GB1250839A - - Google Patents
Info
- Publication number
- GB1250839A GB1250839A GB1250839DA GB1250839A GB 1250839 A GB1250839 A GB 1250839A GB 1250839D A GB1250839D A GB 1250839DA GB 1250839 A GB1250839 A GB 1250839A
- Authority
- GB
- United Kingdom
- Prior art keywords
- pin
- circuit board
- conductor
- electrical
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0292—Programmable, customizable or modifiable circuits having a modifiable lay-out, i.e. adapted for engineering changes or repair
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
1,250,839. Direct connections. INTERNATIONAL COMPUTERS Ltd. 5 May, 1970 [2 May, 1969], No. 22433/69. Heading H2E. A circuit board 10 has one or more holes 12 through the board and the electrical conductors 11 thereon, and one or more electrically conductive pins 8 inserted in corresponding holes, with insulating sleeves 9 of heat shrinkable material around the portion of the pin in the hole and a collar of solder 13 making electrical connection between the electrical conductor 11 and a portion of the pin 8 projecting through the circuit board whereby the electrical connection may be altered without withdrawing the pin from the hole. Thus, the solder 13 may be removed and a washer of insulating material 14 such as polytetrafluoroethylene placed on the pin 8a, thereby isolating the projecting end of the pin from the conductor 11a. A flying lead 15 may then be soldered to the projecting end of the pin without making electrical contact with the conductor 11a Said circuit board may consist of a plurality of layers of insulating material (17), (18) (Fig. 3, not shown) having conductive circuit patterns (16A), (16B), (16C) thereon. The holes (19) are through-plated with conductive material (20) to allow electrical connections to selected conductors at different layers in the multi-layer circuit board.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2243369 | 1969-05-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1250839A true GB1250839A (en) | 1971-10-20 |
Family
ID=10179293
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1250839D Expired GB1250839A (en) | 1969-05-02 | 1969-05-02 |
Country Status (2)
Country | Link |
---|---|
FR (1) | FR2047127A5 (en) |
GB (1) | GB1250839A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4170819A (en) * | 1978-04-10 | 1979-10-16 | International Business Machines Corporation | Method of making conductive via holes in printed circuit boards |
FR2824231A1 (en) * | 2001-04-27 | 2002-10-31 | Siemens Ag | DEVICE FOR MOUNTING ELECTRICAL AND / OR ELECTRONIC COMPONENTS ON A PRINTED CIRCUIT BOARD |
CN106971995A (en) * | 2016-11-04 | 2017-07-21 | 唐虞企业股份有限公司 | Circuit pin positioning structure and manufacturing method of welding circuit assembly thereof |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2437141A1 (en) * | 1978-09-20 | 1980-04-18 | Bunker Ramo | METHOD FOR MANUFACTURING A REMOVABLE COMPONENT SUPPORT, SUPPORT OBTAINED AND MOUNTING ASSEMBLY |
JPH01280344A (en) * | 1988-03-31 | 1989-11-10 | Toshiba Corp | Structure of junction between wiring board and lead pins for semiconductor device |
-
1969
- 1969-05-02 GB GB1250839D patent/GB1250839A/en not_active Expired
-
1970
- 1970-04-29 FR FR7015765A patent/FR2047127A5/fr not_active Expired
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4170819A (en) * | 1978-04-10 | 1979-10-16 | International Business Machines Corporation | Method of making conductive via holes in printed circuit boards |
FR2824231A1 (en) * | 2001-04-27 | 2002-10-31 | Siemens Ag | DEVICE FOR MOUNTING ELECTRICAL AND / OR ELECTRONIC COMPONENTS ON A PRINTED CIRCUIT BOARD |
CN106971995A (en) * | 2016-11-04 | 2017-07-21 | 唐虞企业股份有限公司 | Circuit pin positioning structure and manufacturing method of welding circuit assembly thereof |
CN106971995B (en) * | 2016-11-04 | 2019-08-06 | 唐虞企业股份有限公司 | Circuit pin positioning structure and manufacturing method of welding circuit assembly thereof |
Also Published As
Publication number | Publication date |
---|---|
FR2047127A5 (en) | 1971-03-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |