WO2013140631A1

WO2013140631A1 - Organic el apparatus and method for manufacturing same

Info

Publication number: WO2013140631A1
Application number: PCT/JP2012/057643
Authority: WO
Inventors: 陽介佐藤
Original assignee: パイオニア株式会社; 東北パイオニア株式会社
Priority date: 2012-03-23
Filing date: 2012-03-23
Publication date: 2013-09-26

Abstract

An organic EL apparatus (1) is provided with: a substrate (10); organic EL elements, each of which is provided with at least a lower electrode (11), an organic layer (12), and an upper electrode (13), which are laminated on the substrate (10); a sealing member (50), which seals the organic EL elements (1U) between the substrate (10) and the sealing member; and touch electrodes (20). The touch electrodes (20) are patterned outside of light emitting regions of respective organic EL elements (1U), and are disposed in the sealing regions sealed by means of the sealing member (50).

Description

Organic EL device and manufacturing method thereof

The present invention relates to an organic EL device and a manufacturing method thereof.

A self-luminous device (organic EL device) including an organic EL element includes, for example, a display screen of a mobile phone, a monitor screen of an in-vehicle or household electronic device, an information display screen of a personal computer or a television receiver, a lighting panel for advertisement As various display devices used in various applications, as various light sources used in scanners, printers, etc., as illumination devices used in general illumination and backlights of liquid crystal display devices, etc., and as an optical communication device utilizing a photoelectric conversion function It can be used for various applications and models.

An organic EL device having a touch sensor function is known. Some touch sensors are based on various operation principles such as a capacitance method, a resistance film method, an infrared method, and an ultrasonic method. Among these, as an organic EL display device having a capacitive touch sensor function, a substrate, an organic EL element provided on the substrate, and a sealing film provided on the opposite side of the organic EL element A touch detection electrode provided on the surface of the sealing film, a plurality of touch detection wirings that are electrically connected to the outer peripheral edge of the touch detection electrode at a distance from each other, and from each touch detection wiring A device including a touch position detection circuit that detects a touch position on a touch detection electrode using an electrical signal is known (for example, see Patent Document 1).

JP 2011-23558 A

Compared to the case where a touch panel such as a resistive film type is separately formed and mounted on a display substrate, an organic EL display device having a capacitive touch sensor function as in the prior art is manufactured. The process can be simplified, and the touch detection electrodes are directly formed on the constituent members of the organic EL display device, so that the thickness and weight of the entire device can be reduced.

However, according to the conventional technique, since the touch detection electrode is provided on the surface of the sealing film provided on the side opposite to the organic EL element, the film formation process for forming the touch detection electrode in the normal manufacturing process of the organic EL display device It is necessary to add. If the touch sensor function is added to the organic EL display device, it can be said that a manufacturing process is added, but the addition of the film forming process requires the addition of a substrate transport path and a film forming chamber. This will require a large-scale expansion of manufacturing equipment.

Further, in the manufacturing process of the organic EL device, the tact time of the film forming process occupies most of the time of the entire manufacturing process. Therefore, according to the prior art, the touch detection electrode is formed in the tact time of the normal organic EL display device. The tact time of the film forming process is added, and the entire manufacturing time is greatly extended. This causes a problem that productivity is lowered.

The present invention is an example of a problem to deal with such a problem. That is, in the organic EL device, the touch sensor function can be added in a tact time equivalent to the manufacturing process in the organic EL device having no touch sensor function, and in particular, the organic EL with the touch sensor function added without adding manufacturing equipment. It is an object of the present invention to be able to obtain a device, and to obtain an organic EL device to which a touch sensor function is added without greatly affecting the thickness and weight of the entire device.

In order to achieve such an object, the present invention has at least the following features.

A substrate, an organic EL element having at least a lower electrode, an organic layer, and an upper electrode stacked on the substrate; a sealing member that seals the organic EL element between the substrate; and a touch electrode; The organic EL device is characterized in that the touch electrode is patterned outside a light emitting region for each organic EL element and disposed in a sealing region sealed by the sealing member.

A substrate, an organic EL element that is laminated on the substrate and includes at least a lower electrode, an organic layer, and an upper electrode, a sealing member that seals the organic EL element between the substrate, and a substrate formed on the substrate A method of manufacturing an organic EL device, comprising: a wiring electrode connected to one of the lower electrode and the upper electrode; and a touch electrode for constituting a capacitive touch sensor, wherein the lower electrode The touch electrode is formed at the same time as any one of the upper electrode and the wiring electrode, outside the light emitting region for each organic EL element, and in the sealing region sealed by the sealing member A method for manufacturing an organic EL device.

It is explanatory drawing which showed the structure of the organic electroluminescent apparatus which concerns on one Embodiment of this invention. FIG. 1A is an overall explanatory view in plan view, FIG. 1B is an enlarged view of a portion A in FIG. 1A, and FIG. 1C is a cross-sectional view along XX in FIG. It is explanatory drawing which showed the structural example of the touch electrode in the organic electroluminescent apparatus 1 which concerns on embodiment of this invention, Fig.2 (a) shows the arrangement structure of an electrode, FIG.2 (b) is the simplified circuit diagram of a touch electrode. Is shown. It is explanatory drawing (plan view) which showed the other form example of the electrode structure in the organic electroluminescent apparatus which concerns on embodiment of this invention. It is explanatory drawing (plan view) which showed the other form example of the electrode structure in the organic electroluminescent apparatus which concerns on embodiment of this invention. It is explanatory drawing which showed the other example of the electrode structure in the organic electroluminescent apparatus which concerns on embodiment of this invention. It is explanatory drawing which showed the other example of the electrode structure in the organic electroluminescent apparatus which concerns on embodiment of this invention. It is explanatory drawing which showed the other example of the electrode structure in the organic electroluminescent apparatus which concerns on embodiment of this invention. It is explanatory drawing which showed the example of a connection form of the touch electrode and detection circuit in the organic electroluminescent apparatus which concerns on embodiment of this invention. It is explanatory drawing which showed the example of a connection form of the touch electrode and detection circuit in the organic electroluminescent apparatus which concerns on embodiment of this invention. It is explanatory drawing which showed the example of a connection form of the touch electrode and detection circuit in the organic electroluminescent apparatus which concerns on embodiment of this invention. It is explanatory drawing which showed the example of a connection form of the touch electrode and detection circuit in the organic electroluminescent apparatus which concerns on embodiment of this invention. It is explanatory drawing which showed the example of a connection form of the touch electrode and detection circuit in the organic electroluminescent apparatus which concerns on embodiment of this invention. It is explanatory drawing which showed an example of the manufacturing method of the organic electroluminescent apparatus which concerns on embodiment of this invention. It is explanatory drawing which showed an example of the manufacturing method of the organic electroluminescent apparatus which concerns on embodiment of this invention. It is explanatory drawing which showed an example of the manufacturing method of the organic electroluminescent apparatus which concerns on embodiment of this invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. The embodiment of the present invention includes the contents shown in the drawings, but is not limited thereto. FIG. 1 is an explanatory diagram showing a configuration of an organic EL device according to an embodiment of the present invention. FIG. 1A is an overall explanatory view in plan view, FIG. 1B is an enlarged view of a portion A in FIG. 1A, and FIG. 1C is a cross-sectional view along XX in FIG.

The organic EL device 1 includes a substrate 10 and an organic EL element 1U formed on the substrate 10. The organic EL element 1U is formed in a sealing region 10A in the substrate 10. In the illustrated example, a plurality of organic EL elements 1U are arranged in a matrix in the sealing region 10A. However, the organic EL elements 1U are not limited to this, and one organic EL element 1U may be formed on the substrate 10. Good. The organic EL element 1U is hermetically sealed between the substrate 10 and the sealing member 50 that covers the sealing region 10A and faces the substrate 10.

The organic EL element 1U is laminated on the substrate 10 as shown in FIG. The organic EL element 1U includes at least a lower electrode 11, an organic layer 12, and an upper electrode 13. In the illustrated example, the lower electrode 11 is formed on the substrate 10, the organic layer 12 is formed thereon, and the upper electrode 13 is further formed thereon. Several film-forming layers may exist between them, and other layers may be laminated between the lower electrode 11, the organic layer 12, and the upper electrode 13. The organic layer 12 is composed of one light emitting layer or several functional layers for emitting light (hole injection / transport layer, light emitting layer, electron injection / transport layer, etc.).

In the illustrated example, a plurality of lower electrodes 11 are formed in a stripe shape on the substrate 10, and a plurality of upper electrodes 13 are formed in a stripe shape in a direction intersecting the lower electrode 11. The plurality of lower electrodes 11 are insulatively partitioned by an insulating film 14, and the plurality of upper electrodes 13 are insulatively partitioned by partition walls 16 formed in a stripe shape therebetween.

The organic EL element 1U has a light emitting region 1L for each element. In the illustrated example, the light emitting region 1L is a region surrounded by the insulating film 14, in other words, a region of the opening of the insulating film 14. One or a plurality of light emitting regions 1L are formed in the sealing region 10A on the substrate 10 as in the organic EL element 1U.

The organic EL device 1 includes a wiring electrode 15 connected to either the lower electrode 11 or the upper electrode 13 on the substrate 10. The wiring electrode 15 is made of a conductive layer stacked on a substrate, and is formed by patterning one or a plurality of stacked conductive layers. In this case, the wiring electrode 15 is an auxiliary wiring electrode wired along the lower electrode 11 in order to substantially lower the electric resistance of the lower electrode 11, a lead connected to the end of the lower electrode 11 or the upper electrode 13. One or both of the wiring electrodes.

Further, the organic EL device 1 includes, for example, a touch electrode 20 for constituting a capacitive touch sensor. The touch electrode 20 is patterned outside the light emitting region 1L for each organic EL element 1U, and is disposed in the sealing region 10A sealed by the sealing member 50. The touch electrode 20 is a layer or the same layer made of the same material as any one of the lower electrode 11, the upper electrode 13, and the wiring electrode 15. Here, the same layer refers to a layer formed in the same film formation process. When a certain layer and a certain layer are the same layer, both are necessarily formed of the same material. Become a layer. The touch electrode 20 is patterned simultaneously with any one of the lower electrode 11, the upper electrode 13, and the wiring electrode 15. Note that two layers that are the same layer are not necessarily on the same plane. When there is a step in the underlayer, the same layer is formed on a different plane.

In the example shown in FIG. 1, a plurality of touch electrodes 20 are arranged in parallel with the plurality of lower electrodes 11, and are formed in a region between the plurality of lower electrodes 11. The touch electrode 20 is formed in a plurality of lines.

In the example shown in FIG. 1, the touch electrode 20 is in the same layer as the lower electrode 11 or the wiring electrode 15 and is disposed on the substrate 10 in the same plane as the lower electrode 11 or the wiring electrode 15. When the touch electrode 20 is the same layer as the wiring electrode 15, the touch electrode 20 is made of a metal material such as Al having a low electric resistance with respect to the lower electrode 11 formed of a transparent conductive film such as ITO or IZO. Can be formed.

In the example shown in FIG. 1, the drive circuit element (COG) 30 is mounted on the substrate 10, and the wiring electrode 15 (leading wiring electrode) connected to the end portions of the lower electrode 11 and the upper electrode 13 is the driving circuit. It is connected to the element 30. Further, a circuit board (for example, a flexible circuit board) 31 is connected to the substrate 10, the touch electrode 20 is connected to the detection circuit 32 mounted on the circuit board 31, and the drive circuit element is connected to the drive circuit 33. 30 is connected. The detection circuit 32 is a circuit for detecting a change in capacitance on the touch electrode 20.

In such an organic EL device 1, the touch electrode 20 constituting the touch sensor is patterned outside the light emitting region 1L for each organic EL element 1U and in the sealing region 10A. According to this, the touch electrode 20 can be formed in the same process as any one of the lower electrode 11, the upper electrode 13, and the wiring electrode 15. Thereby, a touch sensor function can be added to a normal organic EL device having no touch sensor function without adding a film forming process or a pattern forming process.

Since the organic EL device 1 has the above-described characteristics, the organic EL device 1 including the touch electrode 20 can be obtained without extending the cycle time of the manufacturing process. Therefore, the organic EL device without a touch sensor function can be obtained. Can be obtained. Since the touch electrode 20 itself is directly formed on the components of the organic EL element 1U such as the substrate 10, an organic EL device to which a touch sensor function is added without greatly affecting the thickness and weight of the entire device. Obtainable.

FIG. 2 is an explanatory view showing a configuration example of a touch electrode in the organic EL device 1 according to the embodiment of the present invention, FIG. 2A shows an electrode arrangement structure, and FIG. 2B is a touch electrode. The simplified circuit diagram is shown.

In the illustrated example, a plurality of touch electrodes 20 are arranged in parallel with the lower electrode 11, and some or all of the plurality of touch electrodes 20 are connected by a connecting electrode 21. In this example, the connection electrode 21 extends in a direction intersecting with a plurality of touch electrodes 20 arranged in parallel with the lower electrode 11, and ends of the touch electrodes 20 are connected to the connection electrodes 21, respectively. .

2 (b), the operation principle of the touch sensor using the touch electrode 20 will be described. In this example, the power source 22 is connected to the connecting electrode 21 at the point a, the touch electrode 20 (20-1) is connected to the connecting electrode 21 at the point b, and the touch electrode 20 (20-2) is connected to the point c. The touch electrodes 20 (20-3) are connected at the point d. The connection points a, b, c, and d can be detected by a resistance R1 between a and b, a resistance R2 between b and c, and a resistance R3 between c and d. In this circuit, a finger or the like touches any one of the touch electrodes 20 (20-1, 20-2, 20-3), and the touch electrode 20 (20-1, 20-2, 20-3) When the capacitance C changes, the detected current i that flows through the connection electrode 21 varies depending on the position of the touch electrode 20 (20-1, 20-2, 20-3) where the capacitance C has changed. The contact position of a finger or the like can be detected based on the difference in the detected current i.

At this time, the difference in the detection current i can be increased by increasing the resistances R1, R2, and R3. Therefore, the connection electrode 21 is preferably formed of a material having a higher electrical resistance than the touch electrode 20. As an example, the touch electrode 20 is formed of a metal material such as Al, and the connection electrode 21 is formed of ITO or the like having an electric resistance higher than that of the metal material. In this case, such an electrical resistance relationship can be obtained by making the touch electrode 20 the same layer as the wiring electrode 15 and the connecting electrode 21 the same layer as the lower electrode 11.

In the example shown in FIG. 1, an electrode layer (upper electrode 13) three-dimensionally overlapping on the touch electrode 20 is provided. At this time, a parasitic capacitance C ₀ is generated between the touch electrode 20 and the electrode layer (upper electrode 13). When the value of the parasitic capacitance C ₀ increases, it becomes difficult to detect a change in capacitance when a finger or the like touches the touch electrode 20. To increase the sensitivity of the touch electrode 20 to eliminate this it is necessary to reduce the value of the parasitic capacitance C _0. In the example shown in FIG. 1, an insulating film 14 is formed between the touch electrode 20 and the electrode layer (upper electrode 13) to reduce the parasitic capacitance C ₀ between these electrodes. By increasing the thickness of the insulating film 14, it is possible to reduce the value of the parasitic capacitance C _0.

3 and 4 are explanatory views (plan views) showing other embodiments of the electrode structure in the organic EL device according to the embodiment of the present invention. Each of the examples shown here has an electrode structure for reducing the parasitic capacitance C ₀ described above.

The example shown in FIG. 3 includes an electrode layer (upper electrode 13) that sterically overlaps the touch electrode 20, and the electrode layer (upper electrode 13) opens a part of the portion that overlaps the touch electrode 20. 13A. According to this, since a part of the electrode layer on the touch electrode 20 is eliminated, the above-described parasitic capacitance C ₀ can be reduced.

In the example shown in FIG. 4, the touch electrode 20 is arranged in parallel with the lower electrode 11 as described above, and the lower electrode 22 is a notch that narrows the electrode width of the lower electrode 11 outside the light emitting region described above. Part 11A. The touch electrode 20 has a widened portion 20A that widens the electrode width of the touch electrode 20 in the cutout portion 11A. In the illustrated example, a rectangular cutout portion 11A is provided below the partition wall 16, and a rectangular widened portion 20A is provided in the cutout portion 11A. According to this, since the partition wall 16 is provided on the widened portion 20A of the touch electrode 20 and there is no electrode layer, contact detection with reduced parasitic capacitance C ₀ is possible by bringing a finger or the like into contact with this part. Become.

FIG. 5 is an explanatory view showing another example of the electrode structure in the organic EL device according to the embodiment of the present invention. In this example, the touch electrode 20 is in the same layer as the upper electrode 13. In the example shown in FIG. 5A, the partition 16 is provided on the insulating film 14 in a direction intersecting the lower electrode 11, and the upper electrode 13 formed along the direction intersecting the lower electrode 11 by the partition 16. Is insulated. A touch electrode 20 is provided on the partition wall 16. In the illustrated example, the upper electrode 13 and the touch electrode 20 are formed on different planes, but both are the same layer and formed in the same film forming process. In this example, the touch electrodes 20 are formed in a region between the upper electrodes 13, and are arranged in a plurality of lines along the partition wall 16 in parallel with the upper electrodes 13. In the example shown in FIG. 5A, another touch electrode 20S is provided on the surface of the partition wall 16 facing the touch electrode 20, and the touch is detected by the physical contact between the touch electrode 20A and the touch electrode 20S. A resistive film method may be adopted.

The example shown in FIGS. 5B and 5C (FIG. 5B is a cross-sectional view and FIG. 5C is a plan view) shows a pair of partition walls in which the touch electrode 20 insulates the upper electrode 13 from each other. 16 (16A, 16B). In this example, two

partition walls

16A and 16B are provided on the insulating film 14 in a direction intersecting the lower electrode 11, and the upper electrode 13 formed along the direction intersecting the lower electrode 11 by the

partition walls

16A and 16B is formed. Insulated compartment. A touch electrode 20 of the same layer as the upper electrode 13 is formed between the

partition walls

16A and 16B. Also in this example, the upper electrode 13 and the touch electrode 20 are formed on different planes, but both are the same layer and formed in the same film forming process, and the touch electrode 20 is in parallel with the upper electrode 13. Then, they are arranged in a plurality of lines along the partition wall 16.

