JP2006210615A - Multiple pattern wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a multipattern wiring board with which a plating layer of constant thickness is coated on a signal wiring in each of wiring board regions. <P>SOLUTION: In a multipattern wiring board 9, a plurality of wiring board regions 1 having a signal wiring 2, respectively, are arrayed into a matrix form, and the wiring board regions 1 are enclosed with a dummy region 3, with a common conductor 4 for plating formed in the dummy region 3 which is electrically connected to the signal wiring 2 of each of wiring board regions 1. A common conductor 9 for plating is electrically connected to the signal wiring 2, with a feeding conductor layer 6 or a ground conductor layer 5 in the wiring board region 1 in-between. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a plurality of wiring boards used for dividing a single mother board to obtain a plurality of wiring boards.

  Conventionally, as a wiring board used in an electronic component storage package for storing an electronic component such as a semiconductor element or a crystal resonator, a signal is applied to the surface of an insulating base made of a ceramic material such as an aluminum oxide sintered body. There is a known structure in which wiring for wiring is formed, and electronic components are mounted on such a wiring board, and the electrodes of the electronic components are electrically connected to predetermined portions of the signal wiring via solder, bonding wires, etc. By doing so, an electronic device is formed.

  In addition, such a wiring board has become extremely small with a size of about several mm square in accordance with the recent demand for downsizing of electronic devices. Such a small wiring board is easy to handle in the manufacturing process, and in order to efficiently produce the wiring board and the electronic device, a plurality of wiring boards are formed from one mother board having a relatively large area. In other words, it is manufactured in the form of a so-called multiple-wiring board in which electronic devices are obtained simultaneously and collectively.

  The above-described multiple wiring substrate is generally formed in a region in which a plurality of wiring substrate regions such as a square shape are arranged in a matrix, a dummy region arranged so as to surround these wiring substrate regions, and each wiring substrate region A plurality of wiring boards can be obtained simultaneously by dividing the mother board along the boundary between adjacent wiring board areas and the boundary between the wiring board area and the dummy area. .

  Further, a plating layer such as nickel or gold is deposited on the surface of the signal wiring in order to prevent oxidative corrosion and improve the connection strength of solder and bonding wires. In general, the plating layer is formed by an electrolytic plating method in which a plating layer is deposited by supplying a plating current to the signal wiring.

For supplying current to the signal wiring in the above-described electrolytic plating method, a frame-shaped common conductor for plating surrounding the entire wiring board region is formed in the dummy area, and the wiring common board This is done by supplying a current to the outermost periphery of the array of regions through a lead wire for plating. In this case, by electrically connecting the signal wirings between the adjacent wiring board areas, the current supplied to the outermost wiring board area is sequentially placed on the central side of the array. Are supplied to the signal wiring.
JP 2001-168526 A JP 2000-286294 A JP 1999-354665 A

  However, in such a multiple wiring board, between the signal wiring in the outermost wiring board area and the signal wiring in the wiring board area located inside the wiring board area directly connected to the common conductor for plating. There is a disadvantage that the plating layer has a large variation in thickness. This is because the distance between the signal wiring and the common conductor for plating gradually increases from the one located on the outer peripheral side of the array toward the one located on the central side, and the electric resistance increases. Due to the variation in electrical resistance, the current supplied to the signal wiring also varies, and as a result, the plating layer has a non-uniform thickness.

  The present invention has been devised in view of the above disadvantages, and an object of the present invention is to provide a multi-piece wiring board capable of depositing a plating layer having a uniform thickness on the signal wiring in each wiring board region. .

  The multiple wiring board of the present invention has a plurality of wiring board areas each having a signal wiring arranged in a matrix, and these wiring board areas are surrounded by dummy areas, and each wiring board area is arranged in the dummy area. A plurality of wiring boards formed by forming a common conductor for plating that is electrically connected to the signal wiring, and the ground in the wiring board region between the common conductor for plating and the signal wiring. It is electrically connected through a conductor layer or a power supply conductor layer.

  The multiple wiring board of the present invention is such that the common conductor for plating and the wiring for signal are electrically connected between each other via a ground conductor layer or a feeding conductor layer in the wiring board region. An increase in electrical resistance according to the distance of the current supply path is suppressed, and it is possible to effectively prevent a large variation in the thickness of the plating layer deposited on the signal wiring between adjacent wiring board regions. it can.

  That is, a current for plating is supplied to the signal wiring in each wiring board region through the ground conductor layer and the power supply conductor layer. In order to supply power stably, it is formed in a larger area than the signal wiring. Therefore, even if the current supply path becomes longer according to the distance from the common conductor for plating, an increase in electrical resistance associated therewith can be suppressed.

  Hereinafter, the present invention will be described with reference to the accompanying drawings. FIG. 1 is a plan view showing an example of an embodiment of a multiple wiring board according to the present invention. A multiple wiring board 9 shown in FIG. 1 is roughly composed of a wiring board region 1 and signal wirings 2. It consists of a dummy region 3 and a common conductor 4 for plating.

