JP4682601B2 - Resistance value correction method for chip-shaped electronic components - Google Patents

Resistance value correction method for chip-shaped electronic components Download PDF

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JP4682601B2
JP4682601B2 JP2004345369A JP2004345369A JP4682601B2 JP 4682601 B2 JP4682601 B2 JP 4682601B2 JP 2004345369 A JP2004345369 A JP 2004345369A JP 2004345369 A JP2004345369 A JP 2004345369A JP 4682601 B2 JP4682601 B2 JP 4682601B2
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potential side
resistor
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JP2006156724A5 (en
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光明 中尾
秀二 有賀
健 井関
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Panasonic Corp
Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Description

本発明は、各種電子機器に使用されるチップ抵抗器や多連チップ抵抗器等のチップ状電子部品の抵抗値修正方法に関するものである。 The present invention relates to a method for correcting a resistance value of a chip-shaped electronic component such as a chip resistor or a multiple chip resistor used in various electronic devices.

従来のこの種のチップ抵抗器や多連チップ抵抗器等のチップ状電子部品は、図５（ａ）に示すように、アルミナ基板等の絶縁性を有するシート状の絶縁基板１の上面に複数対の上面電極２ａ，２ｂをスクリーン印刷・焼成により形成し、その後、図５（ｂ）に示すように、前記複数対の上面電極２ａ，２ｂに電気的に接続されるように抵抗体３をスクリーン印刷・焼成により形成し、その後、この抵抗体３の抵抗値を要求される目的の抵抗値に修正するようにしている。この抵抗値の修正方法としては、抵抗体３を形成した後、レーザーを用いて抵抗体３にトリミング溝を形成することにより、複数対の上面電極２ａ，２ｂ間に位置する抵抗体３の抵抗値を上昇させる手法が一般的に利用されている。この抵抗値修正は、抵抗値修正を目的とする抵抗体が接続されている上面電極に抵抗値測定用の端子を接触させ、この状態で抵抗値を測定しながら目的とする抵抗値になるまでレーザーで加工を行う。   As shown in FIG. 5A, a plurality of conventional chip-type electronic components such as this type of chip resistor and multiple chip resistor are provided on the upper surface of an insulating sheet-like insulating substrate 1 such as an alumina substrate. The pair of upper surface electrodes 2a and 2b are formed by screen printing / firing, and then, as shown in FIG. 5B, the resistor 3 is electrically connected to the plurality of pairs of upper surface electrodes 2a and 2b. It is formed by screen printing / firing, and then the resistance value of the resistor 3 is corrected to the required target resistance value. As a method for correcting the resistance value, after the resistor 3 is formed, a trimming groove is formed in the resistor 3 by using a laser, whereby the resistance of the resistor 3 positioned between the plurality of pairs of upper surface electrodes 2a and 2b is formed. A technique for increasing the value is generally used. In this resistance value correction, a resistance measurement terminal is brought into contact with the upper surface electrode to which a resistor whose resistance value is to be corrected is connected, and the resistance value is measured in this state until the target resistance value is reached. Processing with a laser.

抵抗値を測定するために上面電極に接触させる抵抗値測定用の端子は抵抗値を持っているため、抵抗体の正味の抵抗値を測定するためには、この抵抗値測定用の端子の抵抗値を含まないように、電流端子と電圧端子を高電圧側と低電圧側にそれぞれ独立させた端子構造の抵抗値測定用の端子を上面電極に接触させながら抵抗値を測定する、いわゆる四端子測定法が有効である。この場合、電流端子と電圧端子が独立していない二端子測定法よりも、この四端子測定法を使用することにより、抵抗値測定用の端子を接触させた上面電極間の精密な抵抗値測定が可能となる。   Since the resistance value measurement terminal brought into contact with the upper surface electrode in order to measure the resistance value has a resistance value, in order to measure the net resistance value of the resistor, the resistance value of the resistance value measurement terminal So-called four terminals that measure the resistance value while contacting the upper surface electrode with the terminal for measuring the resistance value of the terminal structure in which the current terminal and the voltage terminal are independent on the high voltage side and the low voltage side, respectively, so as not to include the value The measurement method is effective. In this case, by using this four-terminal measurement method rather than the two-terminal measurement method in which the current terminal and voltage terminal are not independent, precise resistance value measurement between the upper surface electrodes in contact with the resistance measurement terminals is performed. Is possible.

近年、抵抗体の狭公差の要求や、低抵抗領域である１Ω以下の抵抗値の要求が高まっており、これらの抵抗値を精度良く達成するためには、四端子測定法を用いた抵抗値修正方法が必要不可欠である。   In recent years, there has been an increasing demand for resistor tolerances and resistance values of 1Ω or less, which is a low resistance region. In order to achieve these resistance values with high accuracy, resistance values using a four-terminal measurement method are being used. A correction method is essential.

四端子測定法を用いて抵抗体の抵抗値を修正する場合、従来は、抵抗値測定用の端子を図６に示すような配置で上面電極に接触させて抵抗体の抵抗値測定が行われていた。すなわち、抵抗体３の抵抗値を測定する場合、抵抗体３が接続された一方の上面電極２ａに低電位側の電圧端子４ａと低電位側の電流端子５ａの二端子を同時に接触させ、かつ他方の上面電極２ｂに高電位側の電圧端子４ｂと高電位側の電流端子５ｂの二端子を同時に接触させ、この状態で抵抗体３の抵抗値を測定しながら抵抗値修正を行うようにしていた。   When the resistance value of a resistor is corrected by using the four-terminal measurement method, conventionally, the resistance value of the resistor is measured by bringing a terminal for measuring the resistance value into contact with the upper surface electrode in an arrangement as shown in FIG. It was. That is, when the resistance value of the resistor 3 is measured, two terminals of the low potential side voltage terminal 4a and the low potential side current terminal 5a are simultaneously brought into contact with one upper surface electrode 2a to which the resistor 3 is connected, and Two terminals of the high potential side voltage terminal 4b and the high potential side current terminal 5b are simultaneously brought into contact with the other upper surface electrode 2b, and the resistance value is corrected while measuring the resistance value of the resistor 3 in this state. It was.

なお、この出願の発明に関する先行技術文献情報としては、例えば、特許文献１が知られている。
特開平１１−３４０００２号公報 As prior art document information relating to the invention of this application, for example, Patent Document 1 is known.
JP-A-11-340002

しかしながら、近年、回路実装部品の小形化・高密度実装化が進み、非常に小さいチップ抵抗器（１００５、０６０３、０４０２サイズ）が出回るようになってきている。   However, in recent years, miniaturization and high-density mounting of circuit-mounted components have progressed, and very small chip resistors (1005, 0603, 0402 sizes) have come into circulation.

これらの非常に小さいチップ抵抗器の抵抗値修正を行う場合、従来から用いられている四端子測定法においては、図６に示すように、抵抗値測定を行う抵抗体３が電気的に接続されている一方の上面電極２ａに低電位側電圧端子４ａおよび低電位側電流端子５ａの二端子を接触させ、かつ他方の上面電極２ｂに高電位側電圧端子４ｂおよび高電位側電流端子５ｂの二端子を接触させる必要があるが、上記１００５、０６０３、０４０２サイズの非常に小さいチップ抵抗器においては、上面電極の面積が非常に小さいため、一方の上面電極２ａまたは他方の上面電極２ｂにそれぞれ二端子を確実に接触させるのは非常に難しいという問題点を有していた。例えば、１００５サイズのチップ抵抗器では、上面電極２ａ，２ｂの面積が３００μｍ×３００μｍと非常に小さいため、このような面積の小さい上面電極２ａ，２ｂに、従来から用いられている１００μｍの先端径を有する抵抗値測定用の端子をそれぞれ２個ずつ確実に接触させるということは非常に困難を伴うものであった。   When the resistance values of these very small chip resistors are corrected, in the conventional four-terminal measurement method, as shown in FIG. 6, the resistor 3 for measuring the resistance value is electrically connected. One upper surface electrode 2a is in contact with two terminals of a low potential side voltage terminal 4a and a low potential side current terminal 5a, and the other upper surface electrode 2b is in contact with two terminals of a high potential side voltage terminal 4b and a high potential side current terminal 5b. The terminals need to be in contact with each other. However, in the above-mentioned very small chip resistors of 1005, 0603, and 0402 sizes, since the area of the upper surface electrode is very small, the upper surface electrode 2a or the other upper surface electrode 2b has two There was a problem that it was very difficult to contact the terminals reliably. For example, since the area of the upper surface electrodes 2a and 2b is as small as 300 μm × 300 μm in a 1005 size chip resistor, the tip diameter of 100 μm conventionally used for such small upper surface electrodes 2a and 2b is used. It was very difficult to make sure that two resistance value measuring terminals each having a contact with each other were in contact with each other.

この問題を解決する１つの方法として、チップ抵抗器のサイズが小さくなるにつれてより細い先端径を有する抵抗値測定用の端子を使用するという方法がとられているが、抵抗値測定用の端子の先端径を細くすると、端子が折れ曲がりやすく、また、磨耗によって抵抗値測定用の端子の寿命が短くなるなどの不都合が生じていた。   One method for solving this problem is to use a resistance value measuring terminal having a narrower tip diameter as the size of the chip resistor is reduced. When the tip diameter is made thin, the terminal is easily bent, and there are inconveniences such that the life of the terminal for measuring the resistance value is shortened due to wear.

また、特開平１１−３４０００２号公報に見られるように、スリットを挟んで直列に接続する抵抗体を含む格子の間に、ダミー格子を形成して電極面積を確保する方法が提案されているが、この場合は、同一基板で取得できるチップ数が減少してしまい、かつダミーを選別する手間等が必要となるため、実用的ではなかった。   Further, as seen in Japanese Patent Application Laid-Open No. 11-340002, a method has been proposed in which a dummy grid is formed between grids including resistors connected in series with a slit interposed therebetween to secure an electrode area. In this case, the number of chips that can be obtained on the same substrate is reduced, and it is not practical because it takes time and labor to sort out the dummy.

本発明は上記従来の課題を解決するもので、電極部分の面積が非常に小さい抵抗体の抵抗値測定をする場合でも、四端子を確実に電極に接触させて安定した抵抗値測定が可能となり、これにより、抵抗値修正も確実に行えるチップ状電子部品の抵抗値修正方法を提供することを目的とするものである。 The present invention solves the above-described conventional problems, and even when measuring the resistance value of a resistor with a very small area of the electrode portion, it is possible to stably measure the resistance value by making the four terminals securely contact the electrode. Thus, an object of the present invention is to provide a resistance value correcting method for a chip-shaped electronic component that can also reliably correct the resistance value .

上記目的を達成するために、本発明は以下の構成を有するものである。   In order to achieve the above object, the present invention has the following configuration.

本発明の請求項１に記載の発明は、シート状の絶縁基板に形成された抵抗体の抵抗値を高電位側電圧端子、低電位側電圧端子、高電位側電流端子および低電位側電流端子の４個の端子を用いて前記抵抗体の抵抗値を測定しながら前記抵抗体の抵抗値修正をするチップ状電子部品の抵抗値修正方法であって、前記絶縁基板は、前記絶縁基板に形成された分割溝を跨ぐように形成された第１の電極、第２の電極、第３の電極、第４の電極および第５の電極と、前記第１の電極と前記第２の電極との間に電気的に接続されるように形成された第１の抵抗体と、前記第１の電極と前記第３の電極との間に電気的に接続されるように形成された第２の抵抗体と、前記第２の電極と前記第４の電極との間に電気的に接続されるように形成された第３の抵抗体と、前記第４の電極と前記第５の電極との間に電気的に接続されるように形成された第４の抵抗体とを有するものであり、前記高電位側電圧端子および前記高電位側電流端子の一方を前記第１の電極に他方を前記第３の電極にそれぞれ接触させるとともに、前記低電位側電圧端子および前記低電位側電流端子の一方を前記第２の電極に他方を前記第４の電極にそれぞれ接触させ、または、前記低電位側電圧端子および前記低電位側電流端子の一方を前記第１の電極に他方を前記第３の電極にそれぞれ接触させるとともに、前記高電位側電圧端子および前記高電位側電流端子の一方を前記第２の電極に他方を前記第４の電極にそれぞれ接触させて、前記第３の電極、前記第１の電極、前記第２の電極、前記第４の電極の４個の電極および前記第２の抵抗体、前記第１の抵抗体、前記第３の抵抗体の３個の抵抗体を一つの測定領域とし、かつこの一つの測定領域の中で前記第１の抵抗体の抵抗値を四端子測定法により測定しながらこの第１の抵抗体をレーザーを用いてトリミングして目的の抵抗値まで抵抗値修正を行い、次に、前記高電位側電圧端子、前記低電位側電圧端子、前記高電位側電流端子および前記低電位側電流端子をそれぞれが接触している前記第１の電極、前記第２の電極、前記第３の電極または前記第４の電極との接触を絶たせるようにこれらの電極の上方に動かし、次に、前記絶縁基板を移動させることによって、前記第１の抵抗体をトリミングする際に前記第１の電極と接触していた端子を前記第２の電極の上方へ、前記第２の電極と接触していた端子を前記第４の電極の上方へ、前記第３の電極と接触していた端子を前記第１の電極の上方へ、前記第４の電極と接触していた端子を前記第５の電極の上方へそれぞれ移動させ、次に、前記高電位側電圧端子、前記低電位側電圧端子、前記高電位側電流端子および前記低電位側電流端子をそれぞれの下方に位置する電極と接触するように下方に動かし、次に、前記第１の電極、前記第２の電極、前記第４の電極、前記第５の電極の４個の電極および前記第１の抵抗体、前記第３の抵抗体、前記第４の抵抗体の３個の抵抗体を一つの測定領域とし、かつこの一つの測定領域の中で前記第３の抵抗体の抵抗値を四端子測定法により測定しながらこの第３の抵抗体をレーザーを用いてトリミングして目的の抵抗値まで抵抗値修正を行なうようにしたもので、この抵抗値修正方法によれば、電極部分の面積が非常に小さい抵抗体の抵抗値測定をする場合でも、四端子を確実に電極に接触させて安定した抵抗値測定が可能となり、これにより、抵抗値修正も確実に行えるという作用効果を有するものである。 According to the first aspect of the present invention, the resistance value of the resistor formed on the sheet-like insulating substrate is set to the high potential side voltage terminal, the low potential side voltage terminal, the high potential side current terminal, and the low potential side current terminal. A resistance value correction method for a chip-shaped electronic component, wherein the resistance value of the resistor is corrected while measuring the resistance value of the resistor using the four terminals, wherein the insulating substrate is formed on the insulating substrate. A first electrode, a second electrode, a third electrode, a fourth electrode and a fifth electrode formed so as to straddle the divided grooves, and the first electrode and the second electrode a first resistor which is formed to be electrically connected between a second resistor formed so as to be electrically connected between the third electrode and the first electrode body and, third resistor formed so as to be electrically connected between the second electrode and the fourth electrode When, is intended to have a fourth resistor which is formed so as to be electrically connected between the fourth electrode and the fifth electrode, the high-potential-side voltage terminal and the high One of the potential side current terminals is brought into contact with the first electrode and the other is brought into contact with the third electrode, and one of the low potential side voltage terminal and the low potential side current terminal is brought into contact with the second electrode. The fourth electrode is brought into contact with each other, or one of the low potential side voltage terminal and the low potential side current terminal is brought into contact with the first electrode and the other is brought into contact with the third electrode, and the high potential One of a side voltage terminal and the high potential side current terminal is brought into contact with the second electrode and the other is brought into contact with the fourth electrode, respectively, and the third electrode, the first electrode, the second electrode, four electrodes and the said fourth electrode 2 of the resistor, the first resistor, the three resistors of the third resistor and a measurement area, and the resistance value of the first resistor in this one measurement region The first resistor is trimmed using a laser while measuring by a four-terminal measurement method, and the resistance value is corrected to a target resistance value . Next, the high potential side voltage terminal, the low potential side voltage terminal, The high-potential-side current terminal and the low-potential-side current terminal are disconnected from the first electrode, the second electrode, the third electrode, or the fourth electrode that are in contact with each other. The terminal that was in contact with the first electrode when trimming the first resistor is moved by moving the insulating substrate above the electrode and then moving the insulating substrate. Upwardly, the terminal that has been in contact with the second electrode is connected to the fourth electrode. The terminal that has been in contact with the third electrode is moved above the first electrode, and the terminal that has been in contact with the fourth electrode is moved above the fifth electrode. Then, the high potential side voltage terminal, the low potential side voltage terminal, the high potential side current terminal and the low potential side current terminal are moved downward so as to be in contact with the electrodes located below, respectively, , The first electrode, the second electrode, the fourth electrode, the four electrodes of the fifth electrode, the first resistor, the third resistor, and the fourth resistor The three resistors are used as one measurement region, and the third resistor is measured using a laser while measuring the resistance value of the third resistor by the four-terminal measurement method in the one measurement region. trimmed Te which was to carry out the resistance value correction to the resistance value of the objective, the According to the resistance value correction method, even when measuring the resistance value of a resistor with a very small area of the electrode part, it is possible to reliably measure the resistance value by bringing the four terminals into contact with the electrode reliably. This has the effect that the value can be corrected reliably.

本発明の請求項２に記載の発明は、特に、前記第１の抵抗体の抵抗値修正を行なう際に、高電位側電圧端子および低電位側電圧端子の一方を前記第１の電極に他方を前記第２の電極に接触させ、高電位側電流端子および低電位側電流端子の一方を前記第３の電極に他方を前記第４の電極に接触させたもので、この抵抗値修正方法によれば、電極部分の面積が非常に小さい抵抗体の抵抗値測定をする場合でも、四端子を確実に電極に接触させて安定した抵抗値測定が可能となり、これにより、抵抗値修正も確実に行えるという作用効果を有するものである。 In the invention according to claim 2 of the present invention, in particular, when correcting the resistance value of the first resistor, one of the high potential side voltage terminal and the low potential side voltage terminal is used as the first electrode. Is contacted with the second electrode, and one of the high potential side current terminal and the low potential side current terminal is brought into contact with the third electrode, and the other is contacted with the fourth electrode. According to this, even when measuring the resistance value of a resistor with a very small area of the electrode part, it is possible to reliably measure the resistance value by bringing the four terminals into contact with the electrode reliably. It has the effect of being able to do.

本発明の請求項３に記載の発明はシート状の絶縁基板に形成された抵抗体の抵抗値を高電位側電圧端子、低電位側電圧端子、高電位側電流端子および低電位側電流端子の４個の端子を用いて前記抵抗体の抵抗値を測定しながら前記抵抗体の抵抗値修正をするチップ状電子部品の抵抗値修正方法であって、前記絶縁基板は、前記絶縁基板に形成された分割溝を跨ぐように形成された第１の電極、第２の電極および第４の電極と、相隣る分割溝の両方を跨ぐように形成された第３の電極と、前記第１の電極と前記第３の電極との間に電気的に接続されるように形成された第１の抵抗体と、前記第１の電極と前記第２の電極との間に電気的に接続されるように形成された第２の抵抗体と、前記第２の電極と前記第４の電極との間に電気的に接続されるように形成された第３の抵抗体を有するものであり、前記高電位側電圧端子および前記高電位側電流端子の一方を前記第１の端子に他方を前記第２の端子にそれぞれ接触させるとともに、前記低電位側電圧端子および前記低電位側電流端子の一方を前記第３の電極における前記第１の抵抗体側の分割溝側に他方を前記第３の電極における前記分割溝に相隣る分割溝側にそれぞれ接触させて、または、前記低電位側電圧端子および前記低電位側電流端子の一方を前記第１の端子に他方を前記第２の端子にそれぞれ接触させるとともに、前記高電位側電圧端子および前記高電位側電流端子の一方を前記第３の電極における前記第１の抵抗体側の分割溝側に他方を前記第３の電極における前記分割溝に相隣る分割溝側にそれぞれ接触させて、前記第３の電極、前記第１の電極、前記第２の電極の３個の電極および前記第１の抵抗体、前記第２の抵抗体の２個の抵抗体を一つの測定領域とし、かつこの一つの測定領域の中で前記第１の抵抗体の抵抗値を四端子測定法により測定しながらこの第１の抵抗体をレーザーを用いてトリミングして目的の抵抗値まで抵抗値修正を行い、次に、前記高電位側電圧端子、前記低電位側電圧端子、前記高電位側電流端子および前記低電位側電流端子をそれぞれが接触している前記第１の電極、前記第２の電極または前記第３の電極との接触を絶たせるようにこれらの電極の上方に動かし、次に、前記絶縁基板を移動させることによって、前記第１の抵抗体をトリミングする際に前記第１の電極と接触していた端子を前記第２の電極の上方へ、前記第２の電極と接触していた端子を前記第４の電極の上方へ、前記第３の電極における前記第１の抵抗体側の分割溝側と接触していた端子を前記第１の電極の上方へ、前記第３の電極における前記分割溝に相隣る分割溝側と接触していた端子を前記第３の電極における前記第１の抵抗体側の分割溝側の上方へそれぞれ移動させ、次に、前記高電位側電圧端子、前記低電位側電圧端子、前記高電位側電流端子および前記低電位側電流端子をそれぞれの下方に位置する電極と接触するように下方に動かし、次に、前記第１の電極、前記第２の電極、前記第３の電極、前記第４の電極の４個の電極および前記第１の抵抗体、前記第２の抵抗体、前記第３の抵抗体の３個の抵抗体を一つの測定領域とし、かつこの一つの測定領域の中で前記第２の抵抗体の抵抗値を四端子測定法により測定しながらこの第２の抵抗体をレーザーを用いてトリミングして目的の抵抗値まで抵抗値修正を行なうようにしたもので、この抵抗値修正方法によれば、電極部分の面積が非常に小さい抵抗体の抵抗値測定をする場合でも、四端子を確実に電極に接触させて安定した抵抗値測定が可能となり、これにより、抵抗値修正も確実に行えるという作用効果を有するものである。 According to a third aspect of the present invention, the resistance value of the resistor formed on the sheet-like insulating substrate is set to the high potential side voltage terminal, the low potential side voltage terminal, the high potential side current terminal, and the low potential side current terminal. A method of correcting a resistance value of a chip-like electronic component that corrects the resistance value of the resistor while measuring the resistance value of the resistor using four terminals, wherein the insulating substrate is formed on the insulating substrate. The first electrode, the second electrode and the fourth electrode formed so as to straddle the divided grooves, the third electrode formed so as to straddle both adjacent divided grooves, and the first electrode A first resistor formed to be electrically connected between the electrode and the third electrode, and electrically connected between the first electrode and the second electrode; The second resistor formed as described above is electrically connected between the second electrode and the fourth electrode. A third resistor formed as described above, wherein one of the high potential side voltage terminal and the high potential side current terminal is brought into contact with the first terminal and the other is brought into contact with the second terminal. One of the low-potential-side voltage terminal and the low-potential-side current terminal is divided adjacent to the dividing groove on the first resistor side of the third electrode, and the other is adjacent to the dividing groove on the third electrode. Each of the low potential side voltage terminal and the low potential side current terminal is brought into contact with the first terminal while the other is brought into contact with the second terminal, and the high potential side voltage is brought into contact with the groove side. One of the terminal and the high-potential side current terminal is brought into contact with the dividing groove on the first resistor side of the third electrode, and the other is brought into contact with the dividing groove side adjacent to the dividing groove in the third electrode. And said 3 electrodes, the first electrode, the three electrodes of the second electrode, the first resistor, and the two resistors of the second resistor are used as one measurement region. While measuring the resistance value of the first resistor in one measurement region by a four-terminal measurement method, the first resistor is trimmed using a laser to correct the resistance value to the target resistance value, and In addition, the first electrode, the second electrode, or the second electrode each contacting the high potential side voltage terminal, the low potential side voltage terminal, the high potential side current terminal, and the low potential side current terminal. 3 is moved above these electrodes so as to cut off the contact with the three electrodes, and then the insulating substrate is moved to contact the first electrode when trimming the first resistor. The second terminal is placed above the second electrode. The terminal that has been in contact with the pole is above the fourth electrode, and the terminal that is in contact with the split groove side on the first resistor side of the third electrode is above the first electrode. The terminal that has been in contact with the side of the split groove adjacent to the split groove in the third electrode is moved above the split groove side on the first resistor side of the third electrode, respectively, The potential-side voltage terminal, the low-potential-side voltage terminal, the high-potential-side current terminal, and the low-potential-side current terminal are moved downward so as to be in contact with the electrodes positioned below, respectively, and then the first electrode , The second electrode, the third electrode, the four electrodes of the fourth electrode, and the three resistors of the first resistor, the second resistor, and the third resistor And a resistance value of the second resistor within the one measurement region. Which was to perform the trimming to the resistance value modified until the resistance value of the objective by means of a laser the second resistor while measured by the four probe measurement method, according to the resistance value correction method, the electrode portions Even when measuring the resistance value of a resistor with a very small area, it is possible to stably measure the resistance value by reliably contacting the four terminals with the electrode, thereby having the effect that the resistance value can be corrected reliably. Is.

以上のように本発明のチップ状電子部品の抵抗値修正方法は、電極部分の面積が非常に小さい抵抗体の抵抗値測定をする場合でも、四端子を確実に電極に接触させて安定した抵抗値測定が可能となり、これにより、抵抗値修正も確実に行えるという優れた効果を奏するものである。 As described above, the method of correcting the resistance value of a chip-shaped electronic component according to the present invention is a stable resistance by reliably contacting the four terminals with the electrode even when measuring the resistance value of a resistor having a very small area of the electrode portion. This makes it possible to measure the value, thereby producing an excellent effect that the resistance value can be corrected reliably.

（実施の形態１）
以下、実施の形態１を用いて、本発明の特に請求項１〜３に記載の発明について説明する。 (Embodiment 1)
Hereinafter, the invention described in the first to third aspects of the present invention will be described using the first embodiment.

図１は本発明の実施の形態１におけるチップ抵抗器において、シート状の絶縁基板上に複数の電極と複数の抵抗体を形成した状態での抵抗値測定用の四端子の配置位置を示した模式図である。   FIG. 1 shows an arrangement position of four terminals for measuring resistance values in a state where a plurality of electrodes and a plurality of resistors are formed on a sheet-like insulating substrate in the chip resistor according to the first embodiment of the present invention. It is a schematic diagram.

図１において、１１はアルミナ基板等の絶縁性を有するシート状の絶縁基板で、このシート状の絶縁基板１１の上面には、分割溝２３を跨ぐように複数の第１の電極１２、第２の電極１３、第３の電極１４、第４の電極１５をそれぞれスクリーン印刷・焼成により列で形成している。そして前記列で形成されている複数の第１の電極１２と第２の電極１３との間にはこれらと電気的に接続される複数の第１の抵抗体１６をスクリーン印刷・焼成により列で形成し、また前記複数の第１の電極１２と第３の電極１４との間にはこれらと電気的に接続される複数の第２の抵抗体１７をスクリーン印刷・焼成により列で形成し、さらに前記複数の第２の電極１３と第４の電極１５との間にはこれらと電気的に接続される複数の第３の抵抗体１８をスクリーン印刷・焼成により列で形成している。   In FIG. 1, reference numeral 11 denotes an insulating sheet-like insulating substrate such as an alumina substrate. On the upper surface of the sheet-like insulating substrate 11, a plurality of first electrodes 12 and second electrodes are provided so as to straddle the dividing grooves 23. The electrode 13, the third electrode 14, and the fourth electrode 15 are formed in a row by screen printing and firing, respectively. Between the plurality of first electrodes 12 and the second electrode 13 formed in the row, a plurality of first resistors 16 electrically connected thereto are arranged in a row by screen printing / firing. A plurality of second resistors 17 electrically connected to the plurality of first electrodes 12 and the third electrodes 14 are formed in a row by screen printing / firing; Further, a plurality of third resistors 18 electrically connected to the plurality of second electrodes 13 and the fourth electrodes 15 are formed in a row by screen printing / firing.

上記構成において、列で形成されている複数の第１の電極１２と第２の電極１３との間に電気的に接続されている複数の第１の抵抗体１６の抵抗値の修正を行う場合は、複数の第２の電極１３に複数の高電位側電圧端子１９を接触させるとともに、複数の第１の電極１２に複数の低電位側電圧端子２０を接触させ、さらに前記第４の電極１５に複数の高電位側電流端子２１を接触させるとともに、複数の第３の電極１４に複数の低電位側電流端子２２を接触させ、この状態で、レーザーを用いて第１の抵抗体１６にトリミング溝を形成することにより、複数の第１の電極１２と第２の電極１３との間に電気的に接続されている複数の第１の抵抗体１６の抵抗値を上昇させて、要求される目的の抵抗値に修正する。   In the above configuration, when the resistance values of the plurality of first resistors 16 electrically connected between the plurality of first electrodes 12 and the second electrode 13 formed in a row are corrected. Has a plurality of high potential side voltage terminals 19 in contact with a plurality of second electrodes 13, a plurality of low potential side voltage terminals 20 in contact with a plurality of first electrodes 12, and the fourth electrode 15. A plurality of high potential side current terminals 21 are brought into contact with each other and a plurality of low potential side current terminals 22 are brought into contact with a plurality of third electrodes 14. In this state, trimming is performed on the first resistor 16 using a laser. By forming the groove, the resistance value of the plurality of first resistors 16 electrically connected between the plurality of first electrodes 12 and the second electrode 13 is increased, and is required. Correct to the desired resistance value.

次に、列で形成されている複数の第３の抵抗体１８の抵抗値の修正を行う場合は、図１の状態から高電位側電圧端子１９、低電位側電圧端子２０、高電位側電流端子２１、低電位側電流端子２２の４つの端子を上方向に動かして４つの電極１３，１２，１５，１４との接触を断つとともに、複数の電極と複数の抵抗体を有するシート状の絶縁基板１１を載置したステージ（図示せず）を相隣る分割溝２３で定められたピッチ分だけ左方向に動かし、そしてこの状態で、前記高電位側電圧端子１９、低電位側電圧端子２０、高電位側電流端子２１、低電位側電流端子２２の４つの端子を下方向に動かして、図２に示すように４つの電極に接触させる。この場合、高電位側電圧端子１９は第４の電極１５に、低電位側電圧端子２０は第２の電極１３に、高電位側電流端子２１は第４の電極１５の隣に位置する別の電極２４に、低電位側電流端子２２は第１の電極１２にそれぞれ接触することになり、この状態で、レーザーを用いて第３の抵抗体１８にトリミング溝を形成することにより、複数の第２の電極１３と第４の電極１５との間に電気的に接続されている複数の第３の抵抗体１８の抵抗値を上昇させて、要求される目的の抵抗値に修正する。   Next, when correcting the resistance values of the plurality of third resistors 18 formed in a row, the high potential side voltage terminal 19, the low potential side voltage terminal 20, the high potential side current are changed from the state of FIG. The four terminals of the terminal 21 and the low potential side current terminal 22 are moved upward to break contact with the four electrodes 13, 12, 15, 14, and sheet-like insulation having a plurality of electrodes and a plurality of resistors. The stage (not shown) on which the substrate 11 is placed is moved to the left by the pitch determined by the adjacent dividing grooves 23. In this state, the high potential side voltage terminal 19 and the low potential side voltage terminal 20 are moved. Then, the four terminals of the high potential side current terminal 21 and the low potential side current terminal 22 are moved downward to come into contact with the four electrodes as shown in FIG. In this case, the high potential side voltage terminal 19 is located on the fourth electrode 15, the low potential side voltage terminal 20 is located on the second electrode 13, and the high potential side current terminal 21 is located on the other side of the fourth electrode 15. The low-potential-side current terminal 22 is in contact with the electrode 24 and the first electrode 12, and in this state, a plurality of second trimming grooves are formed in the third resistor 18 using a laser. The resistance values of the plurality of third resistors 18 electrically connected between the second electrode 13 and the fourth electrode 15 are increased to correct the desired resistance value.

次に、図２に示す列で形成されている複数の第４の抵抗体２５の抵抗値の修正を行う場合は、図２の状態から高電位側電圧端子１９、低電位側電圧端子２０、高電位側電流端子２１、低電位側電流端子２２の４つの端子を上方向に動かして４つの電極１５，１３，２４，１２との接触を断つとともに、複数の電極と複数の抵抗体を有するシート状の絶縁基板１１を載置したステージ（図示せず）を相隣る分割溝２３で定められたピッチ分だけ左方向に動かし、そしてこの状態で、前記高電位側電圧端子１９、低電位側電圧端子２０、高電位側電流端子２１、低電位側電流端子２２の４つの端子を下方向に動かして、図２に示す４つの電極に接触させる。この場合、高電位側電圧端子１９は第４の電極１５の隣に位置する第５の電極２４に、低電位側電圧端子２０は第４の電極１５に、高電位側電流端子２１は第５の電極２４の隣に位置する第６の電極２６に、低電位側電流端子２２は第２の電極１３にそれぞれ接触することになり、この状態で、レーザーを用いて第４の抵抗体２５にトリミング溝を形成することにより、複数の第４の電極１５と第５の電極２４との間に電気的に接続されている複数の第４の抵抗体２５の抵抗値を上昇させて、要求される目的の抵抗値に修正する。   Next, when correcting the resistance values of the plurality of fourth resistors 25 formed in the row shown in FIG. 2, the high potential side voltage terminal 19, the low potential side voltage terminal 20, The four terminals of the high potential side current terminal 21 and the low potential side current terminal 22 are moved upward to cut off the contact with the four electrodes 15, 13, 24, 12 and have a plurality of electrodes and a plurality of resistors. The stage (not shown) on which the sheet-like insulating substrate 11 is placed is moved to the left by the pitch determined by the adjacent dividing grooves 23, and in this state, the high potential side voltage terminal 19, low potential The four terminals of the side voltage terminal 20, the high potential side current terminal 21, and the low potential side current terminal 22 are moved downward to come into contact with the four electrodes shown in FIG. In this case, the high potential side voltage terminal 19 is connected to the fifth electrode 24 located next to the fourth electrode 15, the low potential side voltage terminal 20 is connected to the fourth electrode 15, and the high potential side current terminal 21 is connected to the fifth electrode 24. The low potential side current terminal 22 comes into contact with the second electrode 13 to the sixth electrode 26 located next to the electrode 24, and in this state, the fourth resistor 25 is connected to the fourth resistor 25 using a laser. By forming the trimming groove, the resistance value of the plurality of fourth resistors 25 electrically connected between the plurality of fourth electrodes 15 and the fifth electrode 24 is increased, which is required. Correct to the desired resistance value.

上記したように本発明の実施の形態１における抵抗値修正方法は、高電位側電圧端子１９、低電位側電圧端子２０、高電位側電流端子２１、低電位側電流端子２２の４つの端子を上下方向に動かして４つの電極との接触を断ったり、あるいは接触させるという動作と、複数の電極と複数の抵抗体を有するシート状の絶縁基板１１を載置したステージ（図示せず）を相隣る分割溝２３で定められたピッチ分だけ左方向へ動かすという動作を順次繰り返すことにより、列で形成されている複数の抵抗体の抵抗値の修正を順次行うようにしたもので、この抵抗値修正方法においては、高電位側と低電位側の２つの電圧端子と高電位側と低電位側の２つの電流端子を４つの電極にそれぞれ１個ずつ接触させて抵抗値修正を行うようにしているため、この抵抗値修正方法を、特に、微小サイズの角チップ抵抗器の抵抗値修正工程において採用すれば、従来のように抵抗値測定を行う抵抗体が電気的に接続されている２つの電極にそれぞれ高電位側と低電位側の２つの電圧端子と高電位側と低電位側の２つの電流端子を接触させて抵抗値修正を行うようにしたものに比べ、１つの抵抗値測定用端子が活用できる電極面積が増加するため、抵抗値測定用端子の電極への接触の確実性が増すものである。この場合、電極に接触する抵抗値測定用端子は、高電位側の電圧・電流端子と、低電位側の電圧・電流端子のそれぞれが抵抗値修正を行う第１の抵抗体１６を挟んで異方向に分かれるようにする必要があるが、この接触条件を満たしていれば、第１の抵抗体１６が直接的に接続される第１、第２の電極１２，１３と、間接的に接続される第３、第４の電極１４，１５で、電圧端子と電流端子の接触を選択しなくてもよいものである。   As described above, the resistance value correcting method according to the first embodiment of the present invention includes the four terminals of the high potential side voltage terminal 19, the low potential side voltage terminal 20, the high potential side current terminal 21, and the low potential side current terminal 22. An operation of moving up and down to disconnect or contact the four electrodes, and a stage (not shown) on which a sheet-like insulating substrate 11 having a plurality of electrodes and a plurality of resistors are placed. By sequentially repeating the operation of moving to the left by the pitch determined by the adjacent divided grooves 23, the resistance values of a plurality of resistors formed in a row are sequentially corrected. In the value correction method, the resistance value correction is performed by bringing two voltage terminals on the high potential side and the low potential side and two current terminals on the high potential side and the low potential side into contact with the four electrodes one by one. Because this If the resistance value correcting method is employed particularly in the resistance value correcting process of a small-sized square chip resistor, each of the two electrodes to which the resistor for measuring the resistance value is electrically connected as in the prior art is used. One resistance value measurement terminal can be used compared to the one in which two voltage terminals on the potential side and the low potential side and two current terminals on the high potential side and the low potential side are brought into contact with each other to correct the resistance value. Since the electrode area is increased, the certainty of contact of the resistance value measuring terminal with the electrode is increased. In this case, the resistance value measurement terminals in contact with the electrodes are different from each other with the first resistor 16 for correcting the resistance value between the high potential side voltage / current terminal and the low potential side voltage / current terminal. Although it is necessary to divide in the direction, if this contact condition is satisfied, the first resistor 16 is indirectly connected to the first and second electrodes 12 and 13 to which the first resistor 16 is directly connected. The third and fourth electrodes 14 and 15 need not select the contact between the voltage terminal and the current terminal.

すなわち、上記本発明の実施の形態１においては、列で形成されている複数の第１の抵抗体１６の抵抗値の修正を行う場合、複数の第２の電極１３に複数の高電位側電圧端子１９を接触させるとともに、複数の第１の電極１２に複数の低電位側電圧端子２０を接触させ、さらに前記複数の第４の電極１５に複数の高電位側電流端子２１を接触させるとともに、複数の第３の電極１４に複数の低電位側電流端子２２を接触させていたが、これとは逆に、複数の第２の電極１３に複数の低電位側電圧端子２０を接触させるとともに、複数の第１の電極１２に複数の高電位側電圧端子１９を接触させ、さらに前記複数の第４の電極１５に複数の低電位側電流端子２２を接触させるとともに、複数の第３の電極１４に複数の高電位側電流端子２１を接触させるようにするか、あるいは複数の第２の電極１３に複数の高電位側電流端子２１または低電位側電流端子２２を接触させるとともに、複数の第１の電極１２に複数の低電位側電流端子２２または高電位側電流端子２１を接触させ、そして前記複数の第４の電極１５に複数の高電位側電圧端子１９または低電位側電圧端子２０を接触させるとともに、複数の第３の電極１４に複数の低電位側電圧端子２０または高電位側電圧端子１９を接触させるようにしてもよく、さらには複数の第１の電極１２に複数の高電位側電流端子２１または低電位側電流端子２２を接触させるとともに、複数の第４の電極１５に複数の低電位側電流端子２２または高電位側電流端子２１を接触させ、そして前記複数の第３の電極１４に複数の高電位側電圧端子１９または低電位側電圧端子２０を接触させるとともに、複数の第２の電極１３に複数の低電位側電圧端子２０または高電位側電圧端子１９を接触させるようにしてもよく、これらの場合においても、上記実施の形態１と同様に、列で形成されている複数の第１の電極１２と第２の電極１３との間に電気的に接続されている複数の第１の抵抗体１６の抵抗値の修正が行えるものである。   That is, in the first embodiment of the present invention, when the resistance values of the plurality of first resistors 16 formed in a row are corrected, a plurality of high potential side voltages are applied to the plurality of second electrodes 13. While contacting the terminal 19, the plurality of low potential side voltage terminals 20 are brought into contact with the plurality of first electrodes 12, and the plurality of high potential side current terminals 21 are brought into contact with the plurality of fourth electrodes 15, While the plurality of low potential side current terminals 22 are in contact with the plurality of third electrodes 14, the plurality of low potential side voltage terminals 20 are in contact with the plurality of second electrodes 13. A plurality of high potential side voltage terminals 19 are brought into contact with the plurality of first electrodes 12, and a plurality of low potential side current terminals 22 are brought into contact with the plurality of fourth electrodes 15. A plurality of high potential side current terminals 21 are connected to Or a plurality of high potential side current terminals 21 or low potential side current terminals 22 are brought into contact with the plurality of second electrodes 13, and a plurality of low potential side current terminals are connected to the plurality of first electrodes 12. 22 or the high potential side current terminal 21 is brought into contact with the plurality of fourth electrodes 15, and the plurality of high potential side voltage terminals 19 or the low potential side voltage terminals 20 are brought into contact with the plurality of third electrodes 14. A plurality of low potential side voltage terminals 20 or high potential side voltage terminals 19 may be brought into contact with each other, and a plurality of high potential side current terminals 21 or low potential side current terminals 22 are connected to the plurality of first electrodes 12. The plurality of fourth electrodes 15 are contacted with a plurality of low potential side current terminals 22 or high potential side current terminals 21, and the plurality of third electrodes 14 are contacted with a plurality of high potential side voltage terminals. 9 or the low potential side voltage terminal 20 may be brought into contact with each other, and a plurality of low potential side voltage terminals 20 or high potential side voltage terminals 19 may be brought into contact with the plurality of second electrodes 13. As in the first embodiment, the resistances of the plurality of first resistors 16 electrically connected between the plurality of first electrodes 12 and the second electrode 13 formed in a row. The value can be corrected.

（実施の形態２）
以下、実施の形態２を用いて、本発明の特に請求項４、５に記載の発明について説明する。 (Embodiment 2)
Hereinafter, the invention described in the fourth and fifth aspects of the present invention will be described using the second embodiment.

図３は本発明の実施の形態２におけるチップ抵抗器において、シート状の絶縁基板上に複数の電極と複数の抵抗体を形成した状態での抵抗値測定用の四端子の配置位置を示した模式図である。   FIG. 3 shows an arrangement position of four terminals for measuring resistance values in a state where a plurality of electrodes and a plurality of resistors are formed on a sheet-like insulating substrate in the chip resistor according to the second embodiment of the present invention. It is a schematic diagram.

図３において、３１はアルミナ基板等の絶縁性を有するシート状の絶縁基板で、このシート状の絶縁基板３１の上面には、分割溝３４を跨ぐように複数の第１の電極３２、第２の電極３３をそれぞれスクリーン印刷・焼成により列で形成するとともに、相隣る分割溝３４の両方に跨がるように第３の電極３５をスクリーン印刷・焼成により列で形成している。そして前記列で形成されている複数の第１の電極３２と第３の電極３５との間にはこれらと電気的に接続されるように複数の第１の抵抗体３６をスクリーン印刷・焼成により列で形成し、さらに前記複数の第１の電極３２と第２の電極３３との間にはこれらと電気的に接続されるように複数の第２の抵抗体３７をスクリーン印刷・焼成により列で形成している。   In FIG. 3, reference numeral 31 denotes an insulating sheet-like insulating substrate such as an alumina substrate. On the upper surface of the sheet-like insulating substrate 31, a plurality of first electrodes 32 and second electrodes are provided so as to straddle the dividing grooves 34. The electrodes 33 are formed in rows by screen printing / firing, and the third electrodes 35 are formed in rows by screen printing / firing so as to straddle both adjacent divided grooves 34. A plurality of first resistors 36 are screen-printed and fired between the plurality of first electrodes 32 and the third electrode 35 formed in the row so as to be electrically connected thereto. A plurality of second resistors 37 are formed by screen printing and firing so as to be electrically connected to the plurality of first electrodes 32 and the second electrodes 33. It is formed with.

上記構成において、列で形成されている複数の第１の電極３２と第２の電極３３との間に電気的に接続されている複数の第１の抵抗体３６の抵抗値の修正を行う場合は、複数の第１の電極３２に複数の高電位側電圧端子３８を接触させるとともに、複数の第３の電極３５に複数の低電位側電圧端子３９と低電位側電流端子４０を接触させ、さらに前記複数の第２の電極３３に複数の高電位側電流端子４１を接触させ、この状態で、レーザーを用いて第１の抵抗体３６にトリミング溝を形成することにより、複数の第１の電極３２と第３の電極３５との間に電気的に接続される複数の第１の抵抗体３６の抵抗値を上昇させて、要求される目的の抵抗値に修正する。   In the above configuration, when the resistance values of the plurality of first resistors 36 electrically connected between the plurality of first electrodes 32 and the second electrode 33 formed in a row are corrected. The plurality of high potential side voltage terminals 38 are brought into contact with the plurality of first electrodes 32, and the plurality of low potential side voltage terminals 39 and the low potential side current terminals 40 are brought into contact with the plurality of third electrodes 35. Further, a plurality of high-potential-side current terminals 41 are brought into contact with the plurality of second electrodes 33, and in this state, trimming grooves are formed in the first resistor 36 using a laser. The resistance values of the plurality of first resistors 36 electrically connected between the electrode 32 and the third electrode 35 are increased to correct the desired resistance value.

次に、列で形成されている複数の第２の抵抗体３７の抵抗値の修正を行う場合は、図３の状態から高電位側電圧端子３８、低電位側電圧端子３９、高電位側電流端子４１、低電位側電流端子４０の４つの端子を上方向に動かして３つの電極３２，３５，３３との接触を断つとともに、複数の電極と複数の抵抗体を有するシート状の絶縁基板３１を載置したステージ（図示せず）を相隣る分割溝３４で定められたピッチ分だけ左方向に動かし、そしてこの状態で、前記高電位側電圧端子３８、低電位側電圧端子３９、高電位側電流端子４１、低電位側電流端子４０の４つの端子を下方向に動かして、図４に示すように４つの電極に接触させる。この場合、高電位側電圧端子３８は第２の電極３３に、低電位側電圧端子３９は第１の電極３２に、高電位側電流端子４１は第２の電極３３の隣に位置する第４の電極４２に、低電位側電流端子４０は第３の電極３５にそれぞれ接触することになり、この状態で、レーザーを用いて第２の抵抗体３７にトリミング溝を形成することにより、複数の第１の電極３２と第２の電極３３との間に電気的に接続されている複数の第２の抵抗体３７の抵抗値を上昇させて、要求される目的の抵抗値に修正する。   Next, when correcting the resistance values of the plurality of second resistors 37 formed in a row, the high potential side voltage terminal 38, the low potential side voltage terminal 39, the high potential side current are changed from the state of FIG. The four terminals of the terminal 41 and the low potential side current terminal 40 are moved upward to break the contact with the three electrodes 32, 35, 33, and the sheet-like insulating substrate 31 having a plurality of electrodes and a plurality of resistors. Is moved to the left by a pitch determined by adjacent dividing grooves 34, and in this state, the high potential side voltage terminal 38, the low potential side voltage terminal 39, The four terminals of the potential side current terminal 41 and the low potential side current terminal 40 are moved downward to contact the four electrodes as shown in FIG. In this case, the high potential side voltage terminal 38 is positioned on the second electrode 33, the low potential side voltage terminal 39 is positioned on the first electrode 32, and the high potential side current terminal 41 is positioned next to the second electrode 33. The low-potential-side current terminal 40 is in contact with the third electrode 35, and a trimming groove is formed in the second resistor 37 using a laser in this state. The resistance values of the plurality of second resistors 37 electrically connected between the first electrode 32 and the second electrode 33 are increased to correct the required resistance value.

次に、図４に示す列で形成されている複数の第３の抵抗体４３の抵抗値の修正を行う場合は、図４の状態から高電位側電圧端子３８、低電位側電圧端子３９、高電位側電流端子４１、低電位側電流端子４０の４つの端子を上方向に動かして４つの電極３３，３２，４２，３５との接触を断つとともに、複数の電極と複数の抵抗体を有するシート状の絶縁基板３１を載置したステージ（図示せず）を相隣る分割溝３４で定められたピッチ分だけ左方向に動かし、そしてこの状態で、前記高電位側電圧端子３８、低電位側電圧端子３９、高電位側電流端子４１、低電位側電流端子４０の４つの端子を下方向に動かして、図４に示す４つの電極に接触させる。この場合、高電位側電圧端子３８は第２の電極３３の隣に位置する第４の電極４２に、低電位側電圧端子３９は第２の電極３３に、高電位側電流端子４１は第４の電極４２の隣に位置する第５の電極４４に、低電位側電流端子４０は第１の電極３２にそれぞれ接触することになり、この状態で、レーザーを用いて第３の抵抗体４３にトリミング溝を形成することにより、複数の第２の電極３３と別の電極４２との間に電気的に接続されている複数の第３の抵抗体４３の抵抗値を上昇させて、要求される目的の抵抗値に修正する。 Next, when correcting the resistance values of the plurality of third resistors 43 formed in the row shown in FIG. 4, the high potential side voltage terminal 38, the low potential side voltage terminal 39, The four terminals of the high potential side current terminal 41 and the low potential side current terminal 40 are moved upward to cut off the contact with the four electrodes 33, 32, 42, and 35, and have a plurality of electrodes and a plurality of resistors. The stage (not shown) on which the sheet-like insulating substrate 31 is placed is moved to the left by the pitch determined by the adjacent dividing grooves 34, and in this state, the high potential side voltage terminal 38, the low potential The four terminals of the side voltage terminal 39, the high potential side current terminal 41, and the low potential side current terminal 40 are moved downward to come into contact with the four electrodes shown in FIG. In this case, the high potential side voltage terminal 38 is connected to the fourth electrode 42 adjacent to the second electrode 33, the low potential side voltage terminal 39 is connected to the second electrode 33, and the high potential side current terminal 41 is connected to the fourth electrode 42. The low potential side current terminal 40 is in contact with the first electrode 32 and the fifth electrode 44 located next to the electrode 42, and in this state, the third resistor 43 is connected to the third resistor 43 using a laser. By forming the trimming groove, the resistance value of the plurality of third resistors 43 electrically connected between the plurality of second electrodes 33 and the other electrode 42 is increased, which is required. Correct to the desired resistance value.

上記したように本発明の実施の形態２における抵抗値修正方法は、高電位側電圧端子３８、低電位側電圧端子３９、高電位側電流端子４１、低電位側電流端子４０の４つの端子を上下方向に動かして、最初は３つの電極との接触を断ったり、あるいは接触させる。そして２番目以降は４つの電極との接触を断ったり、あるいは接触させるという動作と、複数の電極と複数の抵抗体を有するシート状の絶縁基板３１を載置したステージ（図示せず）を相隣る分割溝３４で定められたピッチ分だけ左方向へ動かすという動作を順次繰り返すことにより、列で形成されている複数の抵抗体の抵抗値の修正を順次行うようにしたもので、この抵抗値修正方法においては、高電位側と低電位側の２つの電圧端子と高電位側と低電位側の２つの電流端子のうち、最初は２つの測定端子を相隣る分割溝３４の両方に跨がって形成された１つの電極に接触させ、かつ残り２つの測定端子を２つの電極にそれぞれ１個ずつ接触させて抵抗値修正を行うようにしているため、この抵抗値修正方法を、特に、微小サイズの角チップ抵抗器の抵抗値修正工程において採用すれば、従来のように抵抗値測定を行う抵抗体が電気的に接続されている２つの電極にそれぞれ高電位側と低電位側の２つの電圧端子と高電位側と低電位側の２つの電流端子を接触させて抵抗値修正を行うようにしたものに比べ、１つの抵抗値測定用端子が活用できる電極面積が増加するため、抵抗値測定用端子の電極への接触の確実性が増すものである。この場合、電極に接触する抵抗値測定用端子は、高電位側の電圧・電流端子と、低電位側の電圧・電流端子のそれぞれが抵抗値修正を行う第１の抵抗体３６を挟んで異方向に分かれるようにする必要があるが、この接触条件を満たしていれば、第１の抵抗体３６が直接的に接続される第１、第３の電極３２，３５と、間接的に接続される第２の電極３３で、電圧端子と電流端子の接触を選択しなくてもよいものである。   As described above, the resistance value correcting method according to the second embodiment of the present invention includes the four terminals of the high potential side voltage terminal 38, the low potential side voltage terminal 39, the high potential side current terminal 41, and the low potential side current terminal 40. By moving up and down, the contact with the three electrodes is initially cut off or brought into contact. In the second and subsequent stages, the operation of cutting off or bringing into contact with the four electrodes and the stage (not shown) on which the sheet-like insulating substrate 31 having a plurality of electrodes and a plurality of resistors are placed are combined. By sequentially repeating the operation of moving to the left by the pitch determined by the adjacent divided grooves 34, the resistance values of a plurality of resistors formed in a row are sequentially corrected. In the value correction method, of the two voltage terminals on the high potential side and the low potential side and the two current terminals on the high potential side and the low potential side, first, the two measurement terminals are placed in both adjacent divided grooves 34. Since the resistance value correction is performed by contacting one electrode formed across and contacting the remaining two measurement terminals one by one with each of the two electrodes, this resistance value correction method is In particular, small corners If it is adopted in the resistance value correction process of the resistor, two voltage terminals on the high potential side and the low potential side are respectively connected to two electrodes to which a resistor for measuring the resistance value is electrically connected as in the prior art. Compared to the case where the resistance value is corrected by bringing the two current terminals on the potential side and the low potential side into contact with each other, the electrode area that can be utilized by one resistance value measuring terminal increases. The certainty of contact with the electrode is increased. In this case, the resistance value measurement terminals in contact with the electrodes are different from each other with the first resistor 36 for correcting the resistance value between the high potential side voltage / current terminal and the low potential side voltage / current terminal. Although it is necessary to divide in the direction, if the contact condition is satisfied, the first resistor 36 is indirectly connected to the first and third electrodes 32 and 35 to which the first resistor 36 is directly connected. In the second electrode 33, it is not necessary to select the contact between the voltage terminal and the current terminal.

すなわち、上記本発明の実施の形態２においては、列で形成されている複数の第１の抵抗体３６の抵抗値の修正を行う場合、複数の第１の電極３２に複数の高電位側電圧端子３８を接触させるとともに、複数の第３の電極３５に複数の低電位側電圧端子３９と低電位側電流端子４０を接触させ、さらに前記複数の第２の電極３３に複数の高電位側電流端子４１を接触させるようにしていたが、これとは逆に、複数の第１の電極３２に複数の低電位側電圧端子３９を接触させるとともに、複数の第３の電極３５に複数の高電位側電圧端子３８と高電位側電流端子４１を接触させ、さらに前記複数の第２の電極３３に複数の低電位側電流端子４０を接触させるようにしてもよく、この場合においても、上記実施の形態２と同様に、列で形成されている複数の第１の電極３２と第２の電極３３との間に電気的に接続されている複数の第１の抵抗体３６の抵抗値の修正が行えるものである。   That is, in the second embodiment of the present invention, when the resistance values of the plurality of first resistors 36 formed in a row are corrected, a plurality of high potential side voltages are applied to the plurality of first electrodes 32. The terminal 38 is brought into contact, the plurality of low potential side voltage terminals 39 and the low potential side current terminal 40 are brought into contact with the plurality of third electrodes 35, and the plurality of high potential side currents are brought into contact with the plurality of second electrodes 33. In contrast to this, the terminals 41 are in contact with each other, but conversely, a plurality of low potential side voltage terminals 39 are brought into contact with the plurality of first electrodes 32 and a plurality of high potentials are applied to the plurality of third electrodes 35. The side voltage terminal 38 and the high potential side current terminal 41 may be brought into contact with each other, and the plurality of low potential side current terminals 40 may be brought into contact with the plurality of second electrodes 33. Like form 2, formed in rows That the plurality of first electrodes 32 and in which can be performed electrically the attached correction of resistance values of a plurality of first resistor 36 between the second electrode 33.

本発明にかかるチップ状電子部品の抵抗値修正方法は、従来に比べて小さい電極に接続される抵抗体の抵抗値を測定する場合、抵抗値測定端子が電極と接触不良を起こすこともなく、安定した抵抗値測定が可能となり、抵抗値修正も確実に行えるという効果を有し、回転基板に実装されるチップ状電子部品を構成する抵抗体の抵抗値修正方法として有用である。 The resistance value correcting method of the chip-shaped electronic component according to the present invention, when measuring the resistance value of a resistor connected to an electrode smaller than the conventional one, without causing a contact failure with the electrode, resistance value measurement terminal, Stable resistance value measurement is possible, and resistance value correction can be performed reliably. This is useful as a resistance value correction method for a resistor constituting a chip-shaped electronic component mounted on a rotating substrate.

本発明の実施の形態１におけるチップ抵抗器において、シート状の絶縁基板上に複数の電極と複数の抵抗体を形成した状態での抵抗値測定用の四端子の配置位置を示した模式図The chip resistor in Embodiment 1 of this invention WHEREIN: The schematic diagram which showed the arrangement position of four terminals for resistance value measurement in the state which formed the some electrode and the some resistor on the sheet-like insulating substrate 同抵抗値測定用四端子の配置位置を変えた状態を示す模式図Schematic diagram showing a state where the arrangement position of the four terminals for measuring the resistance value is changed. 本発明の実施の形態２におけるチップ抵抗器において、シート状の絶縁基板上に複数の電極と複数の抵抗体を形成した状態での抵抗値測定用の四端子の配置位置を示した模式図The chip resistor in Embodiment 2 of this invention WHEREIN: The schematic diagram which showed the arrangement position of four terminals for resistance value measurement in the state which formed the some electrode and the some resistor on the sheet-like insulating substrate 同抵抗値測定用四端子の配置位置を変えた状態を示す模式図Schematic diagram showing a state where the arrangement position of the four terminals for measuring the resistance value is changed. （ａ）（ｂ）従来のチップ状電子部品の製造工程を示す製造工程図(A) (b) Manufacturing process diagram showing a manufacturing process of a conventional chip-shaped electronic component 従来のチップ状電子部品において、シート状の絶縁基板上に複数の電極と複数の抵抗体を形成した状態での抵抗値測定用の四端子の配置位置を示した模式図Schematic diagram showing the arrangement positions of four terminals for measuring resistance values in a state where a plurality of electrodes and a plurality of resistors are formed on a sheet-like insulating substrate in a conventional chip-shaped electronic component

符号の説明Explanation of symbols

１１ シート状の絶縁基板
１２ 第１の電極
１３ 第２の電極
１４ 第３の電極
１５ 第４の電極
１６ 第１の抵抗体
１７ 第２の抵抗体
１８ 第３の抵抗体
１９ 高電位側電圧端子
２０ 低電位側電圧端子
２１ 高電位側電流端子
２２ 低電位側電流端子
２３ 分割溝
３１ シート状の絶縁基板
３２ 第１の電極
３３ 第２の電極
３４ 分割溝
３５ 第３の電極
３６ 第１の抵抗体
３７ 第２の抵抗体
３８ 高電位側電圧端子
３９ 低電位側電圧端子
４０ 低電位側電流端子
４１ 高電位側電流端子 DESCRIPTION OF SYMBOLS 11 Sheet-like insulating substrate 12 1st electrode 13 2nd electrode 14 3rd electrode 15 4th electrode 16 1st resistor 17 2nd resistor 18 3rd resistor 19 High potential side voltage terminal 20 Low-potential-side voltage terminal 21 High-potential-side current terminal 22 Low-potential-side current terminal 23 Dividing groove 31 Sheet-like insulating substrate 32 First electrode 33 Second electrode 34 Dividing groove 35 Third electrode 36 First resistance Body 37 second resistor 38 high potential side voltage terminal 39 low potential side voltage terminal 40 low potential side current terminal 41 high potential side current terminal

Claims (3)

シート状の絶縁基板に形成された抵抗体の抵抗値を高電位側電圧端子、低電位側電圧端子、高電位側電流端子および低電位側電流端子の４個の端子を用いて前記抵抗体の抵抗値を測定しながら前記抵抗体の抵抗値修正をするチップ状電子部品の抵抗値修正方法であって、
前記絶縁基板は、前記絶縁基板に形成された分割溝を跨ぐように形成された第１の電極、第２の電極、第３の電極、第４の電極および第５の電極と、前記第１の電極と前記第２の電極との間に電気的に接続されるように形成された第１の抵抗体と、前記第１の電極と前記第３の電極との間に電気的に接続されるように形成された第２の抵抗体と、前記第２の電極と前記第４の電極との間に電気的に接続されるように形成された第３の抵抗体と、前記第４の電極と前記第５の電極との間に電気的に接続されるように形成された第４の抵抗体とを有するものであり、
前記高電位側電圧端子および前記高電位側電流端子の一方を前記第１の電極に他方を前記第３の電極にそれぞれ接触させるとともに、前記低電位側電圧端子および前記低電位側電流端子の一方を前記第２の電極に他方を前記第４の電極にそれぞれ接触させ、
または、前記低電位側電圧端子および前記低電位側電流端子の一方を前記第１の電極に他方を前記第３の電極にそれぞれ接触させるとともに、前記高電位側電圧端子および前記高電位側電流端子の一方を前記第２の電極に他方を前記第４の電極にそれぞれ接触させて、
前記第３の電極、前記第１の電極、前記第２の電極、前記第４の電極の４個の電極および前記第２の抵抗体、前記第１の抵抗体、前記第３の抵抗体の３個の抵抗体を一つの測定領域とし、かつこの一つの測定領域の中で前記第１の抵抗体の抵抗値を四端子測定法により測定しながらこの第１の抵抗体をレーザーを用いてトリミングして目的の抵抗値まで抵抗値修正を行い、
次に、前記高電位側電圧端子、前記低電位側電圧端子、前記高電位側電流端子および前記低電位側電流端子をそれぞれが接触している前記第１の電極、前記第２の電極、前記第３の電極または前記第４の電極との接触を絶たせるようにこれらの電極の上方に動かし、
次に、前記絶縁基板を移動させることによって、前記第１の抵抗体をトリミングする際に前記第１の電極と接触していた端子を前記第２の電極の上方へ、前記第２の電極と接触していた端子を前記第４の電極の上方へ、前記第３の電極と接触していた端子を前記第１の電極の上方へ、前記第４の電極と接触していた端子を前記第５の電極の上方へそれぞれ移動させ、
次に、前記高電位側電圧端子、前記低電位側電圧端子、前記高電位側電流端子および前記低電位側電流端子をそれぞれの下方に位置する電極と接触するように下方に動かし、
次に、前記第１の電極、前記第２の電極、前記第４の電極、前記第５の電極の４個の電極および前記第１の抵抗体、前記第３の抵抗体、前記第４の抵抗体の３個の抵抗体を一つの測定領域とし、かつこの一つの測定領域の中で前記第３の抵抗体の抵抗値を四端子測定法により測定しながらこの第３の抵抗体をレーザーを用いてトリミングして目的の抵抗値まで抵抗値修正を行なうようにしたチップ状電子部品の抵抗値修正方法。 The resistance value of the resistor formed on the sheet-like insulating substrate is determined using the four terminals of the high potential side voltage terminal, the low potential side voltage terminal, the high potential side current terminal, and the low potential side current terminal. A resistance value correction method for a chip-shaped electronic component that corrects the resistance value of the resistor while measuring the resistance value,
The insulating substrate includes a first electrode, a second electrode, a third electrode, a fourth electrode, and a fifth electrode formed so as to straddle a dividing groove formed in the insulating substrate, and the first electrode electrically connected between the first resistor which is formed to be electrically connected, the first electrode and the third electrode between the electrode and the second electrode A second resistor formed to be electrically connected, a third resistor formed to be electrically connected between the second electrode and the fourth electrode, and the fourth resistor is intended to have a fourth resistor which is formed so as to be electrically connected between the an electrode fifth electrode,
One of the high potential side voltage terminal and the high potential side current terminal is brought into contact with the first electrode and the other is brought into contact with the third electrode, and one of the low potential side voltage terminal and the low potential side current terminal Are brought into contact with the second electrode and the other with the fourth electrode,
Alternatively, one of the low potential side voltage terminal and the low potential side current terminal is brought into contact with the first electrode and the other is brought into contact with the third electrode, and the high potential side voltage terminal and the high potential side current terminal One of the electrodes is in contact with the second electrode and the other is in contact with the fourth electrode,
Said third electrode, said first electrode, said second electrode, the four electrode and the second resistor of the fourth electrode, the first resistor, said third resistor three resistors and one measurement region, and using a laser to the first resistor while measuring the resistance value of the first resistor by the four probe measurement method in this one measurement region Trim and correct the resistance value to the desired resistance value ,
Next, the high potential side voltage terminal, the low potential side voltage terminal, the high potential side current terminal and the low potential side current terminal are in contact with each other, the first electrode, the second electrode, Move above these electrodes to break contact with the third electrode or the fourth electrode,
Next, by moving the insulating substrate, the terminal that has been in contact with the first electrode when trimming the first resistor is moved above the second electrode, and the second electrode The terminal that was in contact with the fourth electrode, the terminal that was in contact with the third electrode above the first electrode, and the terminal that was in contact with the fourth electrode were 5 above each of the 5 electrodes,
Next, the high potential side voltage terminal, the low potential side voltage terminal, the high potential side current terminal and the low potential side current terminal are moved downward so as to be in contact with the electrodes located below,
Next, the four electrodes of the first electrode, the second electrode, the fourth electrode, the fifth electrode, the first resistor, the third resistor, the fourth electrode The three resistors are set as one measurement region, and the third resistor is laser-measured while measuring the resistance value of the third resistor by the four-terminal measurement method in the one measurement region. A method for correcting the resistance value of a chip-like electronic component, wherein trimming is performed using a chip to correct the resistance value to the target resistance value . 前記第１の抵抗体の抵抗値修正を行なう際に、高電位側電圧端子および低電位側電圧端子の一方を前記第１の電極に他方を前記第２の電極に接触させ、高電位側電流端子および低電位側電流端子の一方を前記第３の電極に他方を前記第４の電極に接触させた請求項１記載のチップ状電子部品の抵抗値修正方法。 When correcting the resistance value of the first resistor, one of the high-potential side voltage terminal and the low-potential side voltage terminal is brought into contact with the first electrode, and the other is brought into contact with the second electrode. 2. The method of correcting a resistance value of a chip-shaped electronic component according to claim 1, wherein one of a terminal and a low potential side current terminal is brought into contact with the third electrode and the other is brought into contact with the fourth electrode . シート状の絶縁基板に形成された抵抗体の抵抗値を高電位側電圧端子、低電位側電圧端子、高電位側電流端子および低電位側電流端子の４個の端子を用いて前記抵抗体の抵抗値を測定しながら前記抵抗体の抵抗値修正をするチップ状電子部品の抵抗値修正方法であって、The resistance value of the resistor formed on the sheet-like insulating substrate is determined using the four terminals of the high potential side voltage terminal, the low potential side voltage terminal, the high potential side current terminal, and the low potential side current terminal. A resistance value correction method for a chip-shaped electronic component that corrects the resistance value of the resistor while measuring the resistance value,
前記絶縁基板は、前記絶縁基板に形成された分割溝を跨ぐように形成された第１の電極、第２の電極および第４の電極と、相隣る分割溝の両方を跨ぐように形成された第３の電極と、前記第１の電極と前記第３の電極との間に電気的に接続されるように形成された第１の抵抗体と、前記第１の電極と前記第２の電極との間に電気的に接続されるように形成された第２の抵抗体と、前記第２の電極と前記第４の電極との間に電気的に接続されるように形成された第３の抵抗体を有するものであり、The insulating substrate is formed so as to straddle both the first electrode, the second electrode, and the fourth electrode formed so as to straddle the dividing groove formed in the insulating substrate, and the adjacent dividing groove. A third resistor, a first resistor formed to be electrically connected between the first electrode and the third electrode, the first electrode, and the second electrode A second resistor formed to be electrically connected to the electrode, and a second resistor formed to be electrically connected to the second electrode and the fourth electrode. 3 resistors,
前記高電位側電圧端子および前記高電位側電流端子の一方を前記第１の端子に他方を前記第２の端子にそれぞれ接触させるとともに、前記低電位側電圧端子および前記低電位側電流端子の一方を前記第３の電極における前記第１の抵抗体側の分割溝側に他方を前記第３の電極における前記分割溝に相隣る分割溝側にそれぞれ接触させて、One of the high potential side voltage terminal and the high potential side current terminal is brought into contact with the first terminal and the other is brought into contact with the second terminal, respectively, and one of the low potential side voltage terminal and the low potential side current terminal Each of the third electrode and the other side of the third electrode on the side of the split groove adjacent to the split groove,
または、前記低電位側電圧端子および前記低電位側電流端子の一方を前記第１の端子に他方を前記第２の端子にそれぞれ接触させるとともに、前記高電位側電圧端子および前記高電位側電流端子の一方を前記第３の電極における前記第１の抵抗体側の分割溝側に他方を前記第３の電極における前記分割溝に相隣る分割溝側にそれぞれ接触させて、Alternatively, one of the low potential side voltage terminal and the low potential side current terminal is brought into contact with the first terminal and the other is brought into contact with the second terminal, and the high potential side voltage terminal and the high potential side current terminal One side of the third electrode in contact with the split groove side of the first resistor in the third electrode, and the other side in contact with the split groove side adjacent to the split groove in the third electrode,
前記第３の電極、前記第１の電極、前記第２の電極の３個の電極および前記第１の抵抗体、前記第２の抵抗体の２個の抵抗体を一つの測定領域とし、かつこの一つの測定領域の中で前記第１の抵抗体の抵抗値を四端子測定法により測定しながらこの第１の抵抗体をレーザーを用いてトリミングして目的の抵抗値まで抵抗値修正を行い、The third electrode, the first electrode, the three electrodes of the second electrode, the first resistor, and the two resistors of the second resistor are used as one measurement region, and While the resistance value of the first resistor is measured by the four-terminal measurement method in this one measurement region, the first resistor is trimmed with a laser to correct the resistance value to the target resistance value. ,
次に、前記高電位側電圧端子、前記低電位側電圧端子、前記高電位側電流端子および前記低電位側電流端子をそれぞれが接触している前記第１の電極、前記第２の電極または前記第３の電極との接触を絶たせるようにこれらの電極の上方に動かし、Next, the high potential side voltage terminal, the low potential side voltage terminal, the high potential side current terminal, and the low potential side current terminal are in contact with each other, the first electrode, the second electrode, or the Move above these electrodes to break contact with the third electrode,
次に、前記絶縁基板を移動させることによって、前記第１の抵抗体をトリミングする際に前記第１の電極と接触していた端子を前記第２の電極の上方へ、前記第２の電極と接触していた端子を前記第４の電極の上方へ、前記第３の電極における前記第１の抵抗体側の分割溝側と接触していた端子を前記第１の電極の上方へ、前記第３の電極における前記分割溝に相隣る分割溝側と接触していた端子を前記第３の電極における前記第１の抵抗体側の分割溝側の上方へそれぞれ移動させ、Next, by moving the insulating substrate, the terminal that has been in contact with the first electrode when trimming the first resistor is moved above the second electrode, and the second electrode The terminal that was in contact with the fourth electrode is located above the fourth electrode, and the terminal that was in contact with the first resistor-side dividing groove side of the third electrode is located above the first electrode. The terminals that were in contact with the split groove side adjacent to the split groove in the electrode of the first electrode are respectively moved above the split groove side on the first resistor side of the third electrode,
次に、前記高電位側電圧端子、前記低電位側電圧端子、前記高電位側電流端子および前記低電位側電流端子をそれぞれの下方に位置する電極と接触するように下方に動かし、Next, the high potential side voltage terminal, the low potential side voltage terminal, the high potential side current terminal and the low potential side current terminal are moved downward so as to be in contact with the electrodes located below,
次に、前記第１の電極、前記第２の電極、前記第３の電極、前記第４の電極の４個の電極および前記第１の抵抗体、前記第２の抵抗体、前記第３の抵抗体の３個の抵抗体を一つの測定領域とし、かつこの一つの測定領域の中で前記第２の抵抗体の抵抗値を四端子測定法により測定しながらこの第２の抵抗体をレーザーを用いてトリミングして目的の抵抗値まで抵抗値修正を行なうようにしたチップ状電子部品の抵抗値修正方法。Next, the first electrode, the second electrode, the third electrode, the four electrodes of the fourth electrode, the first resistor, the second resistor, the third electrode The three resistors are set as one measurement region, and the second resistor is laser-measured while measuring the resistance value of the second resistor by the four-terminal measurement method in the one measurement region. A method for correcting the resistance value of a chip-like electronic component, wherein trimming is performed using a chip to correct the resistance value to the target resistance value.
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