JP2006222340A - Device and method for drying substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce the price of a device by heating a substrate inexpensively. <P>SOLUTION: The substrate 1 is transferred to the substrate drying device after removing treating liquid on the surface thereof by air knives. Rollers 10 are turned at a predetermined speed to move the substrate 1 into a substrate moving direction with the predetermined speed. The hot air knives 20a, 20b blow gas with a temperature higher than a normal temperature against the substrate 1. Heat insulating members 30a, 30b are constituted of a heat insulating material and suppress the lowering of temperature of the gas blown against the substrate 1 from the hot air knives 20a, 20b. A drying tank 40 is constituted of the heat insulating material and circulates the gas while suppressing the lowering of temperature of the gas passed between the heat insulating members 30a, 30b and the substrate 1, whereby the gas in the drying tank 40 is kept at a high temperature and suppresses further the lowering of temperature of the gas blown against the substrate 1 from the hot air knives 20a, 20b, and a collecting tubing 24 collects a part of gas from the drying tank 40 to return to a gas heating device 22. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a substrate drying apparatus and a substrate drying method for drying a panel substrate or the like for a flat panel display device, and more particularly to a substrate drying apparatus and a substrate drying method suitable for drying a large substrate.

  In a manufacturing process of a panel substrate for a flat panel display device such as a liquid crystal display device or a plasma display device, chemical processing such as development and etching is performed to form a circuit pattern, a color filter, and the like on the substrate. Before or after the chemical treatment, it is necessary to clean the substrate using cleaning water (pure water) and dry the substrate after cleaning. These series of processes including the cleaning and drying of the substrate are often performed while moving the substrate using a moving means such as a roller conveyor, and the drying of the substrate is performed by blowing air onto the substrate using an air knife. In general, a treatment liquid such as cleaning water is removed from the surface of the substrate.

If the substrate becomes larger with the recent increase in the screen size of flat panel display devices, it will take time to sufficiently dry the substrate by simply removing the processing solution using an air knife, or the substrate will be sufficiently dried. I could not. For this reason, after removing the processing liquid using an air knife, the substrate is further dried by heating the substrate. Conventionally, an infrared heater as described in Patent Document 1 and Patent Document 2 has been used for heating such a substrate.
JP-A-5-166789 Japanese Patent Laid-Open No. 10-321583

  The conventional substrate drying apparatus has a problem that the apparatus becomes expensive because an expensive hot plate or infrared heater is required to heat the substrate. In particular, the larger the substrate, the larger the hot plate and infrared heater, which are more expensive.

  An object of the present invention is to heat the substrate at a low cost and to reduce the price of the apparatus.

  The substrate drying apparatus of the present invention comprises a substrate moving means for moving a substrate, a hot air knife for blowing a gas having a temperature higher than normal temperature onto the substrate moved by the substrate moving means, and a heat insulating material, and is moved by the substrate moving means. A heat insulating member that is provided around the substrate and suppresses a decrease in the temperature of the gas blown from the hot air knife to the substrate, and a heat insulating material, and is provided around the hot air knife and the heat insulating member between the heat insulating member and the substrate. And a drying tank that circulates the gas while suppressing a decrease in the temperature of the gas that has passed through.

  In addition, the substrate drying method of the present invention sprays a gas having a temperature higher than normal temperature from the hot air knife to the substrate while moving the substrate, and a thermal insulation member made of a heat insulating material is provided around the substrate to spray the substrate from the hot air knife. The temperature of the generated gas is suppressed, a drying tank made of a heat insulating material is provided around the hot air knife and the heat retaining member, and the gas is measured while suppressing the temperature decrease of the gas that has passed between the heat retaining member and the substrate. Is circulated in the drying tank.

  The substrate is heated and dried by blowing hot gas from the hot air knife to the substrate. The temperature of the gas discharged from the hot air knife decreases due to expansion. And, as it is, the surrounding gas is deprived of heat and the temperature further decreases.In the present invention, the heat transfer is suppressed by the heat insulating member made of a heat insulating material, and the temperature of the gas blown from the hot air knife to the substrate is reduced. Reduction is suppressed. In addition, since the gas that has passed between the heat retaining member and the substrate circulates in the drying tank while suppressing a decrease in temperature, the gas in the drying tank is kept at a high temperature, and the gas blown from the hot air knife to the substrate A decrease in temperature is further suppressed. Therefore, the substrate can be effectively heated using the hot air knife.

