JP2006128637A5 - - Google Patents

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Publication number
JP2006128637A5
JP2006128637A5 JP2005267932A JP2005267932A JP2006128637A5 JP 2006128637 A5 JP2006128637 A5 JP 2006128637A5 JP 2005267932 A JP2005267932 A JP 2005267932A JP 2005267932 A JP2005267932 A JP 2005267932A JP 2006128637 A5 JP2006128637 A5 JP 2006128637A5
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JP
Japan
Prior art keywords
opening
semiconductor device
metal layer
manufacturing
monitoring
Prior art date
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Granted
Application number
JP2005267932A
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English (en)
Japanese (ja)
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JP2006128637A (ja
JP4936695B2 (ja
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Priority to JP2005267932A priority Critical patent/JP4936695B2/ja
Priority claimed from JP2005267932A external-priority patent/JP4936695B2/ja
Publication of JP2006128637A publication Critical patent/JP2006128637A/ja
Publication of JP2006128637A5 publication Critical patent/JP2006128637A5/ja
Application granted granted Critical
Publication of JP4936695B2 publication Critical patent/JP4936695B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2005267932A 2004-09-29 2005-09-15 半導体装置及びその製造方法 Expired - Fee Related JP4936695B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005267932A JP4936695B2 (ja) 2004-09-29 2005-09-15 半導体装置及びその製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004285030 2004-09-29
JP2004285030 2004-09-29
JP2005267932A JP4936695B2 (ja) 2004-09-29 2005-09-15 半導体装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2006128637A JP2006128637A (ja) 2006-05-18
JP2006128637A5 true JP2006128637A5 (zh) 2008-10-16
JP4936695B2 JP4936695B2 (ja) 2012-05-23

Family

ID=36722932

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005267932A Expired - Fee Related JP4936695B2 (ja) 2004-09-29 2005-09-15 半導体装置及びその製造方法

Country Status (1)

Country Link
JP (1) JP4936695B2 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5026025B2 (ja) * 2006-08-24 2012-09-12 株式会社フジクラ 半導体装置
JP2008053429A (ja) * 2006-08-24 2008-03-06 Fujikura Ltd 半導体装置
JP2011096918A (ja) * 2009-10-30 2011-05-12 Oki Semiconductor Co Ltd 半導体装置および半導体装置の製造方法
JP2012023238A (ja) * 2010-07-15 2012-02-02 Renesas Electronics Corp 半導体装置、半導体装置の製造方法、及び半導体装置の設計方法
JP5970736B2 (ja) * 2012-04-27 2016-08-17 住友電工デバイス・イノベーション株式会社 半導体装置の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3966679B2 (ja) * 2000-09-12 2007-08-29 株式会社リコー 半導体装置の製造方法
JP2002217283A (ja) * 2001-01-18 2002-08-02 Sony Corp 半導体装置
JP2002217258A (ja) * 2001-01-22 2002-08-02 Hitachi Ltd 半導体装置およびその測定方法、ならびに半導体装置の製造方法
JP4212293B2 (ja) * 2002-04-15 2009-01-21 三洋電機株式会社 半導体装置の製造方法
JP4215571B2 (ja) * 2002-06-18 2009-01-28 三洋電機株式会社 半導体装置の製造方法
JP2004104046A (ja) * 2002-09-13 2004-04-02 Renesas Technology Corp 半導体装置およびその製造方法
JP4562371B2 (ja) * 2002-10-30 2010-10-13 三洋電機株式会社 半導体装置の製造方法

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