the block numbers of the control commands shown in FIG. 8 are the same as those shown in FIGS. 9 and 10, respectively.

The order of mounting the components 8 is as follows. In the unit board in the order of the steps (A1, A2, A3) in FIG. 7, the components are mounted in the order of the steps (M1, M2...) In FIG. In the case of the embodiment, the same blocks are continuously mounted.

As shown in FIG. 10, the component 5 of the block with the block number 1 is completely covered by the component 5 of the block with the block number 3, and the mounting height is different.

Therefore, the H data stores the height data of the mounting surface at the position where the component 5 is to be mounted. The mounting surface of the substrate 6 is usually a flat surface, but there is a case where only a part of the substrate 6 is concave as shown in FIGS. The substrate 6 may be warped at the center rather than at the side. The data of the height of the mounting surface is usually the data of the height of the upper surface of the board. However, if the data is to be mounted on the already mounted component 5, the height data of the upper surface of the previously mounted component 5 Data.

This H data is set assuming that the height of the standard substrate upper surface is 0, but no data is included in the case of the step of mounting at the standard height as shown in FIG. The data is input only when the height is not the height of the data. Alternatively, even in the standard case, 0 may be input. In this case, 0 may be automatically added from the beginning, and the height may be changed only for the step to be changed. The RAM 31 stores component data (not shown), and stores component thickness data for each component type.

The operation of the above configuration will be described below.

自動 Automatic operation of the electronic component automatic placement device is performed by operating an operation unit (not shown).

The CPU 30 controls the suction operation of the component 5 in accordance with the mounting data shown in FIGS. 7 and 8 stored in the RAM 31. The head 15 is stopped at the take-out position where the head 15 stops at the station I, and the component 5 is vacuum-sucked by the nozzle 14 as the head 15 moves up and down.

Next, after the suction nozzle 14 takes out the component 5, the rotary table 13 rotates intermittently and the mounting head 15 reaches the next station. At this time, in the suction station I, the component 5 in step M2 is suctioned in the same manner.

Next, due to the subsequent intermittent rotation of the rotary table 13, the component recognition device 16 recognizes the positional deviation of the component 5 at the recognition station II, and then corrects the angular position and the position in the X and Y directions, and the mounting station. At the IV, it is mounted on the printed circuit board at the position where the position of step A1 in FIG. 6 is added to the position of the X data and Y data in FIG.

装着 The mounting operation will be described.

While the mounting head 15 is moving to the mounting station IV from the previous station, the CPU 30 reads out the H data of the next mounting step, and reads out the component indicated by the data from the component removal data of the step. The component thickness of the component type supplied by the supply device 8 is read from component data (not shown), and the height calculated by adding the difference between the standard component thickness and the component thickness of the non-equivalent component 5 to the height indicated by the H data is calculated. The position of the cam follower 127 on the engagement piece 126 is determined by rotating the stroke motor 115 so that the calculated amount is added to the standard descending stroke. That is, as shown in FIGS. 9 and 10, the H data is added when the device is mounted in the concave portion, the calculated stroke is increased, and when the component thickness is large, the stroke is reduced.

As a result, next, in the mounting station IV, the vertical movement lever 124 rocks due to the rotation of the cam 119, the calculated stroke elevating plate 55 descends, and the mounting head 15 and the suction nozzle 14 move to the height of the mounting surface. Then, the component 5 is lowered by a distance corresponding to the component thickness, and the component 5 is mounted on the substrate 6 with a predetermined pressing force.

Also, if you set the data of the stroke to be lowered instead of the data of the component thickness for each component type, change it when you want to change the pressing pressure due to the size or material difference of the component 5 even if the component thickness is the same. In this case as well, by setting the H data as shown in FIG. 8, even if the height of the mounting surface changes, it can be mounted by pushing in at the same pressure that should be pushed out.

In the present embodiment, the mounting data is set as shown in FIG. 8, but when the area A of the substrate 6 is higher than the other area B by H1 as shown in FIG. As shown in FIG. 11, the mounting data P1 for the area A is created, and the height H1 (or -H1 if the downward direction is a plus direction) is set collectively in step M0 of the H data. For example, the CPU 30 controls the stroke of the stroke motor 115 in the same manner as described above with the H data of all the steps of the mounting data P1 as H1. In this case, mounting data P2 shown in FIG. 12 is created for area B, 0 is set in step M0, and mounting is performed at a normal height. The mounting data P1 and the mounting data P2 constitute NC data indicating the board type AAA together with operation data (data such as dimensions of the board 6 are stored). In this case, if there is a step in the area B where the height is particularly changed, the H data of the step may be input as shown in FIG. 15, for example. This also applies to the mounting data P1 shown in FIG. 11, and the height of only the step can be changed by inputting the H data of each step, but in the case of FIG. 11, the individually set H The value of the data may be a value based on the upper surface of the area B, or a value added to the value set in the step M0 of the area A.

Also, since the mounting order is divided into blocks, the area A shown in FIG. 14 is one component, and even if other components are mounted thereon, the components having the size of the area A are not mounted. Control can be performed such that the camera is mounted in one of the steps of the data P2.

In the present embodiment, the stroke of the mounting head 15 is changed based on the H data. However, a mechanism for moving the table on which the substrate 6 is placed up and down is provided, and the substrate 6 is moved up and down by the H data. The pressing force on the component 5 may be set to a predetermined value.

In this embodiment, the electronic component automatic mounting apparatus for mounting the electronic component on the printed circuit board has been described. However, in order to temporarily fix the electronic component on the printed circuit board, an adhesive is applied to the substrate before the electronic component is mounted. Also in the adhesive coating apparatus which discharges and applies by the application nozzle which moves up and down, the same H data as in FIG. 8 or FIG. 11 and FIG. Control may be performed so as to be changed accordingly.

It is a figure showing a control block of an electronic parts automatic placement device. It is a top view of an electronic component automatic mounting device. It is a side view of an electronic component automatic mounting device. It is a front view which shows the raising / lowering mechanism of a mounting head. It is a front view which shows the raising / lowering mechanism of a mounting head. It is a side view which shows the raising / lowering mechanism of a mounting head. It is a figure showing attachment data. It is a figure showing attachment data. It is a top view showing a printed circuit board. It is a side view which shows a printed circuit board. It is a figure showing attachment data. It is a figure showing attachment data. It is a figure showing the whole NC data. It is a top view showing a printed circuit board. It is a figure showing attachment data.

Explanation of reference numerals

2 Y-axis motor (relative position changing means)
4 X-axis motor (relative position changing means)
5 Chip-shaped electronic component 6 Printed circuit board 14 Suction nozzle (extraction nozzle)
30 CPU (control means)
31 RAM (storage means)
115 Stroke motor (relative position changing means)

Claims (1)

In an electronic component automatic placement apparatus that takes out desired electronic components from a component supply unit in a predetermined order by a take-out nozzle and mounts them on a printed circuit board, horizontal position information to be mounted on the printed circuit board and a height position to be mounted on the printed circuit board in each mounting order Means for changing the relative position between the take-out nozzle and the printed circuit board; horizontal position information to be mounted and height position to be mounted on the printed circuit board stored in the storage means Control means for controlling the relative position of the take-out nozzle and the printed circuit board in the horizontal direction and the height direction based on the information and mounting the component on the printed circuit board. Electronic component automatic mounting device characterized by the above-mentioned.

Images