WO2013168290A1 - Light emitting apparatus - Google Patents
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- WO2013168290A1 WO2013168290A1 PCT/JP2012/062201 JP2012062201W WO2013168290A1 WO 2013168290 A1 WO2013168290 A1 WO 2013168290A1 JP 2012062201 W JP2012062201 W JP 2012062201W WO 2013168290 A1 WO2013168290 A1 WO 2013168290A1
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- light emitting
- light
- cover member
- panel
- emitting device
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Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/04—Refractors for light sources of lens shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
- F21Y2115/15—Organic light-emitting diodes [OLED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention expands a light output region by effectively using a small space in a light emitting apparatus (1) by disposing a light emitting panel (2) at a discretionary area inside of the light emitting apparatus (1). Excellent visibility is obtained irrespective of the area where the light emitting panel (2) is disposed. The light emitting apparatus (1) is provided with, on a substrate (10), the light emitting panel (2) that is provided with a light emitting unit (20), and a cover member (3) covering the light emitting panel (2), and the cover member (3) is provided with a lens unit (30) at a position facing the light emitting unit (20).
Description
本発明は、発光装置に関するものである。
The present invention relates to a light emitting device.
発光パネルを備えた発光装置が知られている。ここでいう発光パネルは、自発光の有機ＥＬ素子又は無機ＥＬ素子を備えたＥＬパネル、バックライトを備えた液晶パネル、ＬＥＤなどの発光素子を備えた照明用又は表示用の発光パネルなどを含むものである。
A light-emitting device equipped with a light-emitting panel is known. Here, the light-emitting panel includes an EL panel provided with a self-luminous organic EL element or an inorganic EL element, a liquid crystal panel provided with a backlight, and a light-emitting panel for illumination or display provided with a light-emitting element such as an LED. It is a waste.
発光パネルは、一般に平板状の透明基板を備え、この透明基板が光出射面を有している。発光装置は、発光パネルを筐体内に収容しており、筐体に設けた開口や光透過性の基材を介して光を出射させている。光透過性の基材を介して光を出射させるものでは、湾曲した光透過性の基材の内側に平板状の発光パネルを備えるものが知られている（例えば、下記特許文献１参照）。
A light emitting panel generally includes a flat transparent substrate, and this transparent substrate has a light exit surface. In the light emitting device, a light emitting panel is accommodated in a housing, and light is emitted through an opening provided in the housing or a light-transmitting base material. Among those that emit light through a light-transmitting base material, those having a flat light-emitting panel inside a curved light-transmitting base material are known (for example, see Patent Document 1 below).
前述した従来技術のように、湾曲した光透過性基材の内部に平板状の発光パネルを配備した場合には、発光パネルの平面状の光出射面と発光装置における光透過性基材の内面との間に空隙が形成されることになる。この空隙の影響により、光透過性基材の表面に対して発光パネルの光出射面が奥まって視認され良好な視認性を得ることができない。
When a flat light emitting panel is provided inside a curved light-transmitting substrate as in the prior art described above, the planar light emitting surface of the light-emitting panel and the inner surface of the light-transmitting substrate in the light-emitting device A gap is formed between the two. Due to the influence of the air gap, the light exit surface of the light-emitting panel is visually recognized with respect to the surface of the light-transmitting substrate, and good visibility cannot be obtained.
一方、発光装置は、機器の小型化や薄型化の要求によって、発光装置の筐体内部に配置される発光パネルの配置スペースが限られたものになっている。これに対して、発光装置における発光パネルの視認性を考慮すると、前述したような筐体の湾曲部分の内部には発光パネルを配置することができない。このように従来の発光装置は、発光パネルの良好な視認性を確保しながら、発光装置の光出射領域を拡大することができない問題があった。
On the other hand, in the light emitting device, the space for arranging the light emitting panel disposed inside the housing of the light emitting device is limited due to the demand for downsizing and thinning of the device. On the other hand, when the visibility of the light emitting panel in the light emitting device is taken into consideration, the light emitting panel cannot be disposed inside the curved portion of the casing as described above. As described above, the conventional light-emitting device has a problem that the light emission region of the light-emitting device cannot be enlarged while ensuring good visibility of the light-emitting panel.
本発明は、このような問題に対処することを課題の一例とするものである。すなわち、発光装置内部における任意の箇所に発光パネルを配置することで、発光装置内の狭いスペースを有効利用して光出射領域を拡大することができること、発光パネルの配置箇所に拘わらず良好な視認性を得ることができること、等が本発明の目的である。
The present invention is an example of a problem to deal with such a problem. That is, by arranging the light emitting panel at an arbitrary location inside the light emitting device, the light emission area can be enlarged by effectively using the narrow space in the light emitting device, and good visibility regardless of the location of the light emitting panel. It is an object of the present invention to be able to obtain properties.
このような目的を達成するために、本発明による発光装置は、以下の構成を少なくとも具備するものである。
In order to achieve such an object, the light emitting device according to the present invention has at least the following configuration.
基板上に発光部を備えた発光パネルと、該発光パネルを覆うカバー部材を備え、前記カバー部材は、前記発光部と対向する箇所に、レンズ部を備えることを特徴とする発光装置。
A light-emitting device comprising: a light-emitting panel provided with a light-emitting unit on a substrate; and a cover member that covers the light-emitting panel, and the cover member includes a lens unit at a location facing the light-emitting unit.
以下、図面を参照しながら本発明の実施形態を説明する。本発明の実施形態は図示の内容を含むがこれのみに限定されるものではない。図１は本発明の一実施形態に係る発光装置の全体構成図（図１（ａ）が平面図、図１（ｂ）が側面図、図１（ｃ）が正面図）を示している。発光装置１は、一つ又は複数の発光パネル２（２Ａ，２Ｂ）と、発光パネル２を覆うカバー部材３を備えている。カバー部材３は、少なくとも発光パネル２の光出射面と対応する部分では光透過性を有しており、カバー部材３を介して発光パネル２から出射される光を外に放出できるようにしている。図１に示した例では、発光装置１は薄厚の矩形状機体を備えているが、本発明の実施形態における発光装置の形態は特にこのような形態に限られるものではない。
Hereinafter, embodiments of the present invention will be described with reference to the drawings. The embodiment of the present invention includes the contents shown in the drawings, but is not limited thereto. FIG. 1 is an overall configuration diagram of a light emitting device according to an embodiment of the present invention (FIG. 1 (a) is a plan view, FIG. 1 (b) is a side view, and FIG. 1 (c) is a front view). The light emitting device 1 includes one or a plurality of light emitting panels 2 (2A, 2B) and a cover member 3 that covers the light emitting panel 2. The cover member 3 is light transmissive at least in a portion corresponding to the light emission surface of the light emitting panel 2 so that light emitted from the light emitting panel 2 through the cover member 3 can be emitted to the outside. . In the example shown in FIG. 1, the light emitting device 1 includes a thin rectangular body, but the form of the light emitting device in the embodiment of the present invention is not particularly limited to such a form.
図１に示した発光装置１は、カバー部材３の内部に発光パネル２（２Ａ，２Ｂ）を備えており、一つの発光パネル２（２Ａ）がカバー部材３の平坦部分に沿って配置され、他の発光パネル２（２Ｂ）がカバー部材３の湾曲部分（角部分）に対面した状態で配置されている。発光装置１のカバー部材３の内部には、発光装置１を駆動するための電子部品や電源などが配備されているが、ここでは図示及び具体的な説明を省略する。
The light emitting device 1 shown in FIG. 1 includes a light emitting panel 2 (2A, 2B) inside a cover member 3, and one light emitting panel 2 (2A) is arranged along a flat portion of the cover member 3, The other light emitting panel 2 (2B) is arranged in a state of facing the curved portion (corner portion) of the cover member 3. An electronic component and a power source for driving the light emitting device 1 are arranged inside the cover member 3 of the light emitting device 1, but illustration and specific description are omitted here.
図２は、図１（ｂ）におけるＸ－Ｘ断面図を示している。発光装置１が備える発光パネル２（２Ｂ）は、基板１０と基板１０の平面１０Ａ上に形成される発光部２０を少なくとも備えている。発光パネル２（２Ｂ）の形態例を図３に示す。発光パネル２（２Ｂ）は、図３（ａ）に示すように、基板１０を通して光Ｌを出射するものであってもよいし、図３（ｂ）に示すように、基板１０の反対側から光Ｌを出射するものであってもよい。いずれの場合であっても、発光パネル２（２Ｂ）は基板１０を備えており、その基板１０の片側の面が平面１０Ａであり、その平面１０Ａに発光部２０が配備されている。
FIG. 2 is a cross-sectional view taken along the line XX in FIG. The light emitting panel 2 (2B) included in the light emitting device 1 includes at least a substrate 10 and a light emitting unit 20 formed on a plane 10A of the substrate 10. An example of the form of the light-emitting panel 2 (2B) is shown in FIG. The light emitting panel 2 (2B) may emit light L through the substrate 10 as shown in FIG. 3A, or from the opposite side of the substrate 10 as shown in FIG. The light L may be emitted. In any case, the light emitting panel 2 (2B) includes the substrate 10, the surface on one side of the substrate 10 is a flat surface 10A, and the light emitting unit 20 is disposed on the flat surface 10A.
発光装置１のカバー部材３は、図２に示すように、発光パネル２（２Ｂ）の発光部２０と対向する箇所にレンズ部３０を備えている。レンズ部３０は、カバー部材３と一体になるように形成されており、カバー部材３の表面に光出射面３０Ａが形成されている。図２に示した例では、レンズ部３０は、光の出射方向に凸形状であり、カバー部材３の湾曲部３Ａによって構成されている。また、レンズ部３０は、カバー部材３と光透過性部材とが重なって形成されており、この例では、光透過性部材が、カバー部材３と発光パネル２（２Ｂ）との間に充填される充填部材４である。充填部材４は、カバー部材３と発光パネル２の間の空隙を埋めるように充填される。この充填部材４は、光透過性を有するカバー部材３の湾曲部３Ａと同等の屈折率を有する光透過性部材によって構成されることが好ましく、光透過性を有する樹脂材などによって構成することができる。一例を示すと、発光パネル２の基板１０をガラス基板（屈折率１．５０）とし、カバー部材３をアクリル（屈折率１．４８～１．５０）とした場合には、充填部材４は屈折率１．５０～１．５２の透明樹脂材料を用いることができる。
The cover member 3 of the light emitting device 1 includes a lens portion 30 at a location facing the light emitting portion 20 of the light emitting panel 2 (2B), as shown in FIG. The lens unit 30 is formed so as to be integrated with the cover member 3, and a light emitting surface 30 </ b> A is formed on the surface of the cover member 3. In the example shown in FIG. 2, the lens unit 30 has a convex shape in the light emission direction, and is configured by the curved portion 3 </ b> A of the cover member 3. The lens unit 30 is formed by overlapping the cover member 3 and the light transmissive member. In this example, the light transmissive member is filled between the cover member 3 and the light emitting panel 2 (2B). This is a filling member 4. The filling member 4 is filled so as to fill a gap between the cover member 3 and the light emitting panel 2. The filling member 4 is preferably composed of a light transmissive member having a refractive index equivalent to that of the curved portion 3A of the light transmissive cover member 3, and may be composed of a resin material having light transmissive properties. it can. As an example, when the substrate 10 of the light emitting panel 2 is a glass substrate (refractive index 1.50) and the cover member 3 is acrylic (refractive index 1.48 to 1.50), the filling member 4 is refracted. A transparent resin material having a rate of 1.50 to 1.52 can be used.
発光パネル２（２Ｂ）における発光部２０と対向する箇所にこのようなレンズ部３０を設けると、発光パネル２（２Ｂ）をカバー部材３の湾曲部３Ａの内部に設けた場合であっても、発光パネル２（２Ｂ）の発光部２０とカバー部材３の光出射面３０Ａとの間に空隙が存在しない。これによって、発光パネル２（２Ｂ）の視認性を改善することが可能になる。具体的には、レンズ部３０を設けることで、発光パネル２（２Ｂ）を拡大視することができ、また、発光パネル２（２Ｂ）に対する視野角を拡大することが可能になる。そして、カバー部材３の湾曲部３Ａの内部に発光パネル２（２Ｂ）を配備した場合であっても発光パネル２（２Ｂ）がカバー部材３内に奥まって見える不具合を解消することができる。
If such a lens unit 30 is provided at a position facing the light emitting unit 20 in the light emitting panel 2 (2B), even if the light emitting panel 2 (2B) is provided inside the curved portion 3A of the cover member 3, There is no gap between the light emitting portion 20 of the light emitting panel 2 (2B) and the light emitting surface 30A of the cover member 3. This makes it possible to improve the visibility of the light emitting panel 2 (2B). Specifically, by providing the lens unit 30, the light-emitting panel 2 (2B) can be enlarged and the viewing angle with respect to the light-emitting panel 2 (2B) can be enlarged. And even if it is a case where the light emission panel 2 (2B) is arrange | positioned inside the curved part 3A of the cover member 3, the malfunction which the light emission panel 2 (2B) looks behind in the cover member 3 can be eliminated.
図４は、レンズ部３０の機能を示した説明図である。発光パネル２の光出射側にレンズ部３０を設けると、発光パネル２の発光部２０を図示のような斜め角度の視点Ｃから見た場合に、図示のように発光部２０の像２０Ａが結ばれて、発光部２０が拡大して起き上がったように見える。これによって、レンズ部３０を設けない場合と比較して、良好な発光部２０の視認性を得ることができる。
FIG. 4 is an explanatory view showing the function of the lens unit 30. When the lens unit 30 is provided on the light emitting side of the light emitting panel 2, when the light emitting unit 20 of the light emitting panel 2 is viewed from the oblique angle viewpoint C as illustrated, an image 20A of the light emitting unit 20 is formed as illustrated. As a result, it appears that the light emitting unit 20 is enlarged and raised. Thereby, compared with the case where the lens part 30 is not provided, favorable visibility of the light emitting part 20 can be obtained.
図５は、発光装置１が備えるレンズ部３０の他の形態例を示している。図５（ａ）に示した例は、カバー部材３の湾曲部３Ａに厚みを持たせて、発光パネル２（２Ｂ）の接合面３Ａ１を形成している。接合面３Ａ１と発光パネル２（２Ｂ）との間には光透過性の両面テープ又は接合剤などを介在させて、接合面３Ａ１に発光パネル２（２Ｂ）を固定する。これによって、発光パネル２の発光部２０とカバー部材３の光出射面３０Ａとの間に空隙が存在しない状態を作ることができる。
FIG. 5 shows another example of the lens unit 30 included in the light emitting device 1. In the example shown in FIG. 5A, the curved surface 3A of the cover member 3 is thickened to form the joint surface 3A1 of the light emitting panel 2 (2B). The light emitting panel 2 (2B) is fixed to the bonding surface 3A1 by interposing a light-transmitting double-sided tape or a bonding agent between the bonding surface 3A1 and the light emitting panel 2 (2B). Thereby, it is possible to create a state in which no gap exists between the light emitting portion 20 of the light emitting panel 2 and the light emitting surface 30 </ b> A of the cover member 3.
図５（ｂ）に示した例は、カバー部材３の湾曲部３Ａと発光パネル２（２Ｂ）との間に固体の光透過性部材４０を介在させることでレンズ部３０を構成しており、レンズ部３０は、カバー部材３と光透過性部材４０とが重なって形成されている。カバー部材３の内面と光透過性部材４０との間には光透過性の両面テープ又は接合剤を介在させてカバー部材３と光透過性部材４０とを接合する。また、光透過性部材４０と発光パネル２（２Ｂ）との間にも光透過性の両面テープ又は接合剤を介在させて光透過性部材４０と発光パネル２（２Ｂ）とを接合する。これによっても、発光パネル２の発光部２０とカバー部材３の光出射面３０Ａとの間に空隙が存在しない状態を作ることができる。光透過性部材４０はカバー部材３と同材料で形成することが好ましい。
In the example shown in FIG. 5B, the lens unit 30 is configured by interposing a solid light-transmitting member 40 between the curved portion 3A of the cover member 3 and the light emitting panel 2 (2B). The lens unit 30 is formed by overlapping the cover member 3 and the light transmissive member 40. Between the inner surface of the cover member 3 and the light transmissive member 40, a light transmissive double-sided tape or a bonding agent is interposed to bond the cover member 3 and the light transmissive member 40 together. Further, the light transmissive member 40 and the light emitting panel 2 (2B) are joined to each other by interposing a light transmissive double-sided tape or a bonding agent between the light transmissive member 40 and the light emitting panel 2 (2B). This also makes it possible to create a state in which no gap exists between the light emitting portion 20 of the light emitting panel 2 and the light emitting surface 30 </ b> A of the cover member 3. The light transmissive member 40 is preferably formed of the same material as the cover member 3.
図５（ｃ）に示した例は、カバー部材３の湾曲部３Ａに厚みを持たせて、更に、湾曲部３Ａと発光パネル２（２Ｂ）との間に樹脂などの光透過性の充填部材４１を充填してレンズ部３０を構成したものである。これによっても、発光パネル２の発光部２０とカバー部材３の光出射面３０Ａとの間に空隙が存在しない状態を作ることができる。
In the example shown in FIG. 5C, the bending portion 3A of the cover member 3 is thickened, and a light-transmitting filling member such as a resin is provided between the bending portion 3A and the light emitting panel 2 (2B). The lens unit 30 is configured by filling 41. This also makes it possible to create a state in which no gap exists between the light emitting portion 20 of the light emitting panel 2 and the light emitting surface 30 </ b> A of the cover member 3.
図５（ｄ）に示した例は、カバー部材３の湾曲部３Ａに対応して発光パネル２（２Ｂ）の基板１０に厚みを持たせた例である。カバー部材３の内面と基板１０との間には光透過性の両面テープ又は接合剤を介在させてカバー部材３と基板１０とを接合する。これによっても、発光パネル２（２Ｂ）の発光部２０とカバー部材３の光出射面３０Ａとの間に空隙が存在しない状態を作ることができる。基板１０はカバー部材３と同材料で形成することが好ましい。
The example shown in FIG. 5D is an example in which the substrate 10 of the light emitting panel 2 (2B) has a thickness corresponding to the curved portion 3A of the cover member 3. The cover member 3 and the substrate 10 are bonded to each other by interposing a light-transmitting double-sided tape or a bonding agent between the inner surface of the cover member 3 and the substrate 10. This also makes it possible to create a state in which no gap exists between the light emitting portion 20 of the light emitting panel 2 (2B) and the light emitting surface 30A of the cover member 3. The substrate 10 is preferably formed of the same material as the cover member 3.
図６は、図２に示した実施形態の変形例を示した説明図である。図２に示した構成と同じ部位には同一符号を付して重複説明を省略する。図６（ａ）に示した例は、カバー部材３が発光パネル２（２Ｂ）を支持する支持部３Ｂを備えている。ここでの支持部３Ｂは発光パネル２（２Ｂ）のエッジを嵌め込む切り欠き部３Ｂ１である。切り欠き部３Ｂ１に発光パネル２（２Ｂ）の嵌め込むことで、発光パネル２（２Ｂ）の位置決めを簡易に行うことができる。
FIG. 6 is an explanatory view showing a modification of the embodiment shown in FIG. The same parts as those of the configuration shown in FIG. In the example shown in FIG. 6A, the cover member 3 includes a support portion 3B that supports the light emitting panel 2 (2B). The support part 3B here is a notch part 3B1 into which the edge of the light emitting panel 2 (2B) is fitted. By fitting the light emitting panel 2 (2B) into the notch 3B1, the light emitting panel 2 (2B) can be easily positioned.
図６（ｂ）に示した例は、カバー部材３が発光パネル２（２Ｂ）を支持する支持部３Ｂを備えており、この支持部３Ｂは、発光パネル２（２Ｂ）の側面に当接する突起部３Ｂ２である。突起部３Ｂ２に発光パネル２（２Ｂ）の側面を当接させることで、発光パネル２（２Ｂ）の位置決めを簡易に行うことができる。
In the example shown in FIG. 6B, the cover member 3 includes a support portion 3B that supports the light-emitting panel 2 (2B), and the support portion 3B is a protrusion that contacts the side surface of the light-emitting panel 2 (2B). Part 3B2. The light emitting panel 2 (2B) can be easily positioned by bringing the side surface of the light emitting panel 2 (2B) into contact with the protrusion 3B2.
図６（ｃ）は、発光パネル２（２Ｂ）に接続するフレキシブル配線基板５の引出例を示している。この例では、発光パネル２（２Ｂ）の内側にフレキシブル配線基板５を引き出すことで、フレキシブル配線基板５がレンズ部３０に干渉しないようにしている。
FIG. 6C shows an example of pulling out the flexible wiring board 5 connected to the light emitting panel 2 (2B). In this example, the flexible wiring board 5 is prevented from interfering with the lens unit 30 by pulling out the flexible wiring board 5 inside the light emitting panel 2 (2B).
図７は、本発明の実施形態に係る発光装置に備えられる発光パネルの具体的な形態例を示した説明図である。この例では、発光パネル２は有機ＥＬパネルであり、基板１０の平面１０Ａに配備される発光部２０を有機ＥＬ素子１Ｕによって構成している。有機ＥＬ素子１Ｕの構成例を以下に示す。有機ＥＬ素子１Ｕは基板１０上に、下部電極１１、有機層１２、上部電極１３を積層した積層構造を有している。
FIG. 7 is an explanatory view showing a specific form example of the light-emitting panel provided in the light-emitting device according to the embodiment of the present invention. In this example, the light emitting panel 2 is an organic EL panel, and the light emitting unit 20 provided on the flat surface 10A of the substrate 10 is configured by the organic EL element 1U. A configuration example of the organic EL element 1U is shown below. The organic EL element 1U has a laminated structure in which a lower electrode 11, an organic layer 12, and an upper electrode 13 are laminated on a substrate 10.
基板１０は、光透過性であり、ガラスやプラスチックなど、有機ＥＬ素子１Ｕを支持することができる基材によって形成される。下部電極１１を形成する透明導電膜層は、ＩＴＯ（Indium Tin Oxide），ＩＺＯ（Indium Zinc Oxide），酸化亜鉛系透明導電膜，ＳｎＯ2系透明導電膜，二酸化チタン系透明導電膜などの透明金属酸化物を用いることができる。
The substrate 10 is light transmissive and is formed of a base material that can support the organic EL element 1U, such as glass or plastic. The transparent conductive film layer forming the lower electrode 11 is a transparent metal such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), zinc oxide-based transparent conductive film, SnO 2 -based transparent conductive film, titanium dioxide-based transparent conductive film, etc. An oxide can be used.
下部電極１１が複数の電極にパターン形成されている場合は、各電極間の絶縁性を確保するために絶縁膜１４が設けられる。この絶縁膜１４は、ポリイミド樹脂，アクリル系樹脂，酸化シリコン，窒化シリコンなどの材料が用いられる。絶縁膜１４の形成は、絶縁膜１４の材料を下部電極１１がパターン形成された基板１０上に成膜した後、下部電極１１上に有機ＥＬ素子１Ｕ毎の発光領域を形成する開口を形成するパターニングがなされる。具体的には、下部電極１１が形成された基板１０にスピンコート法により所定の塗布厚となるように膜を形成し、露光マスクを用いて露光処理，現像処理を施すことにより、有機ＥＬ素子１Ｕの開口パターン形状を有する絶縁膜１４の層が形成される。この絶縁膜１４は、下部電極１１のパターン間を埋めると共にその側端部分を一部覆うように形成され、有機ＥＬ素子１Ｕをドットマトリクス状に配置する場合は格子状に形成される。
In the case where the lower electrode 11 is patterned on a plurality of electrodes, an insulating film 14 is provided to ensure insulation between the electrodes. The insulating film 14 is made of a material such as polyimide resin, acrylic resin, silicon oxide, or silicon nitride. The insulating film 14 is formed by depositing the material of the insulating film 14 on the substrate 10 on which the lower electrode 11 is patterned, and then forming an opening for forming a light emitting region for each organic EL element 1U on the lower electrode 11. Patterning is performed. Specifically, a film is formed on the substrate 10 on which the lower electrode 11 is formed to have a predetermined coating thickness by spin coating, and exposure processing and development processing are performed using an exposure mask, whereby an organic EL element is obtained. A layer of insulating film 14 having an opening pattern shape of 1U is formed. The insulating film 14 is formed so as to fill the space between the patterns of the lower electrode 11 and partially cover the side end portion thereof, and is formed in a lattice shape when the organic EL elements 1U are arranged in a dot matrix.
隔壁１６が、マスク等を用いることなく上部電極１３のパターンを形成するため、或いは隣り合う上部電極１３を完全に電気的に絶縁するために、下部電極１１と交差する方向にストライプ状に形成される。具体的には、前述した絶縁膜１４の上に感光性樹脂等の絶縁材料を、有機ＥＬ素子１Ｕを形成する有機層１２と上部電極１３の膜厚の総和より厚い膜厚にスピンコート法等で塗布形成した後、この感光性樹脂膜上に下部電極１１に交差するストライプ状パターンを有するフォトマスクを介して紫外線等を照射し、層の厚さ方向の露光量の違いから生じる現像速度の差を利用して、側部が下向きのテーパー面を有する隔壁１６を形成する。
The barrier ribs 16 are formed in stripes in a direction intersecting the lower electrode 11 in order to form a pattern of the upper electrode 13 without using a mask or the like, or to completely electrically insulate the adjacent upper electrode 13 from each other. The Specifically, an insulating material such as a photosensitive resin is formed on the above-described insulating film 14 so that the film thickness is larger than the total thickness of the organic layer 12 and the upper electrode 13 that form the organic EL element 1U. Then, the photosensitive resin film is irradiated with ultraviolet rays or the like through a photomask having a stripe pattern intersecting with the lower electrode 11, and the development speed resulting from the difference in the exposure amount in the thickness direction of the layer is applied. By utilizing the difference, the partition wall 16 having a tapered surface with a side portion facing downward is formed.
有機層１２は、発光層を含む発光機能層の積層構造を有し、下部電極１１と上部電極１３の一方を陽極とし他方を陰極とすると、陽極側から順次、正孔注入層、正孔輸送層、発光層、電子輸送層、電子注入層などが選択的に形成される。有機層１２の成膜は乾式の成膜として真空蒸着法などが用いられ、湿式の成膜としては塗布や各種の印刷法が用いられる。
The organic layer 12 has a laminated structure of light emitting functional layers including a light emitting layer. When one of the lower electrode 11 and the upper electrode 13 is an anode and the other is a cathode, a hole injection layer and a hole transport are sequentially formed from the anode side. A layer, a light emitting layer, an electron transport layer, an electron injection layer, and the like are selectively formed. As the film formation of the organic layer 12, a vacuum deposition method or the like is used as a dry film formation, and coating or various printing methods are used as a wet film formation.
有機層１２の形成例を以下に説明する。例えば先ず、ＮＰＢ（N,N－di（naphtalence）－N,N－dipheneyl－benzidene）を正孔輸送層として成膜する。この正孔輸送層は、陽極から注入される正孔を発光層に輸送する機能を有する。この正孔輸送層は、１層だけ積層したものでも２層以上積層したものであってもよい。また正孔輸送層は、単一の材料による成膜ではなく、複数の材料により一つの層を形成しても良く、電荷輸送能力の高いホスト材料に電荷供与（受容）性の高いゲスト材料をドーピングしてもよい。
An example of forming the organic layer 12 will be described below. For example, first, NPB (N, N-di (naphtalence) -N, N-dipheneyl-benzidene) is formed as a hole transport layer. This hole transport layer has a function of transporting holes injected from the anode to the light emitting layer. The hole transport layer may be a single layer or a stack of two or more layers. In addition, the hole transport layer is not formed by a single material, but a single layer may be formed by a plurality of materials, and a guest material having a high charge donating (accepting) property may be formed on a host material having a high charge transport capability. Doping may be performed.
次に、正孔輸送層の上に発光層を成膜する。一例としては、抵抗加熱蒸着法により、赤（Ｒ）、緑（Ｇ）、青（Ｂ）の発光層を、塗分け用マスクを利用してそれぞれの成膜領域に成膜する。赤（Ｒ）としてＤＣＭ１（４－（ジシアノメチレン）－２－メチル－６－（４’－ジメチルアミノスチリル）－４Ｈ－ピラン）等のスチリル色素等の赤色を発光する有機材料を用いる。緑（Ｇ）としてアルミキノリノール錯体（Ａｌｑ3 ）等の緑色を発光する有機材料を用いる。青（Ｂ）としてジスチリル誘導体、トリアゾール誘導体等の青色を発光する有機材料を用いる。勿論、他の材料でも、ホスト－ゲスト系の層構成でも良く、発光形態も蛍光発光材料を用いてもりん光発光材料を用いたものであってもよい。
Next, a light emitting layer is formed on the hole transport layer. As an example, red (R), green (G), and blue (B) light-emitting layers are formed in respective film formation regions by using a resistance heating vapor deposition method using a coating mask. As red (R), an organic material that emits red light such as a styryl dye such as DCM1 (4- (dicyanomethylene) -2-methyl-6- (4'-dimethylaminostyryl) -4H-pyran) is used. An organic material that emits green light such as an aluminum quinolinol complex (Alq3) is used as green (G). As the blue (B), an organic material emitting blue light such as a distyryl derivative or a triazole derivative is used. Of course, other materials or a host-guest layer structure may be used, and the emission form may be a fluorescent light emitting material or a phosphorescent light emitting material.
発光層の上に成膜される電子輸送層は、抵抗加熱蒸着法等の各種成膜方法により、例えばアルミキノリノール錯体（Ａｌｑ3 ）等の各種材料を用いて成膜する。電子輸送層は、陰極から注入される電子を発光層に輸送する機能を有する。この電子輸送層は、１層だけ積層したものでも２層以上積層した多層構造を有してもよい。また、電子輸送層は、単一の材料による成膜ではなく、複数の材料により一つの層を形成しても良く、電荷輸送能力の高いホスト材料に電荷供与（受容）性の高いゲスト材料をドーピングして形成してもよい。
The electron transport layer formed on the light emitting layer is formed by using various materials such as an aluminum quinolinol complex (Alq3) by various film forming methods such as resistance heating vapor deposition. The electron transport layer has a function of transporting electrons injected from the cathode to the light emitting layer. This electron transport layer may have a multilayer structure in which only one layer is stacked or two or more layers are stacked. In addition, the electron transport layer may be formed of a plurality of materials instead of a single material, and a guest material having a high charge donating (accepting) property may be formed on a host material having a high charge transport capability. It may be formed by doping.
有機層１２上に形成される上部電極１３は、こちらが陰極の場合には、陽極より仕事関数の小さい（例えば４ｅＶ以下）材料（金属，金属酸化物，金属フッ化物，合金等）を用いることができ、具体的には、アルミニウム（Ａｌ），インジウム（Ｉｎ），マグネシウム（Ｍｇ）等の金属膜、ドープされたポリアニリンやドープされたポリフェニレンビニレン等の非晶質半導体、Ｃｒ2Ｏ3，ＮｉＯ，Ｍｎ2Ｏ5等の酸化物を使用できる。構造としては、金属材料による単層構造、ＬｉＯ2／Ａｌ等の積層構造等が採用できる。
When the upper electrode 13 formed on the organic layer 12 is a cathode, a material (metal, metal oxide, metal fluoride, alloy, etc.) having a work function smaller than that of the anode (for example, 4 eV or less) is used. Specifically, metal films such as aluminum (Al), indium (In), magnesium (Mg), amorphous semiconductors such as doped polyaniline and doped polyphenylene vinylene, Cr 2 O 3 , NiO , Oxides such as Mn 2 O 5 can be used. As the structure, a single layer structure made of a metal material, a laminated structure such as LiO 2 / Al, or the like can be adopted.
有機ＥＬ素子１Ｕを封止する封止部材は、一例としては、基板１０と接着層１７Ａを介して貼り合わせられる封止基板１７であり、基板１０と封止基板１７との間に有機ＥＬ素子１Ｕを封止する封止空間が形成される。封止基板１７としては、ガラス基板又は金属基板を用いることができる。下部電極１１は封止基板１７から引き出された引出配線１１Ａに導通している。
The sealing member that seals the organic EL element 1U is, for example, the sealing substrate 17 bonded to the substrate 10 via the adhesive layer 17A, and the organic EL element is interposed between the substrate 10 and the sealing substrate 17. A sealing space for sealing 1U is formed. As the sealing substrate 17, a glass substrate or a metal substrate can be used. The lower electrode 11 is electrically connected to the lead wiring 11 </ b> A drawn from the sealing substrate 17.
また、封止部材としては、有機ＥＬ素子１Ｕを覆う封止膜を採用することもできる、封止膜としては、原子層成長法によって成膜される金属やケイ素の酸化物，窒化物，酸窒化物の単層又は多層膜を用いることができ、ＴＭＡ（トリメチルアルミニウム）やＴＥＡ（トリエチルアルミニウム）、ＤＭＡＨ（ジメチルアルミニウム水素化物）等のアルキル系金属と、水や酸素、アルコール類との反応で得られるアルミニウム酸化物膜（例えば、Ａｌ2Ｏ3膜）、ケイ素系材料の気化ガスと水の気化ガスとの反応で得られるケイ素酸化物膜（例えば、ＳｉＯ2膜）などを用いることができる。
In addition, as the sealing member, a sealing film covering the organic EL element 1U can also be adopted. As the sealing film, a metal or silicon oxide, nitride, or acid formed by an atomic layer growth method can be used. A single layer or multilayer film of nitride can be used. By reaction of alkyl metal such as TMA (trimethylaluminum), TEA (triethylaluminum), DMAH (dimethylaluminum hydride) with water, oxygen, or alcohols. An aluminum oxide film (for example, Al 2 O 3 film) obtained, a silicon oxide film (for example, SiO 2 film) obtained by a reaction between a vaporized gas of a silicon-based material and a vaporized gas of water can be used. .
発光パネル２は、有機ＥＬパネルに限らず、無機ＥＬパネル、バックライトを有する液晶パネル、照明用或いは表示用のＬＥＤパネルなどを用いることができる。
The light-emitting panel 2 is not limited to an organic EL panel, and an inorganic EL panel, a liquid crystal panel having a backlight, an LED panel for illumination, or a display can be used.
このような発光パネル２（２Ａ，２Ｂ）を備えた発光装置１は、発光パネル２をカバー部材３の湾曲部３Ａや角部の内部に配置した場合に発光パネル２の前面にできる領域を活用してレンズ部３０を形成するものである。これによると、発光装置１内部における任意の箇所に発光パネル２を配置することで、発光装置１内の狭いスペースを有効利用して光出射領域を拡大することができる。また、レンズ部３０を形成することで、発光パネル２の配置箇所に拘わらず良好な視認性を得ることができる。
The light-emitting device 1 including such a light-emitting panel 2 (2A, 2B) utilizes an area that can be formed on the front surface of the light-emitting panel 2 when the light-emitting panel 2 is arranged inside the curved portion 3A or corner portion of the cover member 3. Thus, the lens unit 30 is formed. According to this, by arranging the light emitting panel 2 at an arbitrary location inside the light emitting device 1, it is possible to effectively utilize the narrow space in the light emitting device 1 and to expand the light emission region. In addition, by forming the lens portion 30, good visibility can be obtained regardless of the arrangement location of the light emitting panel 2.
