JP2011034682A - Organic el display device - Google Patents

Organic el display device Download PDF

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JP2011034682A
JP2011034682A JP2009176804A JP2009176804A JP2011034682A JP 2011034682 A JP2011034682 A JP 2011034682A JP 2009176804 A JP2009176804 A JP 2009176804A JP 2009176804 A JP2009176804 A JP 2009176804A JP 2011034682 A JP2011034682 A JP 2011034682A
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organic
protective film
display device
upper electrode
insulating protective
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JP5461096B2 (en
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Keisuke Watanabe
圭介 渡辺
Tasuke Takeuchi
太佑 竹内
Sukeki Yukawa
祐基 油川
Masanori Suzuki
将典 鈴木
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TDK Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To improve reliability of an organic EL display device which prevents current leakage between electrodes on an upper surface side of the organic EL layer, and uses a sealing plate formed of conductive material. <P>SOLUTION: The organic EL display device includes; a display part, in which a plurality of organic EL elements, each formed by laminating a translucent lower electrode, organic EL layer, and upper electrode on a support substrate in this order, are arrayed two-dimensionally on the support substrate so as to structure a pixel; and the sealing plate formed of the conductive material and covering the display part. The organic EL display device also includes an insulating protection film for covering the upper electrode. The insulating protection film is formed of material having a lower glass-transition point than a temperature at which the organic EL element is damaged from heat. After the insulating protection film is formed on the upper electrode, it is heated to a temperature higher than the glass-transition point to be fluidized to cover and wrap up the upper electrode. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、有機EL表示装置に係り、特に、金属板のような導電性材料からなる封止板を備えた有機EL表示装置において、導電性異物により電極間に電流リークが生じることを防ぐ装置構造に関する。   The present invention relates to an organic EL display device, and in particular, in an organic EL display device including a sealing plate made of a conductive material such as a metal plate, a device that prevents current leakage between electrodes due to conductive foreign matter. Concerning structure.

有機物の発光現象を利用した有機エレクトロルミネッセンス(Organic Electro-Luminescence/以下「有機EL」と言う)表示装置は、液晶ディスプレイやプラズマディスプレイと比べ画質が高く、より一層の薄型化が可能で、高輝度・高精細・小消費電力等の優れた特長を備えることから次世代の表示装置として近年開発が進められ、例えばテレビやカーナビゲーションシステム、携帯端末等の様々な電子機器のディスプレイとして製品化されつつある。   Organic electro-luminescence (hereinafter referred to as “Organic EL”) display devices that utilize the luminescence phenomenon of organic matter have higher image quality than liquid crystal displays and plasma displays, and can be made thinner and have higher brightness.・ In recent years, it has been developed as a next-generation display device because it has excellent features such as high definition and low power consumption, and is being commercialized as a display for various electronic devices such as televisions, car navigation systems, and portable terminals. is there.

かかる有機EL表示装置では、発光体である有機物とこれを挟む陰陽両電極とを基板上に積層することにより発光素子(有機EL素子)を形成し、これを画素として二次元的に多数配列することによって表示画面を構成する。また、このように有機EL素子を配列させた表示部は、封止板で覆うことにより外気から密閉される。これは、有機EL材料は一般に水分の影響を受けやすく、外気に曝されれば発光素子が劣化し、表示品質や装置の寿命に悪影響が及ぶからである。   In such an organic EL display device, a light-emitting element (organic EL element) is formed by laminating an organic substance as a light emitter and both positive and negative electrodes sandwiching the organic substance on a substrate, and a large number of them are two-dimensionally arranged as pixels. This constitutes the display screen. Further, the display unit in which the organic EL elements are arranged in this way is sealed from the outside air by covering with a sealing plate. This is because organic EL materials are generally easily affected by moisture, and when exposed to the outside air, the light-emitting elements deteriorate and adversely affect the display quality and the life of the device.

また、このような有機EL表示装置を開示するものとして下記特許文献がある。   Further, there is the following patent document as a disclosure of such an organic EL display device.

特開2000‐91067号公報JP 2000-91067 A 特開2001‐68272号公報JP 2001-68272 A

ところで、表示部を覆う封止板としては、従来から一般にガラス製のものが使用されているが、ガラス封止板は水分の遮断性には優れる一方で、割れやすく、機械的な強度が劣る面がある。このため、特に表示光を下面側(支持基板側)に出射するボトムエミッション型の装置にあっては、封止板が透光性を有する必要はないから、機械強度に優れる金属(例えばSUS)製の封止板を使用することが考えられる。   By the way, as a sealing plate which covers a display part, the thing made from glass is generally used conventionally, However, While a glass sealing plate is excellent in the moisture-blocking property, it is easy to break and mechanical strength is inferior. There is a face. For this reason, in particular, in a bottom emission type device that emits display light to the lower surface side (support substrate side), the sealing plate does not need to have translucency, so that the metal has excellent mechanical strength (for example, SUS). It is conceivable to use a sealing plate made of metal.

ところが、従来の有機EL表示装置では、有機EL層の上面側(以下本願では、封止板側を「上」(例えば上面、上部、上方等)、表示光が出射される支持基板側を「下」(例えば下面、下部、下方等)として説明を行う)に積層した電極が、封止板により外気からは保護されるものの、封止板の内部では気体雰囲気中に露出した状態となっている。   However, in the conventional organic EL display device, the upper surface side of the organic EL layer (hereinafter, the sealing plate side is “up” (for example, the upper surface, the upper portion, the upper portion, etc.) and the support substrate side from which the display light is emitted is “ The electrode laminated on the bottom (for example, described as the lower surface, the lower portion, the lower portion, etc.) is protected from the outside air by the sealing plate, but is exposed to the gas atmosphere inside the sealing plate. Yes.

したがって、金属のような導電性を有する材料の封止板を使用する場合には、封止板の作製・加工時に出た微細な金属ゴミが、洗浄を行ったとしても封止板に残留している可能性があり、封止板を設置するときに、あるいは封止した後にこのような導電性の異物が表示部に落下して電極間に付着すれば、これを通じて隣接する電極間で容易に電流リークが生じ、発光異常やダークスポットの発生により表示画質の低下を引き起こすおそれがある。   Therefore, when using a sealing plate made of a conductive material such as metal, fine metal dust generated during the manufacturing and processing of the sealing plate remains on the sealing plate even after cleaning. If such conductive foreign matter falls on the display unit and adheres between the electrodes when the sealing plate is installed or after sealing, it is easy to connect between adjacent electrodes Current leaks, and there is a possibility that display image quality may be deteriorated due to abnormal light emission or dark spots.

一方、前記特許文献1および2に記載の発明は、装置製造中に混入したゴミ(異物)による電界集中や短絡を防止するものではある。   On the other hand, the inventions described in Patent Documents 1 and 2 are intended to prevent electric field concentration and short circuit due to dust (foreign matter) mixed during device manufacture.

しかしながら、これら文献記載の方法は、陽極と陰極との間に混入した異物を対象とし、陰極形成前に有機EL層を加熱して異物を包み込むものものであって、陰極形成後に当該陰極上に付着する異物による電流リークを阻止することは出来ない。またこれらの特許文献は、導電性の封止板を使用した場合に、有機EL層上面側の電極間の電流リークが生じ得ると言う上記本発明の課題を何ら教示するものではない。   However, the methods described in these documents target foreign matters mixed between the anode and the cathode, and heat the organic EL layer before forming the cathode to enclose the foreign matters. Current leakage due to adhering foreign matter cannot be prevented. Further, these patent documents do not teach the above-described problem of the present invention that current leakage between electrodes on the upper surface side of the organic EL layer can occur when a conductive sealing plate is used.

したがって、本発明の目的は、有機EL層上面側の電極間の電流リークを防ぎ、導電性材料からなる封止板を使用する有機EL表示装置の信頼性を高めることにある。   Accordingly, an object of the present invention is to prevent current leakage between electrodes on the upper surface side of the organic EL layer and to improve the reliability of an organic EL display device using a sealing plate made of a conductive material.

前記課題を解決し目的を達成するため、本発明に係る有機EL表示装置は、透光性を有する下部電極、有機EL層および上部電極を、透光性を有する支持基板の上に順に積層してなる有機EL素子を、画素を構成するように前記支持基板上に二次元的に複数配列させた表示部と、導電性材料からなりかつ前記表示部を覆う封止板とを備えた有機EL表示装置であり、前記上部電極を覆う絶縁性保護膜を備えたものである。   In order to solve the above problems and achieve the object, an organic EL display device according to the present invention includes a light-transmitting lower electrode, an organic EL layer, and an upper electrode, which are sequentially stacked on a light-transmitting support substrate. An organic EL device comprising: a display unit in which a plurality of organic EL elements are arranged two-dimensionally on the support substrate so as to constitute a pixel; and a sealing plate made of a conductive material and covering the display unit A display device is provided with an insulating protective film covering the upper electrode.

本発明の有機EL表示装置では、表示部を覆って密閉する封止板として導電性材料からなる封止板を備えるが、有機EL層の上面側(封止板側)に配する上部電極が絶縁性保護膜で覆われている。したがって、封止板の内面に付着した導電性の異物が封止空間内に放出されたとしても、これが上部電極に付着して電流リークを生じさせることを防ぐことが出来る。   In the organic EL display device of the present invention, a sealing plate made of a conductive material is provided as a sealing plate that covers and seals the display unit, but the upper electrode disposed on the upper surface side (sealing plate side) of the organic EL layer is provided. It is covered with an insulating protective film. Therefore, even if conductive foreign matter adhering to the inner surface of the sealing plate is released into the sealing space, it can be prevented that it adheres to the upper electrode and causes current leakage.

上記絶縁性保護膜(以下単に「保護膜」と言う)は、電気抵抗が高い材料または絶縁性を有する材料(高電気抵抗体または絶縁体)であれば、すなわち、上部電極の上面側に導電性異物が付着したときに上部電極間で電流リークが生じない大きさの電気抵抗を有する材料であれば、特にその材料を問わない。例えば、後に説明する実施形態のように、芳香族アミンによりこのような保護膜を形成しても良いし、高電気抵抗を有する有機金属錯体や有機材料によりかかる保護膜を形成することも可能である。   The insulating protective film (hereinafter simply referred to as “protective film”) is a material having a high electric resistance or a material having an insulating property (high electric resistor or insulator), that is, conductive on the upper surface side of the upper electrode. The material is not particularly limited as long as the material has an electric resistance of such a magnitude that current leakage does not occur between the upper electrodes when the adhering foreign material adheres. For example, as in the embodiment described later, such a protective film may be formed with an aromatic amine, or such a protective film may be formed with an organometallic complex or an organic material having high electrical resistance. is there.

また保護膜は、前記表示部に配される(当該保護膜より下層に配される)絶縁性材料と同一の材料により形成するようにしても良い。より具体的には、前記有機EL層に備える電気抵抗の高い膜材料(例えばATP34やTPD5等)を使用したり、あるいは、前記表示部に絶縁膜(例えば下部電極間の絶縁を図るため下部電極上に備える絶縁膜など)を備える場合に当該絶縁膜と同一の材料を用いて上記保護膜を形成しても良い。このように当該表示装置の他の部分に備える膜と同一の材料を使用すれば、本発明に特有の上記保護膜を形成するために別に材料や成膜のための設備を用意する必要がないから、製造工程を複雑化することなく本発明に係る表示装置を製造することが可能となる。   Further, the protective film may be formed of the same material as the insulating material disposed on the display portion (disposed below the protective film). More specifically, a film material (for example, ATP34 or TPD5) having a high electrical resistance provided for the organic EL layer is used, or an insulating film (for example, a lower electrode for insulation between the lower electrodes is used for the display portion). In the case of providing an insulating film provided above, the protective film may be formed using the same material as the insulating film. In this way, if the same material as the film provided in the other part of the display device is used, it is not necessary to prepare a separate material and film forming equipment in order to form the protective film unique to the present invention. Therefore, the display device according to the present invention can be manufactured without complicating the manufacturing process.

一方、上記保護膜は、ガラス転移点を有する材料により形成することが好ましい。保護膜を形成した後に、これを加熱して溶融ないし流動化することよって上部電極をより良好に保護膜で被覆するためである。上記芳香族アミンやATP34、TPD5によれば、このような保護膜を形成することが可能である。   On the other hand, the protective film is preferably formed of a material having a glass transition point. This is because, after forming the protective film, the upper electrode is better coated with the protective film by heating and melting or fluidizing the protective film. According to the aromatic amine, ATP34, and TPD5, it is possible to form such a protective film.

また、上記ガラス転移点は、有機EL素子(下部電極や有機EL層、上部電極等の表示部各部)の耐熱温度、すなわち、当該部分が熱による損傷・変質を受ける温度より低いことが望ましい。保護膜を流動化させるときに有機EL素子が悪影響(ダメージ)を受けることを防ぐためである。例えば、保護膜のガラス転移温度が、表示部を形成する各層(下部電極や有機EL層、上部電極等)の耐熱温度より低くなるように、表示部各層の材料に応じて保護膜に使用する材料を決定すれば良い。   Further, the glass transition point is preferably lower than the heat resistance temperature of the organic EL element (lower electrode, organic EL layer, upper electrode, and other display portions), that is, the temperature at which the portion is damaged or altered by heat. This is to prevent the organic EL element from being adversely affected (damaged) when the protective film is fluidized. For example, the glass transition temperature of the protective film is used for the protective film depending on the material of each layer of the display unit so that the heat resistance temperature of each layer (lower electrode, organic EL layer, upper electrode, etc.) forming the display unit is lower. What is necessary is just to determine a material.

さらに、本発明の表示装置では、前記下部電極および上部電極が共に、前記表示部において平面から見て一定の間隔を隔てて互いに平行に延びる複数本の短冊状電極をそれぞれ含み、下部電極を構成する短冊状電極はそれぞれ支持基板の表面に平行な第一の方向に延び、上部電極を構成する短冊状電極はそれぞれ支持基板の表面に平行でかつ前記第一の方向と略直交する第二の方向に延び(すなわち、下部電極を構成する短冊状電極と上部電極を構成する短冊状電極とが平面から見て互いに略直交するように配置され)、前記保護膜が、上部電極を構成する各短冊状電極の少なくとも上面と側面とを覆うようにすることが好ましい。   Further, in the display device of the present invention, each of the lower electrode and the upper electrode includes a plurality of strip-like electrodes extending in parallel with each other at a constant interval when viewed from the plane in the display unit, and constitutes the lower electrode The strip electrodes extending in a first direction parallel to the surface of the support substrate, and the strip electrodes constituting the upper electrode are each parallel to the surface of the support substrate and substantially perpendicular to the first direction. Extending in the direction (that is, the strip electrode constituting the lower electrode and the strip electrode constituting the upper electrode are arranged so as to be substantially orthogonal to each other when viewed from the plane), and the protective film comprises each of the upper electrode constituting the upper electrode It is preferable to cover at least the upper surface and the side surface of the strip electrode.

上部電極を保護膜によってより完全に覆って導電性異物による電流リークの発生を防ぐためである。なお、このように上部電極の上面と側面とを覆う保護膜の形成は、前述のようにガラス転移点を有する材料を使用して上部電極の上に保護膜を形成し、その後、ガラス転移点以上の温度になるまで当該保護膜を加熱しこれを流動化することにより行うことが可能である。   This is because the upper electrode is more completely covered with a protective film to prevent current leakage due to conductive foreign matter. In addition, the formation of the protective film covering the upper surface and the side surface of the upper electrode in this way is performed by forming the protective film on the upper electrode using the material having the glass transition point as described above, and then the glass transition point. It is possible to heat the protective film until it reaches the above temperature and fluidize it.

さらに本発明の表示装置では、絶縁材料からなり、前記第一の方向(下部電極の延在方向)について隣り合う画素と画素との間を通過するようにかつ互いに平行に前記第二の方向(上部電極の延在方向)に延び、上部電極の上面より上方位置にまで突出することにより前記第一の方向に隣り合う画素について有機EL層および上部電極を分離する複数本の素子分離体を備えることがあり、前記保護膜は、これら素子分離体によって前記第一の方向について分離され、当該第一の方向について不連続となっていることが望ましい。   Further, in the display device of the present invention, the second direction (which is made of an insulating material and passes between adjacent pixels in the first direction (extending direction of the lower electrode) and in parallel to each other ( A plurality of element separators for separating the organic EL layer and the upper electrode for pixels adjacent in the first direction by extending in the upper electrode extending direction) and projecting to a position above the upper surface of the upper electrode. In some cases, the protective film is separated in the first direction by these element separators and is discontinuous in the first direction.

このように素子分離体を備えると共に保護膜を不連続なものとし、上部電極の上面と側面を各短冊電極ごとにそれぞれ個別に覆うこととすれば、例えば表示部全体に亘って連続するような厚い保護膜を形成する場合と比べて、保護膜の膜厚を小さく抑えることが可能となり、保護膜の膜応力によって下層(上部電極膜や有機EL層、下部電極膜等)が悪影響を受けることを排除または軽減することが出来るからである。   In this way, if the device separator is provided and the protective film is discontinuous, and the upper surface and side surfaces of the upper electrode are individually covered for each strip electrode, for example, the entire display unit is continuous. Compared with the case where a thick protective film is formed, the film thickness of the protective film can be reduced, and the lower layer (upper electrode film, organic EL layer, lower electrode film, etc.) is adversely affected by the film stress of the protective film. This is because it can be eliminated or reduced.

また、素子分離体を備える上記表示装置では、素子分離体の上面にも上部電極と同一の材料からなる導電膜がそれぞれ形成されている場合があり、この場合には、前記保護膜を、当該導電膜の上面および側面を覆うように素子分離体の上面部にもそれぞれ形成することが望ましい。   In the display device including the element separator, a conductive film made of the same material as the upper electrode may be formed on the upper surface of the element separator. In this case, the protective film It is desirable to form it also on the upper surface part of an element isolation body so that the upper surface and side surface of an electrically conductive film may be covered.

このように素子分離体上面に形成される導電膜についても保護膜によって覆うこととすれば、例えば素子分離体とその左右両側に隣接する各上部電極との間に導電性異物がそれぞれ付着し、これら異物と素子分離体上面の導電膜を介して上部電極同士が電気的に導通して電流リークが生じるような事態を防ぐことが出来るから、上部電極間のより完全な絶縁を図ることが可能となる。   Thus, if the conductive film formed on the upper surface of the element separator is also covered with a protective film, for example, conductive foreign matters adhere between the element separator and the upper electrodes adjacent to the left and right sides, respectively. It is possible to prevent a situation in which the upper electrodes are electrically connected to each other through the conductive film on the upper surface of the element separator and the foreign matter, thereby preventing current leakage, so that it is possible to achieve more complete insulation between the upper electrodes. It becomes.

上記保護膜の厚さは、良好な絶縁性を確保する点から、5nm以上とすることが好ましく、より好ましくは20nm以上とする。一方、絶縁性の面からは保護膜の厚さは厚いほど良いとも言えるが、保護膜下面の各層(上部電極や有機EL層、下部電極等)が保護膜の膜応力によって悪影響を受けるおそれを排除するため、保護膜の厚さを一定の厚さ以下(例えば100nm以下)に抑えることが望ましい。   The thickness of the protective film is preferably 5 nm or more, more preferably 20 nm or more, from the viewpoint of ensuring good insulation. On the other hand, it can be said that the thicker the protective film is, the better in terms of insulation, but there is a risk that each layer (upper electrode, organic EL layer, lower electrode, etc.) on the lower surface of the protective film may be adversely affected by the film stress of the protective film. In order to eliminate this, it is desirable to suppress the thickness of the protective film to a certain thickness or less (for example, 100 nm or less).

本発明において前記下部電極は、典型的には透光性を有する電極材料、例えばITO(Indium Tin Oxide/酸化インジウム錫)により形成する。ただし、下部電極の材料はこれに限られず、例えばIZO(Indium Zinc Oxide/酸化インジウム亜鉛)や酸化スズ、酸化亜鉛など、他の透光性を有する導電材料を使用することも可能である。   In the present invention, the lower electrode is typically formed of a translucent electrode material, for example, ITO (Indium Tin Oxide). However, the material of the lower electrode is not limited to this, and other light-transmitting conductive materials such as IZO (Indium Zinc Oxide / indium zinc oxide), tin oxide, and zinc oxide can also be used.

一方、上部電極は、例えば低抵抗の金属または合金の単層または複数層の薄膜により形成することが出来る。上部電極を形成する具体的材料としては、例えばアルミニウム、銀、銀‐マグネシウム合金、カルシウム等を使用すれば良い。   On the other hand, the upper electrode can be formed of a single layer or a plurality of layers of a low resistance metal or alloy, for example. As a specific material for forming the upper electrode, for example, aluminum, silver, a silver-magnesium alloy, calcium, or the like may be used.

有機EL層の積層構造および使用材料は、特に限定されない。例えば、当該有機EL層を、ホール注入層、ホール輸送層、発光層、電子輸送層および電子注入層を順に積層した5層構造としても良いし、注入層と輸送層を兼用させた3層構造(ホール輸送層、発光層および電子輸送層)その他の構造を採ることも可能である。各層の使用材料についても、後に実施形態において一例を述べるが、そのほかにも各種の材料を使用することが可能である。   The laminated structure of the organic EL layer and the material used are not particularly limited. For example, the organic EL layer may have a five-layer structure in which a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer are sequentially stacked, or a three-layer structure in which the injection layer and the transport layer are combined. (Hole transporting layer, light emitting layer and electron transporting layer) Other structures can also be adopted. An example of the material used for each layer will be described later in the embodiment, but various other materials can be used.

表示部を覆う封止板は、導電性材料、例えば金属材料からなり、典型的にはステンレス(SUS)により構成するが、マグネシウムやアルミニウムその他の金属材料を使用することも可能である。封止板は、例えば接着剤により前記支持基板上に接着して固定する。このとき、支持基板表面のうち当該封止板を接着する領域(封止板が貼り合わされる糊代部分)には、前記保護膜を形成しないことが望ましい。封止板と支持基板との間の接着強度を確保すると共に、封止板と支持基板との間に保護膜が介在されることによりこれを通じて外部から湿気(水分)が装置内部に侵入することを防ぐためである。   The sealing plate that covers the display portion is made of a conductive material, for example, a metal material, and is typically made of stainless steel (SUS), but magnesium, aluminum, or other metal materials can also be used. The sealing plate is bonded and fixed on the support substrate with an adhesive, for example. At this time, it is desirable that the protective film is not formed in a region of the support substrate surface where the sealing plate is bonded (glue margin where the sealing plate is bonded). In addition to ensuring the adhesive strength between the sealing plate and the support substrate, moisture (moisture) enters the inside of the device from the outside through a protective film interposed between the sealing plate and the support substrate. Is to prevent.

本発明に係る有機EL表示装置の製造方法は、上記有機EL表示装置を製造することが可能なものである。   The manufacturing method of the organic EL display device according to the present invention can manufacture the organic EL display device.

具体的には、当該製造方法は、支持基板の上に順に積層された下部電極、有機EL層および上部電極を含む有機EL素子を、画素を構成するように前記支持基板上に二次元的に複数配列させた表示部と、導電性材料からなりかつ前記表示部を覆う封止板とを備えた有機EL表示装置を製造する方法であって、前記支持基板の表面に前記下部電極を形成する工程と、当該下部電極の上に積層するように前記有機EL層を形成する工程と、当該有機EL層の上に積層するように前記上部電極を形成する工程と、前記表示部において前記上部電極を覆うように保護膜(絶縁性保護膜)を形成する工程と、前記表示部を覆うように前記支持基板に前記封止板を固定する工程とを含む。そして、上記保護膜を形成する工程は、上部電極の上に積層するように前記保護膜を成膜する工程と、当該成膜した保護膜を加熱して流動化する工程とを含む。   Specifically, in the manufacturing method, an organic EL element including a lower electrode, an organic EL layer, and an upper electrode, which are sequentially stacked on a supporting substrate, is two-dimensionally formed on the supporting substrate so as to constitute a pixel. A method of manufacturing an organic EL display device comprising a plurality of arranged display units and a sealing plate made of a conductive material and covering the display unit, wherein the lower electrode is formed on the surface of the support substrate A step of forming the organic EL layer so as to be laminated on the lower electrode, a step of forming the upper electrode so as to be laminated on the organic EL layer, and the upper electrode in the display unit. Forming a protective film (insulating protective film) so as to cover the substrate, and fixing the sealing plate to the support substrate so as to cover the display portion. And the process of forming the said protective film includes the process of forming the said protective film so that it may laminate | stack on an upper electrode, and the process of heating and fluidizing the formed said protective film.

また、上記保護膜は、ガラス転移点を有する材料からなり、上記保護膜を加熱して流動化する工程では、保護膜が当該ガラス転移点以上の温度になるまで加熱することがある。   In addition, the protective film is made of a material having a glass transition point, and in the step of heating and fluidizing the protective film, the protective film may be heated until the temperature of the protective film becomes equal to or higher than the glass transition point.

さらに上記製造方法では、下部電極および上部電極が共に、表示部において平面から見て一定の間隔を隔てて互いに平行に延びる複数本の短冊状電極をそれぞれ含み、下部電極を構成する短冊状電極はそれぞれ、支持基板の表面に平行な第一の方向に延び、上部電極を構成する短冊状電極はそれぞれ、支持基板の表面に平行でかつ前記第一の方向と略直交する第二の方向に延び、下部電極を形成する工程と、有機EL層を形成する工程との間に、複数本の素子分離体を形成する工程をさらに含み、前記保護膜を形成する工程では、上部電極を構成する各短冊状電極の少なくとも上面および側面を、各短冊状電極ごとにそれぞれ覆うように保護膜を形成することがある。   Further, in the above manufacturing method, each of the lower electrode and the upper electrode includes a plurality of strip electrodes extending in parallel with each other at a predetermined interval when viewed from the plane in the display unit, and the strip electrodes constituting the lower electrode are Each of the strip electrodes constituting the upper electrode extends in a first direction parallel to the surface of the support substrate and extends in a second direction parallel to the surface of the support substrate and substantially perpendicular to the first direction. The method further includes the step of forming a plurality of element separators between the step of forming the lower electrode and the step of forming the organic EL layer. In the step of forming the protective film, each of the components constituting the upper electrode A protective film may be formed so as to cover at least the upper and side surfaces of the strip-shaped electrode for each strip-shaped electrode.

なお、上記素子分離体は、絶縁材料からなり、前記第一の方向(下部電極の延在方向)について隣り合う画素と画素との間を通過するようにかつ互いに平行に前記第二の方向(上部電極の延在方向)に延び、上部電極の上面より上方位置にまで突出することにより前記第一の方向に隣り合う画素について有機EL層および上部電極を分離するものである。   The element separator is made of an insulating material, and passes between the adjacent pixels in the first direction (extending direction of the lower electrode) and in parallel with each other in the second direction ( The organic EL layer and the upper electrode are separated from each other in the pixel adjacent to the first direction by extending in the direction in which the upper electrode extends and projecting upward from the upper surface of the upper electrode.

本発明によれば、有機EL層上面側の電極間の電流リークを防ぎ、導電性材料からなる封止板を使用する有機EL表示装置の信頼性を高めることが出来る。   According to the present invention, current leakage between electrodes on the upper surface side of the organic EL layer can be prevented, and the reliability of an organic EL display device using a sealing plate made of a conductive material can be improved.

本発明の他の目的、特徴および利点は、図面に基づいて述べる以下の本発明の実施の形態の説明により明らかにする。なお、本発明は下記実施形態に限定されるものではなく、特許請求の範囲に記載の範囲内で種々の変更を行うことができることは当業者に明らかである。また、各図中、同一の符号は、同一又は相当部分を示す。   Other objects, features, and advantages of the present invention will become apparent from the following description of embodiments of the present invention described with reference to the drawings. It should be noted that the present invention is not limited to the following embodiments, and it will be apparent to those skilled in the art that various modifications can be made within the scope of the claims. Moreover, in each figure, the same code | symbol shows the same or an equivalent part.

図1は、本発明の一実施形態に係る有機EL表示装置を模式的に示す平面図である。FIG. 1 is a plan view schematically showing an organic EL display device according to an embodiment of the present invention. 図2は、前記実施形態に係る有機EL表示装置の断面構造(A‐A切断面)を示す図である。FIG. 2 is a view showing a cross-sectional structure (AA cut surface) of the organic EL display device according to the embodiment. 図3は、前記実施形態に係る有機EL表示装置の一部(図1のB部分)を拡大して模式的に示す平面図である。FIG. 3 is a plan view schematically showing an enlarged part (B portion in FIG. 1) of the organic EL display device according to the embodiment. 図4は、前記実施形態に係る有機EL表示装置の断面構造(図3のC‐C切断面)を模式的に示す図である。FIG. 4 is a diagram schematically showing a cross-sectional structure (a cut surface along CC in FIG. 3) of the organic EL display device according to the embodiment. 図5は、前記実施形態に係る有機EL表示装置の断面構造(図3のD‐D切断面)を模式的に示す図である。FIG. 5 is a diagram schematically showing a cross-sectional structure (DD cut surface in FIG. 3) of the organic EL display device according to the embodiment. 図6は、前記実施形態に係る有機EL表示装置の製造工程(保護膜を形成した直後の状態)を模式的に示す断面図(図4と同様の切断面)である。FIG. 6 is a cross-sectional view (similar to FIG. 4) schematically showing a manufacturing process (a state immediately after forming the protective film) of the organic EL display device according to the embodiment.

