JP2006093570A - Ceramic green sheet laminate for multi-cavity wiring board, multi-cavity wiring board, package for housing electronic component, electronic equipment and method for manufacturing multi-cavity wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a multi-cavity wiring board for reducing the possibility that position deviation is generated between insulating layers, a method for manufacturing the multi-cavity wiring board, a ceramic green sheet laminate, a package for housing an electronic component and electronic equipment. <P>SOLUTION: The ceramic green sheet laminate for a multi-cavity wiring board is configured of a laminate of a plurality of ceramic green sheets 101a to 101c in which a plurality of wiring board regions 109 are vertically and horizontally formed at the central section, and a dummy region 110 is formed at the outer peripheral section. A plurality of through-holes 111a to 111c whose diameters are different are formed so as to be continuously overlapped from the uppermost layer 111a to the lowermost layer 111c in the mutually press-fit upper and lower layer ceramic green sheets 101a to 101c in a dummy region 110 of each of the plurality of ceramic green sheets 101a to 101c. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a ceramic green sheet laminate for a multi-cavity wiring board, a multi-cavity wiring board, an electronic component storage package, an electronic device, and a manufacturing method of the multi-cavity wiring board.

  Conventionally, an electronic component storage package on which electronic components such as LSIs and crystal resonators are mounted is an upper surface of an insulating substrate formed by laminating a plurality of insulating layers formed of an insulating material such as an aluminum oxide sintered body. In this structure, an electronic component mounting portion is provided, and a wiring conductor is led out from the mounting portion to the lower surface or side surface of the insulating base. Such electronic component storage packages have become extremely small with a size of about several mm square in accordance with the recent demand for downsizing of electronic devices, and in order to facilitate handling, A large number of electronic component storage packages (wiring boards) can be obtained simultaneously from a single mother board in the form of a so-called multi-cavity wiring board.

  This multi-cavity wiring board includes a mother board in which a plurality of rectangular wiring board areas are arranged in the center of the main surface in the vertical and horizontal directions and a frame-like dummy area is formed in the outer periphery, and each wiring board area And a wiring conductor formed on the substrate. On the upper surface of each wiring board region, a mounting portion on which electronic components are mounted is formed. The wiring conductor is formed so that a part thereof is exposed to the mounting portion of the wiring board region and the other part is exposed to the lower surface or the like. By dividing this multi-piece wiring board into each wiring board region, an electronic component storage package can be obtained. The electronic component is mounted on the mounting portion of the electronic component storage package, and the electronic component is electrically connected to the wiring conductor to form an electronic device.

  Here, a conventional method for manufacturing a multi-piece wiring board will be described. First, a ceramic raw material powder is formed into a sheet together with an organic solvent and a binder to prepare a plurality of ceramic green sheets. And an opening part and a via hole are formed using a metal mold | die as needed.

  Next, a conductive paste serving as a wiring conductor is applied or filled on the surface of the ceramic green sheet or the inside of the via hole. The conductive paste filled in the via hole becomes a via conductor that electrically connects the wiring conductors between the upper and lower layers.

Next, a plurality of ceramic green sheets are laminated. Then, the laminate of ceramic green sheets is pressed from above and below to be bonded. After that, by firing the pressure-bonded ceramic green sheet, a multi-piece wiring board is obtained. In order to improve the adhesion between the ceramic green sheets, a binder is applied to the surface of each ceramic green sheet to soften and laminate the surface of the ceramic green sheet.
JP 2004-103727 A

  However, the conventional multi-cavity wiring board has a problem that a positional shift (lamination shift) may occur between the layers. If misalignment occurs between each layer, the position of the wiring conductors may deviate from each other, resulting in problems such as electrical short circuits and disconnections, and defects such as poor appearance and dimensional defects of electronic component storage packages. there were. Such misalignment between the layers is such that the ceramic green sheets are softened by the action of the binder, and the ceramic green sheets are easily misaligned between the respective layers when the ceramic green sheet laminate to be a multi-piece wiring board is pressure-bonded. Due to that.

  In particular, with the recent miniaturization of electronic devices, the size of the wiring board region has become as small as a few millimeters square, and the wiring conductor has also been miniaturized and increased in density. The impact has become significant. Moreover, the thickness of the ceramic green sheet has become very thin, for example, 0.3 mm or less due to demands for thinning and high functionality of electronic devices. Ceramic green sheets are becoming more susceptible to deformation such as deflection, and the possibility of displacement is increasing.

  In addition, misalignment is more conspicuous as the length of one side of each ceramic green sheet is longer, and as the wiring board area is farther from the outer periphery fixed to the metal frame, increasing the number of wiring board areas. It has become a problem when making it.

  The present invention has been devised in view of such conventional problems, and an object of the present invention is to provide a multi-piece wiring board in which the possibility of misalignment between insulating layers and a manufacturing method thereof, ceramic green, and the like are reduced. An object is to provide a sheet laminate, an electronic component storage package, and an electronic device.

  The ceramic green sheet laminate for a multi-cavity wiring board according to the present invention is formed by laminating a plurality of ceramic green sheets in which a plurality of wiring board regions are formed vertically and horizontally in the central portion and dummy regions are formed in the outer peripheral portion. In each of the plurality of ceramic green sheets, the upper and lower ceramic green sheets to be pressure-bonded to each other are formed so that through holes having different diameters are continuously overlapped from the uppermost layer to the lowermost layer. It is characterized by being.

  In the ceramic green sheet laminate for a multi-cavity wiring board according to the present invention, preferably, a plurality of the through holes are formed in each of the plurality of ceramic green sheets, and a diameter of each ceramic green sheet is It is characterized by being equal.

  In the ceramic green sheet laminate for a multi-cavity wiring board of the present invention, preferably, a plurality of the through holes are formed in each of the plurality of ceramic green sheets, and each ceramic green sheet has a large diameter. The through-holes and the small-diameter through-holes are alternately arranged.

  Further, the multi-cavity wiring board of the present invention is fired by pressing the plurality of ceramic green sheets of the ceramic green sheet laminate for the multi-cavity wiring board according to any one of claims 1 to 3. It is characterized by this.

  Further, the multi-piece wiring board of the present invention includes a mother board formed by laminating a plurality of insulating layers, a plurality of wiring board regions formed at the center of each insulating layer, and an outer peripheral part of each insulating layer. And a through hole formed in the dummy region of each insulating layer so as to have different diameters in the upper and lower layers bonded to each other and continuously overlap from the uppermost layer to the lowermost layer. In the upper and lower layers that are pressure-bonded, the surface portion of the insulating layer at the outer peripheral portion of the through hole with a small diameter is fitted into the through hole with a large diameter.

  In the multi-piece wiring board of the present invention, preferably, a plurality of the through holes are formed in each of the plurality of insulating layers, and the diameters of the respective insulating layers are equal. .

  In the multi-piece wiring board of the present invention, it is preferable that a plurality of the through holes are formed in each of the plurality of insulating layers, and each of the insulating layers has a large diameter through hole and a small diameter through hole. The holes are alternately arranged.

  An electronic component storage package according to the present invention is characterized in that the multi-cavity wiring board according to any one of claims 4 to 7 is divided into individual wiring board regions. It is.

  According to another aspect of the present invention, there is provided an electronic device comprising: the electronic component storage package according to claim 8; and an electronic component mounted on the electronic component storage package.

  In the method for manufacturing a multi-piece wiring board according to the present invention, a plurality of wiring board regions are formed vertically and horizontally in the center portion, and a dummy region is formed in the outer peripheral portion, and the dummy region has a through hole. A step of preparing a plurality of ceramic green sheets, and a step of laminating the plurality of ceramic green sheets so that the through holes having different diameters are continuously overlapped from the uppermost layer to the lowermost layer in the ceramic green sheets to be pressure-bonded to each other And a step of pressure-bonding the plurality of laminated ceramic green sheets, and a step of firing the pressure-bonded ceramic green sheets.

  The method for producing a multi-piece wiring board of the present invention preferably includes a step of forming a plurality of through holes having the same diameter in each ceramic green sheet.

  The method of manufacturing a multi-cavity wiring board according to the present invention includes a step of forming the plurality of through holes so that the large diameter through holes and the small diameter through holes are alternately arranged in each ceramic green sheet. It is characterized by having.

  The ceramic green sheet laminate for a multi-cavity wiring board of the present invention has through holes having different diameters from the uppermost layer to the uppermost layer of the ceramic green sheets to be bonded to each dummy region of the plurality of ceramic green sheets. By forming multiple layers of ceramic green sheets, the surface portions of the ceramic green sheets around the small diameter through-holes penetrate the large diameter through each layer. It is possible to reduce the possibility of misalignment between the upper and lower ceramic green sheets by fitting into the hole to function like a wedge.

  In addition, during bonding, excess binder remaining between the ceramic green sheets can be released from the through holes, effectively suppressing excessive softening of the surface portion of the ceramic green sheets. It is possible to reduce the possibility of being lost.

Further, by reducing the possibility of displacement of the ceramic green sheet, it is possible to increase the density of the wiring conductor and to reduce the thickness of the insulating layer, and to reduce the size of each wiring board region. . Further, by reducing the possibility of misalignment between layers, it is possible to increase the number of wiring board regions in the ceramic green sheet laminate, thereby improving the productivity of the multi-piece wiring board.

  In the ceramic green sheet laminate for a multi-cavity wiring board of the present invention, preferably, a plurality of through holes are formed in each of the plurality of ceramic green sheets, and the diameters of the ceramic green sheets are equal. Which ceramic green sheet is laminated when each ceramic green sheet is laminated can be grasped by recognizing the diameter of the through hole by an image device or the like. Therefore, the productivity of the ceramic green sheet laminate can be improved, and the cost can be reduced.

  In addition, by alternately arranging layers having small-diameter through-holes and layers having large-diameter through-holes, the same direction between each layer can be inserted into the through-holes of the ceramic green sheet during crimping. Since the fitting of is advanced, it is possible to obtain the effect of suppressing the shift in the same manner between the respective layers.

  In the ceramic green sheet laminate for a multi-cavity wiring board of the present invention, preferably, a plurality of through holes are formed in each of the plurality of ceramic green sheets, and each ceramic green sheet has a large diameter through hole. And the small-diameter through-holes are alternately arranged, so that the surface portion of the ceramic green sheet fits in the through-hole and functions as a wedge is alternately arranged up and down between one layer. Thus, the positional deviation between the upper and lower ceramic green sheets can be more effectively suppressed.

  Further, the ceramic green sheets can have the same rigidity in each ceramic green sheet, and the deflection of the ceramic green sheets in the conveying process can be suppressed. For this reason, misalignment between layers is further suppressed, and a highly reliable multi-piece wiring board can be obtained.

  Further, the multi-cavity wiring board of the present invention is reduced in size, thickness, height and height by pressing and firing a plurality of ceramic green sheets of the ceramic green sheet laminate for the multi-cavity wiring board of the present invention. Densification can be achieved, and reliability and productivity can be improved.

  In the multi-piece wiring board of the present invention, the upper and lower layers that are pressure-bonded to each other are such that the surface portion of the insulating layer at the outer peripheral portion of the small-diameter through-hole is fitted into the large-diameter through-hole. Thus, it is possible to realize a highly reliable multi-piece wiring board in which the displacement between the insulating layers is effectively suppressed. In addition, it is easy to increase the density of the wiring conductor and to reduce the thickness of the insulating layer, and it is possible to reduce the size of each wiring board region. Further, since the positional deviation between the layers is reduced, the number of wiring board regions can be increased, and the productivity can be improved.

  In the multi-piece wiring board of the present invention, preferably, a plurality of through-holes are formed in each of the plurality of insulating layers, and the diameters are equal in each insulating layer, so that the ceramic green sheets are laminated. Which ceramic green sheets are stacked on each other can be grasped by recognizing the diameter of the through hole by the image recognition device, and productivity can be improved. In addition, by alternately arranging the layer in which the small-diameter through hole is formed and the layer in which the large-diameter through hole is formed, the insulating layer is in the same direction between the layers of each insulating layer. Therefore, it is possible to obtain the effect of suppressing the shift in the same way between the respective layers, and the reliability can be further improved.

  In the multi-piece wiring board of the present invention, preferably, a plurality of through holes are formed in each of the plurality of insulating layers, and the large diameter through holes and the small diameter through holes are alternately arranged in each insulating layer. As a result, the surface portion of the insulating layer fits into the through-hole and the portion that functions as a wedge is alternately arranged between the upper and lower layers, and the thickness between the insulating layers is increased. Regardless of this, misalignment between the upper and lower insulating layers can be more effectively suppressed, and the reliability can be further improved. Furthermore, the rigidity in each insulating layer can be made uniform, and the bending of the ceramic green sheet in the conveyance process can be suppressed. As a result, misalignment between layers can be further reduced, and reliability can be further improved.

  In addition, the electronic component storage package of the present invention can be reduced in size, highly integrated, and thinned by dividing the multi-cavity wiring board of the present invention into individual wiring board regions. It is possible to provide an electronic component storage package having excellent electrical characteristics.

  In addition, the electronic device of the present invention includes the electronic component storage package of the present invention and the electronic component mounted on the electronic component storage package, thereby achieving downsizing, high integration, and thinning. Thus, an electronic device having excellent electrical characteristics can be provided.

  In the method for manufacturing a multi-piece wiring board according to the present invention, a plurality of ceramic green sheets are laminated so that through holes having different diameters are continuously overlapped from the uppermost layer to the lowermost layer in the ceramic green sheets to be pressure-bonded to each other. By having a process and a process of crimping a plurality of laminated ceramic green sheets, the surface portion of the ceramic green sheet around the small-diameter through hole fits into the large-diameter through hole, It can play a role like a wedge between the upper and lower layers to effectively suppress the displacement. As a result, it is possible to manufacture a multi-piece wiring board with excellent electrical characteristics while suppressing problems such as disconnection and connection failure.

  In addition, since the displacement between layers is effectively prevented, the wiring board region can be easily reduced in size, thickness, and functionality. Further, even in a ceramic green sheet having a large area, it is possible to suppress misalignment between layers and increase the number of wiring board regions in the ceramic green sheet, thereby improving the productivity of the multi-piece wiring board. .

  In addition, the method for producing a multi-cavity wiring board of the present invention preferably has a step of forming a plurality of through holes having the same diameter in each ceramic green sheet, whereby the rigidity as a sheet depends on the thickness of each ceramic green sheet. Even if a difference occurs, a plurality of through holes corresponding to the rigidity can be formed. Therefore, it is possible to suppress the deflection of the ceramic green sheet in the conveying process.

