JP2006140506A5 - - Google Patents

Download PDF

Info

Publication number
JP2006140506A5
JP2006140506A5 JP2005332689A JP2005332689A JP2006140506A5 JP 2006140506 A5 JP2006140506 A5 JP 2006140506A5 JP 2005332689 A JP2005332689 A JP 2005332689A JP 2005332689 A JP2005332689 A JP 2005332689A JP 2006140506 A5 JP2006140506 A5 JP 2006140506A5
Authority
JP
Japan
Prior art keywords
pattern
dummy
manufacturing
semiconductor device
insulating film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005332689A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006140506A (ja
JP4398420B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005332689A priority Critical patent/JP4398420B2/ja
Priority claimed from JP2005332689A external-priority patent/JP4398420B2/ja
Publication of JP2006140506A publication Critical patent/JP2006140506A/ja
Publication of JP2006140506A5 publication Critical patent/JP2006140506A5/ja
Application granted granted Critical
Publication of JP4398420B2 publication Critical patent/JP4398420B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2005332689A 2005-11-17 2005-11-17 半導体装置の製造方法 Expired - Lifetime JP4398420B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005332689A JP4398420B2 (ja) 2005-11-17 2005-11-17 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005332689A JP4398420B2 (ja) 2005-11-17 2005-11-17 半導体装置の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP34542999A Division JP4307664B2 (ja) 1999-12-03 1999-12-03 半導体装置

Publications (3)

Publication Number Publication Date
JP2006140506A JP2006140506A (ja) 2006-06-01
JP2006140506A5 true JP2006140506A5 (enrdf_load_stackoverflow) 2009-09-10
JP4398420B2 JP4398420B2 (ja) 2010-01-13

Family

ID=36621036

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005332689A Expired - Lifetime JP4398420B2 (ja) 2005-11-17 2005-11-17 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP4398420B2 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5554973B2 (ja) * 2009-12-01 2014-07-23 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
JP2018006443A (ja) 2016-06-29 2018-01-11 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
CN114647145B (zh) * 2022-05-23 2022-09-13 合肥新晶集成电路有限公司 光罩及半导体结构

Similar Documents

Publication Publication Date Title
CN108376672B (zh) 阵列基板及其制备方法,以及显示装置
CN102280452B (zh) 薄膜晶体管基板、其制造方法及具有该基板的平板显示器
TWI356447B (en) Method of fabricating pattern in semiconductor dev
JP2001168185A5 (ja) 半導体装置
JP2011222938A5 (enrdf_load_stackoverflow)
JP2014123671A5 (enrdf_load_stackoverflow)
JP2011502353A5 (enrdf_load_stackoverflow)
JP2014154800A5 (enrdf_load_stackoverflow)
CN108920012B (zh) 一种触控显示面板、显示装置及其制作方法
JP2006516824A5 (enrdf_load_stackoverflow)
WO2008007331A3 (en) Semiconductor devices and methods of manufacture thereof
JP2012003266A5 (enrdf_load_stackoverflow)
JP2003229575A5 (enrdf_load_stackoverflow)
JP2014215485A5 (enrdf_load_stackoverflow)
TWI612637B (zh) 接觸墊結構及其製造方法
JP2013511153A5 (enrdf_load_stackoverflow)
JP2007142382A5 (enrdf_load_stackoverflow)
JP2015025955A5 (enrdf_load_stackoverflow)
JP2005123243A5 (enrdf_load_stackoverflow)
JP2007080978A5 (enrdf_load_stackoverflow)
CN110211968B (zh) 一种显示基板及其制作方法、显示装置
JP2015099287A5 (enrdf_load_stackoverflow)
US8766452B2 (en) Semiconductor device including conductive lines and pads
JP2005123620A5 (enrdf_load_stackoverflow)
JP2006140506A5 (enrdf_load_stackoverflow)