JP2006209853A5 - - Google Patents

Download PDF

Info

Publication number
JP2006209853A5
JP2006209853A5 JP2005019034A JP2005019034A JP2006209853A5 JP 2006209853 A5 JP2006209853 A5 JP 2006209853A5 JP 2005019034 A JP2005019034 A JP 2005019034A JP 2005019034 A JP2005019034 A JP 2005019034A JP 2006209853 A5 JP2006209853 A5 JP 2006209853A5
Authority
JP
Japan
Prior art keywords
magnetic head
metal layer
spring metal
layer
head suspension
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005019034A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006209853A (ja
JP4379727B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005019034A priority Critical patent/JP4379727B2/ja
Priority claimed from JP2005019034A external-priority patent/JP4379727B2/ja
Publication of JP2006209853A publication Critical patent/JP2006209853A/ja
Publication of JP2006209853A5 publication Critical patent/JP2006209853A5/ja
Application granted granted Critical
Publication of JP4379727B2 publication Critical patent/JP4379727B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2005019034A 2005-01-27 2005-01-27 磁気ヘッドサスペンションの製造方法 Expired - Fee Related JP4379727B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005019034A JP4379727B2 (ja) 2005-01-27 2005-01-27 磁気ヘッドサスペンションの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005019034A JP4379727B2 (ja) 2005-01-27 2005-01-27 磁気ヘッドサスペンションの製造方法

Publications (3)

Publication Number Publication Date
JP2006209853A JP2006209853A (ja) 2006-08-10
JP2006209853A5 true JP2006209853A5 (enExample) 2009-01-29
JP4379727B2 JP4379727B2 (ja) 2009-12-09

Family

ID=36966525

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005019034A Expired - Fee Related JP4379727B2 (ja) 2005-01-27 2005-01-27 磁気ヘッドサスペンションの製造方法

Country Status (1)

Country Link
JP (1) JP4379727B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102290054B (zh) * 2007-04-18 2014-12-24 大日本印刷株式会社 悬浮臂用基板、其制备方法、磁头悬浮臂和硬盘驱动器
JP4962392B2 (ja) * 2007-04-18 2012-06-27 大日本印刷株式会社 サスペンション用基板の製造方法
JP5147591B2 (ja) 2008-08-06 2013-02-20 日東電工株式会社 回路付サスペンション基板、その製造方法および回路付サスペンション基板の位置決め方法
JP5304175B2 (ja) * 2008-10-29 2013-10-02 大日本印刷株式会社 サスペンション基板の製造方法

Similar Documents

Publication Publication Date Title
JP2007537562A5 (enExample)
JP2009200389A5 (enExample)
JP2007013092A5 (enExample)
JP2010129899A5 (enExample)
JP2011023574A5 (enExample)
CN106358379B (zh) 印刷电路板及其制造方法
TWI405513B (zh) 在金屬與聚亞醯胺間不具黏合物之金屬插塞基板
TWI358981B (en) Method for fabricating circuit board
JP2006209853A5 (enExample)
JP2011139010A5 (enExample)
JP5304175B2 (ja) サスペンション基板の製造方法
TWI548011B (zh) 封裝基板及其製法
TW201220999A (en) Printed circuit board and method for manufacturing the same
JP4984260B2 (ja) プリント配線板の製造方法およびその方法により製造されたプリント配線板
JP2006005043A (ja) 多層回路基板及び実装方法
KR101313155B1 (ko) 인쇄회로기판의 도금방법 및 이를 이용한 연성 인쇄회로기판의 제조방법
JP2007134458A5 (enExample)
WO2003002786A1 (en) Electroplating method and printed wiring board manufacturing method
US20180209046A1 (en) Integrated Circuit Substrate Containing Photoimageable Dielectric Material and Method of Producing Thereof
KR20160001826A (ko) 인쇄회로기판 제조방법
KR20100107936A (ko) 박형 패키지 기판 제조 방법
JP2002050715A (ja) 半導体パッケージの製造方法
TWI457061B (zh) 多層印刷配線板及其製造方法
TW202315477A (zh) 用於在基材上形成電路圖案的方法及電子電路
JP2008277580A5 (enExample)