JP2006156724A - Method for measuring resistance of chip electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for measuring the resistance of a chip electronic component capable of stably measuring the resistance by surely contacting four terminals with electrodes. <P>SOLUTION: The chip electronic component includes first, second, third, and fourth electrodes 12, 13, 14, 15 formed on an insulation sheet board 11; a first resistor 16 formed between the first electrode 12 and the second electrode 13; a second resistor 17 formed between the first electrode 12 and the third electrode 14; and a third resistor 18 formed between the second electrode 13 and the fourth electrode 15. A high level voltage terminal 19 is in contact with one of the first and second electrodes 12, 13; a low level voltage terminal 20 is in contact with the other of the first and second electrodes 12, 13; a high level voltage terminal 21 is in contact with one of the third and fourth electrodes 14, 15; a low level voltage terminal 22 is in contact with the other of the third and fourth electrodes 14, 15; and the resistance of the first resistor 16 is measured by the four-terminal measurement method. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a resistance value measuring method for chip-shaped electronic components such as chip resistors and multiple chip resistors used in various electronic devices.

  As shown in FIG. 5A, a plurality of conventional chip-type electronic components such as this type of chip resistor and multiple chip resistor are provided on the upper surface of an insulating sheet-like insulating substrate 1 such as an alumina substrate. The pair of upper surface electrodes 2a and 2b are formed by screen printing / firing, and then, as shown in FIG. 5B, the resistor 3 is electrically connected to the plurality of pairs of upper surface electrodes 2a and 2b. It is formed by screen printing / firing, and then the resistance value of the resistor 3 is corrected to the required target resistance value. As a method for correcting the resistance value, after the resistor 3 is formed, a trimming groove is formed in the resistor 3 by using a laser, whereby the resistance of the resistor 3 positioned between the plurality of pairs of upper surface electrodes 2a and 2b is formed. A technique for increasing the value is generally used. In this resistance value correction, a resistance measurement terminal is brought into contact with the upper surface electrode to which a resistor whose resistance value is to be corrected is connected, and the resistance value is measured in this state until the target resistance value is reached. Processing with a laser.

  Since the resistance value measurement terminal brought into contact with the upper surface electrode in order to measure the resistance value has a resistance value, in order to measure the net resistance value of the resistor, the resistance value of the resistance value measurement terminal So-called four terminals that measure the resistance value while contacting the upper surface electrode with the terminal for measuring the resistance value of the terminal structure in which the current terminal and the voltage terminal are independent on the high voltage side and the low voltage side, respectively, so as not to include the value The measurement method is effective. In this case, by using this four-terminal measurement method rather than the two-terminal measurement method in which the current terminal and voltage terminal are not independent, precise resistance value measurement between the upper surface electrodes in contact with the resistance measurement terminals is performed. Is possible.

  In recent years, there has been an increasing demand for resistor tolerances and resistance values of 1Ω or less, which is a low resistance region. In order to achieve these resistance values with high accuracy, resistance values using a four-terminal measurement method are being used. A correction method is essential.

  When the resistance value of a resistor is corrected by using the four-terminal measurement method, conventionally, the resistance value of the resistor is measured by bringing a terminal for measuring the resistance value into contact with the upper surface electrode in an arrangement as shown in FIG. It was. That is, when the resistance value of the resistor 3 is measured, two terminals of the low potential side voltage terminal 4a and the low potential side current terminal 5a are simultaneously brought into contact with one upper surface electrode 2a to which the resistor 3 is connected, and Two terminals of the high potential side voltage terminal 4b and the high potential side current terminal 5b are simultaneously brought into contact with the other upper surface electrode 2b, and the resistance value is corrected while measuring the resistance value of the resistor 3 in this state. It was.

As prior art document information relating to the invention of this application, for example, Patent Document 1 is known.
JP-A-11-340002

  However, in recent years, miniaturization and high-density mounting of circuit-mounted components have progressed, and very small chip resistors (1005, 0603, 0402 sizes) have come into circulation.

  When the resistance values of these very small chip resistors are corrected, in the conventional four-terminal measurement method, as shown in FIG. 6, the resistor 3 for measuring the resistance value is electrically connected. One upper surface electrode 2a is in contact with two terminals of a low potential side voltage terminal 4a and a low potential side current terminal 5a, and the other upper surface electrode 2b is in contact with two terminals of a high potential side voltage terminal 4b and a high potential side current terminal 5b. The terminals need to be in contact with each other. However, in the above-mentioned very small chip resistors of 1005, 0603, and 0402 sizes, the area of the upper surface electrode is very small. There was a problem that it was very difficult to contact the terminals reliably. For example, since the area of the upper surface electrodes 2a and 2b is as small as 300 μm × 300 μm in a 1005 size chip resistor, the tip diameter of 100 μm conventionally used for such small upper surface electrodes 2a and 2b is used. It was very difficult to make sure that two resistance value measuring terminals each having a contact with each other were in contact with each other.

  One method for solving this problem is to use a resistance value measuring terminal having a narrower tip diameter as the size of the chip resistor is reduced. When the tip diameter is made thin, the terminal is easily bent, and there are inconveniences such that the life of the terminal for measuring the resistance value is shortened due to wear.

  Further, as seen in Japanese Patent Application Laid-Open No. 11-340002, a method has been proposed in which a dummy grid is formed between grids including resistors connected in series with a slit interposed therebetween to secure an electrode area. In this case, the number of chips that can be obtained on the same substrate is reduced, and it is not practical because it takes time and labor to sort out the dummy.

  The present invention solves the above-described conventional problems, and even when measuring the resistance value of a resistor having a very small area of the electrode portion, the four terminals can be surely brought into contact with the electrode and stable resistance measurement can be performed. An object of the present invention is to provide a resistance value measuring method for a chip-shaped electronic component.

  In order to achieve the above object, the present invention has the following configuration.

  The invention according to claim 1 of the present invention includes a first electrode, a second electrode, a third electrode, and a fourth electrode, which are formed so as to straddle the dividing grooves formed in the sheet-like insulating substrate. The first resistor formed so as to be electrically connected between the first electrode and the second electrode, and electrically between the first electrode and the third electrode A second resistor formed to be connected; and a third resistor formed to be electrically connected between the second electrode and the fourth electrode; A high potential side voltage terminal is brought into contact with one of the first electrode and the second electrode, and a low potential side voltage terminal is brought into contact with either one of the first electrode and the second electrode; and A high potential side current terminal is brought into contact with one of the third electrode and the fourth electrode, and the third electrode and the fourth electrode A low potential side current terminal is brought into contact with the other side, and the resistance value of the first resistor is measured by a four-terminal measurement method. According to this resistance value measurement method, the area of the electrode portion is measured. Even when measuring the resistance value of a very small resistor, it is possible to make stable resistance measurement by making sure that the four terminals are in contact with the electrode. It is.

  According to a second aspect of the present invention, there is provided a first electrode, a second electrode, a third electrode, and a fourth electrode, which are respectively formed so as to straddle the dividing grooves formed in the sheet-like insulating substrate. The first resistor formed so as to be electrically connected between the first electrode and the second electrode, and electrically between the first electrode and the third electrode A second resistor formed to be connected; and a third resistor formed to be electrically connected between the second electrode and the fourth electrode; A high potential side current terminal is brought into contact with one of the first electrode and the second electrode, and a low potential side current terminal is brought into contact with the other of the first electrode and the second electrode; and A high potential side voltage terminal is brought into contact with one of the third electrode and the fourth electrode, and the third electrode and the fourth electrode A low potential side voltage terminal is brought into contact with the other or the other, and the resistance value of the first resistor is measured by a four-terminal measurement method. According to this resistance value measurement method, the area of the electrode portion is measured. Even when measuring the resistance value of a very small resistor, it is possible to make stable resistance measurement by making sure that the four terminals are in contact with the electrode. It is.

  The invention according to claim 3 of the present invention includes a first electrode, a second electrode, a third electrode, and a fourth electrode, which are formed so as to straddle the dividing grooves formed in the sheet-like insulating substrate. The first resistor formed so as to be electrically connected between the first electrode and the second electrode, and electrically between the first electrode and the third electrode A second resistor formed to be connected; and a third resistor formed to be electrically connected between the second electrode and the fourth electrode; A high potential side current terminal is brought into contact with one of the first electrode and the fourth electrode, and a low potential side current terminal is brought into contact with the other of the first electrode and the fourth electrode; and A high potential side voltage terminal is brought into contact with one of the third electrode and the second electrode, and the third electrode and the second electrode A low potential side voltage terminal is brought into contact with the other or the other, and the resistance value of the first resistor is measured by a four-terminal measurement method. According to this resistance value measurement method, the area of the electrode portion is measured. Even when measuring the resistance value of a very small resistor, it is possible to make stable resistance measurement by making sure that the four terminals are in contact with the electrode. It is.

  According to a fourth aspect of the present invention, both the first electrode and the second electrode formed so as to straddle the divided grooves formed on the sheet-like insulating substrate and the adjacent divided grooves are provided. A third electrode formed to straddle, a first resistor formed to be electrically connected between the first electrode and the third electrode, and the first electrode A second resistor formed so as to be electrically connected to the second electrode, and a high-potential-side voltage terminal is provided on one of the first electrode and the third electrode. A low potential side voltage terminal is brought into contact with either one of the first electrode and the third electrode, and a high potential side current terminal is placed on one of the second electrode and the third electrode. And a low-potential side current terminal is brought into contact with one of the second electrode and the third electrode, and the four terminals The resistance value of the first resistor is measured by an ordinary method. According to this resistance value measuring method, even when the resistance value of a resistor having a very small area of the electrode portion is measured, four terminals are used. It is possible to reliably measure the resistance value by bringing the electrode into contact with the electrode, thereby having the effect of surely correcting the resistance value.

  In the invention according to claim 5 of the present invention, both the first electrode and the second electrode formed so as to straddle the dividing grooves formed on the sheet-like insulating substrate, and the adjacent dividing grooves are provided. A third electrode formed to straddle, a first resistor formed so as to be electrically connected between the first electrode and the second electrode, and the first electrode A second resistor formed so as to be electrically connected to the third electrode, and a high-potential-side current terminal is provided on one of the first electrode and the third electrode. A low potential side current terminal is brought into contact with either one of the first electrode and the third electrode, and a high potential side voltage terminal is placed on either the second electrode or the third electrode. And a low potential side voltage terminal is brought into contact with either one of the second electrode and the third electrode, and four terminals The resistance value of the first resistor is measured by an ordinary method. According to this resistance value measuring method, even when the resistance value of a resistor having a very small area of the electrode portion is measured, four terminals are used. It is possible to reliably measure the resistance value by bringing the electrode into contact with the electrode, thereby having the effect of surely correcting the resistance value.

  As described above, the resistance value measuring method for a chip-shaped electronic component according to the present invention includes the first electrode, the second electrode, and the third electrode that are formed so as to straddle the dividing grooves formed on the sheet-like insulating substrate. , A fourth electrode, a first resistor formed to be electrically connected between the first electrode and the second electrode, the first electrode and the third electrode, A second resistor formed to be electrically connected between the second electrode and a third resistor formed to be electrically connected between the second electrode and the fourth electrode. A high-potential-side voltage terminal is brought into contact with either the first electrode or the second electrode, and a low-potential-side voltage is applied to the other of the first electrode and the second electrode. A terminal, and a high potential side current terminal is brought into contact with one of the third electrode and the fourth electrode, and Since the low potential side current terminal is brought into contact with either one of the third electrode and the fourth electrode, and the resistance value of the first resistor is measured by the four-terminal measurement method, the area of the electrode portion Even when measuring the resistance value of a very small resistor, it is possible to stably measure the resistance value by reliably contacting the four terminals with the electrode, and this provides an excellent effect that the resistance value can be corrected reliably. Is.

(Embodiment 1)
Hereinafter, the invention described in the first to third aspects of the present invention will be described using the first embodiment.

  FIG. 1 shows an arrangement position of four terminals for measuring resistance values in a state where a plurality of electrodes and a plurality of resistors are formed on a sheet-like insulating substrate in the chip resistor according to the first embodiment of the present invention. It is a schematic diagram.

  In FIG. 1, reference numeral 11 denotes an insulating sheet-like insulating substrate such as an alumina substrate. On the upper surface of the sheet-like insulating substrate 11, a plurality of first electrodes 12 and second electrodes are provided so as to straddle the dividing grooves 23. The electrode 13, the third electrode 14, and the fourth electrode 15 are formed in a row by screen printing and firing, respectively. Between the plurality of first electrodes 12 and the second electrode 13 formed in the row, a plurality of first resistors 16 electrically connected thereto are arranged in a row by screen printing / firing. A plurality of second resistors 17 electrically connected to the plurality of first electrodes 12 and the third electrodes 14 are formed in a row by screen printing / firing; Further, a plurality of third resistors 18 electrically connected to the plurality of second electrodes 13 and the fourth electrodes 15 are formed in a row by screen printing / firing.

  In the above configuration, when the resistance values of the plurality of first resistors 16 electrically connected between the plurality of first electrodes 12 and the second electrode 13 formed in a row are corrected. Has a plurality of high potential side voltage terminals 19 in contact with a plurality of second electrodes 13, a plurality of low potential side voltage terminals 20 in contact with a plurality of first electrodes 12, and the fourth electrode 15. A plurality of high potential side current terminals 21 are brought into contact with each other and a plurality of low potential side current terminals 22 are brought into contact with a plurality of third electrodes 14. In this state, trimming is performed on the first resistor 16 using a laser. By forming the groove, the resistance value of the plurality of first resistors 16 electrically connected between the plurality of first electrodes 12 and the second electrode 13 is increased, and is required. Correct to the desired resistance value.

  Next, when correcting the resistance values of the plurality of third resistors 18 formed in a row, the high potential side voltage terminal 19, the low potential side voltage terminal 20, the high potential side current are changed from the state of FIG. The four terminals of the terminal 21 and the low potential side current terminal 22 are moved upward to break contact with the four electrodes 13, 12, 15, 14, and sheet-like insulation having a plurality of electrodes and a plurality of resistors. The stage (not shown) on which the substrate 11 is placed is moved to the left by the pitch determined by the adjacent dividing grooves 23. In this state, the high potential side voltage terminal 19 and the low potential side voltage terminal 20 are moved. Then, the four terminals of the high potential side current terminal 21 and the low potential side current terminal 22 are moved downward to come into contact with the four electrodes as shown in FIG. In this case, the high potential side voltage terminal 19 is located on the fourth electrode 15, the low potential side voltage terminal 20 is located on the second electrode 13, and the high potential side current terminal 21 is located on the other side of the fourth electrode 15. The low-potential-side current terminal 22 is in contact with the electrode 24 and the first electrode 12, and in this state, a plurality of second trimming grooves are formed in the third resistor 18 using a laser. The resistance values of the plurality of third resistors 18 electrically connected between the second electrode 13 and the fourth electrode 15 are increased to correct the desired resistance value.

  Next, when correcting the resistance values of the plurality of fourth resistors 25 formed in the row shown in FIG. 2, the high potential side voltage terminal 19, the low potential side voltage terminal 20, The four terminals of the high potential side current terminal 21 and the low potential side current terminal 22 are moved upward to cut off the contact with the four electrodes 15, 13, 24, 12 and have a plurality of electrodes and a plurality of resistors. The stage (not shown) on which the sheet-like insulating substrate 11 is placed is moved to the left by the pitch determined by the adjacent dividing grooves 23, and in this state, the high potential side voltage terminal 19, low potential The four terminals of the side voltage terminal 20, the high potential side current terminal 21, and the low potential side current terminal 22 are moved downward to come into contact with the four electrodes shown in FIG. In this case, the high potential side voltage terminal 19 is connected to the fifth electrode 24 located next to the fourth electrode 15, the low potential side voltage terminal 20 is connected to the fourth electrode 15, and the high potential side current terminal 21 is connected to the fifth electrode 24. The low potential side current terminal 22 comes into contact with the second electrode 13 to the sixth electrode 26 located next to the electrode 24, and in this state, the fourth resistor 25 is connected to the fourth resistor 25 using a laser. By forming the trimming groove, the resistance value of the plurality of fourth resistors 25 electrically connected between the plurality of fourth electrodes 15 and the fifth electrode 24 is increased, which is required. Correct to the desired resistance value.

  As described above, the resistance value correcting method according to the first embodiment of the present invention includes the four terminals of the high potential side voltage terminal 19, the low potential side voltage terminal 20, the high potential side current terminal 21, and the low potential side current terminal 22. An operation of moving up and down to disconnect or contact the four electrodes, and a stage (not shown) on which a sheet-like insulating substrate 11 having a plurality of electrodes and a plurality of resistors are placed. By sequentially repeating the operation of moving to the left by the pitch determined by the adjacent divided grooves 23, the resistance values of a plurality of resistors formed in a row are sequentially corrected. In the value correction method, the resistance value correction is performed by bringing two voltage terminals on the high potential side and the low potential side and two current terminals on the high potential side and the low potential side into contact with the four electrodes one by one. Because this If the resistance value correcting method is employed particularly in the resistance value correcting process of a small-sized square chip resistor, each of the two electrodes to which the resistor for measuring the resistance value is electrically connected as in the prior art is used. One resistance value measurement terminal can be used compared to the one in which two voltage terminals on the potential side and the low potential side and two current terminals on the high potential side and the low potential side are brought into contact with each other to correct the resistance value. Since the electrode area is increased, the certainty of contact of the resistance value measuring terminal with the electrode is increased. In this case, the resistance value measurement terminals in contact with the electrodes are different from each other with the first resistor 16 for correcting the resistance value between the high potential side voltage / current terminal and the low potential side voltage / current terminal. Although it is necessary to divide in the direction, if this contact condition is satisfied, the first resistor 16 is indirectly connected to the first and second electrodes 12 and 13 to which the first resistor 16 is directly connected. The third and fourth electrodes 14 and 15 need not select the contact between the voltage terminal and the current terminal.

  That is, in the first embodiment of the present invention, when the resistance values of the plurality of first resistors 16 formed in a row are corrected, a plurality of high potential side voltages are applied to the plurality of second electrodes 13. While contacting the terminal 19, the plurality of low potential side voltage terminals 20 are brought into contact with the plurality of first electrodes 12, and the plurality of high potential side current terminals 21 are brought into contact with the plurality of fourth electrodes 15, While the plurality of low potential side current terminals 22 are in contact with the plurality of third electrodes 14, the plurality of low potential side voltage terminals 20 are in contact with the plurality of second electrodes 13. A plurality of high potential side voltage terminals 19 are brought into contact with the plurality of first electrodes 12, and a plurality of low potential side current terminals 22 are brought into contact with the plurality of fourth electrodes 15. A plurality of high potential side current terminals 21 are connected to Or a plurality of high potential side current terminals 21 or low potential side current terminals 22 are brought into contact with the plurality of second electrodes 13, and a plurality of low potential side current terminals are connected to the plurality of first electrodes 12. 22 or the high potential side current terminal 21 is brought into contact with the plurality of fourth electrodes 15, and the plurality of high potential side voltage terminals 19 or the low potential side voltage terminals 20 are brought into contact with the plurality of third electrodes 14. A plurality of low potential side voltage terminals 20 or high potential side voltage terminals 19 may be brought into contact with each other, and a plurality of high potential side current terminals 21 or low potential side current terminals 22 are connected to the plurality of first electrodes 12. The plurality of fourth electrodes 15 are contacted with a plurality of low potential side current terminals 22 or high potential side current terminals 21, and the plurality of third electrodes 14 are contacted with a plurality of high potential side voltage terminals. 9 or the low potential side voltage terminal 20 may be brought into contact with each other, and a plurality of low potential side voltage terminals 20 or high potential side voltage terminals 19 may be brought into contact with the plurality of second electrodes 13. As in the first embodiment, the resistances of the plurality of first resistors 16 electrically connected between the plurality of first electrodes 12 and the second electrode 13 formed in a row. The value can be corrected.

(Embodiment 2)
Hereinafter, the invention described in the fourth and fifth aspects of the present invention will be described using the second embodiment.

  FIG. 3 shows an arrangement position of four terminals for measuring resistance values in a state where a plurality of electrodes and a plurality of resistors are formed on a sheet-like insulating substrate in the chip resistor according to the second embodiment of the present invention. It is a schematic diagram.

  In FIG. 3, reference numeral 31 denotes an insulating sheet-like insulating substrate such as an alumina substrate. On the upper surface of the sheet-like insulating substrate 31, a plurality of first electrodes 32 and second electrodes are provided so as to straddle the dividing grooves 34. The electrodes 33 are formed in rows by screen printing / firing, and the third electrodes 35 are formed in rows by screen printing / firing so as to straddle both adjacent divided grooves 34. A plurality of first resistors 36 are screen-printed and fired between the plurality of first electrodes 32 and the third electrode 35 formed in the row so as to be electrically connected thereto. A plurality of second resistors 37 are formed by screen printing and firing so as to be electrically connected to the plurality of first electrodes 32 and the second electrodes 33. It is formed with.

  In the above configuration, when the resistance values of the plurality of first resistors 36 electrically connected between the plurality of first electrodes 32 and the second electrode 33 formed in a row are corrected. The plurality of high potential side voltage terminals 38 are brought into contact with the plurality of first electrodes 32, and the plurality of low potential side voltage terminals 39 and the low potential side current terminals 40 are brought into contact with the plurality of third electrodes 35. Further, a plurality of high-potential-side current terminals 41 are brought into contact with the plurality of second electrodes 33, and in this state, trimming grooves are formed in the first resistor 36 using a laser. The resistance values of the plurality of first resistors 36 electrically connected between the electrode 32 and the third electrode 35 are increased to correct the desired resistance value.

  Next, when correcting the resistance values of the plurality of second resistors 37 formed in a row, the high potential side voltage terminal 38, the low potential side voltage terminal 39, the high potential side current are changed from the state of FIG. The four terminals of the terminal 41 and the low potential side current terminal 40 are moved upward to break the contact with the three electrodes 32, 35, 33, and the sheet-like insulating substrate 31 having a plurality of electrodes and a plurality of resistors. Is moved to the left by a pitch determined by adjacent dividing grooves 34, and in this state, the high potential side voltage terminal 38, the low potential side voltage terminal 39, The four terminals of the potential side current terminal 41 and the low potential side current terminal 40 are moved downward to contact the four electrodes as shown in FIG. In this case, the high potential side voltage terminal 38 is positioned on the second electrode 33, the low potential side voltage terminal 39 is positioned on the first electrode 32, and the high potential side current terminal 41 is positioned next to the second electrode 33. The low-potential-side current terminal 40 is in contact with the third electrode 35, and a trimming groove is formed in the second resistor 37 using a laser in this state. The resistance values of the plurality of second resistors 37 electrically connected between the first electrode 32 and the second electrode 33 are increased to correct the required resistance value.

  Next, when correcting the resistance values of the plurality of third resistors 43 formed in the row shown in FIG. 4, the high potential side voltage terminal 38, the low potential side voltage terminal 39, The four terminals of the high potential side current terminal 41 and the low potential side current terminal 40 are moved upward to cut off the contact with the four electrodes 33, 32, 42, and 35, and have a plurality of electrodes and a plurality of resistors. The stage (not shown) on which the sheet-like insulating substrate 31 is placed is moved to the left by the pitch determined by the adjacent dividing grooves 34, and in this state, the high potential voltage terminal 38, the low potential side The four terminals of the voltage terminal 39, the high potential side current terminal 41, and the low potential side current terminal 40 are moved downward to come into contact with the four electrodes shown in FIG. In this case, the high potential side voltage terminal 38 is connected to the fourth electrode 42 adjacent to the second electrode 33, the low potential side voltage terminal 39 is connected to the second electrode 33, and the high potential side current terminal 41 is connected to the fourth electrode 42. The low potential side current terminal 40 is in contact with the first electrode 32 and the fifth electrode 44 located next to the electrode 42, and in this state, the third resistor 43 is connected to the third resistor 43 using a laser. By forming the trimming groove, the resistance value of the plurality of third resistors 43 electrically connected between the plurality of second electrodes 33 and the other electrode 42 is increased, which is required. Correct to the desired resistance value.

  As described above, the resistance value correcting method according to the second embodiment of the present invention includes the four terminals of the high potential side voltage terminal 38, the low potential side voltage terminal 39, the high potential side current terminal 41, and the low potential side current terminal 40. By moving up and down, the contact with the three electrodes is initially cut off or brought into contact. In the second and subsequent stages, the operation of cutting off or bringing into contact with the four electrodes and the stage (not shown) on which the sheet-like insulating substrate 31 having a plurality of electrodes and a plurality of resistors are placed are combined. By sequentially repeating the operation of moving to the left by the pitch determined by the adjacent divided grooves 34, the resistance values of a plurality of resistors formed in a row are sequentially corrected. In the value correction method, of the two voltage terminals on the high potential side and the low potential side and the two current terminals on the high potential side and the low potential side, first, the two measurement terminals are placed in both adjacent divided grooves 34. Since the resistance value correction is performed by contacting one electrode formed across and contacting the remaining two measurement terminals one by one with each of the two electrodes, this resistance value correction method is In particular, small corners If it is adopted in the resistance value correction process of the resistor, two voltage terminals on the high potential side and the low potential side are respectively connected to two electrodes to which a resistor for measuring the resistance value is electrically connected as in the prior art. Compared to the case where the resistance value is corrected by bringing the two current terminals on the potential side and the low potential side into contact with each other, the electrode area that can be utilized by one resistance value measuring terminal increases. The certainty of contact with the electrode is increased. In this case, the resistance value measurement terminals in contact with the electrodes are different from each other with the first resistor 36 for correcting the resistance value between the high potential side voltage / current terminal and the low potential side voltage / current terminal. Although it is necessary to divide in the direction, if the contact condition is satisfied, the first resistor 36 is indirectly connected to the first and third electrodes 32 and 35 to which the first resistor 36 is directly connected. In the second electrode 33, it is not necessary to select the contact between the voltage terminal and the current terminal.

  That is, in the second embodiment of the present invention, when the resistance values of the plurality of first resistors 36 formed in a row are corrected, a plurality of high potential side voltages are applied to the plurality of first electrodes 32. The terminal 38 is brought into contact, the plurality of low potential side voltage terminals 39 and the low potential side current terminal 40 are brought into contact with the plurality of third electrodes 35, and the plurality of high potential side currents are brought into contact with the plurality of second electrodes 33. In contrast to this, the terminals 41 are in contact with each other, but conversely, a plurality of low potential side voltage terminals 39 are brought into contact with the plurality of first electrodes 32 and a plurality of high potentials are applied to the plurality of third electrodes 35. The side voltage terminal 38 and the high potential side current terminal 41 may be brought into contact with each other, and the plurality of low potential side current terminals 40 may be brought into contact with the plurality of second electrodes 33. Like form 2, formed in rows That the plurality of first electrodes 32 and in which can be performed electrically the attached correction of resistance values of a plurality of first resistor 36 between the second electrode 33.

  The resistance value measuring method of the chip-shaped electronic component according to the present invention, when measuring the resistance value of a resistor connected to an electrode smaller than conventional, without causing a contact failure with the electrode, resistance value measurement terminal, This has the effect that stable resistance value measurement is possible and resistance value correction can be performed reliably, and is useful as a resistance value measurement method for a resistor constituting a chip-like electronic component mounted on a rotating substrate.

The chip resistor in Embodiment 1 of this invention WHEREIN: The schematic diagram which showed the arrangement position of four terminals for resistance value measurement in the state which formed the some electrode and the some resistor on the sheet-like insulating substrate Schematic diagram showing a state where the arrangement position of the four terminals for measuring the resistance value is changed. The chip resistor in Embodiment 2 of this invention WHEREIN: The schematic diagram which showed the arrangement position of four terminals for resistance value measurement in the state which formed the some electrode and the some resistor on the sheet-like insulating substrate Schematic diagram showing a state where the arrangement position of the four terminals for measuring the resistance value is changed. (A) (b) Manufacturing process diagram showing a manufacturing process of a conventional chip-shaped electronic component Schematic diagram showing the arrangement positions of four terminals for measuring resistance values in a state where a plurality of electrodes and a plurality of resistors are formed on a sheet-like insulating substrate in a conventional chip-shaped electronic component

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Sheet-like insulating substrate 12 1st electrode 13 2nd electrode 14 3rd electrode 15 4th electrode 16 1st resistor 17 2nd resistor 18 3rd resistor 19 High potential side voltage terminal 20 Low-potential-side voltage terminal 21 High-potential-side current terminal 22 Low-potential-side current terminal 23 Dividing groove 31 Sheet-like insulating substrate 32 First electrode 33 Second electrode 34 Dividing groove 35 Third electrode 36 First resistance Body 37 second resistor 38 high potential side voltage terminal 39 low potential side voltage terminal 40 low potential side current terminal 41 high potential side current terminal

Claims (5)

A first electrode, a second electrode, a third electrode, a fourth electrode, which are formed so as to straddle the dividing grooves formed on the sheet-like insulating substrate, and the first electrode and the second electrode; A first resistor formed to be electrically connected between the first electrode and a second resistor formed to be electrically connected between the first electrode and the third electrode. And a third resistor formed so as to be electrically connected between the second electrode and the fourth electrode, and any one of the first electrode and the second electrode One of the first electrode and the second electrode is brought into contact with either one of the first electrode and the second electrode, and the other one of the third electrode and the fourth electrode is brought into contact with the other. A high potential side current terminal is brought into contact with either one of the third electrode and the fourth electrode, and a low potential side current terminal is disposed on the other side. By touch, the resistance value measuring method of the electronic chip components which is adapted to measure the resistance value of the first resistor by the four probe measurement method. A first electrode, a second electrode, a third electrode, a fourth electrode, which are formed so as to straddle the dividing grooves formed on the sheet-like insulating substrate, and the first electrode and the second electrode; A first resistor formed to be electrically connected between the first electrode and a second resistor formed to be electrically connected between the first electrode and the third electrode. And a third resistor formed so as to be electrically connected between the second electrode and the fourth electrode, and any one of the first electrode and the second electrode One of the first electrode and the second electrode is brought into contact with either one of the first electrode and the second electrode, and the other one of the third electrode and the fourth electrode is brought into contact with the other. A high potential side voltage terminal is brought into contact with either one of the third electrode and the fourth electrode. By touch, the resistance value measuring method of the electronic chip components which is adapted to measure the resistance value of the first resistor by the four probe measurement method. A first electrode, a second electrode, a third electrode, a fourth electrode, which are formed so as to straddle the dividing grooves formed on the sheet-like insulating substrate, and the first electrode and the second electrode; A first resistor formed to be electrically connected between the first electrode and a second resistor formed to be electrically connected between the first electrode and the third electrode. And a third resistor formed so as to be electrically connected between the second electrode and the fourth electrode, and any one of the first electrode and the fourth electrode. One of the first electrode and the fourth electrode is brought into contact with either one of the first electrode and the fourth electrode, and the other of the third electrode and the second electrode is brought into contact with the other. A high potential side voltage terminal is brought into contact with either one of the third electrode and the second electrode, and a low potential side voltage terminal is disposed on the other of the third electrode and the second electrode. By touch, the resistance value measuring method of the electronic chip components which is adapted to measure the resistance value of the first resistor by the four probe measurement method. A first electrode formed so as to straddle the divided grooves formed on the sheet-like insulating substrate, a second electrode, and a third electrode formed so as to straddle both of the adjacent divided grooves; A first resistor formed to be electrically connected between the first electrode and the third electrode, and electrically connected between the first electrode and the second electrode A high-voltage side voltage terminal is brought into contact with either one of the first electrode and the third electrode, and the first electrode and the third resistor. A low potential side voltage terminal is brought into contact with one of the other electrodes, and a high potential side current terminal is brought into contact with either one of the second electrode and the third electrode, and the second electrode and the third electrode are brought into contact with each other. A low-potential-side current terminal is brought into contact with one of the other electrodes, and the resistance of the first resistor is measured by a four-terminal measurement method. Resistance measuring method of the electronic chip components which is adapted to measure the value. A first electrode formed so as to straddle the divided grooves formed on the sheet-like insulating substrate, a second electrode, and a third electrode formed so as to straddle both of the adjacent divided grooves; A first resistor formed to be electrically connected between the first electrode and the second electrode, and electrically connected between the first electrode and the third electrode A second resistor formed in such a manner that a high-potential-side current terminal is brought into contact with one of the first electrode and the second electrode, and the first electrode and the second electrode A low-potential-side current terminal is brought into contact with either one of the electrodes, and a high-potential-side voltage terminal is brought into contact with either one of the second electrode and the third electrode. A low-potential-side voltage terminal is brought into contact with one of the other electrodes, and the resistance of the first resistor is measured by a four-terminal measurement method. Resistance measuring method of the electronic chip components which is adapted to measure the value.

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