  In addition, by alternately laminating ceramic green sheets with small-diameter through-holes and ceramic green sheets with large-diameter through-holes, the ceramics in the same direction between the layers of each ceramic green sheet Since the fitting of the green sheet into the through hole proceeds, it is possible to obtain the effect of suppressing the shift in the same manner between the layers.

  In addition, the method for manufacturing a multi-cavity wiring board of the present invention includes a step of forming a plurality of through holes so that large diameter through holes and small diameter through holes are alternately arranged in each ceramic green sheet. The part of the ceramic green sheet that fits into the through-hole and functions as a wedge is placed alternately between the upper and lower layers between the layers, making the displacement between the upper and lower ceramic green sheets more effective. Can be suppressed.

  Furthermore, the rigidity of the ceramic green sheet can be made uniform, and the deflection of the ceramic green sheet in the conveying process can be suppressed. Therefore, the possibility of positional displacement between layers can be further reduced.

  First, the manufacturing method of the multi-piece wiring board of this invention is demonstrated in detail using drawing. 1 (a) to 1 (d) are diagrams showing steps of a method for manufacturing a multi-piece wiring board according to the present invention. 1A to 1D are cross-sectional views of a ceramic green sheet and the like. The method for manufacturing a multi-piece wiring board of the present invention includes the following four steps. The first step is a plurality of ceramic green sheets in which a plurality of wiring board regions 109 are formed vertically and horizontally in the center portion and a dummy region 110 is formed in the outer peripheral portion, and the dummy region 110 has a through hole 111. 101 is a step of preparing 101 (FIGS. 1A and 1B). In the second process, through-holes 111a to 111c having different diameters are continuously overlapped from the uppermost layer 101a to the lowermost layer 101c in ceramic green sheets (for example, 101a and 101b, 101b and 101c) to be bonded to each other. This is a step of laminating a plurality of ceramic green sheets 101a to 101c (FIG. 1C). The third step is a step (FIG. 1 (d)) in which a plurality of laminated ceramic green sheets 101a to 101c are pressure-bonded. The fourth step is a step of firing the plurality of press-bonded ceramic green sheets 101a to 101c. Hereinafter, these steps will be described in more detail.

  First, as shown in FIG. 1A, a ceramic raw material powder is formed into a sheet shape together with an organic solvent and a binder to prepare a plurality of ceramic green sheets 101 (101a, 101b, 101c). A plurality of wiring board regions 109 are formed vertically and horizontally at the center of each ceramic green sheet 101, and a dummy region 110 is formed at the outer periphery.

  Through holes 111 (111 a to 111 c) are formed in the dummy region 110 of the ceramic green sheet 101. The through hole 111 can be formed by punching using the mold 103, laser processing, or the like. In addition, the through-hole 111 is formed so that a diameter may differ in the ceramic green sheet mutually crimped | bonded when a ceramic green sheet is laminated | stacked. The diameter of the through hole 111 is the diameter of the cross section of the through hole 111 when the through hole 111 is circular, and the long axis of the cross section of the through hole 111 when the through hole 111 is elliptical. Or it is a short axis, and when it is quadrangular, it is the length of a side or a diagonal line. The through-hole 111 can be easily formed if it is circular, and the upper and lower layers can be easily aligned as will be described later.

  Further, if necessary, an opening 104 and a via hole 102 in which electronic components are mounted may be formed in the ceramic green sheet 101 using a mold 103. Further, in order to facilitate conveyance and processing in the subsequent process, it is preferable to attach a metal frame (not shown) to the ceramic green sheet 101. The ceramic green sheet 101 can be attached to the metal frame by joining the outer periphery of the ceramic green sheet 101 and the inner periphery of the metal frame via an adhesive or an adhesive tape. Note that FIG. 1A shows only one layer among the plurality of ceramic green sheets 101a to 101c.

  Next, as shown in FIG. 1 (b), a metal powder such as tungsten, molybdenum, manganese, copper, silver, palladium, gold, platinum, an organic solvent, a binder, and the like are formed on the surface of the ceramic green sheet 101 and in the via hole 102. Is applied or filled by screen printing using a printing mask 107 or the like. As the conductive paste 105, a paste in which the composition, the mixing amount of the organic solvent and the binder, or the like is changed according to the part to be coated or filled may be used. In the example of FIG. 1, the conductive paste 105 a is applied or filled into the via hole 102, and the conductive paste 105 b is applied to the surface of the ceramic green sheet 101.

  Next, as shown in FIG. 1C, the through holes 111a to 111c having different diameters in the ceramic green sheets 101a and 101b and 101b and 101c to be bonded to each other continuously overlap from the uppermost layer 101a to the lowermost layer 101c. A plurality of ceramic green sheets 101a to 101c are laminated. In order to allow the through holes 111 to overlap between the upper and lower layers, for example, a notch is provided in advance in the metal frame to which the ceramic green sheet 101 is attached, and the upper and lower ceramic green sheets are based on the notch. It is possible to perform this by aligning the positions.

