JP2006185679A - Organic el panel, organic el light-emitting device and manufacturing method of organic el panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a high-reliability organic EL display; to provide an organic EL light-emitting device; and to provide a manufacturing method of an organic EL display. <P>SOLUTION: This organic EL panel in one embodiment of this application is provided with: an element substrate 10 with organic EL elements 9 formed thereon; a facing substrate 20 disposed so as to face the element substrate 10; a sealing seal 23 formed of a polymer material for sticking the element substrate 10 to the facing substrate 20 and for forming a sealed space between the element substrate 10 and the facing substrate 20; and a barrier film 25 formed of an inorganic substance as a main constituent, and covering the outside surface of the sealing seal 23 for shielding the sealing seal 23 from the outside. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an organic EL panel, an organic EL light emitting device, and a method for manufacturing the organic EL panel.

  In recent years, an organic EL (ElectroLuminescence) display has attracted attention as an FPD (Flat Panel Display). An organic EL display is a self-luminous display element, has a wider viewing angle than a liquid crystal display element, and can be thinned because a backlight is unnecessary. In addition, it has a high response speed and is expected as a next-generation display device because of the variety of luminescent properties of organic substances.

  The organic EL display includes an organic EL panel in which a plurality of organic EL elements serving as pixels are arranged. In this organic EL panel, for example, an organic EL layer is sandwiched between intersections between anodes arranged in parallel stripes and cathodes arranged in parallel stripes so as to intersect the anodes. It has a structured. A pixel as a light emitting element is formed at this one intersection.

  The organic EL panel is configured by arranging such pixels in a matrix. This organic EL panel is expected to be used as a display or a light source for a mobile phone. Many studies have been made on the manufacturing method and various device structures, and detailed reports have been made (Non-Patent Document 1).

  However, the organic EL panel has a problem that display characteristics such as light emission luminance and light emission uniformity deteriorate with time. This is because the light-emitting layer and the organic layer are deteriorated by moisture adsorbed on the surface of the component in the organic EL panel, or moisture and oxygen that have entered the organic EL panel. As a result, the displayable area of the pixel area decreases with time. For this reason, a technique for suppressing a width (hereinafter referred to as “dark frame amount”) that cannot be displayed due to deterioration over time in spite of being a display area is important.

  Therefore, in general, in an organic EL panel, an organic EL element is formed on a glass substrate, and is bonded so as to cover the organic EL element with another glass substrate or metal substrate and a sealing resin. The sealed space surrounded by these two substrates and the sealing resin is filled with an inert gas such as nitrogen or an inert liquid. Thereby, the organic EL element provided in the organic EL panel is sealed so as to be blocked from outside air.

  Furthermore, a water catching material is disposed in the sealed organic EL element. As the water catching material, those of 1) powder type, 2) sheet type (for example, Patent Document 1, Patent Document 2), 3) paste type (for example, Patent Document 3) are known.

In such an organic EL panel, the permeability of the glass substrate and the metal substrate is low, and moisture and gas do not enter from these substrates, but moisture and gas enter from the interface between the sealing resin and the sealing resin and the substrate. Cheap. Moisture that has entered the organic EL panel can be captured to some extent by the water-absorbing material provided in the organic EL panel, but it has been difficult to improve the reliability of the organic EL element and sufficiently realize a highly reliable organic EL panel. It was.
"Organic EL devices and the forefront of industrialization" NTT Publishing Co., Ltd., November 30, 1998 Japanese Patent Laid-Open No. 13-354780 JP 2002-43055 A JP 2003-317934 A

  The present invention has been made in view of the above background, and by suppressing the intrusion of moisture and gas into the organic EL panel, the durability of the organic EL element is improved and the organic EL display and the organic EL display are highly reliable. An object of the present invention is to provide an EL light emitting device and a method for manufacturing an organic EL display.

  An organic EL panel according to a first aspect of the present invention includes an element substrate on which an organic EL element is formed, a counter substrate disposed so as to face the element substrate, and a polymer material. And the counter substrate, and a sealing seal that forms a sealing space between the element substrate and the counter substrate, and an inorganic substance as a main component, covering the outer surface of the sealing seal And a barrier film that shields the sealing seal from the outside. As a result, the shielding property of the sealing portion having a relatively low shielding property in the portion forming the sealing space of the organic EL element is improved, and moisture and gas enter the sealing space from this sealing portion. Can be prevented. Therefore, the organic EL element in the sealed space can be protected, and a highly reliable organic EL display can be realized.

  The organic EL panel according to the second aspect of the present invention extends from the inside of the sealing space to the outside, and drives the organic EL panel with wirings or circuits disposed on the element substrate. The barrier film further includes a connected external wiring, and the barrier film covers the wiring and the circuit, and covers a connection portion between the wiring and the circuit and the external wiring. Thereby, the auxiliary wiring and the external wiring outside the sealed space can be protected by the barrier film, and a short circuit or the like can be prevented.

  In the organic EL panel according to the third aspect of the present invention, the barrier film covers the entire outer surface of the organic EL panel. Thus, the barrier film can prevent moisture and gas from entering the sealing space from the fixing portion between the sealing seal and the element substrate or the counter substrate, and can also provide auxiliary wiring outside the sealing space. External wiring can be protected. In particular, the shielding performance near the interface between the sealing seal and the element substrate is improved, and moisture and gas are prevented from entering the sealing space from the fixing portion between the sealing seal and the element substrate and the counter substrate. Can do. In addition, by forming the barrier film over the entire surface, the barrier film forming process can be simplified.

  In the organic EL panel according to the fourth aspect of the present invention, the barrier film is a silica film. Thereby, a barrier film having a high shielding property can be realized easily and inexpensively.

  The organic EL light emitting device according to the first aspect of the present invention includes such an organic EL panel. Thereby, it is possible to prevent moisture and gas from entering the sealed space. Therefore, the organic EL element in the sealed space can be protected, and a highly reliable organic EL light emitting device can be realized.

  The organic EL panel manufacturing method according to the first aspect of the present invention includes a step of forming an organic EL panel provided with a sealing seal, and the sealing so as to cover an outer surface of the sealing seal. A step of generating a barrier film that shields the stop seal from the outside, and an auxiliary wiring that is connected to an electrode inside the sealing space of the organic EL panel and led out of the sealing space and driving the organic EL panel And connecting the external wiring connected to the driving circuit of the auxiliary wiring and the external wiring after the step of connecting the auxiliary wiring and the external wiring. The step of generating the barrier film so as to cover the film is performed.

  In the method of manufacturing an organic EL panel according to the second aspect of the present invention, the step of forming the barrier film includes a step of immersing the organic EL panel in a film forming solution, and a barrier to the immersed organic EL panel. Forming a film. Thereby, a barrier film with high shielding properties can be easily formed.

  According to the present invention, it is possible to provide a highly reliable organic EL display and organic EL light emitting device, and a method for manufacturing the organic EL display.

  Embodiments to which the present invention can be applied will be described below. The following description is about the embodiment of the present invention, and the present invention is not limited to the following embodiment.

  FIG. 1 is a schematic top view showing the configuration of the organic EL panel according to the present embodiment. FIG. 2 is a cross-sectional view taken along the line A-A ′ in FIG. 1. As shown in FIG. 1, an organic EL panel 100 according to this embodiment includes an anode wiring 1, a cathode wiring 3, a cathode auxiliary wiring 4, a pixel opening 5, an opening insulating film 6, a cathode partition wall 7, a contact hole 8, and an element. A substrate 10 is provided. As shown in FIG. 2, the organic EL panel 100 according to this embodiment includes an organic EL element 9, a water catching material 22, and a counter substrate 20.

