JPH06350257A - Front-back connection wiring board - Google Patents

Abstract

PURPOSE:To provide a high integration highly reliable front-back connection wiring board in which each through hole is provided with joints of two circuits. CONSTITUTION:A dielectric 1 provided with a conductor hole 4 by a through hole system is pressure bonded to a dielectric 3 provided with a conductor hole 6 by a through hole system while sandwiching a dielectric 2 provided with a hole 5 having a diameter different from those of the holes 4, 6 thus providing a continuous through hole 7.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a double-sided wiring connection board for electronic circuit wiring connection.

[0002]

2. Description of the Related Art Conventionally, a through-hole type substrate or a through-pin type substrate is generally used as a double-sided circuit connecting method. A part of the through-hole type substrate is shown in FIG. 2. In FIG. 2, (21) is an insulator such as resin,
(22A) and (22B) are circuit conductors on each side of the insulator (21), and (23) is an insulator (2).
The hole opened in 1), (24) is a conductor formed on the inner peripheral wall of the hole (23) by electroplating or chemical plating, and the conductor (24) is provided between the circuit conductors (22A) and (22B). Is conducted. A part of the through-pin type substrate is shown in FIG. 3. In FIG. 3, (31) is an insulator such as resin,
(32A) and (32B) are circuit conductors on each side of the insulator (31), and (33) is an insulator (3).
1) is a hole opened, and (35) is a conductive pin inserted in the hole (33). The pin (35) is connected to the circuit conductor (32).
A) and (32A) are soldered with solder (36) to electrically connect the double-sided circuit wirings of the circuit conductors (32A) and (32B).

[0003]

In such a board as described above, there are often times when it is desired to change the board circuit, short circuit, or make a branch connection due to the change of the wiring diagram or the selection of the signal circuit. There are the following drawbacks when conducting the wiring or interrupting the conduction. In the through-hole type substrate of FIG. 2, the double-sided circuit is manufactured in a conductive state, and in order to cut off the conductive state of the double-sided circuit, the conductor (24) must be cut and cut with an electric drill or the like. In this cutting operation, circuit conductors (22A), (22B)
The electric conductor is peeled off, the wiring circuit is partially broken, or the reliability of the wiring circuit is deteriorated, and the conducting operation is not easy again. In the through-pin type substrate of FIG. 3, the pins (35) for conducting the circuit conductors (32A) and (32B) of the double-sided circuit are connected to the circuit conductors (32A) and (32).
Pin (3) for soldering to B)
During the soldering work of removing 5) from the circuit conductors (32A) and (32B), the circuit conductors (32A) and (32B) and the insulator (31) are heated and pressed by the soldering iron. The adhesive force between the circuit conductors (32
A) and (32B) are peeled off, the wire is broken, or a part of the wire is broken, so that the reliability of the wiring circuit decreases. The present invention has been made to eliminate these drawbacks.

[0004]

In FIG. 1, a conductor hole (4) processed by a through hole method in an insulator (1) and a conductive material processed by a through hole method in an insulator (3). The hole (6) of the body sandwiches the insulator (2) provided with the hole (4) or the hole (5) having a hole diameter different from the hole diameter of the hole (6), and the hole (4), the hole (5) A through hole (7) formed by continuously forming the hole (6) is provided and pressure-bonded. The present invention is a double-sided wiring connection board having the above configuration.

[0005]

In FIG. 4, solder, which is a conductor, is soldered between the circuit conductors (4A) and (6A) in the through hole (7) to establish conduction between the conductors (4A) and (6A). Let me use
Further, in order to cut off between the circuit conductors (4A) and (6A), the solder (8) is heated and melted with a soldering iron or the like to remove it, so that conduction can be cut off.

[0006]