  The wiring board region 1 and the dummy region 3 are formed of an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, glass ceramics, or the like.

  If the wiring board region 1 and the dummy region 3 are made of, for example, an aluminum oxide sintered body, a plurality of green sheets obtained by forming a raw material powder such as aluminum oxide into a sheet shape are prepared and the wiring board region 1 is arranged in a matrix. Next, the green sheet is manufactured by subjecting the green sheet to an appropriate punching process as necessary, and then laminating and firing.

  Each wiring board region 1 is a region that becomes an individual wiring board for mounting electronic components, and a signal wiring 2 is formed on the upper surface thereof. The signal wiring 2 extends inside the wiring board region 1 and has one end exposed at an outer surface such as a surface (the lower surface in the example of FIG. 1) facing the surface on which the electronic component is mounted.

  In the signal wiring 2, electrodes of electronic components (not shown) mounted on the wiring board region 1 are electrically connected via conductive connection materials (not shown) such as bonding wires and solder, This functions as a conductive path for leading this out to the lower surface or side surface of the wiring board region 1.

  Examples of electronic components mounted on the wiring board region 1 include semiconductor elements, piezoelectric elements such as crystal resonators and surface acoustic wave elements, capacitive elements, resistors, and inductors.

  The signal wiring 2 is made of a metal material such as tungsten, molybdenum, manganese, copper, silver, palladium, gold, or platinum. For example, in the case of tungsten, the tungsten powder is kneaded with an organic solvent and a binder to form a metal paste. This metal paste is formed by printing in a predetermined pattern on a green sheet that forms the wiring board region 1.

  The exposed surface of the signal wiring 2 is made of nickel or gold to prevent oxidative corrosion and improve characteristics such as solder wettability and bonding wire bondability when connecting the solder or bonding wire. A plating layer (not shown) such as is applied.

  This plating layer supplies a predetermined current to the signal wiring 2 serving as a portion to be plated in a conventionally known electrolytic plating method, specifically, in a plating solution containing a metal component such as nickel or gold. Then, the metal component is deposited on the surface of the signal wiring 2 to form a plating layer.

  For supplying current to the signal wiring 2, a frame-shaped plating common conductor 4 surrounding the entire wiring board area 2 is formed in the dummy area 3, and the plating common conductor 4 is connected to the wiring board. This is done by supplying a current to the outermost periphery of the array of regions through a lead wire for plating.

  The current supply to the plating common conductor 4 is performed, for example, by forming a conductive line (not shown) from the plating common conductor 4 to the outer edge of the dummy region 3 or the side surface of the multi-layer wiring board 9. This is done by supplying a current from a power source (DC rectifier or the like) to a conductive line via a plating jig (not shown).

  The plating common conductor 4, lead-out line, conduction line, and the like are formed of the same metal material as that of the signal wiring 2 by the same method.

  What is important here is that the plating common conductor 4 and the signal wiring 2 are electrically connected to each other via the ground conductor layer 5 or the power supply conductor layer 6 in the wiring board region 1. It is.

  With this configuration, an increase in electrical resistance according to the distance of the current supply path from the plating common conductor 4 is suppressed, and the thickness of the plating layer deposited on the signal wiring 2 between the adjacent wiring board regions 1-1. It is possible to effectively prevent the occurrence of large variations in the thickness.

  That is, a current for plating is supplied to the signal wiring 2 in each wiring board region 1 through the ground conductor layer 5 and the power supply conductor layer 6. The layer 6 is formed with a larger area than the signal wiring so as to stably perform grounding and power feeding. Therefore, even if the current supply path becomes longer according to the distance from the plating common conductor 4, it is possible to suppress an increase in electrical resistance associated therewith.

  In this case, the ground conductor layer 5 and the power supply conductor layer 6 are formed in each wiring board region 1 by being electrically connected to the plating common conductor 4, and the ground conductor layer 5 and the power supply conductor layer 6 are formed in the wiring board region. 1 extends to the outer edge, and the extension is connected to the signal wiring in the adjacent wiring board region 1, the signal wiring 2 is routed through the ground conductor layer 5 and the power supply conductor layer 6. And can be electrically connected to the common conductor 4 for plating. Then, the current for plating is supplied from the common conductor 4 for plating to the ground conductor layer 5 and the power supply conductor layer 6 of the wiring board area 1 located on the outermost periphery of the array, thereby allowing the signal wiring in each wiring board region 1. 2 is supplied with a plating current through the ground conductor layer 5 and the power supply conductor layer 6.