  Through this stacking step, the conductive pastes 105a filled in the upper and lower via holes 102 come into contact with each other and are electrically connected. In this laminating step, a binder is applied to the opposing surfaces (contact surfaces) of the ceramic green sheets in order to improve the adhesion between the ceramic green sheets 101a, 101b, 101c.

  Next, as shown in FIG.1 (d), the laminated body of the ceramic green sheet to which predetermined processing was performed is pressurized up and down, and each ceramic green sheet 101a-101c is crimped | bonded. At this time, the adhesion effect between the upper and lower ceramic green sheets 101a to 101c is increased by applying a binder to the adhesion surfaces of the ceramic green sheets 101a, 101b, and 101c to increase flexibility.

  Next, the plurality of bonded ceramic green sheets 101a to 101c are fired.

  As described above, the manufacturing method of the multi-piece wiring board according to the present invention is such that the through-holes 111a to 111c having different diameters in the upper and lower ceramic green sheets 101a and 101b and 101b and 101c to be bonded to each other are formed from the uppermost layer 101a to the lowermost layer. 101 c by laminating a plurality of ceramic green sheets 101 a to 101 c so as to continuously overlap with 101 c and a step of pressure-bonding the laminated ceramic green sheets 101 a to 101 c. In this case, it is possible to reduce the possibility of occurrence of misalignment.

  Here, the crimping process shown in FIG. 1D will be described in more detail with reference to FIG. FIG. 2 is an enlarged view of the periphery of the through hole 111 in the dummy region 110 in the crimping process shown in FIG. That is, in the method for manufacturing a multi-piece wiring board of the present invention, when the laminated ceramic green sheets 101a to 101c are pressure-bonded, the surface portions 201a of the ceramic green sheets 101a and 101c around the small-diameter through holes 111a and 111c. And 201c are fitted into the large-diameter through-hole 111b, and it is possible to reduce the possibility of misalignment by acting like a wedge between the upper and lower layers.

  As a result, it is possible to reduce the possibility of problems in electrical connection such as disconnection and connection failure. In addition, since the possibility of occurrence of misalignment between layers can be reduced, the size of the wiring board region 109 can be reduced. In addition, since the possibility of occurrence of misalignment between layers can be reduced, it is possible to manufacture a multi-piece wiring board in which the number of wiring board regions 109 is increased.

  Moreover, it is preferable that the manufacturing method of the multi-piece wiring board of this invention has the process of forming several through-hole 111a-111c with same diameter in each ceramic green sheet 101a-101c. Ceramic green sheets 101a to 101c in which through holes 111a to 111c are formed by this process are shown in FIG. 3A is a plan view of the uppermost ceramic green sheet 101a, FIG. 3B is a plan view of the intermediate ceramic green sheet 101b, and FIG. 3C is the lowermost layer. It is a top view of the ceramic green sheet 101c. That is, in the method for manufacturing a multi-piece wiring board according to the present invention, for example, a plurality of small-diameter through holes 111a are formed in the uppermost ceramic green sheet 101a, and a plurality of large-diameter through-holes are formed in the intermediate ceramic green sheet 101b. A hole 111b is formed, and a plurality of small-diameter through holes 111c are formed in the lowermost ceramic green sheet 101c.

  The manufacturing method of the multi-cavity wiring board according to the present invention has such a process, so that even when the ceramic green sheets 101a to 101c have different thicknesses, the rigidity of the ceramic green sheets is increased. A plurality of matching through holes 111a to 111c can be formed. Therefore, the deflection of the ceramic green sheets 101a to 101c when the ceramic green sheets 101a to 101c are conveyed can be suppressed.

  In addition, for example, ceramic green sheets 101a and 101c in which small-diameter through holes 111a and 111c are formed and ceramic green sheets 101b in which large-diameter through holes 111b are formed are alternately stacked, so that each ceramic Since the ceramic green sheets 101a and 101c are fitted into the through holes 111b in the same direction between the layers of the green sheets 101a to 101c, it is possible to obtain the same effect of suppressing the shift between the layers.

  The method for manufacturing a multi-piece wiring board according to the present invention includes a step of forming a plurality of through-holes 111 so that large-diameter through-holes and small-diameter through-holes are alternately arranged in each of the ceramic green sheets 101a to 101c. You may have. Ceramic green sheets 101a to 101c in which through holes are formed by this process are shown in FIG. 4A is a plan view of another example of the uppermost ceramic green sheet 101a, and FIG. 4B is a plan view of another example of the intermediate ceramic green sheet 101b. ) Is a plan view of another example of the lowermost ceramic green sheet 101c. That is, in the method for manufacturing a multi-piece wiring board according to the present invention, a plurality of through holes are formed so that the large diameter through holes 401 and the small diameter through holes 402 are alternately arranged in each of the ceramic green sheets 101a to 101b. You may have a process. The manufacturing method of the multi-piece wiring board of the present invention has such a process, so that the surface portion of the ceramic green sheet 101 is fitted in the through hole and functions as a wedge alternately between the upper and lower layers. Therefore, the positional deviation between the upper and lower ceramic green sheets 101 can be more effectively suppressed regardless of the thickness of each ceramic green sheet 101.

  Further, the ceramic green sheets 101a to 101c can have the same rigidity, and the deflection of the ceramic green sheets 101a to 101c during the conveyance process can be suppressed. As a result, the possibility of occurrence of misalignment between layers can be further reduced.

  Next, the ceramic green sheet laminate for the multi-piece wiring board of the present invention will be described. The ceramic green sheet laminate for a multi-cavity wiring board of the present invention has a configuration before the crimping process shown in FIG. That is, in the ceramic green sheet laminate for multi-cavity wiring boards of the present invention, as shown in FIG. 2, a plurality of wiring board regions 109 are formed vertically and horizontally at the center and dummy regions 110 are formed at the outer periphery. A plurality of formed ceramic green sheets 101a to 101c are laminated, and the upper and lower ceramic green sheets 101a to 101c that are press-bonded to each dummy region 110 of the plurality of ceramic green sheets 101a to 101c have different diameters. The through holes 111a to 111c are formed so as to continuously overlap from the uppermost layer 101a to the lowermost layer 101c.

  The ceramic green sheet for a multi-piece wiring board according to the present invention has such a configuration, and therefore, when the laminated ceramic green sheets 101a to 101c are pressure-bonded, the layers of the ceramic green sheets that are pressure-bonded to each other. The surface portions 201a and 201c of the ceramic green sheets 101a and 101c around the small-diameter through holes 111a and 111c are fitted into the large-diameter through-holes 111b to function like wedges. It is possible to reduce the possibility of misalignment between the green sheets 101a to 101c.

  Further, when the plurality of ceramic green sheets 101a to 101c are pressure-bonded, excess binder remaining between the ceramic green sheets 101a to 101c can be released to the through holes 111a to 101c, so that the surface portion of the ceramic green sheet 101 is It can suppress that it softens excessively and can suppress that each ceramic green sheet 101a-101c shifts | deviates in the dummy area | region 110. FIG.

  Further, in the ceramic green sheet laminate for a multi-cavity wiring board of the present invention, as shown in FIG. 3, a plurality of through holes 111a to 111c are formed in each of the plurality of ceramic green sheets 101a to 101c. The ceramic green sheets 101a to 101c preferably have the same diameter. The ceramic green sheet laminate for a multi-cavity wiring board according to the present invention has such a configuration, which indicates which ceramic green sheets are laminated when the ceramic green sheets 101a to 101c are laminated. The diameters of the through holes 111a to 111c can be grasped by recognizing them with an image device or the like. Therefore, it is possible to easily grasp the stacking order and the print pattern, and it is possible to realize a ceramic green sheet laminate for a multi-cavity wiring board with improved productivity and reduced cost.

  Further, the ceramic green sheets 101a and 101c in which the small-diameter through holes 111a and 111c are formed and the ceramic green sheets 101b in which the large-diameter through holes 111b are formed are alternately arranged, so that the laminate can be obtained. When crimping, the surface portions of the ceramic green sheets 101a and 101c are fitted into the through-holes 111b in the same direction in each layer, and the effect of suppressing misalignment can be obtained in the same way between the layers. A more reliable ceramic green sheet laminate for a multi-piece wiring board can be realized.

  Moreover, as shown in FIG. 4, the ceramic green sheet laminate for a multi-cavity wiring board of the present invention has a plurality of through holes formed in each of the plurality of ceramic green sheets 101a to 101c. In the sheets 101a to 101c, it is preferable that the large diameter through holes 401 and the small diameter through holes 402 are alternately arranged. The ceramic green sheet laminate for a multi-cavity wiring board of the present invention has such a configuration, so that the surface portions of the ceramic green sheets 101a to 101c are fitted into the large-diameter through-holes 402 as wedges. The part which performs a function will be alternately arrange | positioned up and down alternately in one layer, and the position shift between the ceramic green sheets 101a-101c can be suppressed more effectively.

  Moreover, in each ceramic green sheet 101a-101c, rigidity can be arrange | equalized and the bending of ceramic green sheet 101a-c in a conveyance process can be suppressed. Therefore, it is possible to realize a ceramic green sheet laminate for a multi-piece wiring board in which the possibility of occurrence of displacement between layers is further reduced.

  Next, the multi-piece wiring board of the present invention will be described. The multi-piece wiring board of the present invention is obtained by firing a plurality of pressure-bonded ceramic green sheets 101a to 101c (FIG. 1 (d)). FIG. 5 shows a cross-sectional view of the peripheral portion of the through hole in the dummy area of the multi-piece wiring board of the present invention. That is, the multi-piece wiring board of the present invention includes a mother board 501, a wiring board area 502 and a dummy area 503 formed on the mother board 501, and a through hole 504 formed in the dummy area 503 of the mother board 501. I have.

  The mother board 501 is formed by laminating a plurality of insulating layers 501a to 501c. A plurality of wiring board regions 502 are formed in the center of each of the insulating layers 501a to 501c. The dummy region 503 is formed on the outer periphery of each of the insulating layers 501a to 501c. The through hole 504 is formed in the dummy region 503 of each of the insulating layers 501a to 501c. The through holes 504 have different diameters in the upper and lower insulating layers 501a to 501c that are pressure-bonded to each other. The through hole 504 is formed so as to continuously overlap from the uppermost layer 501a to the lowermost layer 501c of the insulating layer. In the multi-layer wiring board of the present invention, in the upper and lower insulating layers 501a to 501c that are pressure-bonded to each other, the surface portions of the insulating layers 501a and 501c at the outer peripheral portions of the through holes 504a and 504c having small diameters It has a structure fitted into the large through-hole 504b. Each wiring board region 502 is formed with a wiring conductor 505 and via conductors (not shown) formed by firing the conductive paste 105.

  In the multi-layer wiring board of the present invention, in the upper and lower insulating layers 501a to 501c that are pressure-bonded to each other, the surface portions of the insulating layers 501a and 501c in the outer peripheral portion of the small diameter through holes 504a and 504c By being fitted in the hole 504b, a highly reliable multi-piece wiring board in which the displacement between the insulating layers 501a to 501c is effectively suppressed can be realized. In addition, since the possibility of displacement between the insulating layers 501a to 501c is reduced, it is easy to increase the density of the wiring conductor 505 and to reduce the thickness of the insulating layers 501a to 501c. Miniaturization becomes easy. In addition, since the wiring board region 502 can be reduced in size, the number of wiring board regions 502 can be increased and productivity can be improved.

  Further, as shown in FIG. 6, the multi-cavity wiring board of the present invention has a plurality of through holes 504 a to 504 c formed in each of the plurality of insulating layers 501 a to 501 c, and each of the insulating layers 501 a to 501 c has a diameter. Are preferably equal. 6A is a plan view of the uppermost insulating layer 501a, FIG. 6B is a plan view of the intermediate insulating layer 501b, and FIG. 6C is a lowermost insulating layer. It is a top view of 501c. The multi-cavity wiring board of the present invention has such a configuration, and recognizes the diameter of the through holes 504a to 504c to identify which ceramic green sheet is laminated when each ceramic green sheet is laminated. Thus, a multi-piece wiring board with reduced production costs can be realized.

  Further, the layers in which the small-diameter through holes 504a and 504c are formed and the layers in which the large-diameter through holes 504b are formed are alternately arranged, so that each of the layers between the insulating layers 501a to 501c is provided. The insulating layers 501a and 501c are fitted in the through holes 504b in the same direction, and the positional deviation is similarly suppressed between the respective layers, so that a more reliable multi-piece wiring board can be realized.

  Further, as shown in FIG. 7, in the multi-piece wiring board of the present invention, a plurality of through holes are formed in each of the plurality of insulating layers 501a to 501c, and a large-diameter through hole is formed in each of the insulating layers 501a to 501c. It is preferable that the holes 701 and the small-diameter through holes 702 are alternately arranged.

  In this case, the portions where the surface portion of the insulating layer is fitted into the through-holes and function as wedges are alternately arranged in one layer up and down, and the positional deviation between the upper and lower insulating layers is further increased. A highly reliable multi-piece wiring board that is effectively suppressed and can be realized.

  In addition, the rigidity of the ceramic green sheets in each layer can be made uniform, reducing the possibility of bending of the ceramic green sheets and misalignment between layers in the transport process before firing. A wiring board can be realized.

  The multi-piece wiring board of the present invention is divided into individual pieces for each wiring board region, whereby the electronic component storage package of the present invention is formed.

  The electronic component storage package of the present invention can be downsized, highly integrated, and thinned because the possibility of displacement is reduced, and an electronic component storage package having excellent electrical characteristics is provided. Can be provided.

  The electronic device of the present invention includes the electronic component storage package having the above-described configuration and an electronic component (not shown) mounted on the electronic component storage package. In the electronic device of the present invention, since the stacking deviation is suppressed, the electronic device can be miniaturized, highly integrated, and thinned, and can be provided with excellent electrical characteristics. Electronic components mounted on the electronic component storage package are semiconductor elements, piezoelectric elements, micromachines, and the like. The electronic component mounted on the electronic component storage package is covered with a lid, a sealing resin, or the like as necessary.

  In addition, this invention is not limited to the above-mentioned example, A various deformation | transformation is possible in the range which does not deviate from the summary of this invention. For example, in the above-described example, the through hole in the dummy region of each ceramic green sheet has a circular shape. However, in the upper and lower layers bonded to each other, the surface of the insulating layer (ceramic green sheet) on the outer periphery of the through hole with a small diameter For example, an oval shape or a quadrangular shape may be used as long as the portion fits into a through-hole having a large diameter.