EXAMPLES Examples of the present invention will be described below. In FIG. 1, circuit conductors (4A) and (4B) are circuit-wired by a conductor hole (4) in which a hole is formed in the insulator (1) by a through-hole method and the inner peripheral wall is a conductor. Similarly, a circuit conductor (6A) circuit-wired by a substrate having electrical continuity between the conductors and a conductor hole (6) in which a hole is formed in the insulator (3) by a through-hole method and the inner peripheral wall is a conductor. ),
(6B) The substrate having electrical continuity is the hole (4) or the hole (6).
Insulator (2) with a hole (5) with an inner diameter different from that of
Through which a hole (4), a hole (5), and a hole (6) are continuously formed, and pressure bonding is performed. The present invention has the above-described structure, and an example of this use will be described. With reference to the drawings, a description will be given of examples of use in which a circuit board circuit is changed, a short circuit occurs, and a branch connection often occurs due to a wiring diagram change or a signal circuit selection. In the usage example (a) and FIG. 4, the solder, which is a conductor, is heated and melted in the through hole (7) with a soldering iron, and is poured between the holes (4) and (6) of the conductor to form a circuit conductor (4A). , (6A) is conducted,
Also, by changing the wiring again, the circuit conductor (4A),
When it is desired to cut off the conduction between (6A), the conduction can be cut off by heating and melting the solder (8) with a soldering iron or hot air. In the usage example (b) and FIG. 5, the conductive pin (9) is inserted into the through hole (7) and soldered to the circuit conductors (4A) and (6A), and the circuit conductor (4A), When it is desired to cut off the conduction between the circuit conductors (4A) and (6A) by electrically connecting between (6A) or changing the wiring again, heat and melt the solder (8) with a soldering iron or hot air, By removing it with the pin (9),
The conduction can be cut off. For the same purpose as in use example (c), use example (a), and (b). In the case of FIG. 6, instead of solder, at least the surface of which is made of elastic rubber or resin (10) having conductivity is packed. In the case of FIG. 7, a rod-shaped elastic body (11) having conductivity is inserted. In the case of FIG. 8, a conductive screw (12) such as a metal screw is screwed in. In the case of FIG. 9, the spring (13) is inserted. In the case of FIG. 10, a wire-shaped elastic body (14) having a V-shaped tip is inserted. By connecting and disconnecting the conductor, conduction and interruption of conduction are performed. FIG. 11 shows an application example (d) of application to a matrix board. One circuit conductor (4A) is on the X axis (15), and the other circuit conductor (6A) is on the Y axis (16). By forming a plurality of wiring circuits in each of the two and using the through holes (7) of the present invention at the intersections thereof, the X axis (15) and the Y axis (1
It is possible to arbitrarily and freely branch, change, short-circuit, etc. the wiring circuit with 6).

[0007]

EFFECTS OF THE INVENTION (a) Conductor holes (4), holes (6)
However, since it is processed by the through-hole method, it has high strength against heat and pressure, and the reliability of the wiring circuit can be kept high even if the soldering iron work for conduction and conduction interruption is repeated. (B) Since a reliable contact point of two circuits can be provided in one through hole (7), a two-point connection circuit board having a high degree of integration can be constructed. (C) As a method of using the present invention most effectively,
With matrix board, highly integrated and reliable matrix board can be constructed. (D) By making the hole (5) narrower than the hole (4) and the hole (6), it is possible to prevent the solder film from remaining between the hole (4) and the hole (6) at the time of removing solder for conduction interruption. It is possible to prevent and easily cut off the conduction. (E) By making the hole (5) wider than the hole (4) and the hole (6), it is possible to safely carry out the conduction process with the conductive resin or the rod-shaped elastic body.

[Brief description of drawings]

1 is a cross-sectional view of the present invention.

FIG. 2 is a sectional view of a conventional through-hole type substrate.

FIG. 3 is a cross-sectional view of a conventional through-pin type substrate.

FIG. 4 is a sectional view showing an embodiment of the present invention.

FIG. 5 is a cross-sectional view showing another embodiment of the present invention.

FIG. 6 is a sectional view showing another embodiment of the present invention.

FIG. 7 is a sectional view showing another embodiment of the present invention.

FIG. 8 is a partial cross-sectional view showing another embodiment of the present invention.

FIG. 9 is a partial cross-sectional view showing another embodiment of the present invention.

FIG. 10 is a sectional view showing another embodiment of the present invention.

FIG. 11 is a plan view showing another embodiment of the present invention.

[Explanation of symbols]

 1 Insulator 2 Insulator 3 Insulator 4 Hole 4A Circuit Conductor 4B Circuit Conductor 5 Hole 6 Hole 6A Circuit Conductor 6B Circuit Conductor 7 Through Hole 8 Solder 9 Pin 10 Rubber or Resin 11 Rod-like Elastic Body 12 Screw 13 Spring 14 wire-like elastic body 15 X-axis 16 Y-axis 21 insulator 22A circuit conductor 22B circuit conductor 23 hole 24 conductor 31 insulator 32A circuit conductor 32B circuit conductor 33 hole 35 pin 36 solder

Claims (1)

[Claims] 1. A hole (4) for a conductor processed by a through hole method on an insulator (1) and a hole (6) for a conductor processed by a through hole method on an insulator (3) are holes. (4)
Alternatively, a through hole formed by continuously forming a hole (4), a hole (5), and a hole (6) by sandwiching an insulator (2) provided with a hole (5) having a hole diameter different from the hole diameter of the hole (6). A double-sided wiring connection substrate provided with (7) and pressure-bonded.