CN109037285A - Display panel and preparation method thereof, display device, mask plate component - Google Patents
Display panel and preparation method thereof, display device, mask plate component Download PDFInfo
- Publication number
- CN109037285A CN109037285A CN201810835903.XA CN201810835903A CN109037285A CN 109037285 A CN109037285 A CN 109037285A CN 201810835903 A CN201810835903 A CN 201810835903A CN 109037285 A CN109037285 A CN 109037285A
- Authority
- CN
- China
- Prior art keywords
- touch
- layer
- display panel
- mask plate
- control cabling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
Abstract
Some embodiments of the present application provide a kind of display panel and preparation method thereof, display device, mask plate component, are related to field of display technology, cause to generate touch-control blind area for solving the problem of that touch-control cabling occupies biggish display space.Above-mentioned display panel includes TFT backplate and touch-control cabling and organic function layer in TFT backplate.Organic function layer has multiple via holes, and each via hole exposes a part of touch-control cabling.Display panel further includes the first electrode layer for covering organic function layer.First electrode layer includes the self-capacitance electrode of multiple mutually insulateds, and each self-capacitance electrode is in contact with the touch-control cabling that a via hole exposes.
Description
Technical field
The present invention relates to field of display technology more particularly to display panel and preparation method thereof, display device, mask plate groups
Part.
Background technique
Organic Light Emitting Diode (Organic Light Emitting Diode, OLED) is used as a kind of current mode photophore
Part, because its self-luminous, quick response, wide viewing angle and due to the features such as can be produced in flexible substrate more and more by
In high-performance display field.OLED can be divided into PMOLED (Passive Matrix Driving by driving method
OLED, passive matrix drive Organic Light Emitting Diode) and AMOLED (Active Matrix Driving OLED, active matrix
Drive Organic Light Emitting Diode) two kinds, since displayer has low manufacturing cost, high answer speed, power saving, can be used for
The advantages that DC driven, the operating temperature range of portable device are big etc. and be expected to become and replace LCD (liquid crystal
Display, liquid crystal display) next-generation novel flat panel display.
In order to integrate touch function in OLED display, In-Cell (embedded) technology can be used.The In-Cell
Technology is respectively compound embedded (Hybrid In-Cell, HIC) and complete embedded (Full In-Cell, FIC).Relative to
For HIC structure, FIC structure is simpler.In the prior art, FIC structure has the touch control electrode of multiple same layers setting, with institute
State the touch-control cabling and touch control electrode same layer setting that touch control electrode is connected.In the case, when the size of display device
It is larger, and when touch accuracy is higher, the quantity of touch control electrode and touch-control cabling also will increase, so, multiple touch-control cablings
The display space that the position at place occupies is larger, to generate touch-control blind area.
Summary of the invention
The embodiment of the present invention provides display panel and preparation method thereof, display device, mask plate component, for solving touching
It controls cabling and occupies biggish display space, cause to lead to the problem of touch-control blind area.
In order to achieve the above objectives, the embodiment of the present invention adopts the following technical scheme that
The one side of the embodiment of the present application, provides a kind of display panel, including TFT backplate and is located at the TFT backplate
On touch-control cabling and organic function layer；The organic function layer has multiple via holes, and each via hole exposes the touch-control
A part of cabling；The display panel further includes the first electrode layer for covering the organic function layer；The first electrode layer
Self-capacitance electrode including multiple mutually insulateds；The touch-control that each self-capacitance electrode is exposed with a via hole is walked
Line is in contact.
In some embodiments of the present application, there is insulating layer between the hole wall of the via hole and the touch-control cabling.
In some embodiments of the present application, the display panel further includes being dielectrically separated from the TFT backplate
Column；The column that is dielectrically separated from is set between two neighboring self-capacitance electrode, and the column that is dielectrically separated from is for described adjacent
Two self-capacitance electrodes insulate.
In some embodiments of the present application, the column that is dielectrically separated from includes the first sub- insulated column and second being stacked
Sub- insulated column；The first sub- insulated column is ladder close to the TFT backplate, the shape of the first sub- insulated column vertical cross-section
Shape；The second sub- insulated column is inverted trapezoidal far from the TFT backplate, the shape of the second sub- insulated column vertical cross-section；Institute
It is vertical with the TFT backplate to state vertical interface.
In some embodiments of the present application, the TFT backplate includes underlay substrate, the drive on the underlay substrate
The pixel defining layer of dynamic circuit structure and the covering driving circuit structure；The touch-control cabling is located at the pixel defining layer
Away from a side surface of the underlay substrate.
