JP2006181828A - Method for manufacturing liquid jetting head and liquid jetting head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a liquid jetting head which can remarkably improve print quality by preventing curved flying of liquid droplets, and a liquid jetting head. <P>SOLUTION: The method for manufacturing a liquid jetting head comprises at least a lamination step for forming a wafer laminated body laminating at least a wafer for nozzle plates having a plurality of nozzles formed and a wafer for a cavity substrate having a pressure chamber communicating with the nozzles, a sealing step for sealing the nozzles by sticking a sealing tape with an adhesive layer consisting of an anaerobic adhesive on the nozzle surface having the nozzles opened, a separation step for separating the wafer laminated body into a specified size, and a peeling step for peeling the sealing tape. The method furthermore comprises a curing step for curing the adhesive layer in the region corresponding to at least the nozzles in a state that the air in the pressure chamber is substituted with nitrogen prior to the peeling step. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method of manufacturing a liquid ejecting head that ejects liquid droplets from nozzles, and a liquid ejecting head.

  In general, various types of liquid ejecting heads such as ink jet recording heads used in printers, facsimiles, copiers, and the like are known depending on the mechanism for ejecting droplets. For example, a nozzle that boiles liquid by a heating element or the like and discharges a droplet with a bubble pressure generated at that time, or expands or contracts the volume of a pressure chamber filled with the droplet by displacement of a piezoelectric element There is one that discharges droplets from the nozzle. Further, for example, there is an electrostatic drive type in which droplets are ejected from a nozzle by changing the volume of a pressure chamber using electrostatic force.

  Various methods for manufacturing such an ink jet recording head have been proposed. For example, as a method for manufacturing an electrostatic drive head, a plurality of nozzle plates, cavity plates, and electrode substrates are formed. There is a method in which a plurality of heads are obtained simultaneously by joining three substrates to form a composite substrate and then cutting the composite substrate with a cutting blade or the like (see, for example, Patent Document 1).

  In such a manufacturing method, generally, the composite substrate is cut in a state where an adhesive sheet is attached to both surfaces of the composite substrate. This is to prevent the substrate from being cracked or chipped due to an impact caused by contact with the cutting blade when the composite substrate is cut. The pressure-sensitive adhesive sheet also serves to prevent dirt such as chips from adhering to the surface of the composite substrate.

  However, the pressure-sensitive adhesive sheet attached to the composite substrate in this way is peeled off after the composite substrate is cut, but in this case, the pressure-sensitive adhesive of the pressure-sensitive adhesive sheet may remain on the surface of the substrate. If the pressure-sensitive adhesive of the pressure-sensitive adhesive sheet adheres to the inside of the nozzle, the opening edge of the nozzle, or the like, there is a problem that when the ink droplet is ejected, the ink droplet is bent.

  Such a problem naturally exists not only in the ink jet recording head but also in other liquid ejecting heads.

Japanese Patent Laid-Open No. 11-254689 (FIGS. 1, 2, 5, and 5)

  In view of such circumstances, it is an object of the present invention to provide a method of manufacturing a liquid ejecting head and a liquid ejecting head capable of significantly improving printing quality by preventing flying bending of droplets.

A first aspect of the present invention that solves the above problem is a wafer laminate in which a nozzle plate wafer having a plurality of nozzles and a cavity substrate wafer having a pressure chamber communicating with the nozzles are laminated at least. A sealing step for sealing the nozzle by attaching a sealing tape having an adhesive layer made of an anaerobic adhesive to the nozzle surface where the nozzle is opened, and the wafer laminate. And at least the nozzle in a state where the air in the pressure chamber is replaced with nitrogen before the peeling step. In the method of manufacturing a liquid jet head, the method includes a curing step of curing the adhesive layer in a corresponding region.
In the first aspect, since the adhesive layer near the nozzle is reliably cured when the sealing tape is peeled off, the adhesive layer can be completely removed from the nozzle plate surface, and the adhesive layer (adhesive) remains. It is possible to prevent the flight of the droplet caused by

According to a second aspect of the present invention, in the first aspect, the adhesive layer of the sealing tape is made of an ultraviolet curable adhesive, and in the curing step, the sealing tape is irradiated with ultraviolet rays. In the method of manufacturing a liquid jet head, the pressure-sensitive adhesive layer is cured.
In the second aspect, the adhesive layer can be reliably cured, and the adhesive layer can be partially cured relatively easily.

According to a third aspect of the present invention, in the first or second aspect, the curing step is performed before the separation step, and in the curing step, the adhesive layer only in a region corresponding to the nozzle is cured. A method of manufacturing a liquid jet head characterized by the above.
In the third aspect, when separating the wafer laminate, it is possible to prevent the sealing tape from being peeled off and cutting water or the like from entering from the nozzle, and to prevent the adhesive remaining.

According to a fourth aspect of the present invention, in the first or second aspect, the curing step is performed after the separation step, and the adhesive layer on the entire surface of the sealing tape is cured in the curing step. A method of manufacturing a liquid jet head.
In the fourth aspect, when the wafer laminate is separated, it is possible to prevent the sealing tape from peeling off and intrusion of cutting water or the like from the nozzle, and it is possible to prevent the adhesive remaining.

According to a fifth aspect of the present invention, in any one of the first to fourth aspects, vapor deposition is performed by forming a vapor deposition film made of a material having water and oil repellency by a vapor deposition method on at least the nozzle surface of the nozzle plate wafer. A water repellent and oil repellent film by further attaching a sealing tape on the vapor deposition film in the sealing step, and peeling off a part of the vapor deposition layer together with the sealing tape in the peeling step. In the method of manufacturing a liquid jet head, the method of forming a liquid jet head is provided.
In the fifth aspect, a water / oil repellent film made of a dense film can be formed relatively easily and satisfactorily.

According to a sixth aspect of the present invention, in the liquid jet head manufacturing method according to the fifth aspect, the method further includes an ultraviolet irradiation step of irradiating the deposited film with ultraviolet rays before the sealing step. is there.
In the sixth aspect, since the bonding force in the vapor deposition film increases, a strong water / oil repellent film can be formed with a relatively thick and uniform thickness.

According to a seventh aspect of the present invention, there is provided a liquid ejecting head manufactured by the manufacturing method according to any one of the first to sixth aspects.
In the seventh aspect, it is possible to realize a liquid jet head that can stably obtain good ejection characteristics.

Hereinafter, the present invention will be described in detail based on embodiments.
FIG. 1 is a schematic perspective view of an ink jet recording head which is an example of a liquid ejecting head, and FIG. 2 is a cross-sectional view thereof. The illustrated ink jet recording head is a so-called electrostatic drive head, and includes a cavity substrate 10, and a nozzle plate 20 and an electrode substrate 30 respectively bonded to both surfaces of the cavity substrate 10.

  The cavity substrate 10 is made of, for example, a silicon single crystal substrate having a plane orientation (100) or (110), and a plurality of pressure chambers (cavities) 11 opened on one surface side thereof are arranged in parallel in the width direction. In the present embodiment, as shown in FIG. 2, the cavity substrate 10 is formed with two rows in which a plurality of pressure chambers 11 are arranged in parallel. Further, the cavity substrate 10 is formed with a common ink chamber 12 serving as an ink chamber common to the pressure chambers 11 of each row. The common ink chamber 12 is connected to each pressure chamber 11 via an ink supply path described later. It is communicated to. An ink supply hole 13 for supplying ink to the common ink chamber 12 is formed in the bottom wall of the common ink chamber 12. The cavity substrate 10 is formed with a through hole 14 on the outside of the common ink chamber 12 for exposing an individual terminal portion connected to an individual electrode described later.

  Note that the bottom wall of each pressure chamber 11 functions as a diaphragm 15 for causing a pressure change in the pressure chamber 11 and serves as a common electrode for generating an electrostatic force that displaces the diaphragm 15. Doubles as In the vicinity of the through hole 14 of the cavity substrate 10, a common terminal portion 16 is formed which is exposed in an exposure hole (described later) of the nozzle plate 20 and connected to a drive wiring (not shown).

  Similarly to the cavity substrate 10, the nozzle plate 20 is made of a silicon single crystal substrate having a plane orientation (100) or (110), and a plurality of nozzles 21 communicating with the pressure chambers 11 are formed. The nozzle plate 20 is bonded to the opening surface side of the cavity substrate 10 to form one surface of the pressure chamber 11 and the common ink chamber 12. A nozzle step portion 22 is formed on the surface of the nozzle plate 20 opposite to the cavity substrate 10 by removing a part in the thickness direction over a region corresponding to the nozzle 21.

  Here, each nozzle 21 is provided on the ink droplet ejection side and has a substantially circular small-diameter portion 21a that opens into the nozzle step portion 22, and has a diameter larger than that of the small-diameter portion 21a. The large-diameter portion 21 b communicates with the chamber 11. All the nozzles 21 (small-diameter portions 21a) are opened in the nozzle step portion 22, and in this embodiment, the surface of the nozzle plate 20 in the nozzle step portion 22 is a nozzle surface.

  In addition, on the joint surface of the nozzle plate 20 with the cavity substrate 10, an ink supply that communicates each of the pressure chambers 11 and the common ink chamber 12 with a region corresponding to the boundary between the pressure chamber 11 and the common ink chamber 12. A path 23 is formed. The nozzle plate 20 is formed with an exposure hole 24 that communicates with the through hole 14 of the cavity substrate 10 at a position corresponding to the outside of the common ink chamber 12 and exposes the common terminal portion 16 together with the individual terminal portion described later. ing.

  A water / oil repellent film 25 made of a water / oil repellent material made of, for example, a fluorine-containing silane coupling compound is formed on the surface of the nozzle plate 20, in this embodiment, in the nozzle step portion 22. Thereby, adhesion of ink droplets to the surface (nozzle surface) of the nozzle plate 20 is suppressed.

  On the other hand, the electrode substrate 30 is made of a glass substrate such as borosilicate glass having a thermal expansion coefficient close to that of a silicon single crystal substrate, and is bonded to the surface of the cavity substrate 10 on the vibration plate 15 side. In the region of the electrode substrate 30 facing the diaphragm 15, a recess 31 is formed corresponding to each pressure chamber 11. In addition, an ink introduction hole 32 communicating with the ink supply hole 13 is formed in the electrode substrate 30 at a position corresponding to the ink supply hole 13 of the cavity substrate 10. The common ink chamber 12 is filled with ink from an ink tank (not shown) through the ink introduction hole 32 and the ink supply hole 13.

  In addition, individual electrodes 33 for generating an electrostatic force that displaces the diaphragm 15 are disposed in the respective recesses 31 in a state in which a predetermined interval is secured between the individual electrodes 33. In the recess 31, an individual terminal portion 34 to which a drive wiring (not shown) is connected is formed in a region facing the through hole 14 of the cavity substrate 10, and the individual terminal portion 34 and each individual electrode 33 are connected to each other. Are connected by a lead electrode 35. Although not shown, each individual electrode 33 and the lead electrode 35 are sealed with an insulating film, and a drive voltage pulse is applied between the individual terminal portion 34 and the common terminal portion 16 via a connection wiring. For this purpose, an oscillation circuit is connected.

  In such an ink jet recording head, when a driving voltage is applied between the individual electrode 33 and the diaphragm 15 (cavity substrate 10) by the oscillation circuit, the ink jet recording head is generated in a gap between the individual electrode 33 and the diaphragm 15. When the diaphragm 15 is bent and deformed by the electrostatic force toward the individual electrode 33 side, the volume of the pressure chamber 11 is expanded and the application of the drive voltage is released, the diaphragm 15 returns to the original state, and the volume of the pressure chamber 11 is increased. Contracts. Then, due to the pressure change in the pressure chamber 11 generated at this time, a part of the ink in the pressure chamber 11 is ejected as an ink droplet from the nozzle 21.

  Hereinafter, a method for manufacturing such an ink jet recording head will be described with reference to FIGS. First, as shown in FIG. 3A, the nozzle plate wafer 200 in which the plurality of nozzle plates 20 are integrally formed and the cavity substrate wafer 100 in which the plurality of cavity substrates 10 are integrally formed. And an electrode substrate wafer 300 in which a plurality of electrode substrates 30 are integrally formed, and the nozzle plate wafer 200 and the electrode substrate wafer 300 are bonded to both surfaces of the cavity substrate wafer 100, respectively. Thus, the wafer laminate 400 is formed.

  Next, as shown in FIG. 3B, a vapor deposition film 205 to be a water / oil repellent film 25 is formed on the nozzle surface of the nozzle plate wafer 200, in this embodiment, the nozzle step portion 22. For example, in this embodiment, the vapor deposition film 205 is formed by vacuum-depositing a fluorine-containing silane coupling compound as a water / oil repellent material. Note that the surface of the nozzle plate wafer 200 may be UV-cleaned before the deposition film 205 is formed.

  Next, in the present embodiment, a process of irradiating the deposited film 205 thus formed with ultraviolet rays is performed. Thereby, the thickness of the dense film of the vapor deposition film 205 can be increased. That is, the deposited film 205 formed on the nozzle plate wafer 200 by the vacuum deposition method is a dense film in which the lower layer portion is covalently bonded to the nozzle plate wafer (silicon wafer) 200, but the upper layer portion. Is a sparse film that is held by the bonding force due to intermolecular bonding force. When such a deposited film 205 is irradiated with ultraviolet rays, the in-film bonding force is increased and the thickness of the dense film is increased, and the thickness of the dense film is increased from the lower layer to the upper layer. It is made substantially uniform throughout. Thereby, as will be described in detail later, the water / oil repellent film 25 can be satisfactorily formed on the surface of the nozzle plate 20.

  Next, as shown in FIG. 4A, a sealing tape 50 having an adhesive layer 51 made of a predetermined adhesive is cut out and prepared so as to have the width of the nozzle step portion 22. Is stuck on the vapor deposition film 205 in the nozzle step portion 22 to seal the nozzle 21. Here, when the vapor deposition film 205 is formed only by vacuum vapor deposition, it is rubbed with a certain amount of force using a contact-type pressing tool that directly contacts the wafer laminate 400 from above the sealing tape 50, and vapor deposition. It is necessary to make the film 205 penetrate into the adhesive layer 51 of the sealing tape 50 and to be completely adhered. This is because the sparse film of the deposited film 205 is surely peeled off in the step of peeling the sealing tape 50 described later. When the sealing tape 50 is rubbed in this way, the load at this time causes cracks in the wafer laminate 400, particularly the nozzle plate wafer 200 and the cavity substrate wafer 100. However, in this embodiment, since the process of irradiating the deposited film 205 with ultraviolet rays is performed as described above, there is no need to rub such a sealing tape 50. Therefore, cracking of the wafer laminate 400 can be prevented, and the yield is significantly improved.

  In this embodiment, as the sealing tape 50, an anaerobic adhesive, for example, a dicing tape having an adhesive layer 51 made of an ultraviolet curable adhesive, that is, an ultraviolet peeling type that is generally used. Dicing tape is used. This ultraviolet peeling type dicing tape has a base material thickness of about 100 μm and an adhesive layer thickness of about 25 μm.

Next, as shown in FIG. 5, in a state where the air in the pressure chamber 11 is replaced with nitrogen (N ₂ ), the region corresponding to the nozzle 21 is irradiated with ultraviolet rays to at least adhere to the region corresponding to the nozzle 21. In the present embodiment, only the adhesive layer 51a in the region corresponding to the nozzle 21 is cured. Specifically, the mask material 60 formed of stainless steel (SUS) or the like is fixed on the wafer laminate 400 (nozzle plate wafer 200), and only the regions corresponding to the nozzles 21 of the nozzle plate wafer 200 are provided. Expose. On the other hand, after the inside of the pressure chamber 11 is vacuum-sucked from each ink introduction hole 32 of the electrode substrate wafer 300, nitrogen (N ₂ ) is sent in and the inside of the pressure chamber 11 is maintained in a state where oxygen (O ₂ ) is not present. In this state, the sealing tape 50 is irradiated with ultraviolet rays for a predetermined time, in this embodiment, for several seconds. Thereby, only the adhesive layer 51a in the region corresponding to the nozzle 21 is completely cured. That is, since the adhesive layer 51 of the sealing tape 50 is made of an anaerobic adhesive as described above, the pressure chamber 11 is filled with nitrogen when irradiated with ultraviolet rays, and the region corresponding to the nozzle 21 is adhered. By making the layer 51a not in contact with oxygen, the adhesive layer 51a is reliably cured. Even if the sealing tape 50 is irradiated with ultraviolet rays in the presence of air (oxygen) in the pressure chamber 11, the adhesive layer 51a is not completely cured.

  Further, the irradiation time of the ultraviolet rays to the sealing tape 50 may be appropriately determined in consideration of the type of the adhesive, the thickness of the adhesive layer 51, and the like, but if it is irradiated for a very long time, it is covered with the mask material 60. The pressure-sensitive adhesive layer 51 in the area is also cured. For this reason, it is desirable to make the irradiation time of ultraviolet rays as short as possible.

  Next, as shown in FIG. 4B, a dicing tape 70 having an adhesive layer 71 cut out so as to be the size of the nozzle plate wafer 200 is prepared, and the dicing tape 70 is provided on both surfaces of the wafer laminate 400. paste. That is, the dicing tape 70 is attached to the surface of the wafer laminate 400 (the surface of the nozzle plate wafer 200) from the top of the sealing tape 50, and similarly, the back surface of the wafer laminate 400 (the surface of the electrode substrate wafer 300). ) Is also affixed with the dicing tape 70. In addition, as the dicing tape 70 used here, the ultraviolet peeling type dicing tape generally used is adopted like the sealing tape 50.

  Then, with the sealing tape 50 and the dicing tape 70 attached in this way, the wafer laminated body 400 is cut along, for example, a cutting line indicated by a one-dot chain line in FIG. Is cut out (see FIG. 1 and the like). The cut out inkjet recording head is in a state in which the sealing tape 50 is attached to the nozzle step portion 22 and the dicing tape 70 is attached to the surface.

  Here, as described above, in this embodiment, the adhesive layer 51 of the sealing tape 50 is cured before the separation step, but the entire adhesive layer 51 is not cured, but the nozzle. Only the adhesive layer 51a in the region corresponding to 21 is cured. Therefore, when the wafer laminate 400 is separated, the sealing tape 50 at the cut portion is not peeled off, and cutting water or the like does not enter the nozzle 21. That is, since the adhesive layer 51 of the sealing tape 50 at the cut portion is not cured and maintains a predetermined adhesive force, the sealing tape 50 is not peeled off when the wafer laminate 400 is cut.

  Thereafter, the dicing tape 70 affixed to the surface of the cut out ink jet recording head is irradiated with ultraviolet rays to reduce the adhesive strength of the dicing tape 70. Thereafter, the dicing tape 70 and the sealing tape 50 are peeled off from the ink jet recording head. At this time, as described above, since the adhesive layer 51a in the region corresponding to at least the nozzle 21 of the sealing tape 50 is completely cured, the adhesive layer 51 (adhesive) is peeled off without remaining on the nozzle plate 20. Is done. The adhesive layer 51 (adhesive) does not remain at least in the nozzle 21 or at the opening edge. Therefore, it is possible to prevent the flying bend of the ink droplets due to such a pressure-sensitive adhesive residue, and it is possible to improve the printing quality. In addition, since the product quality is stable and the yield is remarkably improved, the manufacturing cost is greatly reduced. In the case where the nozzles are arranged at high density, such a manufacturing method is particularly effective since the flying curve of minute ink droplets greatly affects the print quality.

  Further, when the sealing tape 50 is peeled in this way, as shown in FIG. 7, a part of the vapor deposition film 205 is peeled off together with the sealing tape 50, whereby the water / oil repellent film 25 having a predetermined thickness is formed. It is formed. That is, when the sealing tape 50 is peeled from the nozzle plate 20, the vapor deposition film 205 formed on the nozzle plate 20 with a thickness of about 50 nm leaves a dense film with high adhesion on the surface of the nozzle plate 20. The sparse film is separated and peeled off with the sealing tape 50. As a result, a water / oil repellent film 25 which is a dense film is formed on the surface of the nozzle plate 20. In the present embodiment, as described above, by irradiating the vapor deposition film 205 with ultraviolet rays, the bonding force in the vapor deposition film is increased and uniformed. Therefore, the water / oil repellent film 25 is relatively thick and has a uniform thickness. Can be formed satisfactorily.

  As mentioned above, although one embodiment of the present invention was described, of course, the present invention is not limited to such an embodiment. For example, in the present embodiment, the curing process for curing the adhesive layer 51 of the sealing tape 50 is performed immediately after the sealing tape 50 is attached, but the present invention is not limited to this, and the sealing tape is peeled off. If it is before, it may be performed at any timing. For example, the separation may be performed after the wafer laminate 400 is separated and the dicing tape 70 on the back side of the ink jet recording head, that is, the surface of the electrode substrate 30 is peeled off. Regardless of the timing, the sealing tape 50 can be reliably peeled without leaving the adhesive layer 51 (adhesive) of the sealing tape 50 on the nozzle plate 20. In addition, when performing the hardening process which hardens the adhesion layer 51 of the sealing tape 50 after separating the wafer laminated body 400 in this way, it is not necessary to cure only the adhesion layer 51a in the region corresponding to the nozzle 21. What is necessary is just to harden the adhesion layer 51 of the sealing tape 50 whole.

  Furthermore, in the present embodiment, the present invention has been described by taking an electrostatic drive type ink jet recording head as an example, but the present invention is not limited to this, for example, a method of ejecting ink droplets by displacement of a piezoelectric element, or In addition, the ink jet recording head of any system can be employed, such as a system in which ink droplets are ejected by heating ink with a heating element or the like. Of course, the present invention can be applied not only to an ink jet recording head that ejects ink droplets but also to a liquid ejecting head that ejects all other droplets. Other liquid ejecting heads include, for example, color material ejecting heads used for manufacturing color filters such as liquid crystal displays, electrode material ejecting heads used for forming electrodes such as organic EL displays and FEDs (surface emitting displays), and biochips. Examples thereof include a bio-organic matter ejecting head used for manufacturing.

1 is a schematic perspective view of a recording head according to an embodiment. FIG. 3 is a cross-sectional view of a recording head according to an embodiment. It is a schematic perspective view which shows the manufacturing process of the recording head which concerns on one Embodiment. It is a schematic perspective view which shows the manufacturing process of the recording head which concerns on one Embodiment. It is sectional drawing which shows the manufacturing process of the recording head which concerns on one Embodiment. FIG. 6 is a plan view illustrating a manufacturing process of a recording head according to an embodiment. It is sectional drawing which shows the manufacturing process of the recording head which concerns on one Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Cavity substrate, 11 Pressure chamber, 12 Common ink chamber, 13 Ink supply hole, 14 Through hole, 15 Diaphragm, 16 Common terminal part, 20 Nozzle plate, 21 Nozzle, 22 Nozzle step part, 23 Ink supply path, 24 Exposure Hole, 25 water and oil repellent film, 30 electrode substrate, 31 recess, 32 ink introduction hole, 33 individual electrode, 34 individual terminal part, 35 lead electrode, 50 sealing tape, 51 adhesive layer, 60 mask material, 70 dicing tape, 100 wafer for cavity substrate, 200 wafer for nozzle plate, 205 vapor deposition film, 300 wafer for electrode substrate

Claims (7)

A laminating step for forming a wafer laminate in which a nozzle plate wafer having a plurality of nozzles and a cavity substrate wafer having pressure chambers communicating with the nozzles are laminated, and a nozzle surface on which the nozzles open A sealing step of sticking a sealing tape having an adhesive layer made of an anaerobic adhesive to seal the nozzle, a separation step of separating the wafer laminate into a predetermined size, and the sealing tape And a curing step for curing at least the adhesive layer in a region corresponding to the nozzle in a state where the air in the pressure chamber is replaced with nitrogen before the peeling step. A method of manufacturing a liquid ejecting head. 2. The adhesive layer according to claim 1, wherein the adhesive layer of the sealing tape is made of an ultraviolet curable adhesive, and in the curing step, the adhesive layer is cured by irradiating the sealing tape with ultraviolet rays. A method for manufacturing a liquid jet head. 3. The method of manufacturing a liquid jet head according to claim 1, wherein the curing step is performed before the separation step, and the adhesive layer is cured only in a region corresponding to the nozzle in the curing step. . 3. The method of manufacturing a liquid jet head according to claim 1, wherein the curing step is performed after the separation step, and in the curing step, the adhesive layer on the entire surface of the sealing tape is cured. 5. The sealing step according to claim 1, further comprising a vapor deposition step of forming a vapor deposition film made of a material having water and oil repellency by a vapor deposition method on at least the nozzle surface of the nozzle plate wafer. The liquid jet is characterized in that the sealing tape is attached onto the vapor deposition film, and in the peeling step, a part of the vapor deposition layer is peeled off together with the sealing tape to form a water / oil repellent film. Manufacturing method of the head. 6. The method of manufacturing a liquid jet head according to claim 5, further comprising an ultraviolet irradiation step of irradiating the deposited film with ultraviolet rays before the sealing step. A liquid jet head manufactured by the manufacturing method according to claim 1.

Images