JP2006184011A - Surface acoustic wave sensor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To facilitate contact of a solution with a receptor. <P>SOLUTION: The surface acoustic wave sensor 10 comprises an exciting IDT 14 composed of a screen-like electrode generating a surface acoustic wave in a piezoelectric substrate 12, which is provided on the surface of the piezoelectric substrate 12. A receiving IDT 16 composed of a screen-like electrode receiving the surface acoustic wave excited by the exciting IDT 14 is also provided on the surface of the substrate 12. The receptor 22 is provided in an exposed state between the IDT 14 and the IDT 16 that corresponds to the propagating area of surface acoustic wave. The IDT 14 and the IDT 16 are covered with an electrode sealing member 24. The sealing member 24 forms a closed space in the circumference of the screen-like electrodes. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a surface acoustic wave sensor using a surface acoustic wave element, and more particularly to a surface acoustic wave sensor suitable for detecting characteristics of a liquid and a substance contained in the liquid.

A surface acoustic wave (SAW) element can be a highly sensitive sensor because a high resonance frequency can be obtained. Above all, a surface acoustic wave sensor using SH (Shear Horizontal) wave, which is a type of surface acoustic wave, can detect physical properties such as viscosity and density of liquid and substances contained in liquid. Development is underway. As described in Non-Patent Document 1, this liquid-phase surface acoustic wave sensor uses a 36 ° rotation Y plate X propagation LiTaO ₃ , an ST cut 90 ° propagation quartz plate, or the like.

And in patent document 1, while providing the receptor between the transmitting electrode formed in the interdigital shape and the receiving electrode formed in the interdigital shape, the pool wall which the upper part opened around the receiver was provided. A solution sensor is described. This solution sensor can prevent the disadvantage that the sample solution flows to the electrode side and the electrode is short-circuited by dropping the sample solution into the pool wall.
Japan Society for the Promotion of Science Elastic Wave Device Technology 150th Committee, edited by “Acoustic Wave Device Technology”, pages 405-412, Ohm Co., Ltd. (2004) Japanese Patent Laid-Open No. 9-80035

  However, surface acoustic wave sensors are required to be highly miniaturized and highly sensitive. The sensitivity of the surface acoustic wave sensor depends on the frequency of the surface acoustic wave generated in the piezoelectric substrate. In order to improve the sensitivity, it is necessary to increase the frequency of the surface acoustic wave to be excited (resonance frequency). The resonance frequency of a surface acoustic wave sensor including a surface acoustic wave element depends on the interelectrode pitch of interdigital electrodes constituting an IDT (Interdigital Transducer). In order to increase the resonance frequency, the pitch between the electrodes must be reduced, and the interdigital electrode must be finely processed. Accordingly, in the surface acoustic wave sensor, the area of the receptor must be reduced due to the demand for miniaturization and the miniaturization of the electrodes. For this reason, in the solution sensor described in Patent Document 1, since the periphery of the receptor is surrounded by a pool wall, it is difficult to drop the sample solution on the receptor, and much labor and time are required for measurement. And measurement failures are likely to occur.

  Moreover, since the interdigital electrode remains exposed, the solution sensor described in Patent Document 1 cannot be used in the solution because the interdigital electrode is short-circuited through the solution when immersed in the solution. For this reason, when a large number of substances contained in a solution are detected simultaneously, it is necessary to drop the solution onto each of the receptors of the large number of solution sensors, which requires a lot of time and labor for the measurement.

The present invention has been made to eliminate the drawbacks of the prior art described above, and it is an object of the present invention to allow a solution to be easily brought into contact with a receptor.
Another object of the present invention is to enable use in a state immersed in a solution.

  In order to achieve the above object, a surface acoustic wave sensor according to the present invention is provided on a surface of a piezoelectric substrate, and is generated by an interdigital electrode that generates surface acoustic waves on the piezoelectric substrate, and the interdigital electrode. A receptor provided exposed in the propagation region of the surface acoustic wave; and an electrode sealing member provided so as to cover the interdigital electrode and forming a sealed space around the interdigital electrode. It is said.

  In the present invention as described above, since no wall is provided around the receptor, the sample solution can be easily prepared even if the surface acoustic wave sensor is reduced in size and sensitivity and the receptor is made smaller. Can be contacted. Further, in the present invention, since the interdigital electrode is sealed by the electrode sealing member, the interdigital electrode is not short-circuited by the solution even if the surface acoustic wave sensor is immersed in the solution. Therefore, by immersing and using many surface acoustic wave sensors according to the present invention in a solution, a large number of substances contained in the solution can be easily detected, and the measurement labor can be greatly reduced. Measurement time can be greatly shortened.

  The width of the joint portion of the electrode sealing member to the piezoelectric substrate in the surface acoustic wave propagation region is preferably an integral multiple of λ / 4 where λ is the surface acoustic wave wavelength. If it does in this way, unnecessary reflection of the surface acoustic wave in the joined part of an electrode sealing member can be avoided. Further, the distance between the joint of the electrode sealing member to the piezoelectric substrate in the surface acoustic wave propagation region and the interdigital electrode is an integral multiple of λ / 4 where λ is the wavelength of the surface acoustic wave. Good. Similarly to the above, unnecessary reflection of the surface acoustic wave at the joint portion of the electrode sealing member can be avoided.

  As a bonding material for bonding the electrode sealing member to the piezoelectric substrate, it is desirable to use an insulating material. Even when the joint portion of the electrode sealing member intersects the wiring portion for feeding the interdigital electrode, it is possible to prevent a short circuit between the wiring portions. Further, the electrode sealing member can be formed in a flat plate shape, and the bonding material for bonding the electrode sealing member to the piezoelectric substrate can have a height for separating the electrode sealing member and the interdigital electrode. It is not necessary to form a recess or the like for forming a gap between the electrode sealing member and the interdigital electrode, and the electrode sealing member can be easily processed.

  The electrode sealing member can be formed of an insulator having an electrode portion on the upper surface, and the interdigital electrode can be electrically connected to the electrode portion through a through hole formed in the electrode sealing member. If it does in this way, it can avoid that the junction part of an electrode sealing member cross | intersects a wiring part etc., A metal can be used for a joining material and attenuation | damping of a surface acoustic wave can be made small. The interdigital electrode has a wiring part drawn out from the sealed space, and the position corresponding to the joint part of the electrode sealing member of the wiring part can be insulated. If it does in this way, a metal can be used for a joining material and attenuation of a surface acoustic wave can be made small.

A preferred embodiment of a surface acoustic wave sensor according to the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is an explanatory diagram of a surface acoustic wave sensor according to the first embodiment. In FIG. 1, the surface acoustic wave sensor 10 includes an excitation IDT 14 and a reception IDT 16 on the surface of a piezoelectric substrate 12. In the case of the embodiment, the piezoelectric substrate 12 is a 36 ° rotation Y plate X propagation LiTaO ₃ or an ST cut 90 ° propagation quartz plate, and can excite SH waves, which are surface acoustic waves. The excitation IDT 14 and the reception IDT 16 each include a pair of comb electrodes 18 (18a, 18b) and 20 (20a, 20b). Each of the comb-shaped electrodes 18 and 20 that form a pair has an interdigital shape in which the electrode fingers are arranged alternately and in parallel at equal intervals. In the embodiment, the comb electrodes 18 and 20 are formed of a thin film of aluminum or an aluminum alloy.

  The excitation IDT 14 is disposed on one side of the piezoelectric substrate 12 so that a voltage having a predetermined frequency is applied between the pair of comb-shaped electrodes 18 to excite the piezoelectric substrate 12 and generate an SH wave. The reception IDT 16 is disposed on the other side of the piezoelectric substrate 12 and receives the SH wave generated by the excitation IDT 14 and propagating through the piezoelectric substrate 12. A receptor 22 is exposed between the IDTs 14 and 16, that is, in the central portion of the piezoelectric substrate 12, which is a surface acoustic wave propagation region, from a sensitive film that binds to a specific substance.

  The excitation IDT 14 and the reception IDT 16 are each covered with an electrode sealing member 24. The electrode sealing member 24 is made of metal, ceramic, glass, or the like, and is formed in a flat plate shape as shown in FIG. In the embodiment, the electrode sealing member 24 is liquid-tightly bonded to the piezoelectric substrate 12 by a bonding material 26 made of an insulating material such as low-melting glass. In the embodiment, the bonding material 26 for bonding the electrode sealing member 24 to the piezoelectric substrate 12 has a thickness h larger than the electrode film thickness d of the comb-shaped electrodes 18, 20. A sealed space 28 can be formed around 18 and 20. Accordingly, the inverse piezoelectric effect of the piezoelectric substrate 12 due to the portion where the excitation IDT 14 is provided and the piezoelectric effect of the piezoelectric substrate 12 where the reception IDT 16 is provided are not affected. be able to.

  The width of the electrode fingers of the comb-shaped electrodes 18 and 20 is formed to be λ / 4, where λ is the wavelength of the surface acoustic wave (SH wave). Further, the joint portion of the electrode sealing member 24 in the propagation direction of the surface acoustic wave, that is, the distance a between the joint material 26 and the comb-shaped electrode 18 and the width b of the joint material 26 are an integral multiple of λ / 4. Thereby, unnecessary reflection of the SH wave can be prevented at the joint portion of the electrode sealing member 24. However, the distance a and the width b need not be the same. The same applies to the reception IDT 16 side. Further, as shown in FIG. 1, each of the comb-shaped electrodes 18 and 20 is integrally formed with a wiring pattern 30 that is a wiring portion. The wiring pattern 30 is drawn out from the sealed space 28 and connected to an electrode pad 32 provided outside the sealed space 28.

  Since the surface acoustic wave sensor 10 according to the first embodiment configured as described above does not have a wall portion around the receptor 22, the sample solution can be easily dropped onto the receptor and brought into contact with the surface. Can be carried out easily and quickly. Moreover, since the excitation IDT 14 and the reception IDT 16 are sealed in the sealed space 28 by the electrode sealing member 24, they do not come into contact with the sample solution. For this reason, it is possible to prevent the surface acoustic waves from being attenuated or short-circuited by the solution in the portions of the excitation IDT 14 and the reception IDT 16. In addition, when using the surface acoustic wave sensor 10 immersed in a solution, after connecting a wire (lead) to each electrode pad 32, an insulating material is apply | coated to the exposed electroconductive part. Thereby, the surface acoustic wave sensor 10 can be used in the liquid. For this reason, by immersing a plurality of surface acoustic wave sensors 10 with different properties of the sensitive film constituting the receptor 22 in the sample solution, a plurality of substances in the solution can be detected and measured simultaneously, Measurement labor and time can be greatly reduced.

  In the above embodiment, the case where the electrode sealing member 24 formed of metal, ceramic, glass, or the like is bonded by the bonding material 26 made of low-melting glass has been described. However, the electrode sealing member and the bonding material are dried. You may form by a film resist. Moreover, in the said embodiment, although the case where the surface acoustic wave to excite was a SH wave was demonstrated, a surface acoustic wave may be a love wave.

  FIG. 3 is a cross-sectional view of a main part of the second embodiment. The surface acoustic wave sensor according to the second embodiment is different from the first embodiment in the electrode sealing member 34 that covers the excitation IDT 14 and the reception IDT 16. That is, the electrode sealing member 34 has a recess 36 formed on the inner surface facing the comb electrodes 18 and 20. Thereby, the restriction on the thickness (height) of the bonding material 26 is relaxed, and the sealed space 28 can be easily formed around the comb-shaped electrodes 18 and 20.

  FIG. 4 is an explanatory diagram of the third embodiment. In the surface acoustic wave sensor 40 according to this embodiment, a so-called IDT 42 is formed in a resonator type. The IDT 42 is formed from a pair of comb electrodes 44 (44a, 44b). In each comb-shaped electrode 44, no electrode finger is formed at the center in the longitudinal direction, electrode fingers are formed at both ends, and the interdigital electrodes 46 (46a, 46b) made of interdigital electrodes are formed at both ends. Forming. The electrode fingers of the comb-shaped electrodes 44a and 44b forming the interdigital electrodes 46a and 46b are electrically connected by bus bars 48 (48a and 48b).

  The receptor 22 is disposed between the bus bars 48 in a portion where the electrode fingers are not formed between the interdigital electrodes 46. Further, reflectors 50 formed in a lattice shape are provided on both sides of the IDT 42 which is the propagation direction of the surface acoustic wave. In the surface acoustic wave sensor 40, the interdigital electrodes 46 and the reflectors 50 located on both sides of the receptor 22 are liquid-tightly sealed by the electrode sealing member 24. The electrode sealing member 24 forms a sealed space around the interdigital electrode portion 46 and the reflector 50 as in the above embodiment. The bus bar 48 is a wiring part, and a part thereof is exposed from the electrode sealing member 24, and the exposed part is connected to the electrode pad 32. In this embodiment, the interdigital electrode portion 46 and the reflector 50 are sealed by the electrode sealing member 24. However, only the interdigital electrode portion 46 is sealed, and the reflector 50 is exposed. You may let them.

  FIG. 5 is a cross-sectional view illustrating a fourth embodiment. In FIG. 5, the surface acoustic wave sensor 60 includes an electrode sealing member 62 that covers each of the excitation IDT 14 and the reception IDT 16 in a flat plate shape. The electrode sealing member 62 is formed of an insulator such as ceramic or glass. The electrode pads 32 of the excitation IDT 14 and the reception IDT 16 are provided on the opposite side of the receptor 22 in the propagation direction of the surface acoustic wave (SH wave). The electrode sealing member 62 has a size that covers the IDTs 14 and 16 and the electrode pad 32, and a through hole 64 is provided at a position corresponding to the electrode pad 32.

  The through hole 64 is formed in a tapered shape that gradually decreases in diameter from the upper surface side toward the lower surface side. The electrode sealing member 62 is provided with a contact pad 66 having a through hole 67 formed corresponding to the through hole 64 at a position corresponding to the through hole 64 on the lower surface. The contact pad 66 is formed of a conductive metal such as aluminum or gold, and when the electrode sealing member 62 is bonded to the piezoelectric substrate 12 as shown in FIG. It comes in contact with the top surface.

  In the surface acoustic wave sensor 60, after the electrode sealing member 62 is bonded to the piezoelectric substrate 12 via the bonding material 26, the electrode material 68 (68 a, 68 b) made of a conductive metal is inserted into the through hole 64 of the electrode sealing member 62. ) Is arranged. The electrode material 68 constitutes an electrode part, and as shown in FIG. And the electrode pad 32 is electrically connected. The electrode material 68a on the excitation IDT 14 side is connected to a power source in order to supply excitation power to the excitation IDT 14. The electrode material 68b on the reception IDT 16 side is connected to a frequency detector. The surface of the through hole 64 of the electrode sealing member 62 is provided with a metal film (not shown) such as tungsten or solder by printing or plating in order to improve the adhesion of the electrode material 68.

  By the way, in this 4th Embodiment, the joining material 26 does not cross | intersect a conductive wiring pattern. Accordingly, the bonding material 26 can be not only an insulating material but also a conductive material such as a metal. For example, the electrode sealing member 62 can be bonded by thermocompression using Cr / Au as the bonding material on the piezoelectric substrate side and the electrode sealing member side, or AuSn on the Cr / Au on the electrode sealing member side. AuSn bonding, solder bonding, anodic bonding, or the like, which is performed by providing solder, can be used. When a metal is used as the bonding material, the contact pad 66 provided on the electrode sealing member 62 can be formed of the same metal as the bonding material. Accordingly, the bonding material and the contact pad 66 can be formed in the same process, and the process can be simplified.

  FIG. 6 is a flowchart illustrating an example of the manufacturing method according to the fourth embodiment. First, as shown in step 70, a Cr / Au film composed of two layers of Cr and Au is formed on the surface of the piezoelectric wafer. This film may be formed by sputtering or vapor deposition. Next, the Cr / Au film is patterned to form a bonding portion (bonding material) (step 72). Thereafter, aluminum (Al) for electrodes is formed by vapor deposition or sputtering (step 74). Next, the Al film is patterned to form IDTs, electrode pads, and the like (step 76).

  On the other hand, a through-hole is formed in a plate material that becomes an electrode sealing member in parallel with the above-described process (step 80). Further, a metal film is formed on the wall surface of the through hole (step 82). This metal film can be formed by applying a metal paste such as tungsten so as to cover the through-holes by printing, etc., sucking from the opposite side of the through-holes to adhere the metal paste to the wall surface of the through-holes, and firing. In addition, when forming an electrode sealing member with a ceramic, after forming a through-hole and apply | coating a metal paste in the state of a green sheet, it sinters.

  Next, a joint portion formed of a two-layer film of Cr and Au is formed (step 84). This joint is formed by printing a metal paste or the like. However, it may be formed by vapor deposition or sputtering. Thereafter, as shown in step 90, the piezoelectric wafer and the electrode sealing member plate are aligned and overlapped, and the Cr / Au films at the joint are joined by thermocompression bonding. When AuSn is bonded to each other, an AuSn film is provided by printing or the like on the bonding portion of the electrode sealing member plate as shown in Step 86, and in Step 90, the AuSn film is melted and bonded. Thereafter, an electrode material is disposed in the through hole provided in the electrode sealing material plate, and the electrode material is melted to fill the through hole (step 92). Next, the piezoelectric wafer and the electrode sealing member plate are cut (diced) to form individual surface acoustic wave sensors (step 94).

  In the case of a multi-channel sensor in which a plurality of individual surface acoustic wave sensors are arranged and integrated, the multi-channel sensor may be cut into individual units by cutting the multi-channel sensor into units.

  FIG. 7 is a cross-sectional view for explaining the fifth embodiment. In the surface acoustic wave sensor 100 according to this embodiment, the electrode pad 32 is formed on the opposite side of the receptor 22 in the propagation direction of the surface acoustic wave. The wiring pattern portion 102 having one end connected to each comb-shaped electrode constituting the excitation IDT 14 and the reception IDT 16 is drawn out from the sealed space 28 formed by the electrode sealing member 24, and the other end is sealed space 28. It is connected to the electrode pad 32 provided outside. In the case of the embodiment, the electrode pad 32 and the wiring pattern portion 102 are formed of aluminum or an aluminum-based alloy together with the comb-shaped electrodes constituting the excitation IDT 14 and the reception IDT 16.

In the embodiment, the bonding material 104 for bonding the electrode sealing member 24 to the piezoelectric substrate 12 is formed of Cr / Au. An insulating layer (insulator) 106 is provided between the bonding material 104 and the wiring pattern portion 102. The insulating layer 106 is formed by anodizing the wiring pattern portion 102. In addition, the code | symbol 108 shown in FIG. 7 is in order to avoid that a height difference arises in a junction part. This is a dummy pattern portion formed integrally with the wiring pattern portion 102. The insulating layer 106 may be formed by forming a silicon dioxide (SiO ₂ ) film or the like. In the case where the insulating layer 106 is provided by silicon oxide or the like without anodizing the pattern, it can be applied to the surface acoustic wave sensor provided with the resonance type IDT shown in FIG.

It is explanatory drawing of 1st Embodiment. FIG. 2 is a partial cross-sectional view taken along line AA in FIG. 1. It is principal part sectional drawing of 2nd Embodiment. It is explanatory drawing of 3rd Embodiment. It is sectional drawing of 4th Embodiment. It is a flowchart which shows an example of the manufacturing method of 4th Embodiment. It is sectional drawing of 5th Embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ......... Surface acoustic wave sensor, 12 ......... Piezoelectric substrate, 14, 16 ......... Interdigital electrode (excitation IDT, reception IDT), 22 ......... Receptor, 24 ......... Electrode sealing member , 26... Junction portions (bonding materials) 40, 60, 100... Surface acoustic wave sensor 42... IDT, 46a, 46b ... Interdigital electrode portion 50 ... Reflector 64 ...... Through hole, 68a, 68b ......... electrode part (electrode material), 106 ......... insulator (insulating layer).

Claims (7)

Interdigital electrodes that are provided on the surface of the piezoelectric substrate and generate surface acoustic waves on the piezoelectric substrate;
A receptor provided exposed to the propagation region of the surface acoustic wave generated by the interdigital electrode;
An electrode sealing member which covers the interdigital electrode and forms a sealed space around the interdigital electrode;
A surface acoustic wave sensor comprising: The surface acoustic wave sensor according to claim 1,
The width of the joint of the electrode sealing member to the piezoelectric substrate in the surface acoustic wave propagation region is an integral multiple of λ / 4 where λ is the wavelength of the surface acoustic wave. A surface acoustic wave sensor. The surface acoustic wave sensor according to claim 1 or 2,
The distance between the joint of the electrode sealing member to the piezoelectric substrate and the interdigital electrode in the surface acoustic wave propagation region is an integer of λ / 4, where λ is the wavelength of the surface acoustic wave. A surface acoustic wave sensor characterized by being doubled. The surface acoustic wave sensor according to any one of claims 1 to 3,
The surface acoustic wave sensor according to claim 1, wherein the bonding material for bonding the electrode sealing member to the piezoelectric substrate is made of an insulating material. The surface acoustic wave sensor according to any one of claims 1 to 4,
The electrode sealing member is formed in a flat plate shape,
The bonding material for bonding the electrode sealing member to the piezoelectric substrate has a height for separating the electrode sealing member and the interdigital electrode.
A surface acoustic wave sensor. The surface acoustic wave sensor according to any one of claims 1 to 5,
The electrode sealing member is made of an insulator having an electrode portion on the upper surface,
The interdigital electrode is electrically connected to the electrode portion through a through hole formed in the electrode sealing member.
A surface acoustic wave sensor. In the surface acoustic wave sensor according to any one of claims 1 to 3, 5, and 6,
The interdigital electrode has a wiring portion drawn out from the sealed space,
The position corresponding to the joint portion of the electrode sealing member of the wiring portion is insulated,
A surface acoustic wave sensor.

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