FIG. 6 is an explanatory view showing another example of the electrode structure in the organic EL device according to the embodiment of the present invention. In this example, the touch electrodes 20 are arranged so as to intersect in two directions. A plurality of touch electrodes 20 (20X) arranged in parallel along one direction are in the same layer as the upper electrode 13 and are formed in a region between the upper electrodes 13. A plurality of touch electrodes 20 (20Y) arranged in parallel along the other direction are in the same layer as the lower electrode 11 and are formed in a region between the lower electrodes 11. The touch electrode 20X can be formed on a partition wall (not shown) or between two partition walls as shown in FIG. 5, and the touch electrode 20Y can be formed on a substrate as shown in FIG. it can.

FIG. 7 is an explanatory view showing another example of the electrode structure in the organic EL device according to the embodiment of the present invention. In this example, the organic EL elements are formed in a segment shape (FIG. 7A) or an icon shape (FIG. 7B). In the example shown in FIG. 7A, the touch electrode 20 is formed so as to surround the organic EL element 1U formed in a segment shape. In the example shown in FIG. 7B, the touch electrode 20 is formed in an icon shape. A touch electrode 20 is formed so as to surround the organic EL element 1U. As described above, the touch electrode 20 shown in FIGS. 7A and 7B is the same layer as any one of the lower electrode, the upper electrode, and the wiring electrode.

8 to 12 are explanatory diagrams showing examples of connection forms of the touch electrode and the detection circuit in the organic EL device according to the embodiment of the present invention. The touch electrodes 20 in the examples shown in FIGS. 8 to 12 are the same layer as any one of the lower electrode, the upper electrode, and the wiring electrode as described above.

In the example shown in FIG. 8, the detection circuit 32 is connected to each of the plurality of touch electrodes 20. The example shown in FIG. 9 includes a plurality of touch electrodes 20, and some or all of the plurality of touch electrodes 20 are connected in parallel by connecting electrodes 21, and the touch electrodes 20 are detected via the connecting electrodes 21. The circuit 32 is connected.

In the example illustrated in FIG. 10, the plurality of touch electrodes 20 are divided into a plurality of areas (Ar1, Ar2, Ar3), and the connection electrodes 21 (21A, 21B, 21C) are provided separately for each area. Is connected to a detection circuit 32 (32A, 32B, 32C) provided for each area via a coupling electrode 21 (21A, 21B, 21C).

In the example shown in FIG. 11, the plurality of touch electrodes 20 are divided into a plurality of areas (Ar1, Ar2, Ar3), and the connection electrodes 21 (21A, 21B, 21C) are provided separately for each area. Are electrically connected to the detection circuit 32 via the coupling electrodes 21 (21A, 21B, 21C) in a time-sharing manner. The detection circuit 32 and the connecting electrode 21 (21A, 21B, 21C) are sequentially connected by a time division switching circuit 34.

In the example shown in FIG. 12, the touch electrode 20 formed along the lower electrode 11 or the upper electrode 13 is divided into a plurality along the lower electrode 11 or the upper electrode 13. In the example shown in FIG. 12A, the touch electrodes 20 divided into a plurality for each line along the lower electrode 11 or the upper electrode 13 are connected by the connecting electrode 21 and connected to the detection circuit 32. In the example shown in FIG. 12B, the touch electrodes 20 divided into a plurality for each line along the lower electrode 11 or the upper electrode 13 are individually connected to the detection circuit 32 via the connection electrodes 21. .

13 to 15 are explanatory views showing an example of a method for manufacturing an organic EL device according to an embodiment of the present invention. FIG. 13 shows an example of a manufacturing process when the touch electrode is the same layer as the lower electrode. In the substrate preparation step S1, surface treatment of the substrate 10 and formation of a base layer (a layer such as a protective film or a planarizing film) on the surface are performed. In the subsequent lower electrode layer deposition step S2, a lower electrode layer made of a transparent conductive film material such as ITO or IZO is deposited on the substrate 10 that has undergone the substrate preparation step S1. In the subsequent wiring electrode layer partial film forming step S3, a wiring electrode layer made of a metal material such as Al is formed in a partial region on the lower electrode layer.

In the subsequent lower electrode / wiring electrode / touch electrode simultaneous forming step S4, the lower electrode 11, the wiring electrode 15, and the touch electrode 20 are simultaneously patterned by a pattern forming step such as photolithography. At this time, the touch electrode 20 is formed by patterning the lower electrode layer formed on the substrate 10.

Thereafter, the insulating film 14 and the partition 16 are sequentially formed in the insulating film / partition forming step S5, the organic layer 12 is formed into a mask in the organic layer forming step S6, and is formed on the organic layer 12 in the upper electrode forming step S7. An upper electrode 13 made of a metal material such as Al is formed. Thereafter, a sealing step S8 for hermetically sealing the organic EL element 1U and a circuit mounting step S9 for connecting a drive circuit and a detection circuit to the wiring electrode 15 and the touch electrode 20 are performed.

FIG. 14 shows an example of the manufacturing process when the touch electrode is the same layer as the wiring electrode. In this example, after the substrate preparation process S1 and the lower electrode layer film formation process S2 described above are performed, the lower electrode 11 is formed by a pattern formation process such as photolithography in the lower electrode formation process S2a. Thereafter, in the wiring electrode layer forming step S3a, a wiring electrode layer made of a metal material such as Al is formed on the substrate 10 on which the lower electrode 11 is formed. Thereafter, in the wiring electrode / touch electrode simultaneous forming step S4a, the wiring electrode 15 and the touch electrode 20 are simultaneously patterned by a pattern forming step such as photolithography. At this time, the touch electrode 20 is formed by patterning a wiring electrode layer made of a metal material such as Al formed on the substrate 10. Thereafter, as described above, the insulating film / partition wall forming step S5, the organic layer forming step S6, the upper electrode forming step S7, the sealing step S8, and the circuit mounting step S9 are performed.

FIG. 15 shows an example of the manufacturing process when the touch electrode is the same layer as the upper electrode. In this example, the substrate preparation process S1, the lower electrode layer film forming process S2, and the wiring electrode layer partial film forming process S3 described above are performed, and then the lower electrode / wiring electrode forming process S4b is performed to form a pattern such as photolithography. The lower electrode 11 and the wiring electrode 15 are formed by the process. Thereafter, as described above, the insulating film / partition wall forming step S5 and the organic layer film forming step S6 are performed, and then the upper electrode film forming / touch electrode simultaneous forming step S7a is performed. At this time, the touch electrode 20 is made of the same metal material such as Al as the upper electrode 13 and is patterned on the partition wall 16 or between the two

partition walls

16A and 16B. Thereafter, as described above, the sealing step S8 and the circuit mounting step S9 are performed.

According to such a manufacturing method of the organic EL device 1, the touch electrode 20 can be formed without adding a film forming process or a pattern forming process, so that the tact equivalent to that of the organic EL device having no touch sensor function is achieved. The organic EL device 1 having a touch sensor function can be manufactured in time.

Hereinafter, a specific configuration example of the organic EL element 1U described above will be described.

The substrate 10 is light transmissive and is formed of a base material that can support the organic EL element 1U, such as glass or plastic. The transparent conductive film layer forming the lower electrode 11 is a transparent metal such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), zinc oxide-based transparent conductive film, SnO ₂ -based transparent conductive film, titanium dioxide-based transparent conductive film, etc. An oxide can be used.

In the case where the lower electrode 11 is patterned on a plurality of electrodes, an insulating film 14 is provided to ensure insulation between the electrodes. The insulating film 14 is made of a material such as polyimide resin, acrylic resin, silicon oxide, or silicon nitride. The insulating film 14 is formed by depositing the material of the insulating film 14 on the substrate 10 on which the lower electrode 11 is patterned, and then forming an opening for forming the light emitting region 1L for each organic EL element 1U on the lower electrode 11. Patterning is performed. Specifically, a film is formed on the substrate 10 on which the lower electrode 11 is formed to have a predetermined coating thickness by spin coating, and exposure processing and development processing are performed using an exposure mask, whereby an organic EL element is obtained. A layer of insulating film 14 having an opening pattern shape of 1U is formed. The insulating film 14 is formed so as to fill the space between the patterns of the lower electrode 11 and partially cover the side end portion thereof, and is formed in a lattice shape when the organic EL elements 1U are arranged in a dot matrix.

The barrier ribs 16 are formed in stripes in a direction intersecting the lower electrode 11 in order to form a pattern of the upper electrode 13 without using a mask or the like, or to completely electrically insulate the adjacent upper electrode 13 from each other. The Specifically, an insulating material such as a photosensitive resin is formed on the above-described insulating film 14 so that the film thickness is larger than the total thickness of the organic layer 12 and the upper electrode 13 that form the organic EL element 1U. Then, the photosensitive resin film is irradiated with ultraviolet rays or the like through a photomask having a stripe pattern intersecting with the lower electrode 11, and the development speed resulting from the difference in the exposure amount in the thickness direction of the layer is applied. By utilizing the difference, the partition wall 16 having a tapered surface with a downward side is formed.

The organic layer 12 has a laminated structure of light emitting functional layers including a light emitting layer. When one of the lower electrode 11 and the upper electrode 13 is an anode and the other is a cathode, a hole injection layer and a hole transport are sequentially formed from the anode side. A layer, a light emitting layer, an electron transport layer, an electron injection layer, and the like are selectively formed. As the film formation of the organic layer 12, a vacuum deposition method or the like is used as a dry film formation, and coating or various printing methods are used as a wet film formation.

An example of forming the organic layer 12 will be described below. For example, first, NPB (N, N-di (naphtalence) -N, N-dipheneyl-benzidene) is formed as a hole transport layer. This hole transport layer has a function of transporting holes injected from the anode to the light emitting layer. The hole transport layer may be a single layer or a stack of two or more layers. In addition, the hole transport layer is not formed by a single material, but a single layer may be formed by a plurality of materials, and a guest material having a high charge donating (accepting) property may be formed on a host material having a high charge transport capability. Doping may be performed.

Next, a light emitting layer is formed on the hole transport layer. As an example, red (R), green (G), and blue (B) light-emitting layers are formed in respective film formation regions by using a resistance heating vapor deposition method using a coating mask. As red (R), an organic material that emits red light such as a styryl dye such as DCM1 (4- (dicyanomethylene) -2-methyl-6- (4'-dimethylaminostyryl) -4H-pyran) is used. An organic material that emits green light, such as aluminum quinolinol complex (Alq3), is used as green (G). As the blue (B), an organic material emitting blue light such as a distyryl derivative or a triazole derivative is used. Of course, other materials or a host-guest layer structure may be used, and the emission form may be a fluorescent material or a phosphorescent material.

The electron transport layer formed on the light emitting layer is formed by using various materials such as an aluminum quinolinol complex (Alq3) by various film forming methods such as resistance heating vapor deposition. The electron transport layer has a function of transporting electrons injected from the cathode to the light emitting layer. This electron transport layer may have a multilayer structure in which only one layer is stacked or two or more layers are stacked. In addition, the electron transport layer may be formed of a plurality of materials instead of a single material, and a guest material having a high charge donating (accepting) property may be formed on a host material having a high charge transport capability. It may be formed by doping.

When the upper electrode 13 formed on the organic layer 12 is a cathode, a material (metal, metal oxide, metal fluoride, alloy, etc.) having a work function smaller than that of the anode (for example, 4 eV or less) is used. Specifically, metal films such as aluminum (Al), indium (In), magnesium (Mg), amorphous semiconductors such as doped polyaniline and doped polyphenylene vinylene, Cr ₂ O ₃ , NiO , Oxides such as Mn ₂ O ₅ can be used. As the structure, a single layer structure made of a metal material, a laminated structure such as LiO ₂ / Al, or the like can be adopted.

As an example of the sealing member for sealing the organic EL element 1U, a single layer or a multilayer of metal, silicon oxide, nitride, or oxynitride formed by an atomic layer growth method can be used. . For example, an aluminum oxide film (for example, Al ₂ O) obtained by a reaction between an alkyl metal such as TMA (trimethylaluminum), TEA (triethylaluminum), DMAH (dimethylaluminum hydride) and water, oxygen, or alcohols. ₃ film), a silicon oxide film (for example, SiO ₂ film) obtained by a reaction between a vaporized gas of a silicon-based material and a vaporized gas of water can be used.

The embodiments of the present invention have been described in detail with reference to the drawings. However, the specific configuration is not limited to these embodiments, and the design can be changed without departing from the scope of the present invention. Is included in the present invention. The embodiments described in the above drawings can be combined with each other as long as there is no particular contradiction or problem in the purpose and configuration. Moreover, the description content of each figure can become independent embodiment, respectively, and embodiment of this invention is not limited to one embodiment which combined each figure.