(A)-(d) is a figure which shows the process of the manufacturing method of the multi-cavity wiring board of this invention. FIG. 2 is an enlarged view of the vicinity of a through hole 111 in a dummy region in the crimping process shown in FIG. (A) is a top view which shows the structure of the ceramic green sheet 101a of the uppermost layer, (b) is a top view which shows the structure of the ceramic green sheet 101b of an intermediate | middle layer, (c) is the lowest layer It is a top view which shows the structure of the ceramic green sheet 101c. (A) is a top view which shows the structure of the other example of the ceramic green sheet 101a of the uppermost layer, (b) is a top view which shows the structure of the other example of the ceramic green sheet 101b of an intermediate | middle layer, (C) is a top view which shows the structure of the other example of the ceramic green sheet 101c of the lowest layer. It is sectional drawing of the peripheral part of the through-hole of the dummy area | region of the multi-cavity wiring board of this invention. (A) is a top view which shows the structure of the uppermost insulating layer 501a, (b) is a top view which shows the structure of the insulating layer 501b of an intermediate | middle layer, (c) is the insulating layer of the lowest layer It is a top view which shows the structure of 501c. (A) is a top view which shows the structure of the other example of the uppermost insulating layer 501a, (b) is a top view which shows the structure of the other example of the insulating layer 501b of an intermediate | middle layer, (c) ) Is a plan view showing the structure of another example of the lowermost insulating layer 501c.

Explanation of symbols

101 (101a to 101c) ... ceramic green sheet 102 ... via hole 103 ... mold 104 ... opening 105 ... conductive paste 107 ... printing mask 109 ... wiring board region 110 ... dummy region 111 ... through hole

Claims (12)

A plurality of ceramic green sheets in which a plurality of wiring board regions are formed vertically and horizontally in the central portion and a dummy region is formed on the outer peripheral portion are laminated, and in each dummy region of each of the plurality of ceramic green sheets, The ceramic green sheet laminate for multi-piece wiring boards, wherein the upper and lower ceramic green sheets that are pressure-bonded to each other are formed so that through holes having different diameters are continuously overlapped from the uppermost layer to the lowermost layer body. 2. The ceramic green sheet laminate for a multi-piece wiring board according to claim 1, wherein a plurality of the through holes are formed in each of the plurality of ceramic green sheets, and the diameters of the ceramic green sheets are equal. body. A plurality of the through holes are formed in each of the plurality of ceramic green sheets, and the large diameter through holes and the small diameter through holes are alternately arranged in each of the ceramic green sheets. The ceramic green sheet laminate for a multi-cavity wiring board according to claim 1. A multi-cavity wiring board, wherein the plurality of ceramic green sheets of the ceramic green sheet laminate for a multi-cavity wiring board according to any one of claims 1 to 3 are pressed and fired. A mother board formed by laminating a plurality of insulating layers, a plurality of wiring board regions formed at the center of each insulating layer, a dummy region formed at the outer periphery of each insulating layer, and each insulating layer And the through-holes formed so as to continuously overlap from the uppermost layer to the lowermost layer in the upper and lower layers pressure-bonded to each other, the through-holes having a small diameter in the upper and lower layers pressure-bonded to each other A multi-piece wiring board, wherein a surface portion of the insulating layer at an outer peripheral portion of the hole is fitted into the through-hole having a large diameter. 6. The multi-piece wiring board according to claim 5, wherein a plurality of the through holes are formed in each of the plurality of insulating layers, and the diameters of the respective insulating layers are equal. The plurality of through holes are formed in each of the plurality of insulating layers, and the large diameter through holes and the small diameter through holes are alternately arranged in each of the insulating layers. Item 6. The multi-cavity wiring board according to Item 5. 8. A package for storing electronic components, wherein the multi-piece wiring board according to claim 4 is divided into individual pieces for each wiring board region. 9. An electronic device comprising: the electronic component storage package according to claim 8; and an electronic component mounted on the electronic component storage package. A plurality of wiring board regions are formed vertically and horizontally in the central portion and a dummy region is formed in the outer peripheral portion, and preparing a plurality of ceramic green sheets having through holes in the dummy region;
Laminating the plurality of ceramic green sheets so that the through holes having different diameters are continuously overlapped from the uppermost layer to the lowermost layer in the ceramic green sheets to be pressure-bonded to each other;
A step of pressure-bonding the laminated ceramic green sheets; and
And a step of firing the plurality of ceramic green sheets that have been pressure-bonded. The method of manufacturing a multi-cavity wiring board according to claim 10, further comprising a step of forming a plurality of the through holes having the same diameter in each ceramic green sheet. 11. The multi-piece wiring according to claim 10, further comprising a step of forming a plurality of through holes so that the through holes having a large diameter and the through holes having a small diameter are alternately arranged in each ceramic green sheet. A method for manufacturing a substrate.

Images