  Furthermore, the substrate drying apparatus of the present invention comprises a gas supply means for heating the gas and supplying it to the hot air knife, and a gas recovery means for recovering a part of the gas from the drying tank and returning it to the gas supply means. is there. Further, the substrate drying method of the present invention recovers a part of the gas from the drying tank, reheats it, and uses it as a part of the gas supplied to the hot air knife.

  By collecting and reusing the high-temperature gas in the drying tank, the amount of gas consumed is reduced, and further, energy for heating the gas is reduced.

  Further, when a plurality of hot air knives are provided, the heating effect of the substrate is improved. When a plurality of hot air knives are provided, a plurality of hot air knives may be provided along the flow of the substrate to be moved, or may be provided on the upstream side and the downstream side of the substrate to be moved.

  According to the substrate drying apparatus and the substrate drying method of the present invention, the substrate can be effectively heated using the hot air knife. Therefore, the substrate can be heated at a low cost without using an expensive hot plate or infrared heater, and the price of the apparatus can be reduced.

  Moreover, by recovering and reusing the high-temperature gas in the drying tank, it is possible to reduce gas consumption and further reduce the energy for heating the gas. Therefore, the operating cost of the apparatus is reduced.

  Moreover, the heating effect of a board | substrate can be improved by providing multiple hot air knives.

  FIG. 1 is a diagram showing a schematic configuration of a substrate drying apparatus according to an embodiment of the present invention. The substrate drying apparatus includes a roller 10, hot air knives 20 a and 20 b, heat retaining members 30 a and 30 b, and a drying tank 40.

  The substrate drying apparatus of the present embodiment is used after removing the processing liquid on the surface of the substrate using an air knife in the substrate drying process. The substrate 1 is transported to the substrate drying apparatus in the substrate movement direction indicated by a large arrow after the surface treatment liquid is removed by an air knife (not shown).

  The substrate 1 transported to the substrate drying apparatus is mounted on a plurality of rollers 10. Each roller 10 is installed at a constant interval in the substrate moving direction, and is rotated at a predetermined speed by a driving means (not shown) to move the substrate 1 in the substrate moving direction at a predetermined speed.

  Above the substrate 1 mounted on the roller 10, a hot air knife 20 a is installed in parallel with the substrate 1 over a width in a direction (drawing depth direction) orthogonal to the substrate moving direction of the substrate 1. A hot air knife 20b is similarly installed below the substrate 1 mounted on the roller 10. The hot air knives 20a and 20b are configured, for example, by forming a pressurizing chamber inside a long casing and providing an air passage leading to the pressurizing chamber in a slit shape in the longitudinal direction.

  A gas supply facility for supplying gas to the hot air knives 20 a and 20 b includes a gas tank 21, a gas heating device 22, and a supply pipe 23. Gas is supplied from the gas tank 21 to the gas heating device 22. The gas heating device 22 is configured, for example, by installing a pipe spirally around a cylindrical heater, and heats the gas passing through the pipe with the heat of the heater. The gas having a temperature higher than normal temperature heated by the gas heating device 22 is supplied to the hot air knives 20a and 20b through the supply pipe 23. The supply pipe 23 can prevent the temperature of the gas heated by the gas heating device 22 from being lowered by winding a heat insulating material.

  As the gas, for example, purified air or nitrogen is used. The advantage of using air is that it is inexpensive and easy to handle. The advantage of using nitrogen is that the piping in the gas heating device 22, the supply piping 23, and the like are not easily oxidized.

  The hot air knives 20a and 20b uniformly discharge a gas having a temperature higher than normal temperature supplied through the supply pipe 23 from the front end of the air passage in the longitudinal direction. In the present embodiment, as an example, the temperature of the gas discharged from the tip of the air passage is set to 180 to 200 ° C. The gas discharged from the hot air knives 20a, 20b is blown obliquely in the substrate movement direction at a predetermined incident angle with respect to the front or back surface of the substrate 1. Thereby, the front surface and the back surface of the substrate 1 are heated and dried.

  Above the substrate 1 mounted on the roller 10, a heat retaining member 30a is installed in parallel with the substrate 1 at a predetermined interval over a width in a direction orthogonal to the substrate movement direction of the substrate 1 (the depth direction in the drawing). Yes. Also, below the substrate 1 mounted on the roller 10, a heat retaining member 30b is installed in parallel with the substrate 1 at a predetermined interval across the width in the direction orthogonal to the substrate moving direction of the substrate 1 (the drawing depth direction). Has been. The heat retaining members 30a and 30b are made of a heat insulating material. Silicon-based rubber or urethane may be used for the heat insulating material.

  In the present embodiment, the thickness of the heat retaining member 30b is larger than the diameter of the roller 10, and the heat retaining member 30b is provided with the roller 10 across the width in the direction perpendicular to the substrate moving direction of the substrate 1 (the depth direction in the drawing). An entry groove is provided.

  The temperature of the gas discharged from the hot air knives 20a and 20b decreases due to expansion. Then, although the heat is taken away by the surrounding gas as it is and the temperature further decreases, the heat retaining members 30a and 30b made of a heat insulating material are blown from the hot air knives 20a and 20b to the substrate 1 while suppressing heat propagation. Suppresses a decrease in the gas temperature.

  A drying tank 40 is provided around the hot air knives 20a and 20b and the heat retaining members 30a and 30b. The drying tank 40 is made of a heat insulating material in the same manner as the heat retaining members 30a and 30b.

  In the present embodiment, since the gas from the hot air knives 20a, 20b is blown obliquely in the direction of movement of the substrate, the gas blown from the hot air knives 20a, 20b to the substrate 1 flows between the heat retaining members 30a, 30b and the substrate 1. It passes in the same direction as the substrate movement direction. A part of the gas passing between the heat retaining members 30a and 30b and the substrate 1 circulates in the drying tank 40 as indicated by a small arrow, and a part of the gas enters and exits the substrate 1 provided in the drying tank 40. Discharged from.

  The drying tank 40 made of a heat insulating material keeps the gas in the drying tank 40 at a high temperature by circulating the gas while suppressing a decrease in the temperature of the gas that has passed between the heat retaining members 30a and 30b and the substrate 1. Further, the temperature of the gas blown from the hot air knives 20a, 20b to the substrate 1 is further suppressed.

  FIG. 2 is a diagram showing a schematic configuration of a substrate drying apparatus according to another embodiment of the present invention. In this embodiment, a recovery pipe 24 is added to the embodiment shown in FIG. The recovery pipe 24 recovers a part of the gas from the drying tank 40 and returns it to the gas heating device 22. The recovery pipe 24 can prevent the temperature of the recovered gas from decreasing by winding a heat insulating material.

  The gas supply facility heats the gas recovered by the recovery pipe 24 together with the gas supplied from the gas tank 21 by the gas heating device 22, and supplies the gas to the hot air knives 20 a and 20 b via the supply pipe 23. Thereby, a part of gas in the drying tank 40 is collect | recovered and reheated, and becomes a part of gas supplied to hot air knife 20a, 20b.

  According to the present embodiment, by recovering and reusing the high-temperature gas in the drying tank 40, the gas consumption is reduced, and the energy for the gas heating device 22 to heat the gas is reduced. be able to. Therefore, the operating cost of the apparatus is reduced.

  FIG. 3 is a diagram showing a schematic configuration of a substrate drying apparatus according to still another embodiment of the present invention. In the present embodiment, a plurality of hot air knives 20a and 20b are provided along the flow of the substrate 1 to be moved in the embodiment shown in FIG.

  A plurality of hot air knives 20 a (two in the present embodiment) are installed above the substrate 1 mounted on the roller 10 along the flow of the substrate 1 moved by the roller 10. A hot air knife 20b is similarly installed below the substrate 1 mounted on the roller 10. The gas discharged from the hot air knives 20a, 20b is blown obliquely in the substrate movement direction at a predetermined incident angle with respect to the front or back surface of the substrate 1. The heat retaining members 30a and 30b are divided and installed so as not to interfere with the hot air knives 20a and 20b.

  FIG. 4 is a diagram showing a schematic configuration of a substrate drying apparatus according to still another embodiment of the present invention. In the present embodiment, hot air knives 20a and 20b are provided on the upstream side and the downstream side of the substrate to be moved as compared with the embodiment shown in FIG.