以上、本発明の実施の形態について図面を参照して詳述してきたが、具体的な構成はこれらの実施の形態に限られるものではなく、本発明の要旨を逸脱しない範囲の設計の変更等があっても本発明に含まれる。上述の各図で示した実施の形態は、その目的及び構成等に特に矛盾や問題がない限り、互いの記載内容を組み合わせることが可能である。また、各図の記載内容はそれぞれ独立した実施形態になり得るものであり、本発明の実施形態は各図を組み合わせた一つの実施形態に限定されるものではない。
As described above, the embodiments of the present invention have been described in detail with reference to the drawings. However, the specific configuration is not limited to these embodiments, and the design can be changed without departing from the scope of the present invention. Is included in the present invention. The embodiments described in the above drawings can be combined with each other as long as there is no particular contradiction or problem in the purpose, configuration, or the like. Moreover, the description content of each figure can become independent embodiment, respectively, and embodiment of this invention is not limited to one embodiment which combined each figure.
Claims (15)
- 基板上に発光部を備えた発光パネルと、該発光パネルを覆うカバー部材を備え、
前記カバー部材は、前記発光部と対向する箇所に、レンズ部を備えることを特徴とする発光装置。 A light-emitting panel provided with a light-emitting unit on a substrate, and a cover member that covers the light-emitting panel;
The cover member includes a lens unit at a position facing the light emitting unit. - 前記レンズ部は、前記カバー部材と一体となるように形成されていることを特徴とする請求項１記載の発光装置。 The light emitting device according to claim 1, wherein the lens portion is formed so as to be integrated with the cover member.
- 前記レンズ部は、光の出射方向に凸形状であることを特徴とする請求項２記載の発光装置。 3. The light emitting device according to claim 2, wherein the lens portion has a convex shape in the light emitting direction.
- 前記レンズ部は、前記カバー部材の湾曲部によって構成されることを特徴とする請求項３記載の発光装置。 4. The light emitting device according to claim 3, wherein the lens portion is constituted by a curved portion of the cover member.
- 前記レンズ部は、前記カバー部材と、光透過性部材とが重なって形成されていることを特徴とする請求項１～４のいずれかに記載の発光装置。 5. The light emitting device according to claim 1, wherein the lens portion is formed by overlapping the cover member and a light transmissive member.
- 前記光透過性部材は、前記カバー部材と前記発光パネルとの間に充填される充填部材であることを特徴とする請求項５記載の発光装置。 6. The light emitting device according to claim 5, wherein the light transmissive member is a filling member filled between the cover member and the light emitting panel.
- 前記レンズ部は、前記カバー部材と前記基板によって構成されることを特徴とする請求項１～４のいずれかに記載の発光装置。 The light-emitting device according to any one of claims 1 to 4, wherein the lens unit includes the cover member and the substrate.
- 前記発光部と前記カバー部材の光出射面との間には空隙が存在しないことを特徴とする請求項１～４のいずれかに記載の発光装置。 5. The light emitting device according to claim 1, wherein no gap exists between the light emitting portion and the light emitting surface of the cover member.
- 前記発光部と前記カバー部材の光出射面との間には空隙が存在しないことを特徴とする請求項５記載の発光装置。 6. The light emitting device according to claim 5, wherein no gap exists between the light emitting portion and the light emitting surface of the cover member.
- 前記発光部と前記カバー部材の光出射面との間には空隙が存在しないことを特徴とする請求項６記載の発光装置。 The light emitting device according to claim 6, wherein no gap exists between the light emitting portion and the light emitting surface of the cover member.
- 前記発光部と前記カバー部材の光出射面との間には空隙が存在しないことを特徴とする請求項７記載の発光装置。 The light emitting device according to claim 7, wherein no gap exists between the light emitting portion and the light emitting surface of the cover member.
- 前記カバー部材は、前記発光パネルを支持する支持部を備えることを特徴とする請求項１～４のいずれかに記載の発光装置。 5. The light emitting device according to claim 1, wherein the cover member includes a support portion that supports the light emitting panel.
- 前記支持部は、前記発光パネルのエッジを嵌め込む切り欠き部であることを特徴とする請求項１２記載の発光装置。 13. The light emitting device according to claim 12, wherein the support portion is a cutout portion into which an edge of the light emitting panel is fitted.
- 前記支持部は、前記発光パネルの側面に当接する突起部であることを特徴とする請求項１２に記載の発光装置。 13. The light emitting device according to claim 12, wherein the support portion is a protrusion that contacts a side surface of the light emitting panel.
- 前記発光パネルは前記発光部を有機ＥＬ素子によって構成した有機ＥＬパネルであることを特徴とする請求項１～４のいずれかに記載の発光装置。 The light-emitting device according to any one of claims 1 to 4, wherein the light-emitting panel is an organic EL panel in which the light-emitting portion is configured by an organic EL element.
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