In some embodiments of the present application, the display panel includes being dielectrically separated from column；It is described be dielectrically separated from column and
The touch-control cabling deviates from a side surface of the underlay substrate positioned at the pixel defining layer.
In some embodiments of the present application, the display panel further includes being located at the organic function layer close to the lining
The second electrode of substrate side；The pixel defining layer includes the pixel separator and separated by the pixel that transverse and longitudinal is intersected
Object encloses the opening set；The second electrode is located in the opening；The organic function layer includes organic luminous layer, described organic
Luminescent layer is located in the opening.
The another aspect of the embodiment of the present application provides the production method of a kind of pair of any one of the above display panel, described
Method includes the method for making TFT backplate；The method also includes: touch-control cabling is made in the TFT backplate；Have in production
Organic function layer is formed in the TFT backplate of the touch-control cabling；Form one layer of organic film in the organic function layer
The method of layer includes: that organic material is deposited in the TFT backplate that production has the touch-control cabling using the first mask plate；
Using the second mask plate, in the TFT backplate for being vapor-deposited with the organic material, the organic material is deposited again；Wherein,
After first mask plate and second mask plate superposition, the first occlusion part of first mask plate and second exposure mask
Second occlusion part of version has overlay region；Organic material is not deposited for position corresponding with the overlay region in the TFT backplate
Material forms and forms via hole on the organic function layer；The via hole exposes a part of the touch-control cabling；Have in production
In the TFT backplate of the organic function layer and the touch-control cabling, the self-capacitance electrode of multiple mutually insulateds is formed, each
The self-capacitance electrode is in contact with the touch-control cabling that a via hole exposes.
The another aspect of the embodiment of the present application provides covering of using in a kind of production method of display panel as described above
Film version component, the mask plate component include the first mask plate and the second mask plate；First mask plate has multiple first
Occlusion part and the first through portion, first occlusion part are arranged alternately with first through portion；First occlusion part includes
The sub- occlusion part of main occlusion part and multiple protrusions on the main occlusion part；Second mask plate has multiple second to hide
Stopper and the second through portion, second occlusion part are arranged alternately with second through portion；First mask plate and described
After the superposition of second mask plate, the main occlusion part in first occlusion part is corresponding with the position of second through portion；It is described
Sub- occlusion part and second occlusion part in first occlusion part have overlay region.
The another aspect of the embodiment of the present application provides a kind of display device, including any one display surface as described above
Plate.
In conclusion in display panel provided by the embodiments of the present application, realize a self-capacitance electrode of touch function with
The touch-control cabling that a via hole on organic function layer exposes is in contact, therefore touch-control cabling can be located under self-capacitance electrode
Side is located at self-capacitance electrode close to the side of underlay substrate, so that touch-control cabling and the electricity certainly being electrically connected with the touch-control cabling
Hold the different layer setting of electrode.So, when can be arranged to avoid touch-control cabling and self-capacitance electrode same layer, touch-control cabling occupy compared with
Big display space leads to the problem of touch-control blind area occur.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 provides a kind of structural schematic diagram of display panel for some embodiments of the present application；
Fig. 2 provides the structural schematic diagram of another display panel for some embodiments of the present application；
Fig. 3 is the concrete structure schematic diagram of pixel defining layer in Fig. 2；
Fig. 4 is the structural schematic diagram of organic function layer in Fig. 2；
Fig. 5 is a kind of structural schematic diagram for touch control electrode that some embodiments of the present application provide；
Fig. 6 is the connection schematic diagram of a kind of touch control electrode that some embodiments of the present application provide and touch-control lead；
Fig. 7 is the connection schematic diagram of another touch control electrode that some embodiments of the present application provide and touch-control lead；
Fig. 8 provides the structural schematic diagram of another display panel for some embodiments of the present application；
Fig. 9 is a kind of structural schematic diagram for being dielectrically separated from column that some embodiments of the present application provide；
Figure 10 is a kind of structural schematic diagram for display panel that some embodiments of the present application provide；
Figure 11 is a kind of structural schematic diagram for display panel that some embodiments of the present application provide；
Figure 12 is a kind of production method flow chart of display panel provided by the embodiments of the present application；
Figure 13 a, Figure 13 b, Figure 13 c and Figure 13 d are the corresponding structural schematic diagram of part steps in production method in Figure 12；
Figure 14 a is a kind of structural schematic diagram for mask plate that some embodiments of the present application provide；
Figure 14 b is a kind of structural schematic diagram for mask plate that some embodiments of the present application provide；
Figure 14 c is the schematic diagram of the overlay region formed after mask plate shown in Figure 14 a and Figure 14 b is superimposed；
Figure 14 d is that mask plate shown in Figure 14 a and Figure 14 b is superimposed schematic diagram；
Figure 15 provides the structural schematic diagram of another display panel for some embodiments of the present application.
Appended drawing reference:
01- display panel；10-TFT backboard；100- underlay substrate；101- driving circuit structure；102- pixel defining layer；
1021- opening；1022- pixel separator；110- first electrode layer；111- second electrode first electrode layer；20- touch-control cabling；
30- organic function layer；301- hole injection layer；302- hole transmission layer；303- organic luminous layer；304- electron transfer layer；
310- via hole；40- self-capacitance electrode；50- insulating layer；60- is dielectrically separated from column；The sub- insulated column of 601- first；Of 602- second every
From column；The first mask plate of 70-；The first occlusion part of 701-；The main occlusion part of 7011-；The sub- occlusion part of 7012-；The first through portion of 702-；
The second mask plate of 71-；The second occlusion part of 711-；The second through portion of 712-；The overlay region 72-；80- encapsulation part；801- inorganic thin film
Layer；802- organic thin film layer.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Some embodiments of the present application disclose a kind of display panel 01, as shown in Figure 1, the display panel 01 is carried on the back including TFT
Plate 10 and touch-control cabling 20 and organic function layer 30 in above-mentioned TFT backplate 10.
As shown in Fig. 2, above-mentioned TFT backplate 10 includes underlay substrate 100, the driving circuit knot on underlay substrate 100
Structure 101.The driving circuit structure 101 includes the TFT driving circuit of array arrangement and the pixel for covering driving circuit structure 101
Define layer 102.
Display panel has the sub-pix of multiple array arrangements, and an above-mentioned TFT driving electricity is provided in each sub-pix
Road.The TFT driving circuit includes multiple TFT and capacitor.Each TFT driving circuit is connected with a luminescent device, to constitute
Pixel circuit.Above-mentioned luminescent device can be OLED, LED or miniature LED.Below for convenience of explanation, above-mentioned luminescent device
It is the explanation carried out by taking OLED as an example.
The OLED includes first electrode, and the first electrode of multiple OLED is connected to form first electrode layer as shown in Figure 2
110.In addition, OLED further includes the second electrode 111 being oppositely arranged with first electrode layer 110.
It should be noted that above-mentioned first electrode can be anode, second electrode 111 can be cathode；Or first electricity
Extremely cathode, second electrode 111 are anode.It for convenience of explanation, is the second electrode 111 using first electrode as cathode below
For the explanation carried out for anode.
Based on this, as shown in figure 3, above-mentioned pixel defining layer 102 include transverse and longitudinal intersect pixel separator 1022 and by
Pixel separator 1022 encloses the opening 1021 set.In the case, above-mentioned second electrode 111 is located in pixel defining layer 102
Opening 1021 in, and at least one thin film transistor (TFT) (Thin in driving circuit structure 101 in a TFT driving circuit
Film Transistor, TFT) source electrode or drain electrode electrical connection.
In addition, above-mentioned organic function layer 30 is set between first electrode layer 110 and second electrode 111.The organic functions
Layer 30 is as shown in Figure 4, comprising: hole injection layer 301, hole transmission layer 302, organic luminous layer 303 and electron transfer layer 304
Deng.Wherein, hole injection layer 301, hole transmission layer 302 and electron transfer layer 304 can cover all sub-pixes, and
The different sub-pix of luminescent color has different organic luminous layers 303, i.e., as shown in Fig. 2, the organic light emission of different sub-pixes
Layer 303 is located in different openings 1021.
In addition, as shown in Fig. 2, above-mentioned touch-control cabling 20 is located at the pixel separator 1022 of pixel defining layer 102 away from lining
One side surface of substrate 100.
On this basis, as shown in Figure 1, above-mentioned organic function layer 30 has multiple via holes 310, each via hole exposes touch-control
A part of cabling 20.
In addition, display panel 01 further includes the first electrode layer 110 for covering the organic function layer 30.As shown in figure 5, this
One electrode layer 110 includes the self-capacitance electrode 40 of multiple mutually insulateds.As shown in Figure 1, each self-capacitance electrode 40 and a mistake
The touch-control cabling 20 that hole 310 is exposed is in contact.
It should be noted that the size of said one self-capacitance electrode 40 is millimeter magnitude.
In conclusion realizing a self-capacitance electrode of touch function in display panel 01 provided by the embodiments of the present application
The 40 touch-control cablings 20 exposed with a via hole 310 on organic function layer 30 are in contact, therefore as shown in fig. 6, touch-control cabling
20 can be located at the lower section of self-capacitance electrode 40, that is, be located at self-capacitance electrode 40 close to the side of underlay substrate 100, so that touch-control
Cabling 20 and the different layer of self-capacitance electrode 40 being electrically connected with the touch-control cabling 20 setting.It so, can be to avoid touch-control cabling
20 with 40 same layer of self-capacitance electrode setting (as shown in Figure 7) when, touch-control cabling 20 occupies biggish display space, causes to touch
The problem of controlling blind area.
It can be seen from the above, first electrode layer 110 includes the self-capacitance electrode 40 of multiple mutually insulateds.The first electrode layer
110 cathodes that can be used as OLED use, and self-capacitance electrode 40 can be used as touch control electrode use.In the case, it shows
Show that panel 01 in the display stage, can provide identical voltage to above-mentioned multiple self-capacitance electrodes 40, using the cathode as OLED
It uses, driving OLED shines.In the touch-control stage, multiple self-capacitance electrodes 40 are multiplexed with touch control electrode, touch display surface in user
When plate 01, the capacitance in self-capacitance that self-capacitance electrode 40 is constituted with ground terminal changes, and above-mentioned capacitance is as touch-control
Signal is transmitted to processor by the touch-control cabling 20 being connected with the self-capacitance electrode 40.
It should be noted that above-mentioned display stage and touch-control stage are two independent stages, it does not interfere with each other.For example, can
A picture frame as a display stage, is inserted into a touch-control stage between two adjacent images frame.So, this Shen
Please the display panel 01 that provides of embodiment pass through the first electrode layer 11 as cathode be multiplexed with touch control electrode, without
Touch sensing (Touch Sensor) is additionally made in display panel, and then can achieve the purpose that simplified manufacture craft.
In addition, directly contacted to improve touch-control cabling 20 in the exposed part of above-mentioned via hole 310 with organic function layer 30,
And side leakage electricity occurs, in some embodiments of the present application, as shown in figure 8, the hole wall of above-mentioned via hole 310 and touch-control cabling 20 it
Between have insulating layer 50.
In some embodiments of the present application, in order to form the self-capacitance electrode 40, Ke Yi of above-mentioned multiple mutually insulateds
Using Open Mask vapor deposition first electrode layer 110 material when, using it is as shown in Figure 9 it is multiple be dielectrically separated from column 60, to first
Electrode layer 110 is split.Adjacent multiple frame like structure for being dielectrically separated from one closure of the besieged city of column 60.It is limited in the frame like structure
The size of self-capacitance electrode 40 after cutting out.
In the case where display panel 01 has pixel defining layer 102, the above-mentioned column 60 that is dielectrically separated from is located at pixel defining layer
Pixel separator 1022 deviates from a side surface of underlay substrate 100 in 102.
In the case, above-mentioned to be dielectrically separated from column 60 as shown in Figure 10, it is set between two neighboring self-capacitance electrode 40,
This is dielectrically separated from column 60 and is constituted using insulating materials, for insulating to above-mentioned two adjacent self-capacitance electrodes 40.
In some embodiments of the present application, as described in Figure 10, the above-mentioned shape for being dielectrically separated from 60 vertical cross-section of column can be with
For inverted trapezoidal.In the case, when using the material of Open Mask vapor deposition first electrode layer 110, the film layer of formation can not
Adhere in the boundary position for the upper surface and side for being dielectrically separated from column 60, it is multiple so as to which first electrode layer 110 to be divided into
The self-capacitance electrode 40 of insulation.
Above-mentioned vertical cross-section is vertical with TFT backplate 10.
In other embodiments of the application, as shown in figure 11, the above-mentioned column 60 that is dielectrically separated from includes the be stacked
One sub- insulated column 601 and the second sub- insulated column 602.
First sub- insulated column 601 is trapezoidal close to TFT backplate 10, the shape of first sub- 601 vertical cross-section of insulated column.
Second sub- insulated column 602 is inverted trapezoidal far from TFT backplate 10, the shape of the second sub- 602 vertical cross-section of insulated column.
In the case, on the one hand, for the material for constituting the second sub- insulated column 602, constitute above-mentioned first son
The material of insulated column 601 can choose the better material of insulating properties.So, the effect of the first sub- insulated column 601 is main
For two neighboring self-capacitance electrode 40 to be insulated.
On the other hand, the vertical cross-section of the second sub- insulated column 602 uses inverted trapezoidal, so, when using Open Mask
When the material of first electrode layer 110 is deposited, the film layer of formation can not be in the friendship of the upper surface and side of the second sub- insulated column 602
Boundary position attachment, so as to which first electrode layer 110 to be divided into the self-capacitance electrode 40 of multiple insulation.
Some embodiments of the present application provide a kind of production method to any one display panel as described above.
The above method, as shown in figure 12, comprising:
S101, it makes as depicted in fig. 13 a, TFT backplate 10.
Above-mentioned S101 may include: that the TFT of array arrangement is made by patterning processes firstly, on a underlay substrate 100
Driving circuit.Multiple above-mentioned TFT driving circuits constitute driving circuit structure 101.
Wherein, the application to the material of above-mentioned underlay substrate 100 without limitation, can be transparent glass substrate, Huo Zhe
When above-mentioned display panel is flexible display panels, above-mentioned underlay substrate 100 can be constituted using transparent resin material, for example, poly-
Acid imide (PI).
Next, production covering is driven using patterning processes on the underlay substrate 100 for being formed with driving circuit structure 101
The pixel defining layer 102 of dynamic circuit structure 101.The pixel defining layer 102 has pixel separator 1022 as shown in Figure 3 and opens
Mouth 1021.
It should be noted that above-mentioned patterning processes can be InkJet printing processes, photoetching process in the embodiment of the present application
Deng.The photoetching process includes: exposure mask, exposure, etching etc..
S102, the second electrode 111. of production as illustrated in fig. 13b
Illustratively, above-mentioned second electrode is formed in the opening 1021 of above-mentioned pixel defining layer 102 using patterning processes
111。
S103, it is made in above-mentioned TFT backplate 10, touch-control cabling 20 as shown in figure 13 c.
Specifically, deviating from a side surface of underlay substrate 100 in 102 pixel separator 1022 of pixel defining layer, by upper
It states patterning processes and forms above-mentioned touch-control cabling 20.
In addition, in order to improve touch-control cabling 20 in the exposed part of the via hole 310 of above-mentioned organic function layer 30 and organic function
Ergosphere 30 directly contacts, and side leakage electricity occurs, and one layer of insulation can also be formed in the TFT backplate 10 for be formed with touch-control cabling 20
Then material layer will cover insulating materials of the touch-control cabling 20 on 100 1 side surface of underlay substrate and remove, is located at being formed
The insulating layer 50 of 20 side of touch-control cabling, avoids touch-control cabling 20 from directly contacting with the hole wall of via hole 310.
S104, made in above-mentioned TFT backplate 10, as shown in figure 13 c be dielectrically separated from column 60.
Make the inorganic material that the above-mentioned material for being dielectrically separated from column 60 may include insulation, such as silicon nitride, silicon carbide, oxygen
At least one of SiClx；Or at least one of organic polymer material, such as polyimides, polytetrafluoroethylene (PTFE), alternatively,
Photoresist.
Be dielectrically separated from column 60 when above-mentioned, as shown in figure 11, the first sub- insulated column 601 and the second son including being stacked every
When from column 602, the above-mentioned production method for being dielectrically separated from column 60 can be with are as follows:
Firstly, the spin coating first layer Photosensitive organic insulating material in TFT backplate 10, for example, Photosensitive PI.Film thickness is
0.5~5um.To the film layer front baking post-exposure, strip or netted structure are formed.The first sub- insulated column 601 is formed after development, it should
The line width of first sub- insulated column 601 is 10um~50um, is dried after then carrying out.
Next, re-forming in the TFT backplate of above structure, the photosensitive insulating organic material of the spin coating second layer, film thickness is
0.5um~5um.To the film layer front baking post-exposure, strip or netted structure are formed, forms the second sub- insulated column 602 after development,
The width of the second sub- insulated column 602 is 5um~45um.In order to enable the orthogonal cross-sectional shape of the second sub- insulated column 602 is to fall
Trapezoidal, the material for constituting the second sub- insulated column 602 can be negative photoresist.
S105, it is formed in the TFT backplate 10 that production has touch-control cabling 20, forms organic function layer as shown in figure 13d
30。
Wherein, need to be arranged multiple via holes 310 on above-mentioned organic function layer 30, so that self-capacitance electrode 40 can pass through
Via hole 310 is in contact with the touch-control cabling 20 that the via hole 310 leaks out.
In some embodiments of the present application, it can use photoetching process on the organic function layer 30 made at above-mentioned
Via hole 310.However, the material for constituting organic function layer 30 is easy to cause steam or oxygen to enter display panel intolerant to water oxygen
Inside influences the quality of display panel.
To solve the above-mentioned problems, in some embodiments of the present application, one layer in above-mentioned organic function layer 30 is formed
The method of organic thin film layer includes:
Firstly, being steamed in the TFT backplate 10 that production has touch-control cabling 20 using the first mask plate 70 as shown in figures 14a
Plate organic material.
Next, using the second mask plate 71 as shown in fig. 14b, in the TFT backplate 10 for being vapor-deposited with organic material, then
Secondary vapor deposition organic material.
Wherein, after the first mask plate 70 and the second mask plate 71 are superimposed, 701 He of the first occlusion part of first mask plate 70
Second occlusion part 711 of the second mask plate has overlay region 72 as shown in figure 14 c.
In the case, above-mentioned organic material is not deposited for position corresponding with overlay region 72 in above-mentioned TFT backplate 10, thus
It is formed to be located on organic function layer 30 and forms via hole 310, a part of touch-control cabling 20 is exposed by above-mentioned via hole 310.
Based on this, in order to make above-mentioned organic function layer 30, some embodiments of the application provide a kind of mask plate component.It should
Mask plate component includes the first mask plate 70 as shown in figures 14a and the second mask plate 71 as shown in fig. 14b.
As shown in figures 14a, above-mentioned first mask plate 70 has multiple first occlusion parts 701 and the first through portion 702.First
Occlusion part 701 is arranged alternately with the first through portion 702.In addition, above-mentioned first occlusion part 701 includes main occlusion part 7011 and is located at
The sub- occlusion part 7012 of multiple protrusions on main occlusion part 7011.
As shown in fig. 14b, the second mask plate 71 has multiple second occlusion parts 711 and the second through portion 712.Second screening
Stopper 711 is arranged alternately with the second through portion 712.
In the case, after the first mask plate 70 and the superposition of the second mask plate 71, in the first occlusion part of Figure 14 d 70
Main occlusion part 7011 is corresponding with the position of the second through portion 712.Sub- occlusion part 7012 and second in first occlusion part 70 hide
Stopper 711 has overlay region 72 as shown in figure 14 c.
In addition, above-mentioned production method further include:
S106, production have organic function layer 30 and touch-control cabling 20 TFT backplate 10 on, formed it is multiple as shown in figure 15
Mutually insulated self-capacitance electrode 40, each self-capacitance electrode 40 is in contact with the touch-control cabling 20 that a via hole 310 exposes.
Specifically, being steamed in the TFT backplate 10 that production has organic function layer 30 and touch-control cabling 20 using Open Mask
When plating the material of first electrode layer 110, the film layer of formation can not be in the boundary position for the upper surface and side for being dielectrically separated from column 60
Attachment is set, so as to which first electrode layer 110 to be divided into the self-capacitance electrode 40 of multiple insulation.The above method is certainly electric in preparation
Hold during electrode 40 without using metal mask version, by be dielectrically separated from column 60 as barrier to first electrode layer 110 into
Row segmentation.
S107, production encapsulation part 80 as shown in figure 15.
Above-mentioned encapsulation part 80 can use thin-film package (Thin-Film Encapsulation, TFE) technology, in this feelings
Under condition, above-mentioned encapsulation part 80 includes two layers of inorganic thin film layer 801, and having between above-mentioned two layers of inorganic thin film layer 801
Machine film layer 802 is constituted.
Above-mentioned inorganic thin film layer 801 can be constituted using silicon nitride (SiNx).Organic thin film layer can use inkjet printing
((Ink Jet Printing, IJP) technology preparation.
The production method of above-mentioned display panel has technical effect identical with the display panel that previous embodiment provides,
Details are not described herein again.
Some embodiments of the present application provide a kind of display device, the display device include it is as described above any one
Display panel.
It should be noted that above-mentioned display device can have display function for display, TV, mobile phone, tablet computer etc.
Any one device of energy.The display panel has the identical technical effect of display panel provided such as previous embodiment, herein
It repeats no more.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (10)
1. a kind of display panel, which is characterized in that touch-control cabling including TFT backplate and in the TFT backplate and have
Machine functional layer；
The organic function layer has multiple via holes, and each via hole exposes a part of the touch-control cabling；
The display panel further includes the first electrode layer for covering the organic function layer；The first electrode layer includes multiple phases
The self-capacitance electrode mutually to insulate；Each self-capacitance electrode is in contact with the touch-control cabling that a via hole exposes.
2. display panel according to claim 1, which is characterized in that between the hole wall of the via hole and the touch-control cabling
With insulating layer.
3. display panel according to claim 1, which is characterized in that the display panel further includes being located at the TFT to carry on the back
Column is dielectrically separated from plate；
The column that is dielectrically separated from is set between two neighboring self-capacitance electrode, and the column that is dielectrically separated from is for described adjacent
Two self-capacitance electrodes insulate.
4. display panel according to claim 3, which is characterized in that the column that is dielectrically separated from includes first be stacked
Sub- insulated column and the second sub- insulated column；
The first sub- insulated column is trapezoidal close to the TFT backplate, the shape of the first sub- insulated column vertical cross-section；
The second sub- insulated column is inverted trapezoidal far from the TFT backplate, the shape of the second sub- insulated column vertical cross-section；
The vertical interface is vertical with the TFT backplate.
5. display panel according to claim 1-4, which is characterized in that
The TFT backplate includes underlay substrate, the driving circuit structure on the underlay substrate and the covering driving
The pixel defining layer of circuit structure；
The touch-control cabling is located at the side surface that the pixel defining layer deviates from the underlay substrate.
6. display panel according to claim 5, which is characterized in that the display panel includes being dielectrically separated from column；
It is described to be dielectrically separated from column and the touch-control cabling, the side table of the underlay substrate is deviated from positioned at the pixel defining layer
Face.
7. display panel according to claim 5, which is characterized in that the display panel further includes being located at organic function
Second electrode of the ergosphere close to the underlay substrate side；
The pixel defining layer includes the pixel separator and enclose the opening set by the pixel separator that transverse and longitudinal is intersected；It is described
Second electrode is located in the opening；
The organic function layer includes organic luminous layer, and the organic luminous layer is located in the opening.
8. a kind of production method to such as described in any item display panels of claim 1-7, which is characterized in that the method packet
The method for including production TFT backplate；The method also includes:
Touch-control cabling is made in the TFT backplate；
Organic function layer is formed in the TFT backplate that production has the touch-control cabling；It is formed in the organic function layer
The method of one layer of organic thin film layer includes:
Using the first mask plate, organic material is deposited in the TFT backplate that production has the touch-control cabling；
Using the second mask plate, in the TFT backplate for being vapor-deposited with the organic material, the organic material is deposited again；
Wherein, after first mask plate and second mask plate are superimposed, the first occlusion part of first mask plate and institute
The second occlusion part for stating the second mask plate has overlay region；Position corresponding with the overlay region is not deposited in the TFT backplate
The organic material forms and forms via hole on the organic function layer；The via hole exposes one of the touch-control cabling
Point；
In the TFT backplate that production has the organic function layer and the touch-control cabling, oneself of multiple mutually insulateds is formed
Capacitance electrode, each self-capacitance electrode are in contact with the touch-control cabling that a via hole exposes.
9. the mask plate component used in a kind of production method of display panel as claimed in claim 8, which is characterized in that institute
Stating mask plate component includes the first mask plate and the second mask plate；
First mask plate has multiple first occlusion parts and the first through portion, and first occlusion part and described first penetrate
Portion is arranged alternately；First occlusion part includes that the son of main occlusion part and multiple protrusions on the main occlusion part blocks
Portion；
Second mask plate has multiple second occlusion parts and the second through portion, and second occlusion part and described second penetrate
Portion is arranged alternately；
After first mask plate and second mask plate superposition, the main occlusion part and described second in first occlusion part
The position of through portion is corresponding；Sub- occlusion part and second occlusion part in first occlusion part have overlay region.
10. a kind of display device, which is characterized in that including such as described in any item display panels of claim 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810835903.XA CN109037285B (en) | 2018-07-26 | 2018-07-26 | Display panel and manufacturing method thereof, display device and mask assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810835903.XA CN109037285B (en) | 2018-07-26 | 2018-07-26 | Display panel and manufacturing method thereof, display device and mask assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109037285A true CN109037285A (en) | 2018-12-18 |
| CN109037285B CN109037285B (en) | 2020-11-27 |
Family
ID=64646660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810835903.XA Expired - Fee Related CN109037285B (en) | 2018-07-26 | 2018-07-26 | Display panel and manufacturing method thereof, display device and mask assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109037285B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109947292A (en) * | 2019-03-14 | 2019-06-28 | 合肥鑫晟光电科技有限公司 | A kind of preparation method of narrow-frame touch panel, narrow-frame touch panel and display device |
| CN111653212A (en) * | 2020-06-10 | 2020-09-11 | 武汉华星光电技术有限公司 | Micro light-emitting diode display panel, manufacturing method thereof and display device |
| CN113741717A (en) * | 2020-05-29 | 2021-12-03 | 华为技术有限公司 | Touch control assembly and terminal equipment |
| CN114594879A (en) * | 2022-03-16 | 2022-06-07 | 合肥维信诺科技有限公司 | Touch display panel, preparation method thereof and display device |
| JP7416940B2 (en) | 2019-11-29 | 2024-01-17 | 華為技術有限公司 | Display panels, flexible displays, electronic devices and display panel manufacturing methods |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205645814U (en) * | 2016-03-15 | 2016-10-12 | 上海天马微电子有限公司 | Organic luminous display panel |
| CN106406590A (en) * | 2015-07-31 | 2017-02-15 | 昆山国显光电有限公司 | Touch control display apparatus and preparation method thereof |
| CN107123621A (en) * | 2017-05-10 | 2017-09-01 | 京东方科技集团股份有限公司 | A kind of OLED touch-control display panels and preparation method thereof, touch control display apparatus |
| CN107704129A (en) * | 2017-09-27 | 2018-02-16 | 京东方科技集团股份有限公司 | OLED touch display substrates, preparation method, display panel and display device |
-
2018
- 2018-07-26 CN CN201810835903.XA patent/CN109037285B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106406590A (en) * | 2015-07-31 | 2017-02-15 | 昆山国显光电有限公司 | Touch control display apparatus and preparation method thereof |
| CN205645814U (en) * | 2016-03-15 | 2016-10-12 | 上海天马微电子有限公司 | Organic luminous display panel |
| CN107123621A (en) * | 2017-05-10 | 2017-09-01 | 京东方科技集团股份有限公司 | A kind of OLED touch-control display panels and preparation method thereof, touch control display apparatus |
| CN107704129A (en) * | 2017-09-27 | 2018-02-16 | 京东方科技集团股份有限公司 | OLED touch display substrates, preparation method, display panel and display device |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109947292A (en) * | 2019-03-14 | 2019-06-28 | 合肥鑫晟光电科技有限公司 | A kind of preparation method of narrow-frame touch panel, narrow-frame touch panel and display device |
| JP7416940B2 (en) | 2019-11-29 | 2024-01-17 | 華為技術有限公司 | Display panels, flexible displays, electronic devices and display panel manufacturing methods |
| CN113741717A (en) * | 2020-05-29 | 2021-12-03 | 华为技术有限公司 | Touch control assembly and terminal equipment |
| CN111653212A (en) * | 2020-06-10 | 2020-09-11 | 武汉华星光电技术有限公司 | Micro light-emitting diode display panel, manufacturing method thereof and display device |
| CN111653212B (en) * | 2020-06-10 | 2021-09-24 | 武汉华星光电技术有限公司 | Micro light-emitting diode display panel, manufacturing method thereof and display device |
| CN114594879A (en) * | 2022-03-16 | 2022-06-07 | 合肥维信诺科技有限公司 | Touch display panel, preparation method thereof and display device |
| CN114594879B (en) * | 2022-03-16 | 2024-01-16 | 合肥维信诺科技有限公司 | Touch display panel, manufacturing method thereof and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109037285B (en) | 2020-11-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109037285A (en) | Display panel and preparation method thereof, display device, mask plate component | |
| KR101574390B1 (en) | Organic light emitting diode, touch display device and method for fabricating the same | |
| CN106783933B (en) | A kind of display panel, device and production method | |
| CN103489894B (en) | Active matrix organic electroluminescent display device, display device and preparation method thereof | |
| CN109599429A (en) | Display panel and its manufacturing method | |
| CN106775039B (en) | Embedded touch screen, manufacturing method thereof and display device | |
| CN107526468B (en) | Display screen and preparation method thereof | |
| CN105742330A (en) | Organic light emitting display panel, fabrication method thereof and display device | |
| US20200111844A1 (en) | Display panel, method for fabricating the same, and display device | |
| WO2013104220A1 (en) | Circuit, array substrate and manufacturing method, and display | |
| JP2017504918A (en) | Touch display device and manufacturing method thereof | |
| CN108376686A (en) | Array substrate and its manufacturing method, display device | |
| CN107340928A (en) | Touch-control display panel and its manufacture method, touch control display apparatus | |
| CN107452808A (en) | Thin film transistor (TFT) and preparation method thereof, array base palte and display device | |
| CN108695370A (en) | Oled substrate and production method, display device | |
| CN104681629A (en) | Thin film transistor, array substrate, manufacturing methods for thin film transistor and array substrate, and display device | |
| CN111596796B (en) | Three-dimensional touch module, driving method thereof and display device | |
| JP7053858B2 (en) | Display panel, display and display terminal | |
| CN107634087A (en) | A kind of display panel and display device | |
| CN107978691B (en) | Organic light-emitting display panel, display device and manufacturing method of display panel | |
| CN103794633B (en) | A kind of array base palte and preparation method thereof, display device | |
| CN109671722B (en) | Organic light emitting diode array substrate and manufacturing method thereof | |
| CN106933431A (en) | Organic Light Emitting Diode touch display substrate and touch control display apparatus | |
| CN109904199A (en) | Touch-control display panel and preparation method thereof, display device | |
| CN109119451A (en) | Display base plate and its manufacturing method, display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201127 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |