GB1250839A - - Google Patents

Info

Publication number
GB1250839A
GB1250839A GB1250839DA GB1250839A GB 1250839 A GB1250839 A GB 1250839A GB 1250839D A GB1250839D A GB 1250839DA GB 1250839 A GB1250839 A GB 1250839A
Authority
GB
United Kingdom
Prior art keywords
pin
circuit board
conductor
electrical
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1250839A publication Critical patent/GB1250839A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0292—Programmable, customizable or modifiable circuits having a modifiable lay-out, i.e. adapted for engineering changes or repair
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/176—Removing, replacing or disconnecting component; Easily removable component

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

1,250,839. Direct connections. INTERNATIONAL COMPUTERS Ltd. 5 May, 1970 [2 May, 1969], No. 22433/69. Heading H2E. A circuit board 10 has one or more holes 12 through the board and the electrical conductors 11 thereon, and one or more electrically conductive pins 8 inserted in corresponding holes, with insulating sleeves 9 of heat shrinkable material around the portion of the pin in the hole and a collar of solder 13 making electrical connection between the electrical conductor 11 and a portion of the pin 8 projecting through the circuit board whereby the electrical connection may be altered without withdrawing the pin from the hole. Thus, the solder 13 may be removed and a washer of insulating material 14 such as polytetrafluoroethylene placed on the pin 8a, thereby isolating the projecting end of the pin from the conductor 11a. A flying lead 15 may then be soldered to the projecting end of the pin without making electrical contact with the conductor 11a Said circuit board may consist of a plurality of layers of insulating material (17), (18) (Fig. 3, not shown) having conductive circuit patterns (16A), (16B), (16C) thereon. The holes (19) are through-plated with conductive material (20) to allow electrical connections to selected conductors at different layers in the multi-layer circuit board.
GB1250839D 1969-05-02 1969-05-02 Expired GB1250839A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2243369 1969-05-02

Publications (1)

Publication Number Publication Date
GB1250839A true GB1250839A (en) 1971-10-20

Family

ID=10179293

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1250839D Expired GB1250839A (en) 1969-05-02 1969-05-02

Country Status (2)

Country Link
FR (1) FR2047127A5 (en)
GB (1) GB1250839A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4170819A (en) * 1978-04-10 1979-10-16 International Business Machines Corporation Method of making conductive via holes in printed circuit boards
FR2824231A1 (en) * 2001-04-27 2002-10-31 Siemens Ag DEVICE FOR MOUNTING ELECTRICAL AND / OR ELECTRONIC COMPONENTS ON A PRINTED CIRCUIT BOARD
CN106971995A (en) * 2016-11-04 2017-07-21 唐虞企业股份有限公司 Circuit pin positioning structure and manufacturing method of welding circuit assembly thereof

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2437141A1 (en) * 1978-09-20 1980-04-18 Bunker Ramo METHOD FOR MANUFACTURING A REMOVABLE COMPONENT SUPPORT, SUPPORT OBTAINED AND MOUNTING ASSEMBLY
JPH01280344A (en) * 1988-03-31 1989-11-10 Toshiba Corp Structure of junction between wiring board and lead pins for semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4170819A (en) * 1978-04-10 1979-10-16 International Business Machines Corporation Method of making conductive via holes in printed circuit boards
FR2824231A1 (en) * 2001-04-27 2002-10-31 Siemens Ag DEVICE FOR MOUNTING ELECTRICAL AND / OR ELECTRONIC COMPONENTS ON A PRINTED CIRCUIT BOARD
CN106971995A (en) * 2016-11-04 2017-07-21 唐虞企业股份有限公司 Circuit pin positioning structure and manufacturing method of welding circuit assembly thereof
CN106971995B (en) * 2016-11-04 2019-08-06 唐虞企业股份有限公司 Circuit pin positioning structure and manufacturing method of welding circuit assembly thereof

Also Published As

Publication number Publication date
FR2047127A5 (en) 1971-03-12

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee