JP2006208129A - Package for pressure detector, and the pressure detector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for a pressure detector and the pressure detector of high reliability, capable of detecting a carbon chip, when the carbon chip or the like is mixed in between insulation base and diaphragm. <P>SOLUTION: This package/detector is provided with an inspecting electrode 12 formed in the peripheral region of the first electrode 7 within a frame-shaped spacer 11 on a surface of the insulation base 1, a surface of the first electrode 7 is a convex surface that becomes gradually lower in height, starting from the central part going toward the outer circumferential part, and a surface of the inspecting electrode 12 is inclined to a first electrode 7 side. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a pressure detection device package and a pressure detection device used in a pressure detection device for detecting pressure.

  Conventionally, a capacitance type pressure detection device is known as a pressure detection device for detecting pressure. As described in Patent Document 1 below, a package used in this capacitance type pressure detection device includes an insulating base having a mounting portion on which a semiconductor element is mounted, and a static electricity formed on the surface of the insulating base. A first electrode for forming a capacitance, a diaphragm joined in a flexible state to the surface of an insulating substrate, and a capacitor for forming a capacitance deposited on the surface of the diaphragm so as to face the first electrode The second electrode. In order to form a capacitance by the first electrode and the second electrode, it is necessary to provide a predetermined interval between these electrodes, and a spacer is provided between the diaphragm and the insulating base.

  Here, as a method of joining the diaphragm with a high precision placed at a predetermined position on the insulating base, a method of joining using an assembly jig is generally used. For example, an assembly jig having an alignment hole having a shape corresponding to the diaphragm at a predetermined position is arranged on the insulating base, and the diaphragm is inserted into the alignment hole on the assembly jig, and the insulating base and the diaphragm There is a method in which the insulating base and the diaphragm are joined together while aligning with each other.

  As such an assembly jig, in order to join the insulating base and the diaphragm with a high positional accuracy, a tool having a low possibility of deformation due to heat at the time of joining is required. Things are used.

In addition, the capacitance formed by the first electrode and the second electrode acts on the distance between the first electrode and the second electrode and the region where the first electrode and the second electrode face each other. When an external pressure is applied to the diaphragm, the position of the central portion of the diaphragm changes greatly, but the change of the outer peripheral portion is extremely small, and the outer periphery of the first electrode and the outer periphery of the second electrode The amount of change caused by the change in external pressure is small, and the outer periphery of the first electrode and the outer periphery of the second electrode contribute to the change in capacitance when an external pressure is applied. It is a site with a low degree to do. Therefore, in order to increase the pressure detection sensitivity, the area of one of the first electrode and the second electrode is reduced as a method of increasing the amount of change in capacitance when the diaphragm is bent. A package for a pressure sensing device is conceivable.
JP 2001-356064 A

  However, when the insulating base and the diaphragm are joined, the diaphragm and the assembly jig come into contact with each other and a part of the assembly jig is lost, and carbon scrap is interposed between the insulating base and the diaphragm. There was a possibility. Then, there is a possibility that the first electrode and the second electrode are short-circuited through the carbon waste.

  Further, when carbon scraps are interposed between the insulating base and the diaphragm, or when scraps are interposed between the first electrode and the second electrode, the first electrode and the second electrode Carbon waste can be detected by measuring the insulation resistance between the electrodes. However, there is a problem that it cannot be detected when there is carbon debris on the outer periphery of the electrode having the smaller area. For this reason, carbon scraps move during use as a pressure device and are interposed between the first electrode and the second electrode, which may reduce the accuracy of pressure detection.

  The present invention has been devised in view of the above-mentioned problems of the prior art, and its purpose is to detect carbon debris when carbon debris or the like is mixed between the insulating base and the diaphragm, It is an object of the present invention to provide a highly reliable pressure sensing device package and pressure sensing device.

  A package for a pressure detection device according to the present invention includes an insulating base on which a semiconductor element is mounted, a diaphragm disposed at a position facing the surface of the insulating base, and a surface between the surface of the insulating base and the surface of the diaphragm. A formed frame-shaped spacer; a first electrode for forming a capacitance formed inside the frame-shaped spacer on the surface of the insulating base; and an inner side of the frame-shaped spacer on the surface of the diaphragm. A second electrode for forming a capacitance formed so as to face the first electrode, and inside the frame-shaped spacer on the surface of the insulating base and around the first electrode. An inspection electrode formed in a region, and the surface of the first electrode is a convex surface that gradually decreases from the center toward the outer periphery, and the surface of the inspection electrode is inclined toward the first electrode. It is characterized by being That.

  The package for a pressure detection device of the present invention is characterized in that the inspection electrode is an electrode for detecting a resistance value between the inspection electrode and the first electrode.

  The pressure detection device package according to the present invention is characterized in that the inspection electrode is formed over the entire circumference of the first electrode.

  In the package for a pressure detection device according to the present invention, the distance between the first electrode and the inspection electrode is such that the first electrode and the second electrode when the maximum pressure in a rated pressure range is applied to the diaphragm. Or less than the minimum distance between the electrodes.

  The pressure detection device package of the present invention is such that when the maximum pressure in the rated pressure range is applied to the diaphragm, the thickness of the outer peripheral edge of the first electrode and the thickness of the inner peripheral edge of the inspection electrode, The minimum distance between the first electrode and the second electrode is ½ times or more of the minimum distance between the first electrode and the second electrode.

  The pressure detection device of the present invention includes the pressure detection device package of the present invention, and a semiconductor element mounted on the pressure detection device package and detecting a pressure applied to the diaphragm. Is.

  A package for a pressure detection device according to the present invention includes an inspection electrode formed in a region around a first electrode inside a frame-like spacer on the surface of an insulating base, and the surface of the first electrode is a central portion. As the surface of the inspection electrode is inclined toward the first electrode side, the surface of the inspection electrode is inclined toward the outer peripheral portion. Detecting the presence of carbon debris by evaluating the insulation resistance between the first electrode and the inspection electrode, which can be collected between one electrode and the inspection electrode. Can do. Therefore, an external pressure can be detected well, and a highly reliable pressure detection device can be realized.

  In addition, when carbon debris or the like is mixed between the first electrode and the inspection electrode, a voltage is applied between the first electrode and the inspection electrode to destroy the carbon debris and reduce the size. It can be small.

  In the package for a pressure detection device according to the present invention, the first electrode for forming the capacitance is smaller than the second electrode because the inspection electrode is formed over the entire circumference of the first electrode. In the structure, a region in which the inspection electrode is not formed with the first electrode in the insulating base in the space where the electrostatic capacitance is formed can be filled with the inspection electrode, and the capacitance is formed in the space. It becomes possible to improve the detection accuracy of carbon debris in the inside.

  In the package for the pressure detection device of the present invention, the distance between the first electrode and the inspection electrode is the minimum between the first electrode and the second electrode when the maximum pressure in the rated pressure range is applied to the diaphragm. When the capacitance is equal to or less than the interval, carbon scraps or the like larger than the interval between the first electrode and the second electrode when the capacitance reaches the maximum value of the rated pressure range are in the space where the capacitance is formed. Even if it is mixed, carbon scraps can be detected by short-circuiting the first electrode and the inspection electrode.

  The package for a pressure detection device according to the present invention is configured such that the thickness of the outer peripheral edge of the first electrode and the thickness of the inner peripheral edge of the inspection electrode is the first electrode when the maximum pressure in the rated pressure range is applied to the diaphragm. Since the minimum distance between the first electrode and the second electrode is ½ times or more, the maximum width, such as a spherical shape, between the inspection electrode and the first electrode is larger than the portion in contact with the insulating substrate 1. Even when carbon dust or the like is mixed, if the size of the carbon dust or the like is equal to or larger than the distance between the first electrode and the second electrode when the maximum pressure in the rated pressure range is applied, carbon The scraps and the like come into contact with the first electrode and the inspection electrode, and the first electrode 7 and the inspection electrode 12 are short-circuited, so that the carbon scraps can be detected.

  The pressure detection device of the present invention improves reliability by including the pressure detection device package of the present invention and a semiconductor element that is mounted on the pressure detection device package and detects the pressure applied to the diaphragm. Can be made.

  A package for a pressure detection device according to the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a cross-sectional view showing a structure of a first example of an embodiment of a package for a pressure detection device according to the present invention.

  The package for a pressure detection device according to the present invention includes an insulating base 1 on which a semiconductor element 3 is mounted, a diaphragm 2 disposed at a position facing the surface of the insulating base 1, a surface of the insulating base 1, and a surface of the diaphragm 2. A frame-shaped spacer 11 formed between the electrodes, a first electrode 7 for forming a capacitance formed inside the frame-shaped spacer 11 on the surface of the insulating base 1, and a frame-shaped surface on the surface of the diaphragm 2. The second electrode 9 for forming a capacitance formed so as to face the first electrode 7 inside the spacer 11, the inside of the frame-shaped spacer 11 on the surface of the insulating base 1, and the first And an inspection electrode 12 formed in a region around the electrode 7.

  The insulating substrate 1 is a laminated layer made of an electrically insulating material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, a silicon carbide sintered body, a silicon nitride sintered body, or a glass-ceramic. Is the body. If the insulating base 1 is made of, for example, an aluminum oxide sintered body, it is manufactured as follows. First, a ceramic raw material powder such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide is mixed with a suitable organic binder, solvent, plasticizer, and dispersant to form a slurry, and this is formed into a sheet by the doctor blade method. To obtain a plurality of ceramic green sheets. Thereafter, a green ceramic molded body for the insulating substrate 1 is obtained by subjecting these ceramic green sheets to appropriate punching, laminating, and cutting. The raw ceramic molded body is fired at a temperature of about 1600 ° C., whereby the insulating base 1 is manufactured.

  The insulating substrate 1 has a concave portion 1a for accommodating the semiconductor element 3 formed on one surface (the lower surface in FIG. 1), and functions as a container for accommodating the semiconductor element 3. And the mounting part 1b in which the semiconductor element 3 is mounted is formed in the center part of the bottom face of this recessed part 1a. The semiconductor element 3 is mounted on the mounting portion 1b, and the semiconductor element 3 is covered with a resin sealing material 4 such as an epoxy resin in the recess 1a, whereby the semiconductor element 3 is sealed.

  In this example, the semiconductor element 3 is sealed by being covered with the resin sealing material 4, but a lid made of metal or ceramic is closed on one surface of the insulating base 1 so as to close the recess 1 a. It may be sealed by bonding.

  In addition, a plurality of wiring conductors 5 electrically connected to the respective electrodes of the semiconductor element 3 are led out to the mounting portion 1b, and the wiring conductor 5 and the respective electrodes of the semiconductor element 3 are electrically conductive such as solder bumps. By bonding through the conductive bonding material 6 made of a material, each electrode of the semiconductor element 3 and each wiring conductor 5 are electrically connected and the semiconductor element 3 is fixed to the mounting portion 1b. In the example shown in FIG. 1, the electrode of the semiconductor element 3 and the wiring conductor 5 are connected via solder bumps. However, the electrode of the semiconductor element 3 and the wiring conductor 5 are other than bonding wires or the like. The electrical connection means may be used.

  The wiring conductor 5 functions as a conductive path for electrically connecting each electrode of the semiconductor element 3 to the external electric circuit and the first electrode 7 and the second electrode 9, and a part of the wiring conductor 5 is one side of the insulating substrate 1. The other part is electrically connected to the first electrode 7 and the second electrode 9. The other part is electrically connected to the first electrode 7 and the second electrode 9. Then, after each electrode of the semiconductor element 3 is electrically connected to the wiring conductor 5 via a conductive bonding material 6 such as a solder bump and the semiconductor element 3 is sealed with the resin sealing material 4, A portion led to the outer peripheral portion of one surface (the lower surface in FIG. 1) of the insulating base 1 of the wiring conductor 5 is bonded to the wiring conductor (not shown) of the external electric circuit board via a conductive bonding material such as solder. As a result, the semiconductor element 3 housed therein is electrically connected to the external electric circuit.

  Such a wiring conductor 5 is made of metal powder metallization such as tungsten, molybdenum, copper, silver, etc., and is obtained by adding and mixing an appropriate organic binder, solvent, plasticizer, dispersant, etc. to metal powder such as tungsten. The paste is printed and applied in a predetermined pattern on a ceramic green sheet for the insulating substrate 1 by a screen printing method, and this is baked together with a green ceramic molded body for the insulating substrate 1, thereby forming a predetermined pattern on the inside and the surface of the insulating substrate 1. Formed. The exposed surface of the wiring conductor 5 has a thickness so as to prevent the wiring conductor 5 from being oxidatively corroded and to improve the bonding between the wiring conductor 5 and the conductive bonding material 6 such as solder. It is preferable that a nickel plating layer having a thickness of about 1 to 10 μm and a gold plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited.

  A first electrode 7 for forming a capacitance is attached to the center of the upper surface of the insulating substrate 1. The first electrode 7 is for forming a capacitance for a pressure sensitive element together with a second electrode 9 described later, and is formed in a substantially circular pattern, for example. A wiring conductor 5a which is one of the plurality of wiring conductors 5 is connected to the first electrode 7, and the electrode of the semiconductor element 3 is connected to the wiring conductor 5a with a conductive bonding member such as a solder bump. By connecting via 6, the electrode of the semiconductor element 3 and the first electrode 7 are electrically connected.

  In the package for a pressure detection device of the present invention, the surface of the first electrode 7 is a convex surface that gradually decreases from the central portion toward the outer peripheral portion. With such a configuration, the pressure detection device package according to the present invention is configured such that when carbon debris or the like is present on the first electrode 7, the carbon debris or the like can be obtained by applying vibration to the package at the time of inspection or the like. Can be collected on the edge of the first electrode 7.

  The first electrode 7 is made of metal powder metallization such as tungsten, molybdenum, copper, and silver, and is obtained by adding and mixing an appropriate organic binder, solvent, plasticizer, and dispersant to metal powder such as tungsten. The metallized paste is printed and applied to a ceramic green sheet for the insulating substrate 1 by screen printing, and is fired together with a green ceramic molded body for the insulating substrate 1 to form a predetermined pattern at the center of the upper surface of the insulating substrate 1. The A nickel plating layer having a thickness of about 1 to 10 μm is deposited on the exposed surface of the first electrode 7 in order to prevent the first electrode 7 from being oxidized and corroded.

  A frame-shaped first bonding metallization layer 8 is attached to the outer peripheral portion of the upper surface of the insulating substrate 1 over the entire periphery, and this first bonding metallization layer 8 has a lower surface to be described later. The second metallization layer 10 for bonding formed on the lower surface of the spacer 11 on the outer periphery of the lower surface of the diaphragm 2 having the second electrode 9 is bonded by bonding through a conductive bonding material such as a silver-copper brazing material. It is worn. A wiring conductor 5b, which is one of the plurality of wiring conductors 5, is connected to the first metallization layer 8 for bonding, and an electrode of the semiconductor element 3 is connected to the wiring conductor 5b by a conductive bonding such as a solder bump. By being electrically connected via the member 6, the second bonding metallized layer 10 connected to the first bonding metallized layer 8 and the electrode of the semiconductor element 3 are electrically connected.

  The first bonding metallization layer 8 is made of metal powder metallization such as tungsten, molybdenum, copper, or silver, and is obtained by adding and mixing an appropriate organic binder, solvent, plasticizer, and dispersant to metal powder such as tungsten. The metallized paste is printed and applied to a ceramic green sheet for the insulating substrate 1 by screen printing, and is fired together with a green ceramic molded body for the insulating substrate 1, whereby a predetermined frame-like shape is formed on the outer periphery of the upper surface of the insulating substrate 1. Formed into a pattern. The exposed surface of the first bonding metallization layer 8 prevents the first bonding metallization layer 8 from being oxidized and corroded and bonds the first bonding metallization layer 8 and the conductive bonding material. In order to be strong, a nickel plating layer having a thickness of about 1 to 10 μm is applied.

  The diaphragm 2 is disposed at a position facing the surface of the insulating substrate 1 (in FIG. 1, the upper surface of the insulating substrate 1). The diaphragm 2 is attached so as to form a sealed space with the insulating substrate 1. The diaphragm 2 has a thickness of 0 made of an electrically insulating material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, a silicon nitride sintered body, a silicon carbide sintered body, or a glass ceramic. .01-5 mm flat plate and bends toward the insulating substrate 1 according to external pressure.

