JP2006179487A - 垂直方向に配列されたナノロッドおよびその配列への電気接点をつくるためのシステムおよび方法 - Google Patents
垂直方向に配列されたナノロッドおよびその配列への電気接点をつくるためのシステムおよび方法 Download PDFInfo
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- JP2006179487A JP2006179487A JP2005361926A JP2005361926A JP2006179487A JP 2006179487 A JP2006179487 A JP 2006179487A JP 2005361926 A JP2005361926 A JP 2005361926A JP 2005361926 A JP2005361926 A JP 2005361926A JP 2006179487 A JP2006179487 A JP 2006179487A
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- 239000002073 nanorod Substances 0.000 title claims abstract description 198
- 238000000034 method Methods 0.000 title abstract description 45
- 239000000758 substrate Substances 0.000 claims description 37
- 238000009736 wetting Methods 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 abstract description 65
- 239000002184 metal Substances 0.000 abstract description 65
- 238000005259 measurement Methods 0.000 abstract 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 30
- 230000008569 process Effects 0.000 description 26
- 239000011888 foil Substances 0.000 description 23
- 239000007789 gas Substances 0.000 description 22
- 239000000463 material Substances 0.000 description 14
- 239000011787 zinc oxide Substances 0.000 description 13
- 230000008018 melting Effects 0.000 description 8
- 238000002844 melting Methods 0.000 description 8
- 239000002086 nanomaterial Substances 0.000 description 6
- 239000011800 void material Substances 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 238000001312 dry etching Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 229910001338 liquidmetal Inorganic materials 0.000 description 4
- 239000002070 nanowire Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 239000010980 sapphire Substances 0.000 description 4
- 229910052594 sapphire Inorganic materials 0.000 description 4
- 238000001039 wet etching Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 229910003437 indium oxide Inorganic materials 0.000 description 3
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 3
- 229910001887 tin oxide Inorganic materials 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- 239000005751 Copper oxide Substances 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000004590 computer program Methods 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002061 nanopillar Substances 0.000 description 1
- 239000002071 nanotube Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- RNWHGQJWIACOKP-UHFFFAOYSA-N zinc;oxygen(2-) Chemical group [O-2].[Zn+2] RNWHGQJWIACOKP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B19/00—Selenium; Tellurium; Compounds thereof
- C01B19/007—Tellurides or selenides of metals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B21/00—Nitrogen; Compounds thereof
- C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
- C01B21/0632—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with gallium, indium or thallium
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/10—Particle morphology extending in one dimension, e.g. needle-like
- C01P2004/16—Nanowires or nanorods, i.e. solid nanofibres with two nearly equal dimensions between 1-100 nanometer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249967—Inorganic matrix in void-containing component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249967—Inorganic matrix in void-containing component
- Y10T428/249969—Of silicon-containing material [e.g., glass, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249967—Inorganic matrix in void-containing component
- Y10T428/24997—Of metal-containing material
Abstract
【解決手段】システムおよび方法は、ほぼ垂直方向に整列したナノロッド132の配列に電気接点を提供する。ナノロッド132は、ナノロッド132への底部接点120として作用する導電性の層の上部に製造することができる。上部金属接点140は、ナノロッド132の配列の複数のナノロッド132に適用される。接点120,140は、ナノロッドのI/V(電流/電圧)特性を測定することを可能にする。
【選択図】図1
Description
Claims (5)
- 基板と、
前記基板の表面上に形成され、各々が前記基板の表面と平行でない方向に伸びているナノロッドの配列と、
前記基板と反対の配列上に形成された接点層とを有し、前記接点層は、配列の複数のナノロッドと電気的に接触している装置。 - 前記基板は、前記ナノロッドと電気的に接触している請求項1に記載の装置。
- アナライザを含み、前記アナライザは、前記基板と接点層に電気的に接続され、少なくとも1つのナノロッドの少なくとも1つの特徴を測定する請求項2に記載の装置。
- 基板と接点層との間に形成された中間接点を含み、前記中間接点は、複数のナノロッドと電気的に接触する請求項1に記載の装置。
- 前記基板上に形成されたウエッティング層またはバッファ層を含む請求項1に記載の装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/015,469 US20060134392A1 (en) | 2004-12-20 | 2004-12-20 | Systems and methods for electrical contacts to arrays of vertically aligned nanorods |
US11/015,469 | 2004-12-20 |
Publications (2)
Publication Number | Publication Date |
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JP2006179487A true JP2006179487A (ja) | 2006-07-06 |
JP4939047B2 JP4939047B2 (ja) | 2012-05-23 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2005361926A Expired - Fee Related JP4939047B2 (ja) | 2004-12-20 | 2005-12-15 | 垂直方向に配列されたナノロッド及びその配列への電気接点をつくるための方法 |
Country Status (2)
Country | Link |
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US (1) | US20060134392A1 (ja) |
JP (1) | JP4939047B2 (ja) |
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JP2009094228A (ja) * | 2007-10-05 | 2009-04-30 | Panasonic Electric Works Co Ltd | 半導体発光装置およびそれを用いる照明装置ならびに半導体発光装置の製造方法 |
KR101280498B1 (ko) * | 2011-04-27 | 2013-07-05 | 한국과학기술연구원 | 나노 구조를 갖는 금속산화물반도체 가스센서 및 그 제조방법 |
WO2013191309A1 (ko) * | 2012-06-18 | 2013-12-27 | 포항공과대학교 산학협력단 | 나노 구조를 갖는 금속산화물반도체 가스센서 및 그 제조방법 |
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KR100593264B1 (ko) * | 2003-06-26 | 2006-06-26 | 학교법인 포항공과대학교 | p-타입 반도체 박막과 n-타입 산화아연(ZnO)계나노막대의 이종접합 구조체, 이의 제법 및 이를 이용한소자 |
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KR101182305B1 (ko) * | 2005-06-30 | 2012-09-20 | 엘지디스플레이 주식회사 | 액정표시장치의 제조방법 |
TW200806829A (en) * | 2006-07-20 | 2008-02-01 | Univ Nat Central | Method for producing single crystal gallium nitride substrate |
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JP2009094228A (ja) * | 2007-10-05 | 2009-04-30 | Panasonic Electric Works Co Ltd | 半導体発光装置およびそれを用いる照明装置ならびに半導体発光装置の製造方法 |
KR101280498B1 (ko) * | 2011-04-27 | 2013-07-05 | 한국과학기술연구원 | 나노 구조를 갖는 금속산화물반도체 가스센서 및 그 제조방법 |
WO2013191309A1 (ko) * | 2012-06-18 | 2013-12-27 | 포항공과대학교 산학협력단 | 나노 구조를 갖는 금속산화물반도체 가스센서 및 그 제조방법 |
US9689785B2 (en) | 2012-06-18 | 2017-06-27 | Postech Academy-Industry Foundation | Metal oxide semiconductor gas sensor having nanostructure and method for manufacturing same |
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