JP2006165399A5 - - Google Patents

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JP2006165399A5
JP2006165399A5 JP2004357292A JP2004357292A JP2006165399A5 JP 2006165399 A5 JP2006165399 A5 JP 2006165399A5 JP 2004357292 A JP2004357292 A JP 2004357292A JP 2004357292 A JP2004357292 A JP 2004357292A JP 2006165399 A5 JP2006165399 A5 JP 2006165399A5
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Prior art keywords
gas
gas supply
branch pipe
supply device
pipe
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JP2004357292A
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JP2006165399A (en
JP4358727B2 (en
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Priority claimed from JP2004357292A external-priority patent/JP4358727B2/en
Priority to JP2004357292A priority Critical patent/JP4358727B2/en
Priority to US11/296,209 priority patent/US20060124169A1/en
Priority to TW094143443A priority patent/TWI441254B/en
Priority to KR1020050119216A priority patent/KR100753692B1/en
Priority to CNB2005101303873A priority patent/CN100390933C/en
Publication of JP2006165399A publication Critical patent/JP2006165399A/en
Publication of JP2006165399A5 publication Critical patent/JP2006165399A5/ja
Publication of JP4358727B2 publication Critical patent/JP4358727B2/en
Application granted granted Critical
Priority to US12/651,165 priority patent/US8906193B2/en
Priority to US13/691,125 priority patent/US9441791B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Claims (13)

基板を処理する処理容器にガスを供給するガス供給装置であって，
複数のガス供給源と，
前記複数のガス供給源から供給される複数のガスを混合する混合配管と，
前記混合配管で混合された混合ガスを分流して処理容器の複数箇所に供給する複数の分岐配管と，
少なくとも一つの分岐配管を流れる混合ガスに所定の付加ガスを供給する付加ガス供給装置と，を備え，
ガス流量を調整するためのバルブと圧力計を各分岐配管に備え，
さらに，前記圧力計の計測結果に基づいて，前記バルブの開閉度を調整して，前記混合配管の混合ガスを所定の圧力比で前記分岐配管に分流する圧力比制御装置を備えた
ことを特徴とする，ガス供給装置。 A gas supply device for supplying a gas to a processing container for processing a substrate,
Multiple gas sources;
A mixing pipe for mixing a plurality of gases supplied from the plurality of gas supply sources;
A plurality of branch pipes for diverting the mixed gas mixed in the mixing pipe and supplying the mixed gas to a plurality of locations in the processing vessel;
An additional gas supply device for supplying a predetermined additional gas to the mixed gas flowing through at least one branch pipe ,
Each branch pipe is equipped with a valve and pressure gauge to adjust the gas flow rate.
And a pressure ratio control device for adjusting a degree of opening and closing of the valve based on a measurement result of the pressure gauge and diverting a mixed gas of the mixing pipe to the branch pipe at a predetermined pressure ratio. Gas supply device. 前記付加ガス供給装置は，前記分岐配管に連通する付加ガス供給配管を有し，The additional gas supply device has an additional gas supply pipe communicating with the branch pipe;
前記付加ガス供給配管は，前記圧力計と前記バルブの下流側に接続されていることを特徴とする，請求項１に記載のガス供給装置。The gas supply device according to claim 1, wherein the additional gas supply pipe is connected to the downstream side of the pressure gauge and the valve. 前記圧力比制御装置は，前記付加ガス供給装置から分岐配管に前記付加ガスを供給しない状態で，前記各分岐配管に分流される混合ガスの圧力比を前記バルブにより所定の圧力比に調整し，その状態で前記バルブの開閉度を固定することを特徴とする，請求項２に記載のガス供給装置。The pressure ratio control device adjusts the pressure ratio of the mixed gas divided into each branch pipe to a predetermined pressure ratio by the valve without supplying the additional gas from the additional gas supply device to the branch pipe, The gas supply device according to claim 2, wherein the degree of opening and closing of the valve is fixed in that state. 前記圧力比制御装置により前記分岐配管の混合ガスが所定の圧力比に調整された後に，前記付加ガス供給装置から前記分岐配管に付加ガスを供給する制御部をさらに備えたことを特徴とする，請求項３に記載のガス供給装置。The apparatus further comprises a control unit that supplies additional gas from the additional gas supply device to the branch pipe after the mixed gas in the branch pipe is adjusted to a predetermined pressure ratio by the pressure ratio control device. The gas supply device according to claim 3. 基板を収容する処理容器と，A processing container for containing a substrate;
複数のガス供給源と，Multiple gas sources;
前記複数のガス供給源から供給される複数のガスを混合する混合配管と，A mixing pipe for mixing a plurality of gases supplied from the plurality of gas supply sources;
前記混合配管で混合された混合ガスを分流して処理容器の複数箇所に供給する複数の分岐配管と，A plurality of branch pipes for dividing the mixed gas mixed in the mixing pipe and supplying the mixed gas to a plurality of locations in the processing vessel;
少なくとも一つの分岐配管を流れる混合ガスに所定の付加ガスを供給する付加ガス供給装置と，を備え，An additional gas supply device for supplying a predetermined additional gas to the mixed gas flowing through at least one branch pipe,
前記処理容器内に配置され，前記処理容器内の処理空間にガスを吐出させるためのシャワーヘッドを有し，A shower head disposed in the processing vessel, for discharging gas into the processing space in the processing vessel;
前記複数の分岐配管は，前記シャワーヘッドに接続されることを特徴とする基板処理装置。The substrate processing apparatus, wherein the plurality of branch pipes are connected to the shower head. ガス流量を調整するためのバルブと圧力計を各分岐配管に備え，Each branch pipe is equipped with a valve and pressure gauge to adjust the gas flow rate.
さらに，前記圧力計の計測結果に基づいて，前記バルブの開閉度を調整して，前記混合配管の混合ガスを所定の圧力比で前記分岐配管に分流する圧力比制御装置を備えたことを特徴とする，請求項５に記載の基板処理装置。And a pressure ratio control device that adjusts the degree of opening and closing of the valve based on the measurement result of the pressure gauge and diverts the mixed gas of the mixed pipe to the branch pipe at a predetermined pressure ratio. The substrate processing apparatus according to claim 5. 前記付加ガス供給装置は，前記分岐配管に連通する付加ガス供給配管を有し，The additional gas supply device has an additional gas supply pipe communicating with the branch pipe;
前記付加ガス供給配管は，前記圧力計と前記バルブの下流側に接続されていることを特徴とする，請求項６に記載の基盤処理装置。The substrate processing apparatus according to claim 6, wherein the additional gas supply pipe is connected to the downstream side of the pressure gauge and the valve. 前記圧力比制御装置は，前記付加ガス供給装置から分岐配管に前記付加ガスを供給しない状態で，前記各分岐配管に分流される混合ガスの圧力比を前記バルブにより所定の圧力比に調整し，その状態で前記バルブの開閉度を固定することを特徴とする，請求項７に記載の基盤処理装置。The pressure ratio control device adjusts the pressure ratio of the mixed gas divided into each branch pipe to a predetermined pressure ratio by the valve without supplying the additional gas from the additional gas supply device to the branch pipe, The base processing apparatus according to claim 7, wherein the degree of opening and closing of the valve is fixed in that state. 前記圧力比制御装置により前記分岐配管の混合ガスが所定の圧力比に調整された後に，前記付加ガス供給装置から前記分岐配管に付加ガスを供給する制御部をさらに備えたことを特徴とする，請求項８に記載の基盤処理装置。The apparatus further comprises a control unit that supplies additional gas from the additional gas supply device to the branch pipe after the mixed gas in the branch pipe is adjusted to a predetermined pressure ratio by the pressure ratio control device. The substrate processing apparatus according to claim 8. 前記複数の分岐配管は２本であり，The plurality of branch pipes are two,
前記２本の分岐配管は，前記シャワーヘッド内部で同心円状に区画された第１，第２のバッファ室にそれぞれ接続されることを特徴とする，請求項９に記載の基板処理装置。The substrate processing apparatus according to claim 9, wherein the two branch pipes are connected to first and second buffer chambers concentrically partitioned inside the shower head. 前記第１のバッファ室はシャワーヘッド中心部側に，前記第２のバッファ室は前記シャワーヘッド外周部側に配置され，The first buffer chamber is disposed on the shower head center side, and the second buffer chamber is disposed on the shower head outer peripheral side;
前記付加ガス供給装置が接続された分岐配管は，前記第２のバッファ室に接続されることを特徴とする，請求項１０に記載の基板処理装置。The substrate processing apparatus according to claim 10, wherein the branch pipe connected to the additional gas supply device is connected to the second buffer chamber. 前記処理容器内に配置され，前記基板を載置する載置部を有し，Disposed in the processing container, and having a placement portion for placing the substrate;
前記複数の分岐配管の内少なくとも１つは，前記処理容器の側面から，前記シャワーヘッドと前記載置部とで形成される空間にガスを供給できるよう接続されることを特徴とする，請求項５に記載の基板処理装置。The at least one of the plurality of branch pipes is connected from a side surface of the processing vessel so that gas can be supplied to a space formed by the shower head and the mounting portion. 5. The substrate processing apparatus according to 5. 複数のガス供給源と，Multiple gas sources;
前記複数のガス供給源から供給される複数のガスを混合する混合配管と，A mixing pipe for mixing a plurality of gases supplied from the plurality of gas supply sources;
前記混合配管で混合された混合ガスを分流して処理容器の複数箇所に供給する複数の分岐配管と，A plurality of branch pipes for dividing the mixed gas mixed in the mixing pipe and supplying the mixed gas to a plurality of locations in the processing vessel;
少なくとも一つの分岐配管を流れる混合ガスに所定の付加ガスを供給する付加ガス供給装置と，を有し，An additional gas supply device for supplying a predetermined additional gas to the mixed gas flowing through at least one branch pipe,
ガス流量を調整するためのバルブと圧力計を各分岐配管に備えたガス供給装置を用いた供給ガス設定方法であって，A supply gas setting method using a gas supply device provided with a valve and a pressure gauge for adjusting a gas flow rate in each branch pipe,
前記付加ガス供給装置から前記分岐配管に付加ガスを供給しない状態で，前記混合配管から各分岐配管に分流される混合ガスの圧力比を前記バルブにより所定の混合比に調整し，その後前記分岐配管の前記バルブの開閉度を固定する工程と，The pressure ratio of the mixed gas branched from the mixing pipe to each branch pipe is adjusted to a predetermined mixing ratio by the valve without supplying additional gas from the additional gas supply device to the branch pipe, and then the branch pipe Fixing the opening / closing degree of the valve of
その後，付加前記ガス供給装置から所定の前記分岐配管に所定流量の付加ガスを供給する工程と，を有することを特徴とする，供給ガス設定方法。And a step of supplying a predetermined flow rate of the additional gas from the additional gas supply device to the predetermined branch pipe.
JP2004357292A 2004-12-09 2004-12-09 Gas supply apparatus, substrate processing apparatus, and supply gas setting method Expired - Fee Related JP4358727B2 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2004357292A JP4358727B2 (en) 2004-12-09 2004-12-09 Gas supply apparatus, substrate processing apparatus, and supply gas setting method
US11/296,209 US20060124169A1 (en) 2004-12-09 2005-12-08 Gas supply unit, substrate processing apparatus, and supply gas setting method
TW094143443A TWI441254B (en) 2004-12-09 2005-12-08 A gas supply device, a substrate processing device, and a supply gas setting method
KR1020050119216A KR100753692B1 (en) 2004-12-09 2005-12-08 Gas supply unit, substrate processing apparatus and supply gas setting method
CNB2005101303873A CN100390933C (en) 2004-12-09 2005-12-09 Gas supply unit, substrate processing apparatus, and supply gas setting method
US12/651,165 US8906193B2 (en) 2004-12-09 2009-12-31 Gas supply unit, substrate processing apparatus and supply gas setting method
US13/691,125 US9441791B2 (en) 2004-12-09 2012-11-30 Gas supply unit, substrate processing apparatus and supply gas setting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004357292A JP4358727B2 (en) 2004-12-09 2004-12-09 Gas supply apparatus, substrate processing apparatus, and supply gas setting method

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JP2006165399A JP2006165399A (en) 2006-06-22
JP2006165399A5 true JP2006165399A5 (en) 2008-01-31
JP4358727B2 JP4358727B2 (en) 2009-11-04

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JP (1) JP4358727B2 (en)
KR (1) KR100753692B1 (en)
CN (1) CN100390933C (en)
TW (1) TWI441254B (en)

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