  The capacitance type pressure detection device is generally used under a pressure of 80 kPa (pressure detection device for low pressure) to 2000 kPa (pressure detection device for high pressure). When the thickness is less than 0.01 mm, the mechanical strength becomes small, and when this is applied to a large external pressure of, for example, about 80 kPa, the mechanical strength is easily broken. Therefore, it tends to be unsuitable as a pressure detection diaphragm. Therefore, the thickness of the diaphragm 2 is preferably in the range of 0.01 to 5 mm.

  If such a diaphragm 2 is made of, for example, an aluminum oxide sintered body, it is manufactured as follows. First, a ceramic raw material powder such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide is mixed with a suitable organic binder, solvent, plasticizer, and dispersant to form a slurry, which is then formed into a sheet by the doctor blade method. To obtain a ceramic green sheet. Thereafter, the ceramic green sheet is appropriately punched or cut to obtain a green ceramic molded body for the diaphragm 2. And this diaphragm 2 is manufactured by baking this raw ceramic molded object at the temperature of about 1600 degreeC.

  Further, a frame-like spacer 11 having a height of about 0.01 to 5 mm is provided on the outer peripheral portion of the lower surface of the diaphragm 2, thereby forming a concave portion having a substantially flat bottom surface at the center of the lower surface. The concave portion is for forming a sealed space between the insulating base 1 and the second electrode 9 for forming a capacitance is attached to the bottom surface of the concave portion.

  Such a second electrode 9 is made of metal powder metallization such as tungsten, molybdenum, copper, silver, etc., and obtained by adding and mixing an appropriate organic binder, solvent, plasticizer, and dispersant to metal powder such as tungsten. The metallized paste is printed on the ceramic green sheet for the diaphragm 2 by screen printing and fired together with the green ceramic molded body for the diaphragm 2 to form a predetermined pattern on substantially the entire bottom surface of the concave portion of the diaphragm 2. The A nickel plating layer having a thickness of about 1 to 10 μm is deposited on the exposed surface of the second electrode 9 in order to prevent the second electrode 9 from being oxidatively corroded.

  Further, a frame-like second bonding metallization layer 10 is deposited on the lower surface of the spacer of the diaphragm 2 over the entire circumference, and the second bonding metallization layer 10 is covered with the first bonding metallization layer 10 described above. The metallized layer 8 is attached by bonding through a conductive bonding material such as a silver-copper brazing material.

  Further, the second bonding metallization 10 and the second electrode 9 are electrically connected to each other via the first bonding metallization layer 8 electrically connected to the semiconductor element 3 described above. Thus, the second electrode 9 and the electrode of the semiconductor element 3 are electrically connected.

  At this time, the first electrode 7 and the second electrode 9 are opposed to each other with a space formed between the insulating base 1 and the diaphragm 2 interposed therebetween, and the first electrode 7 is interposed therebetween. In addition, a predetermined capacitance is formed according to the area of the second electrode 9 and the distance between the first electrode 7 and the second electrode 9. When an external pressure is applied to the upper surface of the diaphragm 2, the diaphragm 2 is bent toward the insulating base 1 in accordance with the pressure, and the distance between the first electrode 7 and the second electrode 9 is changed. Since the capacitance between the first electrode 7 and the second electrode 9 changes, it functions as a pressure-sensitive element that senses a change in external pressure as a change in capacitance. Then, the change in electrostatic capacity is transmitted to the semiconductor element 3 accommodated in the recess 1a through the wiring conductors 5a and 5b, and this is processed by the semiconductor element 3 so as to know the magnitude of the external pressure. Can do.

  The second bonding metallization layer 10 is made of metal powder metallization such as tungsten, molybdenum, copper, and silver, and an appropriate organic binder, solvent, plasticizer, and dispersant are added to the metal powder such as tungsten. The metallized paste obtained by mixing is printed on the ceramic green sheet for the spacer of the diaphragm 2 by a screen printing method, and the diaphragm 2 is connected to the second electrode 9 formed on the lower surface of the diaphragm 2. After laminating with a ceramic green sheet and forming spacers and recesses in the diaphragm 2, it is fired together with a green ceramic molded body for the diaphragm 2, thereby forming a predetermined pattern on the lower surface and the surface or inside of the spacer 11 of the diaphragm 2. It is formed. Note that the exposed surface of the second bonding metallization layer 10 prevents the second bonding metallization layer 10 from being oxidatively corroded, and the second bonding metallization layer 10 and the conductive bonding material. In order to strengthen the bonding, a nickel plating layer having a thickness of about 1 to 10 μm is applied.

  The first electrode 7 is formed in the central part of the region where the other main surface is exposed in the sealed space, and is formed to be about 50 to 80% of the diameter of this region. It is more preferable. If it is less than 50%, the capacitance formed between the first electrode 7 and the second electrode 9 becomes small, making it difficult to detect the pressure well, and exceeding 80%. In addition, an extra capacitance that does not contribute to the change in capacitance is formed between the first electrode 7 and the second electrode 9, and the rate of change in capacitance is reduced, so the pressure detection sensitivity is low. turn into.

  The pressure detection device package of the present invention includes an inspection electrode 12 formed inside the frame spacer 11 on the surface of the insulating substrate 1 and in a region around the first electrode 7. The surface of the inspection electrode 12 is inclined toward the first electrode 7 side. The package for a pressure detection device according to the present invention has such a configuration, and when carbon debris or the like is present on the inspection electrode 12, the carbon debris or the like is inspected by applying vibration to the package at the time of inspection, for example. It can be collected on the edge of the electrode 12 for use.

  The inspection electrode 12 is made of metal powder metallization such as tungsten, molybdenum, copper, silver, etc., and a metallized paste obtained by adding and mixing an appropriate organic binder, solvent, plasticizer, and dispersant to metal powder such as tungsten is screened. A ceramic green sheet for the insulating substrate 1 is printed and applied by a printing method and fired together with a green ceramic molded body for the insulating substrate 1 to form a predetermined pattern on the outer peripheral portion of the upper surface of the insulating substrate 1. The exposed surface of the inspection electrode 12 is coated with a nickel plating layer having a thickness of about 1 to 10 μm in order to prevent the inspection electrode 12 from being oxidized and corroded. Further, the inspection electrode 12 is electrically connected to an inspection pad 13 formed outside the space (in FIG. 1, the side surface of the insulating base 1).

  The package for a pressure detection device according to the present invention includes an inspection electrode 12 formed inside a frame-shaped spacer 11 on the surface of the insulating base 1 and in a region around the first electrode 7. The surface of the electrode 7 is a convex surface that gradually decreases from the central portion toward the outer peripheral portion, and the surface of the inspection electrode 12 is inclined toward the first electrode 7 side. The package for a pressure detection device according to the present invention has the above-described configuration. For example, by applying vibration to the package at the time of inspection or the like, carbon scraps or the like mixed inside the frame-shaped spacer 11 are removed from the first electrode 7. Between the first electrode 7 and the inspection electrode 12, and the resistance between the first electrode 7 and the inspection electrode 12 can be measured to detect carbon debris.

  In the pressure detection device package shown in FIG. 1, the measurement terminals are applied to the wiring conductor 5 and the inspection pad 13 connected to the first electrode 7, and each of the first electrode 7 and the inspection electrode 12 is provided. By evaluating the insulation resistance, it is possible to inspect the state in the space where the capacitance is formed.

  In addition, when the first electrode 7 and the inspection electrode 12 are in contact with each other through carbon scraps, the first electrode 7 and the inspection electrode 12 are short-circuited, and the first electrode 7 and the second electrode 7 are short-circuited. Since the capacitance value formed with the electrode 12 becomes larger than a predetermined value, carbon scraps and the like are also mixed by evaluating the capacitance value between the first electrode 7 and the second electrode 9. Can be detected.

  Further, when carbon debris or the like is mixed between the first electrode 7 and the inspection electrode 12, a voltage is applied between the first electrode 7 and the inspection electrode 12 to destroy the carbon debris. The size can be reduced.

  Moreover, in FIG. 1, although the surface of the 1st electrode 7 was formed as a convex surface, FIG. 2 is sectional drawing which shows the structure of the 2nd example of embodiment of the package for pressure detection apparatuses of this invention. As described above, the surface of the insulating substrate 1 may be a convex surface, and the surface of the first electrode 7 may be a convex surface.

  Further, in the pressure detecting device package of the present invention, as shown in the plan view of the insulating base of the pressure detecting device package shown in FIG. 1, the inspection electrode extends over the entire circumference of the first electrode 7. Preferably it is formed. With this configuration, in the structure in which the first electrode 7 for forming a capacitance is formed smaller than the second electrode 9, the inspection electrode 12 of the insulating substrate 1 in the space where the capacitance is formed is the first. The region where one electrode 7 is not formed can be filled with the inspection electrode 12, and the detection accuracy of carbon debris and the like in the space where the capacitance is formed can be improved.

  In the pressure detection device package of the present invention, the distance d1 between the first electrode 7 and the inspection electrode 12 is the same as that of the first electrode 7 when the maximum pressure in the rated pressure range is applied to the diaphragm 2. It is preferable that the distance is not more than the minimum distance d2 from the second electrode 9. Here, the rated pressure range refers to a capacitance value range that varies with normal use. FIG. 5 is a cross-sectional view showing an example of a package for a pressure detection device when the electrostatic capacitance reaches the maximum value in the rated pressure range. With such a configuration, the package for a pressure detection device of the present invention has carbon scrap or the like larger than the distance d2 between the first electrode 7 and the second electrode 9 when the capacitance reaches the maximum value in the rated pressure range. However, even if it is mixed in the space in which the electrostatic capacitance is formed, carbon dust or the like can be detected by short-circuiting the first electrode 7 and the inspection electrode 12.

  In the package for the pressure detection device shown in FIG. 5, the distance d2 between the first electrode 7 and the second electrode 9 when the capacitance reaches the maximum value in the rated pressure range is such that the diaphragm 2 is bent. In this case, the distance between the center portions of the respective electrodes where the distance between the first electrode 7 and the second electrode 9 is the narrowest.

  In the pressure detection device package according to the present invention, the outer peripheral thickness d3 of the first electrode 7 and the inner peripheral thickness d4 of the inspection electrode 12 are applied to the diaphragm 2 with the maximum pressure within the rated pressure range. It is preferable that it is 1/2 times or more the minimum distance d2 between the first electrode 7 and the second electrode 9. The package for a pressure detection device of the present invention has such a configuration that the first electrode 7 and the inspection electrode 12 have a shape that is wider than the surface portion of the insulating base 1 such that carbon scraps are spherical. Even if the size of the carbon waste is between the first electrode and the second electrode d2 when the maximum pressure in the rated pressure range is applied, the carbon waste etc. When the first electrode 7 and the inspection electrode 12 are short-circuited in contact with the first electrode 7 and the inspection electrode 12, carbon debris or the like can be detected.

  Further, the surface of the insulating substrate 1 exposed between the first electrode 7 and the inspection electrode 12 may be inclined from one side of the first electrode 7 or the inspection electrode 12 to the other side. In this case, carbon dust collected between the first electrode 7 and the inspection electrode 12 can be brought to one side of the first electrode 7 or the inspection electrode 12, and the carbon waste mixed in the space. Or the like can be suppressed from being caught on the surface of the first electrode 7 or the inspection electrode 12 and can be easily detected. The exposed surface of the insulating substrate 1 is preferably not more than the distance d2 between the first electrode 7 and the second electrode 9 when the maximum pressure in the rated pressure range is applied.

  7 is a cross-sectional view showing the structure of the fourth example of the embodiment of the pressure detecting device package of the present invention, and the second inner surface is provided between the first electrode 7 and the inspection electrode 12. The groove 15 in which the inspection electrode 14 is formed may be formed. In this case, carbon scraps mixed in the space can be easily dropped into the groove 15, and can be easily detected by suppressing being caught on the surface of the first electrode 7 or the inspection electrode 12. . The maximum distance between the second inspection electrode 14 and the first electrode 7 and the inspection electrode 12 is such that the first electrode 7 and the first electrode 7 when the maximum pressure in the rated pressure range is applied to the diaphragm 2. It is preferable that the distance between the first electrode 7 and the second electrode 9 is not less than ½ times the minimum distance d2 between the first electrode 7 and the second electrode 9.