Claims

A substrate,
An organic EL element comprising at least a lower electrode, an organic layer, and an upper electrode laminated on the substrate;
A sealing member for sealing the organic EL element with the substrate;
With touch electrodes,
The organic EL device according to claim 1, wherein the touch electrode is patterned outside a light emitting region for each organic EL element and disposed in a sealing region sealed by the sealing member.
A wiring electrode formed on the substrate and connected to either the lower electrode or the upper electrode;
The organic EL device according to claim 1, wherein the touch electrode is a layer made of the same material as any one of the lower electrode, the upper electrode, and the wiring electrode.
A wiring electrode formed on the substrate and connected to either the lower electrode or the upper electrode;
The organic EL device according to claim 1, wherein the touch electrode is the same layer as any one of the lower electrode, the upper electrode, and the wiring electrode.
3. The organic EL device according to claim 2, wherein the touch electrode constitutes a capacitive touch sensor.
A plurality of the upper electrode and the lower electrode, respectively,
The organic EL device according to claim 1, wherein the touch electrode is formed in a region between the upper electrodes or between the lower electrodes.
The organic EL device according to claim 1, wherein the touch electrodes are formed in a plurality of lines.
The organic EL device according to claim 1, wherein the touch electrode is arranged in parallel with the lower electrode or the upper electrode.
2. The organic EL device according to claim 1, wherein a plurality of the touch electrodes are arranged in parallel with the lower electrode, and are made of a material having a lower electric resistance than the lower electrode.
2. The organic EL device according to claim 1, comprising a plurality of the touch electrodes, wherein some or all of the plurality of touch electrodes are connected by a connection electrode.
10. The organic EL device according to claim 9, wherein the connecting electrode is made of a material having a higher electric resistance than the touch electrode.
10. The organic EL device according to claim 9, wherein the plurality of touch electrodes are divided for each area, and the connection electrodes are provided for each area.
Comprising an electrode layer overlying the touch electrode;
The organic EL device according to claim 1, wherein an insulating film that reduces parasitic capacitance between the electrodes is formed between the touch electrode and the electrode layer.
Comprising an electrode layer overlying the touch electrode;
The organic EL device according to claim 1, wherein the electrode layer has an opening in which a part of the portion overlapping the touch electrode is opened.
The touch electrode is arranged in parallel with the lower electrode,
The lower electrode has a notch that narrows the electrode width of the lower electrode outside the light emitting region,
The organic EL device according to claim 1, wherein the touch electrode has a widened portion that widens an electrode width of the touch electrode in the cutout portion.
2. The organic EL device according to claim 1, wherein the touch electrode is in the same layer as the lower electrode, and the touch electrode and the lower electrode are formed on the same plane.
2. The organic EL device according to claim 1, wherein the touch electrode is in the same layer as the wiring electrode, and the touch electrode and the wiring electrode are formed on the same plane.
The organic EL device according to claim 1, wherein the touch electrode is formed in the same layer as the upper electrode, and the touch electrode and the upper electrode are formed on different planes.
The organic EL device according to claim 17, wherein the touch electrode is formed on a partition wall for insulatingly partitioning the upper electrode.
The organic EL device according to claim 17, wherein the touch electrode is formed between a pair of partition walls that insulate and partition the upper electrode.
A detection circuit for detecting a capacitance change on the touch electrode;
The organic EL device according to claim 1, wherein the touch electrode is connected to the detection circuit.
A plurality of touch electrodes;
21. The organic EL device according to claim 20, wherein the detection circuit is connected to each of the plurality of touch electrodes.
A plurality of touch electrodes;
A part or all of the plurality of touch electrodes are connected by a connecting electrode and connected in parallel,
21. The organic EL device according to claim 20, wherein the touch electrode is connected to the detection circuit through the connection electrode.
A plurality of the touch electrodes are divided for each area, and the connection electrode is divided for each area,
23. The organic EL device according to claim 22, wherein the touch electrode is connected to the detection circuit provided for each area via the connection electrode.
A plurality of the touch electrodes are divided for each area, and the connection electrode is divided for each area,
23. The organic EL device according to claim 22, wherein the touch electrode is electrically connected to the detection circuit through the connection electrode in a time division manner.
2. The wiring electrode according to claim 1, wherein the wiring electrode is one or both of an auxiliary wiring electrode wired along the lower electrode, an extraction wiring electrode connected to an end of the lower electrode, or the upper electrode. Organic EL device.
A substrate, an organic EL element that is laminated on the substrate and includes at least a lower electrode, an organic layer, and an upper electrode, a sealing member that seals the organic EL element between the substrate, and a substrate formed on the substrate A method of manufacturing an organic EL device comprising: a wiring electrode connected to any one of the lower electrode and the upper electrode; and a touch electrode for constituting a capacitive touch sensor,
Simultaneously with any one of the lower electrode, the upper electrode, and the wiring electrode, the touch is performed outside the light emitting region for each organic EL element and within a sealing region sealed by the sealing member. An organic EL device manufacturing method comprising forming an electrode.