JP2006088692A5 - - Google Patents

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Publication number
JP2006088692A5
JP2006088692A5 JP2005239796A JP2005239796A JP2006088692A5 JP 2006088692 A5 JP2006088692 A5 JP 2006088692A5 JP 2005239796 A JP2005239796 A JP 2005239796A JP 2005239796 A JP2005239796 A JP 2005239796A JP 2006088692 A5 JP2006088692 A5 JP 2006088692A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2005239796A
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Japanese (ja)
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JP2006088692A (ja
JP4778751B2 (ja
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Priority to JP2005239796A priority Critical patent/JP4778751B2/ja
Priority claimed from JP2005239796A external-priority patent/JP4778751B2/ja
Publication of JP2006088692A publication Critical patent/JP2006088692A/ja
Publication of JP2006088692A5 publication Critical patent/JP2006088692A5/ja
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Publication of JP4778751B2 publication Critical patent/JP4778751B2/ja
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JP2005239796A 2004-08-26 2005-08-22 樹脂モールド金型 Active JP4778751B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005239796A JP4778751B2 (ja) 2004-08-26 2005-08-22 樹脂モールド金型

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004247266 2004-08-26
JP2004247266 2004-08-26
JP2005239796A JP4778751B2 (ja) 2004-08-26 2005-08-22 樹脂モールド金型

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011125027A Division JP5325933B2 (ja) 2004-08-26 2011-06-03 樹脂モールド金型

Publications (3)

Publication Number Publication Date
JP2006088692A JP2006088692A (ja) 2006-04-06
JP2006088692A5 true JP2006088692A5 (pt) 2009-06-04
JP4778751B2 JP4778751B2 (ja) 2011-09-21

Family

ID=36230096

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005239796A Active JP4778751B2 (ja) 2004-08-26 2005-08-22 樹脂モールド金型

Country Status (1)

Country Link
JP (1) JP4778751B2 (pt)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5621146B2 (ja) * 2010-07-20 2014-11-05 アピックヤマダ株式会社 金型駆動装置
JP5621147B2 (ja) * 2010-07-20 2014-11-05 アピックヤマダ株式会社 樹脂モールド装置
JP5693931B2 (ja) * 2010-11-25 2015-04-01 アピックヤマダ株式会社 樹脂モールド装置
TWI585908B (zh) 2010-11-25 2017-06-01 山田尖端科技股份有限公司 樹脂模塑裝置與樹脂模塑方法
JP6096081B2 (ja) * 2013-08-06 2017-03-15 アピックヤマダ株式会社 樹脂封止金型、樹脂封止方法、および樹脂封止金型のクリーニング方法
CN104485308B (zh) * 2014-12-25 2018-07-27 天津威盛电子有限公司 一种加压夹具及使用该加压夹具固化树脂封装的方法
CN108556233B (zh) * 2018-04-20 2023-05-12 天津昌润鹏科技有限公司 一种手机电池胶带吸取夹具挂胶治具
JP7465829B2 (ja) 2021-02-17 2024-04-11 Ｔｏｗａ株式会社 樹脂成形品の製造方法、成形型及び樹脂成形装置
CN114714436B (zh) * 2022-03-25 2024-04-05 安徽金诚复合材料有限公司 Phc门板加工用定型模具及其操作方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3746357B2 (ja) * 1997-08-21 2006-02-15 アピックヤマダ株式会社 樹脂モールド装置
JP2001062839A (ja) * 1999-08-26 2001-03-13 Matsushita Electric Works Ltd 成形装置
JP3415575B2 (ja) * 2000-09-07 2003-06-09 Ｔｏｗａ株式会社 位置合わせ機構及び位置合わせ方法
JP4174263B2 (ja) * 2002-08-12 2008-10-29 アピックヤマダ株式会社 樹脂モールド方法

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