  In the pressure detection device package according to the present invention, when carbon debris or the like is present inside the frame-shaped spacer 11, the carbon debris is collected between the first electrode 7 and the inspection electrode 12. Therefore, it is preferable to evaluate after giving vibration or the like to the package for the pressure detection device.

  The pressure device of the present invention is mounted on the pressure detection device package of the present invention and the mounting portion 1b of the insulating base 1, and changes in capacitance between the first electrode 7 and the second electrode 9 are performed. And a semiconductor element 3 for detecting the pressure applied to the diaphragm 2 based on the above. With such a configuration, the pressure device of the present invention can be said to have improved pressure detection accuracy while achieving downsizing.

  Further, the first electrode 7 and the second electrode 9 for forming the capacitance are connected to the respective electrodes of the semiconductor element 3 through the wiring conductors 5a and 5b disposed on the surface of the insulating substrate 1 and inside. As a result, the first electrode 7 and the second electrode 9 can be connected to the semiconductor element 3 at a short distance. As a result, unnecessary capacitance generated between the wiring conductors 5a and 5b can be reduced. As a small device, a highly sensitive pressure detecting device can be realized.

  Note that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention. For example, in the above-described example, the spacer 11 is formed on the diaphragm 2 side, but the spacer 12 is formed on the insulating base 1 side. For example, the first bonding metallization layer 8 and the second bonding metallization layer are used. 10 may be formed at a height different from that of the inspection electrode 12.

It is sectional drawing which shows the structure of the 1st example of embodiment of the package for pressure detection apparatuses of this invention. It is a top view which shows the structure of the 2nd example of embodiment of the package for pressure detection apparatuses of this invention. (A) is a top view of the insulation base | substrate of the package for pressure detection apparatuses shown in FIG. 1, (b) is a bottom view of a diaphragm. It is sectional drawing which shows the state which the diaphragm of the package for pressure detection apparatuses shown in FIG. 1 bent. It is a principal part expanded sectional view of the package for pressure detection apparatuses in FIG. It is a principal part expanded sectional view which shows the structure of the 3rd example of embodiment of the package for pressure detection apparatuses of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Insulation base | substrate 1a ......... Recessed part 1b ......... Mounting part 2 ...... Diaphragm 3 ...... Semiconductor Element 4... Resin sealing material 5, 5 a, 5 b ..Wiring conductor 6... Conductive bonding material 7. 8... First metallized layer 9... Second electrode 10... Second metallized layer 11. .... Inspection electrodes

Claims (6)

An insulating base on which a semiconductor element is mounted; a diaphragm disposed at a position facing the surface of the insulating base; a frame-shaped spacer formed between the surface of the insulating base and the surface of the diaphragm; A first electrode for forming a capacitance formed inside the frame-shaped spacer on the surface of the insulating base, and the first electrode facing the first electrode inside the frame-shaped spacer on the surface of the diaphragm. A second electrode for forming a capacitance formed as described above, and an inspection electrode formed inside the frame-shaped spacer on the surface of the insulating base and in a region around the first electrode. A pressure detecting device characterized in that the surface of the first electrode is a convex surface that gradually decreases from the central portion toward the outer peripheral portion, and the surface of the inspection electrode is inclined toward the first electrode. For package. The pressure detection device package according to claim 1, wherein the inspection electrode is an electrode for detecting a resistance value between the inspection electrode and the first electrode. The pressure detection device package according to claim 1, wherein the inspection electrode is formed over the entire circumference of the first electrode. An interval between the first electrode and the inspection electrode is equal to or less than a minimum interval between the first electrode and the second electrode when a maximum pressure in a rated pressure range is applied to the diaphragm. The package for a pressure detection device according to claim 3. The thickness of the outer peripheral edge of the first electrode and the thickness of the inner peripheral edge of the inspection electrode are the first electrode and the second electrode when the maximum pressure in the rated pressure range is applied to the diaphragm. 5. The package for a pressure detecting device according to claim 3, wherein the package is at least 1/2 times the minimum distance from the electrode. A pressure detection device package according to any one of claims 1 to 5, and a semiconductor element mounted on the pressure detection device package for detecting a pressure applied to the diaphragm. A pressure detection device.

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