JP2006119651A5 - - Google Patents

Download PDF

Info

Publication number
JP2006119651A5
JP2006119651A5 JP2005306747A JP2005306747A JP2006119651A5 JP 2006119651 A5 JP2006119651 A5 JP 2006119651A5 JP 2005306747 A JP2005306747 A JP 2005306747A JP 2005306747 A JP2005306747 A JP 2005306747A JP 2006119651 A5 JP2006119651 A5 JP 2006119651A5
Authority
JP
Japan
Prior art keywords
phase shift
shift mask
layer
groove
grooved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005306747A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006119651A (ja
Filing date
Publication date
Priority claimed from US10/973,526 external-priority patent/US7384714B2/en
Application filed filed Critical
Publication of JP2006119651A publication Critical patent/JP2006119651A/ja
Publication of JP2006119651A5 publication Critical patent/JP2006119651A5/ja
Pending legal-status Critical Current

Links

JP2005306747A 2004-10-25 2005-10-21 位相シフトマスクを製作するための方法および位相シフトマスク Pending JP2006119651A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/973,526 US7384714B2 (en) 2004-10-25 2004-10-25 Anti-reflective sidewall coated alternating phase shift mask and fabrication method

Publications (2)

Publication Number Publication Date
JP2006119651A JP2006119651A (ja) 2006-05-11
JP2006119651A5 true JP2006119651A5 (https=) 2008-12-04

Family

ID=36206554

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005306747A Pending JP2006119651A (ja) 2004-10-25 2005-10-21 位相シフトマスクを製作するための方法および位相シフトマスク

Country Status (3)

Country Link
US (1) US7384714B2 (https=)
JP (1) JP2006119651A (https=)
SG (1) SG121937A1 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7674562B2 (en) * 2005-12-07 2010-03-09 Chartered Semiconductor Manufacturing, Ltd. Angled-wedge chrome-face wall for intensity balance of alternating phase shift mask
US20080261120A1 (en) * 2007-04-20 2008-10-23 Jeffrey Peter Gambino Photolithography mask with integrally formed protective capping layer
US20080261121A1 (en) * 2007-04-20 2008-10-23 Jeffrey Peter Gambino Photolithography mask with protective silicide capping layer
US20080261122A1 (en) * 2007-04-20 2008-10-23 Jeffrey Peter Gambino Photolithography mask with protective capping layer
JP2008299159A (ja) * 2007-06-01 2008-12-11 Nec Electronics Corp レベンソンマスク及びレベンソンマスクの製造方法
US20080311485A1 (en) * 2007-06-12 2008-12-18 William Stanton Photomasks Used to Fabricate Integrated Circuitry, Finished-Construction Binary Photomasks Used to Fabricate Integrated Circuitry, Methods of Forming Photomasks, and Methods of Photolithographically Patterning Substrates
US20090226823A1 (en) * 2008-03-06 2009-09-10 Micron Technology, Inc. Reticles including assistant structures, methods of forming such reticles, and methods of utilizing such reticles
EP2562599B1 (en) 2009-01-29 2014-12-10 Digiflex Ltd. Process for producing a photomask on a photopolymeric surface
US8586403B2 (en) * 2011-02-15 2013-11-19 Sunpower Corporation Process and structures for fabrication of solar cells with laser ablation steps to form contact holes
US8846273B2 (en) 2012-06-04 2014-09-30 Micron Technology, Inc. Photomasks, methods of forming a photomask, and methods of photolithographically patterning a substrate
CN108650794B (zh) * 2018-06-04 2023-01-17 上海量子绘景电子股份有限公司 一种线路板的制备方法
CN112099308B (zh) * 2020-10-22 2025-04-11 泉芯集成电路制造(济南)有限公司 衰减相移掩模版及其制程方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5411824A (en) * 1993-01-21 1995-05-02 Sematech, Inc. Phase shifting mask structure with absorbing/attenuating sidewalls for improved imaging
AU5681194A (en) * 1993-01-21 1994-08-15 Sematech, Inc. Phase shifting mask structure with multilayer optical coating for improved transmission
US5418095A (en) * 1993-01-21 1995-05-23 Sematech, Inc. Method of fabricating phase shifters with absorbing/attenuating sidewalls using an additive process
JP3750312B2 (ja) * 1997-10-20 2006-03-01 ソニー株式会社 位相シフトマスク及び位相シフトマスクの製造方法
JP2002289592A (ja) * 2001-03-28 2002-10-04 Sony Corp 半導体装置の製造方法
JP2003043662A (ja) * 2001-08-01 2003-02-13 Toppan Printing Co Ltd ハーフトーン型位相シフトマスク
US6824932B2 (en) * 2002-06-05 2004-11-30 International Business Machines Corporation Self-aligned alternating phase shift mask patterning process

Similar Documents

Publication Publication Date Title
TWI628715B (zh) 特徵尺寸縮減技術(二)
US8309463B2 (en) Method for forming fine pattern in semiconductor device
KR101572269B1 (ko) 극자외선 마스크를 보호하는 펠리클 제조 방법
JP2006119651A5 (https=)
TWI505336B (zh) 金屬光柵的製備方法
TW200908093A (en) Method for fabricating semiconductor device
TWI414001B (zh) 用於對材料層進行圖案化之方法
CN101271864B (zh) 光掩模以及利用该光掩模制造图像传感器的方法
JP5333978B2 (ja) パターンを形成する方法
TW201923834A (zh) 半導體結構的形成方法
JP2000206671A5 (https=)
US20090170310A1 (en) Method of forming a metal line of a semiconductor device
JP2002202585A5 (https=)
CN106298507B (zh) 图案化方法
CN104157556B (zh) 金属硬掩模开口刻蚀方法
CN102881567B (zh) 一种双重图形化方法
US7939451B2 (en) Method for fabricating a pattern
US20120225560A1 (en) Manufacturing method of integrated circuits based on formation of lines and trenches
JP6357753B2 (ja) ナノインプリントモールドの製造方法
CN118263096A (zh) 一种调节晶圆翘曲的方法
JP6019967B2 (ja) パターン形成方法
KR101145032B1 (ko) 포토마스크 제조 방법
KR20060077524A (ko) 시모스 이미지 센서의 제조방법
CN121578582B (zh) 一种耐刻蚀性复合硬掩膜的制备方法及其应用
TWI885866B (zh) 圖案化半導體結構之方法