  The signal wiring 2 in the wiring board region 1 located on the outermost periphery of the array is electrically connected to the ground conductor layer 5 and the power feeding conductor layer 6 in the wiring board region 1 in which the signal wiring 2 is formed. The In these outermost wiring board regions 1, a part of the path of the connection line that electrically connects the signal wiring 2 to the ground conductor layer 5 and the power supply conductor layer 6 passes through the dummy region 3. In this way, it is formed. In this way, when the multi-piece wiring board 9 is divided into individual wiring boards, the connection line is disconnected at the portion located in the dummy region 3, so that the signal wiring 2; An electrical short circuit with the ground conductor layer 5 and the power supply conductor layer 6 can be prevented.

  The ground conductor layer 5 and the power supply conductor layer 6 are electrically connected to a ground terminal and a power supply terminal (not shown) of an electronic component to perform grounding and power supply. For example, the surface of the wiring board region 1 It is formed in layers inside.

  Further, the electrical connection between the ground conductor layer 5 or the power supply conductor layer 6 and the electronic component is performed through a conductive connecting material such as a bonding wire or solder, as in the case of the signal wiring 2.

  The ground conductor layer 5 and the power supply conductor layer 6 can be formed by using the same metal material as that for the signal wiring and by the same formation method, and only one of these conductor layers may be formed.

  Further, in order to reliably perform grounding and power feeding by the ground conductor layer 5 and the power feeding conductor layer 6, the ground conductor layer 5 and the power feeding conductor layer 6 are formed in a wide area that covers the entire plane portion of the wiring board region 1. It is preferable.

  Furthermore, when the ground conductor layer 5 and the power supply conductor layer 6 are formed over the entire plane portion of the wiring board region 1, the electric resistance of the plating current path supplied to the signal wiring 2 can be more effectively suppressed. . Thereby, the variation of the plating current supplied to the signal wiring 2 is further suppressed, and the thickness variation of the plating layer can be further reduced.

  In addition, when forming the ground conductor layer 5 and the power supply conductor layer 6 in a wide area extending over the entire planar portion of the wiring board region 1, when forming a plurality in one wiring board region 1, Each is printed with metal paste and laminated. Moreover, when electrically connecting the common conductor 4 for plating and the signal wiring 2 through the ground conductor layer 5 and the electric power feeding conductor layer 6 between them, it is preferable to arrange in any one. In this case, variation in current supplied to the signal wiring 2 can be more effectively suppressed, and variation in the thickness of the plating layer can be more reliably suppressed.

  Further, in order to form the ground conductor layer 5 and the power supply conductor layer 6 in a wide area, an insulating layer (such as a green sheet) for forming such a conductor layer may be added. In this case, the insulating layer on which the ground conductor layer 5 and the power supply conductor layer 6 are formed may or may not be formed with the signal wiring 2.

  With respect to such a multiple wiring board 9, electronic components are mounted on each wiring board region 1, and the electrodes (signal electrodes) of the electronic parts are electrically connected to the signal wiring 2, and a lid is provided as necessary. After sealing the electronic component with a sealing means such as resin or resin, it is divided along the boundary between the wiring substrate regions 1 or the boundary between the wiring substrate region 1 and the dummy region 3, so A plurality of electronic devices having components mounted thereon are formed simultaneously. Here, the mounting of the electronic components may be performed after the plurality of wiring boards are divided into individual wiring board regions.

  The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention.

  For example, in the example of FIG. 1 described above, the ground conductor layer 5 and the power supply conductor layer 6 are formed on the same plane as the signal wiring 2 (the upper surface of the plurality of wiring boards 9). You may make it form in 1 inside. In this case, the ground conductor layer 5 and the power supply conductor layer 6 are connected to a mounting surface (upper surface) of the electronic component via a via conductor (not shown) or the like for electrical connection with a ground terminal of the electronic component. Is derived. Further, the electrical connection between the ground conductor layer 5 and the feeding conductor layer 6 and the signal wiring 2 in the adjacent wiring board region 1 is a castellation provided so as to straddle the boundary between the adjacent wiring board regions 1-1. This is done through a through conductor (not shown). Via conductors and through conductors as described above are formed by punching through holes in advance at the boundary between the wiring board regions 1 and the wiring board regions 1 of the green sheet for forming the multi-piece wiring board 9, for example. The through hole is formed by filling and applying a predetermined metal paste by a conventionally known screen printing method or the like.

It is a top view which shows an example of embodiment of the multiple pick-up wiring board of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Wiring board area 2 ... Signal wiring 3 ... Dummy area 4 ... Common conductor for plating 5 ... Ground conductor layer 6 ...・ Feeding conductor layer 9 ... Multiple wiring board

Claims (1)

A plurality of wiring board regions each having signal wirings are arranged in a matrix, and these wiring board regions are surrounded by dummy regions, and are electrically connected to the signal wirings of the respective wiring board regions. In a multiple wiring board formed by forming a common conductor for plating,
A plurality of wiring boards, wherein the common conductor for plating and the signal wiring are electrically connected to each other through a ground conductor layer or a power supply conductor layer in the wiring board region.

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