  As the element substrate 10, for example, an alkali-free glass substrate (for example, AN100 manufactured by Asahi Glass Co., Ltd.) or an alkali glass substrate (for example, AS manufactured by Asahi Glass Co., Ltd.) can be used. The thickness of the element substrate 10 is not particularly limited, but it is preferable to use a thickness of 0.7 to 1.1 mm, for example.

  As shown in FIG. 1, a plurality of anode wirings 1 are provided on the element substrate 10 and are arranged so as to be parallel to each other. As a material for the anode wiring 1, for example, ITO is preferably used. The anode wiring 1 is connected to external wiring such as FPC (Flexible Printed Circuit board) and TCP (Tape Career Package) via an anisotropic conductive film (hereinafter abbreviated as “ACF”) on the end side of the element substrate 10. Functions as a metal pad for connection. With this configuration, a current is supplied to the anode wiring 1 from an external drive circuit. Further, CF, CCM, overcoat (planarization film), barrier film, etc. may be provided under the anode wiring 1 formed using ITO.

  A plurality of cathode wirings 3 are provided as shown in FIG. 1 and are arranged so as to be parallel to each other and to be orthogonal to the anode wiring 1. The cathode wiring 3 usually uses Al or an Al alloy. The cathode auxiliary wiring 4 is electrically connected to the cathode wiring 3 via the contact hole 8 at the end of the cathode wiring 3 and arranged in parallel. The cathode auxiliary wiring 4 extends from the end of the cathode wiring 3 toward the end of the element substrate 10. Therefore, the same number of cathode auxiliary wires 4 as the cathode wires 3 are formed. The cathode auxiliary wiring 4 functions as a metal pad for connecting to an external wiring 42 such as FPC or TCP on the end side. The auxiliary cathode wiring 4 can be formed of a metal film having a multilayer structure or a single layer structure.

  The opening insulating film 6 is formed on the anode wiring 1 and the cathode auxiliary wiring 4 so as to cover a part thereof (see FIGS. 1 and 2). A pixel opening 5 serving as a display pixel region is provided at a position where the anode wiring 1 and the cathode wiring 3 intersect. The organic EL element 9 is formed on the opening insulating film 6 as shown in FIG. 2 and has a structure sandwiched between the anode wiring 1 and the cathode wiring 3. The organic EL element 9 is an organic EL layer configured by, for example, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer.

  The cathode partition 7 is disposed in parallel with the cathode wiring 3 as shown in FIG. The cathode partition 7 spatially separates the plurality of cathode wirings 3 so that the wirings of the cathode wirings 3 do not conduct with each other. The cross-sectional shape of the cathode barrier 7 refers to a shape (reverse taper shape) in which the cross-sectional width (the B direction in FIG. 1) increases as the distance from the element substrate 10 increases. Thereby, the side wall and the rising portion of the cathode partition wall 7 are shaded, and the plurality of cathode wirings 3 can be easily separated spatially in the manufacturing process of the cathode wiring 3 to be described later.

  The element substrate 10 is bonded to the counter substrate 20 via a sealing material, and a space in which the organic EL element 9 and the like are provided is sealed. The reason for sealing is to prevent the organic EL element 9 from deteriorating due to moisture in the air. On the counter substrate 20, a water capturing material 22 is disposed in the sealed space with a gap from the organic EL element 9, the cathode wiring 3, and the like described above. That is, it has the anode wiring 1, the organic EL element 9, the cathode wiring 3, etc., and the water catching material 22 is disposed away from the laminate that becomes the organic EL element.

  As the water catching material 22, a physical adsorptive water catching material, a chemical adsorptive water catching material or the like can be used. Examples of the physically adsorbing water capturing material include silica gel and synthetic zeolite, and examples of the chemisorbing water capturing material include phosphorus pentoxide and calcium chloride. Moreover, as the water catching material 22, a water catching material mainly composed of an alkaline earth metal oxide and an inert oil can be used. Examples of the alkaline earth metal oxide include BaO, CaO, and MgO. As the inert oil, known oils can be used as long as they are not contrary to the gist of the present invention. Preferably, fluorine oil or silicone oil can be used.

  The sealing seal 23 is fixed to both the element substrate 10 and the counter substrate 20, and the element substrate 10 and the counter substrate 20 are bonded together. As a result, a sealing space is formed between the element substrate 10 and the counter substrate 20. The material of the sealing seal 23 is a polymer material, and for example, a photosensitive epoxy resin such as a cationic photopolymerization type epoxy resin can be suitably used. Further, for example, the width of the sealing seal 23 can be about 2 mm, and the height thereof can be about 20 μm.

  The barrier film 25 is covered on the sealing seal 23 and shields the sealing seal 23 from the outside. Specifically, the barrier film 25 covers the outer surface of the fixing portion between the element substrate 10 and the sealing seal 23, and also covers the outer surface of the fixing portion between the counter substrate 20 and the sealing seal 23. . Therefore, the barrier film 25 shields the fixing portion between the sealing seal 23 and the element substrate 10 and the counter substrate 20 from the outside. The barrier film 25 is provided so as to cover the entire outer surface of the sealing seal 23. In this embodiment, the barrier film 25 covers the entire outer surface of the organic EL panel 100 and shields the entire organic EL panel 100 from the outside. ing.

  The barrier film 25 is formed from an inorganic thin film formed by deposition from a film forming solution containing a compound that forms an inorganic thin film. That is, the barrier film 25 is formed of a film containing an inorganic substance as a main component. Here, the film-forming solution is a liquid containing a compound that forms this inorganic thin film. This inorganic thin film is required to have a film forming property capable of following a complicated shape and a shielding property and stability higher than those of a sealing material. As the barrier film 25 satisfying such conditions, a film containing an inorganic substance as a main component is preferable, and a silica film having excellent transparency and high insulating properties is more preferable. Various known methods can be applied as a method for forming a film containing an inorganic substance as a main component. As a soluble compound used in a film forming solution, a tetrafunctional hydrolyzable silane compound or a partially hydrolyzed silane compound can be used. There are decomposition condensates, silicone-based thermosetting compounds and polysilazanes.

  Examples of the tetrafunctional hydrolyzable silane compound and its partial hydrolysis condensate include tetraalkoxysilane and its partial hydrolysis condensate. It is more preferable to use polysilazane that forms a dense silica film as a film forming solution, and a barrier film having excellent flatness and surface characteristics can be obtained. The silica film can also be formed by natural drying of the film forming solution. However, in order to form a denser silica film, it is possible to use techniques such as heat drying, baking, and ultraviolet curing. Further, it is possible to use a catalyst or a film forming aid for promoting the film forming reaction.

  If the film thickness of the barrier film 25 is too thin, the shielding property is deteriorated and the covering property against protrusions such as foreign matters is deteriorated. If the film is too thick, cracks are easily generated, and the shielding property and uniformity are deteriorated. Therefore, the film thickness of the barrier film 25 is preferably about 30 nm to 3 μm, and about 100 nm to 1 μm is more preferable because it can cover deposits and the like and crack resistance does not decrease.

  Next, a method for manufacturing the organic EL light emitting device according to this embodiment will be described with reference to FIGS. In addition, the following manufacturing process is a typical example in the case of an organic EL light-emitting device, and it cannot be overemphasized that other manufacturing methods can be employ | adopted as long as it agree | coincides with the meaning of this invention. FIG. 3 is a flowchart showing manufacturing steps of the organic EL light emitting device according to this embodiment. FIG. 4 is a cross-sectional view showing the configuration of the organic EL panel 100. FIG. 5 is a cross-sectional view showing a configuration of the organic EL panel 100 during immersion, and a cross-sectional view showing a configuration of the organic EL panel 100 after drying.

  As step S <b> 1, the anode wiring 1 and the cathode auxiliary wiring 4 are formed on the element substrate 10. For example, an anode wiring material such as ITO is formed on the entire surface of the element substrate 10 with good uniformity by sputtering or vapor deposition. Thereafter, the formed anode wiring material is patterned by a photolithography process and an etching process. Thereby, the anode wiring 1 is formed. For example, in the photolithography process, phenol novolac resin is used as a resist. In the etching process, a wet etching method is employed, and a mixed aqueous solution of hydrochloric acid and ferric hydrochloric acid is used as a treatment liquid. As the stripping solution, for example, a monoethanolamine aqueous solution is used.

  The cathode auxiliary wiring 4 can be formed, for example, by patterning a low-resistance metal material such as Al or Al alloy formed by sputtering or vapor deposition through a photolithography process and an etching process. For example, when the wet etching method is employed, an etching solution made of a mixed aqueous solution of phosphoric acid, acetic acid, and nitric acid is used as the processing solution. In addition, from the viewpoint of improving adhesion to the base and preventing corrosion, a barrier layer such as TiN or Cr can be formed in the lower layer or upper layer of the Al film to make the auxiliary wiring a multilayer structure. For example, a Cr / Al / Cr multilayer structure having a total thickness of 450 nm is formed by DC sputtering. It is also possible to pattern the auxiliary wiring material and the cathode wiring material in order after forming the anode material and the auxiliary wiring material in order.

  Thereafter, as step S2, an opening insulating film 7 is formed. As the opening insulating film material, for example, photosensitive polyimide can be used. For example, a polyimide film is formed by spin coating. The formed opening insulating film material is patterned so that the pixel opening 5 and the contact hole 8 serving as a display area are opened. In the case of using photosensitive polyimide, a curing process is performed after the exposure process and the development process, and a pattern of the opening insulating film 6 having the pixel opening 5 and the contact hole 8 as shown in FIGS. 1 and 2 is obtained.

  Subsequently, the cathode barrier 6 is formed as step S3. For example, after a photosensitive novolac resin, a photosensitive acrylic resin, or the like is formed by spin coating, the gap between the positions where the plurality of cathode wirings 3 are formed is parallel to the cathode wirings 3 as shown in FIG. Patterning is performed. In addition, when a negative type photosensitive resin is used, in the exposure process, the lower the position of the cathode partition wall 7, the less the photoreaction, and the reverse taper structure can be easily formed. In addition, after this step S3, in order to modify the surface of the ITO layer exposed by the pixel opening 5 formed in the insulating film, a step of irradiating oxygen plasma or ultraviolet light may be added.

  Subsequently, in step S4, an organic EL layer constituting the organic EL element 9 is mask-deposited. For example, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer are sequentially deposited. Further, as step S5, the cathode wiring 3 is formed by mask vapor deposition of a cathode wiring material such as Al. Instead of mask vapor deposition, another physical vapor deposition method (PVD) such as sputtering or ion plating may be used. Through the above steps, a plurality of organic EL elements 9 are formed on the element substrate 10.

  Next, a process for manufacturing a counter substrate for sealing the organic EL element 9 will be described. First, a plurality of recessed water catching material accommodating portions 21 are provided on the counter substrate 20 by etching or sandblasting. As shown in FIG. 4, the water catching material accommodating portion 21 is provided at a position facing the organic EL element 9 provided on the element substrate 10. This is because a water capturing material 22 for capturing moisture in the sealed space is provided at a position facing the organic EL display region 11.

  Subsequently, as shown in FIG. 4, as shown in FIG. 4, a sealing seal 23 and a scattering prevention seal 24 are applied to the surface side of the counter substrate 20 where the water catching material accommodating portion 21 is provided as step S <b> 6. As shown in FIG. 4, the sealing seal 23 is applied to the outer frame portion surrounding the recess in which the water catching material accommodation portion 21 is provided. The sealing seal 23 plays a role of sealing the organic EL display region 11. The cathode auxiliary wiring 4 and the anode wiring 1 are extended to the outside of the sealing seal 23 so as to be connected to an external drive circuit described later. As shown in FIG. 4, the anti-scattering seal 24 is provided near the center of the gap between the organic EL panels. The scattering prevention seal 24 plays a role of preventing the cut end material from scattering when the substrate for separating each organic EL panel described later is cut.

  Thereafter, as step S7, a paste-like water catching material 22 is applied by an application nozzle. This application amount is appropriately changed according to the size of the water catching material accommodation portion 21 so that an appropriate amount is applied. Each of the sealing materials can be applied using a dispenser or the like. As a material for the sealing seal 23, a photosensitive epoxy resin such as a cationic photopolymerization type epoxy resin can be suitably used. The same material can be used for the anti-scattering seal 24. Thereby, a manufacturing process can be simplified. The counter substrate 20 is manufactured as described above.

  Next, in step S8, the element substrate 10 and the counter substrate 20 are bonded together. After aligning the element substrate 10 and the counter substrate 20, both substrates are pressurized, and each sealing material is irradiated with UV light. Thereby, the element substrate 10 and the counter substrate 20 are bonded together. Thereby, the display area in which the organic EL element 9 is formed is sealed.

  Subsequently, in step S <b> 9, the substrate on which the element substrate 10 and the counter substrate 20 are bonded is cut and separated, and is divided for each organic EL panel 100. Thereafter, as step S10, external wiring, a drive circuit, and the like are mounted on the organic EL panel 100. ACF is attached to the ends of the cathode auxiliary wiring 4 and the anode wiring 1 extending to the outside of the sealing seal 23 and connected to an external wiring 41 such as FPC or TCP provided with a drive circuit. Then, the organic EL panel 100 to which the wiring is connected is completed.

  Finally, as step S11, the organic EL panel 100 sealed with the sealing seal 23 and connected to the wiring is immersed in the film forming solution 27 in the container 26 (see FIG. 5). Here, as the film-forming solution 27, for example, a polysilazane solution or the like is used. Thereafter, the wiring-connected organic EL panel 100 is heated and dried at a temperature of about 100 ° C. for about 10 to 30 minutes, and the barrier film 25 is formed from the film-forming solution 27 attached to the outer surface of the wiring-connected organic EL panel 100. Is generated. Thereby, the barrier film 25 made of a silica film is formed on the entire outer surface of the organic EL panel 100 that has been connected to the wiring, and the organic EL panel 100 according to the present invention is completed. Then, the organic EL panel 100 covered with the barrier film 25 is attached to the housing to complete the organic EL light emitting device (see FIG. 6). At this time, the barrier film 25 is also formed on the cathode auxiliary wiring 4 and the anode wiring 1 and also on the external wiring 41 connected thereto. Here, since this silica film is colorless and transparent, there is no problem even if it is formed on the light emitting surface of the organic EL panel 100.

  As described above, in the organic EL panel 100 according to the present invention, the barrier film 25 can improve the shielding performance of the sealing seal 23. In particular, the barrier film 25 is formed of an inorganic thin film such as a silica film. Since the shielding property of the inorganic thin film is much higher than that of the sealing seal 23 formed using a polymer material, the barrier film 25 of the inorganic thin film transmits moisture and gas more than the sealing seal 23. Hateful. Therefore, the barrier film 25 can reliably prevent moisture and gas from entering the sealing space through the sealing seal 23 from the outside. Therefore, the organic EL panel 100 with high reliability can be realized by the barrier film 25.

  Furthermore, in the present invention, the entire organic EL panel 100 is covered with the barrier film 25. As a result, the exposed portion of the sealing seal 23 and the sealing seal 23 formed on the cell end surface of the organic EL panel 100, which has conventionally been an infiltration path for moisture, gas, and the like, the element substrate 10 and the counter substrate 20 Can be covered with a barrier film 25 together with a sealing seal 23. Therefore, it is possible to prevent moisture and gas from entering the sealed space. In particular, the durability of the organic EL element 9 in the sealed space can be improved, and the reliability of the organic EL panel 100 can be improved.

  Furthermore, in the present embodiment, the barrier film 25 is also formed on the cathode auxiliary wiring 4 and the anode wiring 1 drawn out to the outside of the organic EL panel 100 and further on the external wiring 41 connected thereto. Therefore, the barrier film 25 also functions as a protective film for these wiring metals, and at the same time, it is possible to reduce the intrusion amount of moisture and gas from such a connection portion. Therefore, the organic EL panel 100 with higher reliability can be realized.

  In the present embodiment, the barrier film 25 covers the entire outer surface of the organic EL panel 100 and the wiring and connection portions outside the sealing space, and improves moisture and gas shielding properties and protects the wiring and connection portions. Can be expected at the same time. On the other hand, it is also possible to selectively cover the sealing seal portion or the interface between the sealing seal and the substrate with a barrier film due to a reduction in the amount of the raw material used for the barrier film and the convenience of the process. Further, it is desirable that the barrier film has no film formation defects such as cracks and pinholes. However, even if there is a film formation defect in a part of the barrier film, the organic EL panel has an organic EL panel when compared with an organic EL panel without the barrier film due to the moisture and gas intrusion suppression effect of the barrier film that is being formed smoothly. The durability of the element can be expected to improve.

  In this embodiment, in the step of forming the barrier film 25, the film is only immersed once in the film forming solution 27. However, the film is not limited to once and may be immersed many times. Further, in this embodiment, the barrier film 25 is attached to the organic EL panel 100 by dipping. However, the present invention is not limited to this, and the film forming solution may be applied by spraying or the like.

  In the above embodiment, the anode wiring 1 and the cathode auxiliary wiring 4 are drawn out from the two sides of the organic EL panel 100. On the other hand, as shown in FIG. 7, the cathode wiring 1 and the cathode auxiliary wiring 4 may be drawn from only one side of the organic EL panel 100, and the external wiring 42 may be drawn from the one side. In such a case, it is possible to hold the external wiring 42 drawn from one side and immerse the organic EL panel 100 connected to the wiring in the film forming solution 27. Thereafter, the barrier film 25 can be generated from the film-forming solution 27 attached to the outer surface of the organic EL panel 100 with wiring connection by heating and drying the organic EL panel 100 with wiring connection (see FIG. 8). . Thus, when the external wiring 42 is pulled out from one side, it can be easily immersed in the film forming solution 27, and the barrier film 25 can be efficiently generated.

  Hereinafter, the present embodiment will be specifically described with reference to examples, but the present invention is not limited thereto. In addition, using the inorganic thin film (barrier film 25) covering the organic EL panel 100 obtained in the following examples, the amount of enlargement of the dark frame (non-light emitting region) was measured or evaluated as follows.

  In this example, the element substrate 10 and the counter substrate 20 were bonded and sealed with a sealing resin (sealing seal 23), and the FPC was pressure-bonded to the organic EL panel 100. Thereafter, the entire organic EL panel 100 connected to the wiring is immersed in a polysilazane solution (NP-110 manufactured by Clariant, trade name Aquamica), dried in an oven at 100 ° C. for 10 minutes, and sealed resin (sealing seal 23) A silica film (barrier film 25) was formed on the entire outer surface of the organic EL panel 100 including the outer surface. Moreover, in the organic EL panel 100 in a present Example, the commercially available (Dynic company make) seal-like water catching material was used.

  The organic EL panel 100 thus formed was subjected to a storage test in a high-temperature and high-humidity furnace at 80 ° C. and 90% RH. And the comparison with the conventional organic electroluminescent panel in which the silica film (barrier film 25) was not formed was performed. The comparison result is shown in the graph of FIG.

  As shown in FIG. 9, in the organic EL panel 100 according to the present invention, after about 220 hours, the expansion of the dark frame can be suppressed as compared with the conventional organic EL panel. This is presumably because the barrier film 25 newly provided in the present invention blocks entry of moisture, gas, and the like from the outside of the organic EL panel 100.

  In the above embodiment, an example in which the invention is applied to an organic EL light emitting device has been described. However, this organic EL light emitting device is a device using light emission of an organic EL element such as an organic EL display device and an organic EL light source device. Is included. In this embodiment, the barrier film is formed on the anode wiring and the cathode auxiliary wiring. However, the barrier film according to the present invention is applied to various electrode wirings and wiring forms such as these auxiliary wirings. be able to. For example, the present invention can also be applied to a wiring form such as COG (Chip On Glass) in which a driving circuit is directly attached to a substrate.

1 is a schematic top view of a configuration example of an organic EL panel according to an embodiment. FIG. 2 is a partial cross-sectional view taken along the line A-A ′ of FIG. 1. The flowchart which shows the manufacturing method of the organic electroluminescent light emitting device concerning this embodiment. Sectional drawing which shows the structure of the organic electroluminescent panel concerning this embodiment. Sectional drawing which shows the structure during the immersion of the organic electroluminescent panel concerning this embodiment. Sectional drawing which shows the structure after drying of the organic electroluminescent panel concerning this embodiment. Sectional drawing which shows the structure during the immersion of the organic electroluminescent panel concerning this embodiment. Sectional drawing which shows the structure after drying of the organic electroluminescent panel concerning this embodiment. The figure which shows the relationship between high temperature, high humidity test time, and the amount of dark frames.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Anode wiring 3 Cathode wiring 4 Cathode auxiliary wiring 5 Pixel opening part 6 Cathode partition 7 Opening insulating film 8 Contact hole 9 Organic EL element 10 Element board | substrate 11 Display area | region 20 Counter substrate 21 Water catching material accommodating part 22 Water catching material 23 Sealing Seal 24 Anti-scattering seal 25 Barrier film 26 Container 27 Film-forming solution 41, 42 External wiring 100 Organic EL panel

Claims (7)

An element substrate on which an organic EL element is formed;
A counter substrate arranged to face the element substrate;
A sealing seal that is formed of a polymer material, bonds the element substrate and the counter substrate, and forms a sealing space between the element substrate and the counter substrate;
A barrier film that is formed mainly of an inorganic substance, covers an outer surface of the sealing seal, and shields the sealing seal from the outside.
Organic EL panel. Wiring or a circuit extending from the inside of the sealing space to the outside and disposed on the element substrate;
And an external wiring connected to drive the organic EL panel,
The barrier film covers the wiring and the circuit, and covers the wiring and the connection portion of the circuit and the external wiring.
The organic EL panel according to claim 1. The barrier film covers the entire outer surface of the organic EL panel.
The organic EL panel according to claim 1 or 2. The barrier film is a silica film;
The organic electroluminescent panel in any one of Claims 1 thru | or 3.   An organic EL light emitting device comprising the organic EL panel according to claim 1. Forming an organic EL panel provided with a sealing seal;
Generating a barrier film that shields the sealing seal from the outside so as to cover the outer surface of the sealing seal;
Connecting the auxiliary wiring connected to the electrode inside the sealing space of the organic EL panel and drawn out of the sealing space and the external wiring connected to a driving circuit for driving the organic EL panel; , Prepare,
After the step of connecting the auxiliary wiring and the external wiring, performing the step of generating the barrier film so that the barrier film covers the auxiliary wiring outside the sealing space and the external wiring;
Manufacturing method of organic EL panel. The step of forming the barrier film includes
Immersing the organic EL panel in a film-forming solution;
Forming a barrier film on the immersed organic EL panel.
The manufacturing method of the organic electroluminescent panel of Claim 6.

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