JP2006128637A5 - - Google Patents
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- Publication number
- JP2006128637A5 JP2006128637A5 JP2005267932A JP2005267932A JP2006128637A5 JP 2006128637 A5 JP2006128637 A5 JP 2006128637A5 JP 2005267932 A JP2005267932 A JP 2005267932A JP 2005267932 A JP2005267932 A JP 2005267932A JP 2006128637 A5 JP2006128637 A5 JP 2006128637A5
- Authority
- JP
- Japan
- Prior art keywords
- opening
- semiconductor device
- metal layer
- manufacturing
- monitoring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 20
- 239000010410 layer Substances 0.000 claims 19
- 239000002184 metal Substances 0.000 claims 11
- 238000004519 manufacturing process Methods 0.000 claims 8
- 239000000758 substrate Substances 0.000 claims 6
- 230000015572 biosynthetic process Effects 0.000 claims 2
- 238000005755 formation reaction Methods 0.000 claims 2
- 239000011241 protective layer Substances 0.000 claims 2
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005267932A JP4936695B2 (ja) | 2004-09-29 | 2005-09-15 | 半導体装置及びその製造方法 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004285030 | 2004-09-29 | ||
JP2004285030 | 2004-09-29 | ||
JP2005267932A JP4936695B2 (ja) | 2004-09-29 | 2005-09-15 | 半導体装置及びその製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2006128637A JP2006128637A (ja) | 2006-05-18 |
JP2006128637A5 true JP2006128637A5 (zh) | 2008-10-16 |
JP4936695B2 JP4936695B2 (ja) | 2012-05-23 |
Family
ID=36722932
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005267932A Expired - Fee Related JP4936695B2 (ja) | 2004-09-29 | 2005-09-15 | 半導体装置及びその製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4936695B2 (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5026025B2 (ja) * | 2006-08-24 | 2012-09-12 | 株式会社フジクラ | 半導体装置 |
JP2008053429A (ja) * | 2006-08-24 | 2008-03-06 | Fujikura Ltd | 半導体装置 |
JP2011096918A (ja) * | 2009-10-30 | 2011-05-12 | Oki Semiconductor Co Ltd | 半導体装置および半導体装置の製造方法 |
JP2012023238A (ja) * | 2010-07-15 | 2012-02-02 | Renesas Electronics Corp | 半導体装置、半導体装置の製造方法、及び半導体装置の設計方法 |
JP5970736B2 (ja) * | 2012-04-27 | 2016-08-17 | 住友電工デバイス・イノベーション株式会社 | 半導体装置の製造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3966679B2 (ja) * | 2000-09-12 | 2007-08-29 | 株式会社リコー | 半導体装置の製造方法 |
JP2002217283A (ja) * | 2001-01-18 | 2002-08-02 | Sony Corp | 半導体装置 |
JP2002217258A (ja) * | 2001-01-22 | 2002-08-02 | Hitachi Ltd | 半導体装置およびその測定方法、ならびに半導体装置の製造方法 |
JP4212293B2 (ja) * | 2002-04-15 | 2009-01-21 | 三洋電機株式会社 | 半導体装置の製造方法 |
JP4215571B2 (ja) * | 2002-06-18 | 2009-01-28 | 三洋電機株式会社 | 半導体装置の製造方法 |
JP2004104046A (ja) * | 2002-09-13 | 2004-04-02 | Renesas Technology Corp | 半導体装置およびその製造方法 |
JP4562371B2 (ja) * | 2002-10-30 | 2010-10-13 | 三洋電機株式会社 | 半導体装置の製造方法 |
-
2005
- 2005-09-15 JP JP2005267932A patent/JP4936695B2/ja not_active Expired - Fee Related
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