  Above the substrate 1 mounted on the roller 10, hot air knives 20 a are respectively installed on the upstream side and the downstream side of the substrate moved by the roller 10. A hot air knife 20b is similarly installed below the substrate 1 mounted on the roller 10. The heat retaining members 30a and 30b are each divided into two, and are installed with an opening at the center. The recovery pipe 24 is installed above or below the openings of the heat retaining members 30a and 30b.

  The gas discharged from the hot air knives 20a and 20b on the upstream side is blown obliquely to the front or back surface of the substrate 1 at a predetermined incident angle in the substrate moving direction. The gas blown from the upstream hot air knives 20a, 20b to the substrate 1 passes between the heat retaining members 30a, 30b and the substrate 1 in the same direction as the substrate moving direction.

  On the other hand, the gas discharged from the hot air knives 20a and 20b on the downstream side is blown obliquely to the front or back surface of the substrate 1 at a predetermined incident angle in the direction opposite to the substrate moving direction. The gas blown to the substrate 1 from the hot air knives 20a and 20b on the downstream side passes between the heat retaining members 30a and 30b and the substrate 1 in the direction opposite to the substrate moving direction.

  The gas that has passed between the heat retaining members 30a and 30b and the substrate 1 passes through the openings of the heat retaining members 30a and 30b, and then circulates in the drying tank 40 as indicated by small arrows. The part is recovered by the recovery pipe 24.

  According to the embodiment shown in FIGS. 3 and 4, the heating effect of the substrate 1 can be improved by providing a plurality of hot air knives 20a, 20b.

  According to the embodiment described above, the substrate 1 can be effectively heated using the hot air knives 20a and 20b. Therefore, the substrate can be heated at a low cost without using an expensive hot plate or infrared heater, and the price of the apparatus can be reduced.

It is a figure which shows schematic structure of the board | substrate drying apparatus by one embodiment of this invention. It is a figure which shows schematic structure of the board | substrate drying apparatus by other embodiment of this invention. It is a figure which shows schematic structure of the board | substrate drying apparatus by further another embodiment of this invention. It is a figure which shows schematic structure of the board | substrate drying apparatus by further another embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate 10 Roller 20a, 20b Hot air knife 21 Gas tank 22 Gas heating device 23 Supply piping 24 Recovery piping 30a, 30b Thermal insulation member 40 Drying tank

Claims (8)

A substrate moving means for moving the substrate;
A hot air knife that blows a gas having a temperature higher than room temperature onto the substrate moved by the substrate moving means;
A heat insulating member made of a heat insulating material, provided around the substrate moved by the substrate moving means, and suppressing a decrease in the temperature of the gas blown from the hot air knife to the substrate;
It was made of a heat insulating material, provided around the hot air knife and the heat retaining member, and provided with a drying tank for circulating the gas while suppressing a decrease in the temperature of the gas that passed between the heat retaining member and the substrate. A substrate drying apparatus. Gas supply means for heating and supplying gas to the hot air knife;
The substrate drying apparatus according to claim 1, further comprising a gas recovery unit that recovers a part of the gas from the drying tank and returns the gas to the gas supply unit.   The substrate drying apparatus according to claim 1, wherein a plurality of the hot air knives are provided along a flow of the substrate moved by the substrate moving means.   The substrate drying apparatus according to claim 1, wherein the hot air knife is provided on an upstream side and a downstream side of the substrate moved by the substrate moving unit. While moving the board
Blow a gas at a temperature higher than normal temperature from the hot air knife to the substrate,
A thermal insulation member made of a heat insulating material is provided around the substrate to suppress a decrease in the temperature of the gas blown from the hot air knife to the substrate,
A drying tank made of a heat insulating material is provided around the hot air knife and the heat retaining member, and the gas is circulated in the drying tank while suppressing a decrease in the temperature of the gas that has passed between the heat retaining member and the substrate. Substrate drying method.   6. The substrate drying method according to claim 5, wherein a part of the gas is recovered from the drying tank, reheated, and used as a part of the gas supplied to the hot air knife.   6. The substrate drying method according to claim 5, wherein a plurality of hot air knives are provided along the flow of the substrate to be moved.   6. The substrate drying method according to claim 5, wherein hot air knives are provided upstream and downstream of the substrate to be moved.

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