図1から図2に示すように本発明の一実施形態に係る有機EL表示装置11は、透光性を有する平板状のガラス基板12(以下単に「基板」と言うことがある)と、このガラス基板12の表面に形成した有機EL表示部13(以下「表示部」と言う)と、当該表示部13を覆う封止板14と、表示部13を駆動するIC(Integrated Circuit/集積回路)17と、IC17に接続されたFPC(Flexible Printed Circuit board/フレキシブルプリント基板)18とを有する。   As shown in FIGS. 1 to 2, an organic EL display device 11 according to an embodiment of the present invention includes a light-transmitting flat glass substrate 12 (hereinafter sometimes simply referred to as “substrate”), An organic EL display unit 13 (hereinafter referred to as “display unit”) formed on the surface of the glass substrate 12, a sealing plate 14 covering the display unit 13, and an IC (Integrated Circuit) for driving the display unit 13 17 and an FPC (Flexible Printed Circuit Board) 18 connected to the IC 17.

表示部13は、画像を表示できるように、画素を構成する複数の有機EL素子を二次元的に、すなわち横方向(図1のx方向)と縦方向(図1のy方向)とにマトリックス状に配列させたもので、図3から図5に拡大して示すように、ガラス基板12の上に陽極21(下部電極)と、隣り合う陽極21同士を電気的に絶縁する絶縁膜24と、発光層を含む有機EL層22と、陰極23(上部電極)とを順に積層することにより形成する。なお、この実施形態の表示装置11は、図2、図4および図5の下方へ(ガラス基板12側へ)表示光を出射するボトムエミッション型であり、表示部13はパッシブマトリックス方式により駆動される。   The display unit 13 is configured to display a plurality of organic EL elements constituting pixels in a two-dimensional manner, that is, in a horizontal direction (x direction in FIG. 1) and a vertical direction (y direction in FIG. 1) so as to display an image. As shown in an enlarged view in FIG. 3 to FIG. 5, an anode 21 (lower electrode) on the glass substrate 12 and an insulating film 24 that electrically insulates the adjacent anodes 21 from each other, The organic EL layer 22 including the light emitting layer and the cathode 23 (upper electrode) are sequentially stacked. The display device 11 of this embodiment is a bottom emission type that emits display light downward (to the glass substrate 12 side) in FIGS. 2, 4, and 5, and the display unit 13 is driven by a passive matrix method. The

陽極21はITOにより形成する。この陽極21は、基板12上においてストライプ状(短冊状)に互いに平行に配列させ、画素数に対応した本数だけ備える。これらの陽極21は、基板12の表面に平行な第一の方向(図3のy方向)に延びる。なお、陽極21を形成するには、例えば、基板12の表面にスパッタ等のいわゆる薄膜形成技術によって陽極21を形成するための電極膜を成膜し、この電極膜を互いに平行な複数本の直線状の電極が配列されるように公知のフォトリソグラフィ技術(レジスト塗布、パターンマスクを通しての露光および現像・エッチング処理)を用いてパターニングして画素数に対応した本数の陽極21を形成すれば良い。   The anode 21 is made of ITO. The anodes 21 are arranged in parallel with each other in stripes (stripes) on the substrate 12 and are provided in a number corresponding to the number of pixels. These anodes 21 extend in a first direction (y direction in FIG. 3) parallel to the surface of the substrate 12. In order to form the anode 21, for example, an electrode film for forming the anode 21 is formed on the surface of the substrate 12 by a so-called thin film forming technique such as sputtering, and the electrode film is formed into a plurality of straight lines parallel to each other. The number of anodes 21 corresponding to the number of pixels may be formed by patterning using a well-known photolithography technique (resist application, exposure through a pattern mask and development / etching process) so that the electrodes are arranged.

また、これら形成した各陽極21に接続するように陽極21側の補助電極16と(図1参照)、後に陰極23を接続できるように陰極23側の補助電極15とを同様のフォトリソグラフィ技術によって基板12上にパターン形成する。これら補助電極15,16は、表示部13(封止板14による封止空間)から引き出すように配置し、駆動用のIC17とそれぞれ電気的に接続する。   Also, the auxiliary electrode 16 on the anode 21 side (see FIG. 1) is connected to each of the formed anodes 21 (see FIG. 1), and the auxiliary electrode 15 on the cathode 23 side is connected by a similar photolithography technique so that the cathode 23 can be connected later. A pattern is formed on the substrate 12. The auxiliary electrodes 15 and 16 are arranged so as to be drawn out from the display unit 13 (sealed space by the sealing plate 14), and are electrically connected to the driving IC 17 respectively.

陽極21の上には、絶縁膜24を設ける。この絶縁膜24は、隣り合う陽極21間に電流リークが生じることを防ぐために陽極21の縁部を覆う一方、画素を形成するために略正方形の平面形状を有する複数の画素開口24aを備える。これら画素開口24aは、陽極21と後に形成する陰極23と交差部分に位置してこれら画素開口24aの内側が発光領域となる。この絶縁膜24は、例えば、酸化シリコン、酸化窒化シリコン、窒化シリコン、酸化アルミニウム、酸化タンタルなどを主成分とする無機化合物や、アクリル樹脂、ノボラック樹脂、ポリイミド樹脂、ポリシクロオレフィン樹脂等により形成することが可能である。   An insulating film 24 is provided on the anode 21. The insulating film 24 covers the edge of the anode 21 to prevent current leakage between the adjacent anodes 21, and includes a plurality of pixel openings 24 a having a substantially square planar shape for forming pixels. These pixel openings 24a are located at intersections with the anode 21 and the cathode 23 to be formed later, and the inside of these pixel openings 24a is a light emitting region. The insulating film 24 is formed of, for example, an inorganic compound mainly composed of silicon oxide, silicon oxynitride, silicon nitride, aluminum oxide, tantalum oxide, an acrylic resin, a novolac resin, a polyimide resin, a polycycloolefin resin, or the like. It is possible.

さらに絶縁膜24の上には、陽極21と同様にストライプ状(短冊状)に互いに平行に延びる複数本の陰極23を形成するため、複数本の隔壁25(素子分離体)を形成する。これらの隔壁25は、前記絶縁膜24と同様に絶縁材料からなり、後に配する陰極23を陽極21と直交させるため、陽極21に直交する方向(図3のx方向)に延び、かつ、陽極21の延在方向(図3のy方向)について隣り合う画素開口24aと画素開口24aとの各間を通過するように設ける。また、これら隔壁25は、図4に示すように、後に述べる保護膜31の上面より上方に突出する高さを有する。   Further, a plurality of barrier ribs 25 (element separators) are formed on the insulating film 24 in order to form a plurality of cathodes 23 extending in parallel with each other in a stripe shape (strip shape) like the anode 21. These partition walls 25 are made of an insulating material in the same manner as the insulating film 24, and extend in a direction orthogonal to the anode 21 (the x direction in FIG. 3) in order to make the cathode 23 disposed later orthogonal to the anode 21. 21 is provided so as to pass between adjacent pixel openings 24a and 24a in the extending direction (y direction in FIG. 3). Further, as shown in FIG. 4, these partition walls 25 have a height that protrudes upward from the upper surface of a protective film 31 described later.

なお、例えば陰極材料の蒸着時に、形成すべき陰極23の平面形状に対応したスリット状の開口を有するマスクを通して蒸着を行えば同様のストライプ状の陰極を形成することは可能であるから、この隔壁25(素子分離体)は本発明に必須のものではない。さらに、上記陽極21や後述の有機EL層22、陰極23、保護膜31の成膜方法は、特に問わず、本実施形態の例に限定されるものではない。   For example, when the cathode material is vapor-deposited, it is possible to form a similar stripe-shaped cathode by performing vapor deposition through a mask having a slit-like opening corresponding to the planar shape of the cathode 23 to be formed. 25 (element separator) is not essential for the present invention. Furthermore, the method for forming the anode 21, the organic EL layer 22, the cathode 23, and the protective film 31 described later is not particularly limited and is not limited to the example of the present embodiment.

