JP2006222259A - 半導体装置およびその製造方法 - Google Patents
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Abstract
【課題】 製造コストの上昇を抑え、ワイヤーボンド工程で安定した品質のパッケージを製造することができる半導体装置およびその製造方法を提供する。
【解決手段】 リードフレーム10とヒートシンク11が接続される。続いて、ダイパット101上にチップ12が載置され、ワイヤーボンド工程において、チップ12とリードとが、ワイヤー13によって接続される。ワイヤーボンド工程が終了するまでは、ヒートシンク11とリードは密着している。ワイヤーボンド工程の後、一体化されたリードフレーム10、ヒートシンク11、およびチップ12が、上側金型14および下側金型15によって挟み込まれる。この工程において、接続部104を除いて、リードフレーム10とヒートシンク11が分離する。
【選択図】 図1
Description
Claims (10)
- 半導体素子と、前記半導体素子に接続される複数のリードを有するリードフレームと、放熱用のヒートシンクとを備えた半導体装置において、
前記リードフレームは、前記ヒートシンクと接続する接続部を備え、
前記半導体素子と前記リードとをワイヤーで接続するワイヤーボンド工程が終了するまでは、前記ヒートシンクと前記リードは密着しており、
前記ワイヤーボンド工程が終了した後は、前記接続部の変形によって、前記ヒートシンクと前記リードが分離する
ことを特徴とする半導体装置。 - 前記接続部は、前記リードフレームの主面内から外方へ突出するように曲げ加工が施されていることを特徴とする請求項1に記載の半導体装置。
- 前記接続部は、前記リードフレームの主面に平行な方向に屈曲または湾曲していることを特徴とする請求項1に記載の半導体装置。
- 前記接続部は、前記リードフレームの主面内から外方へ突出するように曲げ加工が施されていると共に、前記リードフレームの主面に平行な方向に屈曲または湾曲していることを特徴とする請求項1に記載の半導体装置。
- 前記半導体素子が前記ヒートシンクに搭載されていることを特徴とする請求項1〜請求項4のいずれかの項に記載の半導体装置。
- 前記半導体素子が、前記リードフレームに接続されたダイパットに搭載されていることを特徴とする請求項1〜請求項4のいずれかの項に記載の半導体装置。
- 前記ヒートシンクに搭載された前記半導体素子と、前記リードフレームに接続されたダイパットに搭載された前記半導体素子とを備えたマルチチップ構造であることを特徴とする請求項1〜請求項4のいずれかの項に記載の半導体装置。
- 前記ヒートシンクと前記接続部との接続が、かしめ加工によって行われていることを特徴とする請求項1〜請求項7のいずれかの項に記載の半導体装置。
- 前記ヒートシンクと前記リードの分離が、上側金型と下側金型とによって前記リードフレームを挟み込むクランプ工程において行われることを特徴とする請求項1〜請求項8のいずれかの項に記載の半導体装置。
- 半導体素子と、前記半導体素子に接続される複数のリードを有するリードフレームと、放熱用のヒートシンクとを備えた半導体装置の製造方法において、
前記リードフレームは、前記ヒートシンクと接続する接続部を備え、
前記ヒートシンクと前記リードが密着した状態で、前記半導体素子と前記リードとをワイヤーで接続するワイヤーボンドを行う工程と、
前記ワイヤーボンドが終了した後、前記接続部の変形によって、前記ヒートシンクと前記リードを分離する工程と、
を備えたことを特徴とする半導体装置の製造方法。
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JP2005034136A JP4291788B2 (ja) | 2005-02-10 | 2005-02-10 | 半導体装置およびその製造方法 |
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JP4291788B2 JP4291788B2 (ja) | 2009-07-08 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2018527762A (ja) * | 2015-09-01 | 2018-09-20 | マコム テクノロジー ソリューションズ ホールディングス, インコーポレイテッドMacom Technology Solutions Holdings, Inc. | エアキャビティパッケージ |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2018527762A (ja) * | 2015-09-01 | 2018-09-20 | マコム テクノロジー ソリューションズ ホールディングス, インコーポレイテッドMacom Technology Solutions Holdings, Inc. | エアキャビティパッケージ |
JP7049611B2 (ja) | 2015-09-01 | 2022-04-07 | マコム テクノロジー ソリューションズ ホールディングス, インコーポレイテッド | エアキャビティパッケージ |
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