絶縁膜24の上には、有機EL層22を形成する。この有機EL層22は、図では単一の層として描いているが、有機EL材料からなる発光層を含み、典型的には複数の機能層からなる。例えば、既に述べたように、ホール注入層、ホール輸送層、発光層、電子輸送層および電子注入層を順に積層した5層構造としても良いし、注入層と輸送層を兼用させた3層構造(ホール輸送層、発光層および電子輸送層)や4層構造(ホール輸送層、発光層、電子輸送層および電子注入層)とすることも可能である。また、これら以外の積層構造を採ることも出来る。   An organic EL layer 22 is formed on the insulating film 24. The organic EL layer 22 is depicted as a single layer in the figure, but includes a light emitting layer made of an organic EL material, and typically includes a plurality of functional layers. For example, as already described, a five-layer structure in which a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer are sequentially stacked, or a three-layer structure in which the injection layer and the transport layer are combined is used. (Hole transport layer, light emitting layer and electron transport layer) or a four-layer structure (hole transport layer, light emitting layer, electron transport layer and electron injection layer) can also be used. Also, a laminated structure other than these can be adopted.

有機EL層22の具体的構成材料の一例を述べれば、α‐NPD(Bis[N-(1-naphthyl)-N-pheny]benzidine/ホール輸送層)と、ルブレン(rubrene)をドーピングしたAlq3(トリスキノリナトアルミニウム(tris(8-hydroxyquinoline)aluminum)/発光層)と、Alq3(電子輸送層)と、フッ化リチウム(電子注入層)とをこの順に陽極21の上に蒸着し成膜すれば良い。   An example of a specific constituent material of the organic EL layer 22 is described as follows: α-NPD (Bis [N- (1-naphthyl) -N-pheny] benzidine / hole transport layer) and Alq3 doped with rubrene (rubrene) If trisquinolinato aluminum (tris (8-hydroxyquinoline) aluminum) / light emitting layer), Alq3 (electron transport layer), and lithium fluoride (electron injection layer) are vapor-deposited on the anode 21 in this order, a film is formed. good.

また、有機EL層22の具体的構成材料の別の一例を述べれば、ホール注入層としてATP34又はHI406(出光興産株式会社製/ガラス転移温度Tg=133℃)からなる膜と、ホール輸送層としてTPD3(ガラス転移温度Tg=133℃)からなる膜と、発光層として出光興産株式会社製IDE−120にドーパントとして出光興産株式会社製IDE−102が3体積%添加された膜と、電子輸送層としてAlq3(ガラス転移温度無し)からなる膜と、電子注入層としてLi2OまたはRuO2からなる膜とをこの順に陽極21の上に蒸着し成膜すれば良い。 Further, another example of the specific constituent material of the organic EL layer 22 will be described. As a hole injection layer, a film made of ATP34 or HI406 (made by Idemitsu Kosan Co., Ltd./glass transition temperature Tg = 133 ° C.), and a hole transport layer A film composed of TPD3 (glass transition temperature Tg = 133 ° C.), a film in which 3% by volume of IDE-102 manufactured by Idemitsu Kosan Co., Ltd. is added as a dopant to IDE-120 manufactured by Idemitsu Kosan Co., Ltd. as an emitting layer, and an electron transport layer And a film made of Alq3 (no glass transition temperature) and a film made of Li 2 O or RuO 2 as the electron injection layer may be deposited on the anode 21 in this order.

有機EL層22の上には、陰極23を配置する。陰極23は、前記陽極21と同様にストライプ状に互いに平行に画素数に対応した本数だけ備えるが、基板表面に平行でかつ前記第一の方向(図3のy方向)に直交する第二の方向(図3のx方向)に延び、したがって平面から見て各陰極23が前記各陽極21と直交する。これら陰極23と陽極21の交差部分が発光領域となる。このようなストライプ状の陰極23は、前記隔壁25を備えた表示部13の全面に陰極材料を蒸着させれば、形成することが可能である。なおこのとき、陰極材料は、図4に示すように隔壁25の上面にも堆積されて膜(以下「陰極材料膜)と言う)が形成されるが、この陰極材料膜23aは後に述べるように保護膜31aによって覆われる。陰極23には、例えば、アルミニウムや銀、銀‐マグネシウム合金等の低電気抵抗の金属材料を使用する。   A cathode 23 is disposed on the organic EL layer 22. Similar to the anode 21, the cathodes 23 are provided in parallel with each other in a stripe shape corresponding to the number of pixels, but are parallel to the substrate surface and perpendicular to the first direction (y direction in FIG. 3). The cathodes 23 extend in the direction (x direction in FIG. 3), and therefore, each cathode 23 is orthogonal to each anode 21 when viewed from above. The intersection between the cathode 23 and the anode 21 is a light emitting region. Such a striped cathode 23 can be formed by depositing a cathode material on the entire surface of the display unit 13 including the partition walls 25. At this time, as shown in FIG. 4, the cathode material is also deposited on the upper surface of the partition wall 25 to form a film (hereinafter referred to as “cathode material film”). This cathode material film 23a is described later. The cathode 23 is made of a metal material having a low electrical resistance such as aluminum, silver, or a silver-magnesium alloy.

陰極23の上面には、保護膜31(絶縁性保護膜)を形成する。保護膜31の材料としては、電気抵抗が高くかつガラス転移点を有することが好ましく、本実施形態ではこれらの要件を満たしかつコスト的にも有利な芳香族アミンを使用する。保護膜31の形成は、陰極23と同様に表示部13の全面に当該保護膜材料を蒸着することにより行うが、形成される膜は、陰極23と同様に隔壁25によって上下方向に分断され、図6に示すように各陰極23の上面と、隔壁25の上面の各陰極材料膜23aの上面とに分かれた形で形成される。なお、前述のように隔壁25を設けない場合には、陰極23の形成時と同様に保護膜31も、蒸着時にストライプ状のスリット開口を有するマスクを使用して陰極23の上面にのみ成膜を行えば良い。   A protective film 31 (insulating protective film) is formed on the upper surface of the cathode 23. As the material of the protective film 31, it is preferable that the electrical resistance is high and that it has a glass transition point. In this embodiment, an aromatic amine that satisfies these requirements and is advantageous in terms of cost is used. The protective film 31 is formed by vapor-depositing the protective film material on the entire surface of the display unit 13 in the same manner as the cathode 23. The film to be formed is divided in the vertical direction by the partition wall 25 in the same manner as the cathode 23. As shown in FIG. 6, the cathode 23 is divided into an upper surface of each cathode 23 and an upper surface of each cathode material film 23 a on the upper surface of the partition wall 25. In the case where the partition wall 25 is not provided as described above, the protective film 31 is also formed only on the upper surface of the cathode 23 using a mask having a stripe-shaped slit opening at the time of vapor deposition, as in the formation of the cathode 23. Just do it.

そして保護膜31の形成後、表示部13をガラス転移点以上の温度に加熱することによって陰極23ならびに陰極材料膜23aの上の保護膜31,31aを流動化する。流動化した保護膜31,31aは、図4に示すようにその側縁部31b,31cが下方に垂れ落ちて陰極23および陰極材料膜23aの側面を覆い、各陰極23および各陰極材料膜23aの上面のみならず、それらの側面をも覆って陰極23および陰極材料膜23aを包み込むように配置される。これにより陰極23と隔壁25上の陰極材料膜23aとが保護膜31,31aによって覆われ、封止空間Sに導電性の異物が混入したとしても陰極間に電流リークが生じることを防ぐことが出来る。   After the protective film 31 is formed, the protective film 31 and 31a on the cathode 23 and the cathode material film 23a are fluidized by heating the display unit 13 to a temperature equal to or higher than the glass transition point. As shown in FIG. 4, the fluidized protective films 31 and 31a have their side edges 31b and 31c hanging down to cover the side surfaces of the cathode 23 and the cathode material film 23a, and each cathode 23 and each cathode material film 23a. The cathode 23 and the cathode material film 23a are disposed so as to cover not only the upper surface but also the side surfaces thereof. As a result, the cathode 23 and the cathode material film 23a on the partition wall 25 are covered with the protective films 31 and 31a, and even if conductive foreign matter enters the sealing space S, current leakage between the cathodes can be prevented. I can do it.

保護膜31の材料としては、芳香族アミン以外にも、例えば下記に示すATP34(ガラス転移温度Tg=104℃)やTPD5(ガラス転移温度Tg=95℃)など、様々な絶縁材料ないし電気抵抗の高い材料を使用することが可能である。   As the material of the protective film 31, in addition to the aromatic amine, various insulating materials or electrical resistances such as ATP34 (glass transition temperature Tg = 104 ° C.) and TPD5 (glass transition temperature Tg = 95 ° C.) shown below can be used. It is possible to use expensive materials.

Figure 2011034682
Figure 2011034682

Figure 2011034682
Figure 2011034682

表示部13を覆う封止板14は、例えばステンレス(SUS)板をプレス加工して作成する。封止板14を固定するには、例えばアクリル系やエポキシ系等の紫外線硬化型樹脂などからなる接着剤20を使用して封止板14をガラス基板12の表面に接着すれば良い。封止板14の内側には、乾燥剤(図示せず)を設置または塗布しておく。   The sealing plate 14 that covers the display unit 13 is formed, for example, by pressing a stainless (SUS) plate. In order to fix the sealing plate 14, the sealing plate 14 may be bonded to the surface of the glass substrate 12 using an adhesive 20 made of, for example, an acrylic or epoxy ultraviolet curable resin. A desiccant (not shown) is installed or applied inside the sealing plate 14.

上記実施形態に基づいて様々な厚さの保護膜を備えSUS板により封止を行った表示装置を作製し、表示部に不良(薄暗線の発生および消費電力の増加)が見られるかサンプリング調査を行った。結果は下記の表のとおりである。   Based on the above embodiment, a display device having protective films of various thicknesses and sealed with a SUS plate is manufactured, and a sampling investigation is performed to determine whether the display portion is defective (occurrence of thin dark lines and increased power consumption). Went. The results are shown in the table below.

Figure 2011034682
Figure 2011034682

上記表から分かるように、保護膜を備えない装置では2個のサンプルのうち2個とも上記不良が発見され、保護膜の厚さが1nmのものでは9個のサンプルのうち4個に不良が発見されたが、厚さ5nmおよび10nmの保護膜を備えた装置では、9〜10個のサンプルのうち不良が発見されたものはいずれも1個、さらに、保護膜の厚さをそれぞれ20nm、30nmおよび50nmとした装置ではサンプル中に不良は発見されなかった。このように保護膜を備えることにより不良の発生確率を抑えることができ、特に、5nm以上、より好ましくは20nm以上の保護膜を備えることによって不良の発生確率を大幅に低減できることを確認した。   As can be seen from the above table, in the device without the protective film, two of the two samples found the defect, and when the protective film had a thickness of 1 nm, four of the nine samples had a defect. Although it was discovered, in the apparatus equipped with the protective film having a thickness of 5 nm and 10 nm, any one of 9 to 10 samples in which a defect was found was 1 and the thickness of the protective film was 20 nm, No defects were found in the samples with the 30 nm and 50 nm devices. Thus, it was confirmed that the probability of occurrence of defects can be suppressed by providing the protective film, and in particular, the probability of occurrence of defects can be significantly reduced by providing the protective film of 5 nm or more, more preferably 20 nm or more.

11 有機EL表示装置
12 ガラス基板
13 有機EL表示部
14 封止板
15 陰極側補助電極(引出配線)
16 陽極側補助電極(引出配線)
17 駆動用IC
18 FPC
20 接着剤
21 陽極(透明電極)
22 有機EL層
23 陰極
23a 陰極材料膜
24 絶縁膜
24a 画素開口
25 隔壁(素子分離体)
31,31a 絶縁性保護膜
31b,31c 絶縁性保護膜の縁部
S 封止板による封止空間
DESCRIPTION OF SYMBOLS 11 Organic EL display device 12 Glass substrate 13 Organic EL display part 14 Sealing plate 15 Cathode side auxiliary electrode (lead-out wiring)
16 Anode-side auxiliary electrode (lead-out wiring)
17 Driving IC
18 FPC
20 Adhesive 21 Anode (transparent electrode)
22 Organic EL layer 23 Cathode 23a Cathode material film 24 Insulating film 24a Pixel opening 25 Partition (element separator)
31, 31a Insulating protective film 31b, 31c Edge of insulating protective film S Sealing space by sealing plate

Claims (16)

透光性を有する下部電極、有機EL層および上部電極を、透光性を有する支持基板の上に順に積層してなる有機EL素子を、画素を構成するように前記支持基板上に二次元的に複数配列させた表示部と、
導電性材料からなりかつ前記表示部を覆う封止板と
を備えた有機EL表示装置であって、
前記上部電極を覆う絶縁性保護膜を備えた
ことを特徴とする有機EL表示装置。
An organic EL element in which a translucent lower electrode, an organic EL layer, and an upper electrode are sequentially laminated on a translucent support substrate is two-dimensionally formed on the support substrate so as to constitute a pixel. A plurality of display units arranged in
An organic EL display device comprising a sealing plate made of a conductive material and covering the display unit,
An organic EL display device comprising an insulating protective film covering the upper electrode.
前記絶縁性保護膜は、ガラス転移点を有する材料からなる
請求項1に記載の有機EL表示装置。
The organic EL display device according to claim 1, wherein the insulating protective film is made of a material having a glass transition point.
前記絶縁性保護膜のガラス転移点は、前記有機EL素子が熱による損傷を受ける温度より低い
請求項2に記載の有機EL表示装置。
The organic EL display device according to claim 2, wherein a glass transition point of the insulating protective film is lower than a temperature at which the organic EL element is damaged by heat.
前記下部電極および前記上部電極は共に、前記表示部において平面から見て一定の間隔を隔てて互いに平行に延びる複数本の短冊状電極をそれぞれ含み、
前記下部電極を構成する短冊状電極はそれぞれ、前記支持基板の表面に平行な第一の方向に延び、
前記上部電極を構成する短冊状電極はそれぞれ、前記支持基板の表面に平行でかつ前記第一の方向と略直交する第二の方向に延び、
前記絶縁性保護膜は、前記上部電極を構成する各短冊状電極の少なくとも上面および側面をそれぞれ覆う
請求項1から3のいずれか一項に記載の有機EL表示装置。
Each of the lower electrode and the upper electrode includes a plurality of strip-shaped electrodes extending in parallel with each other at a predetermined interval when viewed from the plane in the display unit,
Each of the strip electrodes constituting the lower electrode extends in a first direction parallel to the surface of the support substrate,
Each of the strip electrodes constituting the upper electrode extends in a second direction parallel to the surface of the support substrate and substantially perpendicular to the first direction,
The organic EL display device according to any one of claims 1 to 3, wherein the insulating protective film covers at least an upper surface and a side surface of each strip-shaped electrode constituting the upper electrode.
絶縁材料からなり、前記第一の方向について隣り合う画素と画素との間を通過するようにかつ互いに平行に前記第二の方向に延び、前記上部電極の上面より上方位置にまで突出することにより前記第一の方向に隣り合う画素について有機EL層および上部電極を分離する複数本の素子分離体を備え、
前記絶縁性保護膜は、これら素子分離体によって前記第一の方向について分離され、当該第一の方向について不連続となっている
請求項4に記載の有機EL表示装置。
By being made of an insulating material, extending in the second direction so as to pass between adjacent pixels in the first direction and parallel to each other, and projecting to a position above the upper surface of the upper electrode A plurality of element separators for separating the organic EL layer and the upper electrode for pixels adjacent in the first direction,
The organic EL display device according to claim 4, wherein the insulating protective film is separated in the first direction by these element separators and is discontinuous in the first direction.
前記素子分離体の上面に、上部電極と同一の材料からなる導電膜がそれぞれ形成されており、
前記絶縁性保護膜は、当該導電膜の上面および側面を覆うように前記素子分離体の上面部にもそれぞれ形成されている
請求項5に記載の有機EL表示装置。
A conductive film made of the same material as the upper electrode is formed on the upper surface of the element separator,
The organic EL display device according to claim 5, wherein the insulating protective film is also formed on an upper surface portion of the element separator so as to cover an upper surface and a side surface of the conductive film.
前記絶縁性保護膜は、有機金属錯体からなる
請求項1から6のいずれか一項に記載の有機EL表示装置。
The organic EL display device according to claim 1, wherein the insulating protective film is made of an organometallic complex.
前記絶縁性保護膜は、芳香族アミンからなる
請求項1から6のいずれか一項に記載の有機EL表示装置。
The organic EL display device according to any one of claims 1 to 6, wherein the insulating protective film is made of an aromatic amine.
前記絶縁性保護膜は、前記表示部に配される絶縁性材料と同一の材料からなる
請求項1から6のいずれか一項に記載の有機EL表示装置。
The organic EL display device according to claim 1, wherein the insulating protective film is made of the same material as an insulating material disposed in the display unit.
前記絶縁性保護膜は、5nm以上の厚さを有する
請求項1から9のいずれか一項に記載の有機EL表示装置。
The organic EL display device according to claim 1, wherein the insulating protective film has a thickness of 5 nm or more.
前記絶縁性保護膜は、100nm以下の厚さを有する
請求項10に記載の有機EL表示装置。
The organic EL display device according to claim 10, wherein the insulating protective film has a thickness of 100 nm or less.
前記封止板は、金属材料からなる
請求項1から11のいずれか一項に記載の有機EL表示装置。
The organic EL display device according to claim 1, wherein the sealing plate is made of a metal material.
前記封止板は、ステンレスからなる
請求項12に記載の有機EL表示装置。
The organic EL display device according to claim 12, wherein the sealing plate is made of stainless steel.
支持基板の上に順に積層された下部電極、有機EL層および上部電極を含む有機EL素子を、画素を構成するように前記支持基板上に二次元的に複数配列させた表示部と、導電性材料からなりかつ前記表示部を覆う封止板とを備えた有機EL表示装置を製造する方法であって、
前記支持基板の表面に前記下部電極を形成する工程と、
当該下部電極の上に積層するように前記有機EL層を形成する工程と、
当該有機EL層の上に積層するように前記上部電極を形成する工程と、
前記表示部において前記上部電極を覆うように絶縁性保護膜を形成する工程と、
前記表示部を覆うように前記支持基板に前記封止板を固定する工程と
を含み、
前記絶縁性保護膜を形成する工程は、
前記上部電極の上に積層するように前記絶縁性保護膜を成膜する工程と、
当該成膜した絶縁性保護膜を加熱して流動化する工程と
を含むことを特徴とする有機EL表示装置の製造方法。
A display unit in which a plurality of organic EL elements including a lower electrode, an organic EL layer, and an upper electrode stacked in order on a support substrate are two-dimensionally arranged on the support substrate so as to constitute a pixel; A method of manufacturing an organic EL display device comprising a sealing plate made of a material and covering the display unit,
Forming the lower electrode on the surface of the support substrate;
Forming the organic EL layer so as to be laminated on the lower electrode;
Forming the upper electrode so as to be laminated on the organic EL layer;
Forming an insulating protective film so as to cover the upper electrode in the display unit;
Fixing the sealing plate to the support substrate so as to cover the display unit,
The step of forming the insulating protective film includes:
Forming the insulating protective film so as to be laminated on the upper electrode;
And heating the fluidized insulating protective film to fluidize the organic EL display device.
前記絶縁性保護膜は、ガラス転移点を有する材料からなり、
前記絶縁性保護膜を加熱して流動化する工程では、前記絶縁性保護膜が当該ガラス転移点以上の温度になるまで加熱する
請求項14に記載の有機EL表示装置の製造方法。
The insulating protective film is made of a material having a glass transition point,
The method of manufacturing an organic EL display device according to claim 14, wherein in the step of heating and fluidizing the insulating protective film, the insulating protective film is heated until the temperature reaches the glass transition point or higher.
前記下部電極および前記上部電極は共に、前記表示部において平面から見て一定の間隔を隔てて互いに平行に延びる複数本の短冊状電極をそれぞれ含み、
前記下部電極を構成する短冊状電極はそれぞれ、前記支持基板の表面に平行な第一の方向に延び、
前記上部電極を構成する短冊状電極はそれぞれ、前記支持基板の表面に平行でかつ前記第一の方向と略直交する第二の方向に延び、
前記下部電極を形成する工程と、前記有機EL層を形成する工程との間に、
絶縁材料からなり、前記第一の方向について隣り合う画素と画素との間を通過するようにかつ互いに平行に前記第二の方向に延び、前記上部電極の上面より上方位置にまで突出することにより前記第一の方向に隣り合う画素について有機EL層および上部電極を分離する複数本の素子分離体を形成する工程をさらに含み、
前記絶縁性保護膜を形成する工程では、
前記上部電極を構成する各短冊状電極の少なくとも上面および側面を、各短冊状電極ごとにそれぞれ覆うように前記絶縁性保護膜を形成する
請求項14または15に記載の有機EL表示装置の製造方法。
Each of the lower electrode and the upper electrode includes a plurality of strip-shaped electrodes extending in parallel with each other at a predetermined interval when viewed from the plane in the display unit,
Each of the strip electrodes constituting the lower electrode extends in a first direction parallel to the surface of the support substrate,
Each of the strip electrodes constituting the upper electrode extends in a second direction parallel to the surface of the support substrate and substantially perpendicular to the first direction,
Between the step of forming the lower electrode and the step of forming the organic EL layer,
By being made of an insulating material, extending in the second direction so as to pass between adjacent pixels in the first direction and parallel to each other, and projecting to a position above the upper surface of the upper electrode Forming a plurality of element separators for separating the organic EL layer and the upper electrode for pixels adjacent in the first direction;
In the step of forming the insulating protective film,
The method for manufacturing an organic EL display device according to claim 14, wherein the insulating protective film is formed so as to cover at least the upper surface and the side surface of each strip-shaped electrode constituting the upper electrode for each strip-shaped electrode. .
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