JP2006088298A - Polishing device of printed circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device capable of efficiently polishing a thin printed circuit board. <P>SOLUTION: This polishing device of the printed circuit board to polish the printed circuit board 4 formed of a flexible material while carrying it has mechanisms 5, 51, 52, 53, 54 to move belts 2, 21, 22 and is furnished with a carrier means to carry the printed circuit board along a predetermined route by adhering it with water on the belts, a first polishing means 11 arranged at an inlet side part in the predetermined route and to polish one surface of the printed circuit board, a first guide roll 51 to deliver the belts while bending the printed circuit board in a range free to carry the printed circuit board while maintaining a state where it is adhered on the belts through water, a second guide roll 52 to bend the belts so as to separate the printed circuit board passing the first guide roll from the belts and a second polishing means 12 to polish the other surface of the printed circuit board passing the second guide roll. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an apparatus for performing surface treatment of a flexible printed circuit board (hereinafter referred to as a printed board), and more particularly to an apparatus for polishing both surfaces of a printed board.

  In the production of a printed circuit board, polishing is widely performed for removing burrs generated during drilling, for roughening the surface before plating pattern formation, or for cleaning. By performing such processing, disconnection and short-circuiting of the circuit can be prevented, and the product yield can be improved.

  Here, with the downsizing of electronic devices that are subject to application, printed circuit boards that are subject to processing are desired to be extremely thin and flexible, and low-stiffness type printed boards with a thickness of 0.1 mm or less are widely used. It has come to be. As the base material, polyimide is generally used.

  Conventionally, such a thin printed circuit board is polished by an apparatus as shown in FIG. That is, the polishing buff 1 is provided at the center of the conveyor belt 2, and the printed circuit board 4 fed by the conveyor roller 3 is pressed against the buff 1 and polished. The printed circuit board 4 is conveyed along with the movement of the belt 2 by the guide roll 5, and polishing of one side is performed.

  On the other hand, as shown in FIG. 4, the double-side polishing is performed by a polishing apparatus provided with a polishing buff 11 for one surface (upper surface in the drawing) and a buff 12 for polishing the other surface (lower surface in the drawing). In this case, the printed circuit board is wound or repelled by the rotation of the buff 12 on the lower side of the drawing, and as a result, damage such as turning, bending, wrinkling, and cracking is likely to occur.

In a thin printed circuit board, if it is not held by a surface, it is easily affected by the rotation of the buff due to its flexibility. As shown in FIG. 6, if it rotates in the feed direction, it will repel.
Japanese Patent Laid-Open No. 5-186625 Japanese Patent Laid-Open No. 9-1456 Japanese Patent Laid-Open No. 9-1456

  For this reason, in order to process both sides of the printed circuit board with the apparatus shown in FIG. 3, after removing the printed circuit board once, changing the direction of the top and bottom again, or turning it on again, or two polishing apparatuses arranged in series It is necessary to incorporate the reversing device shown in Patent Document 1 on the way. If it is turned on again, the number of man-hours increases, and there is a problem that the installation of the reversing device becomes insufficient and the maintenance becomes complicated.

  As what can solve such a problem, there is one shown in FIG. 7 (Patent Document 3). This uses a conveyor belt having a large number of apertures, has a suction part at a position facing the buff, and is provided with another conveyor belt 23 on the upper side of the lower buff 12. The printed circuit board is sucked and held through the belt 23. Thereby, double-side polishing becomes possible.

  However, water or abrasive powder sprayed during polishing may cause clogging of the suction part, which hinders the polishing operation.

  The present invention has been made in view of the above points, and an object thereof is to provide an apparatus capable of efficiently polishing a thin printed circuit board.

In order to achieve the above object, in the present invention,
In an apparatus for polishing while conveying a printed circuit board formed of a flexible material,
A transport unit having a mechanism for moving the belt, and transporting the printed circuit board along the predetermined path by adhering the printed circuit board on the belt with water;
A first polishing means disposed on an inlet side portion of the predetermined path and polishing one surface of the printed circuit board;
A first guide roll that sends the belt while bending the printed circuit board in a range that can be conveyed while maintaining the state where the printed circuit board is attached to the belt via water;
A second guide roll that bends the belt so as to peel the printed circuit board from the belt through the first guide roll;
A second polishing means for polishing the other surface of the printed circuit board through the second guide roll;
A printed circuit board polishing apparatus characterized by comprising:
Is to provide.

In the present invention, as described above, the first and second guide rolls are disposed between the first and second polishing means disposed along the conveying belt and polishing each surface of the printed circuit board. Because it is configured and provided with a mechanism to change the direction of the printed circuit board and peel it off,
Even a thin printed circuit board can be efficiently polished.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

  FIG. 1 is a side view showing the configuration of the first embodiment of the present invention. In this embodiment, the printed circuit board to be polished is supplied from the upper left part of the figure and double-side polished, and then sent out to the lower right part. A buff 11 as a first polishing means is arranged at the upper part of the figure, and a buff 12 as a second polishing means is arranged at the lower part of the figure. Among them, a belt 21 and guide rolls 5, 51, 52 for driving the belt 21 are provided for transporting printed circuit boards before and after the buff 11. Further, a belt 22 and guide rolls 53 and 54 for driving the belt 22 are provided for conveying printed circuit boards before and after the buff 12.

  Among the guide rolls that drive the buff 11, the guide roll 51 that first bends the printed circuit board 4 after polishing with the buff 11 has a relatively large diameter, and the guide roll 52 that peels the printed circuit board 4 from the belt 21 is compared. Small diameter.

  The guide roll 51 feeds the belt 21 while bending the printed circuit board 4 within a range in which the printed circuit board 4 can be conveyed while maintaining a state where the printed circuit board 4 is attached to the belt 21 through water. There must be.

  On the other hand, the guide roll 52 bends the belt 21 so that the printed circuit board 4 that has passed through the guide roll 51 is peeled off from the belt 21 and needs to have a small diameter.

  The printed circuit board 4 is polished by the buff 11 while being conveyed by the belt 21 driven by the guide rolls including these two guide rolls 51 and 52, and then transferred to the belt 22 driven by the guide rolls 53 and 54. While being polished by the buff 12. The printed circuit board 4 supplied from the input port 101 in this way is sequentially polished on both sides and sent to the discharge port 102.

  A guide roller row 6 is provided along the travel path of the belt 21 between the guide rolls 51 and 52. The guide roller row 6 prevents the printed circuit board 4 attached to the belt 21 through water from peeling off, and presses the printed circuit board 4 toward the belt 21 from the outside.

  FIG. 2 shows the structure of the guide roller row 6 shown in FIG. 1 as viewed from the left side of FIG. As shown in FIG. 2, the guide roller row is arranged so that as many rollers 61 as possible contact with the printed circuit board 4 by alternately arranging a plurality of rollers 61 fitted on the shaft 62. The printed circuit board 61 is supported in a state close to surface contact.

(Modification)
In the above embodiment, the buff is exemplified as the polishing means. However, for example, if the solder ball is cleaned, a brush is effective.

Explanatory drawing which shows the structure of one Example of this invention. Explanatory drawing which shows the detailed structure of the roller 6 in the Example of FIG. Explanatory drawing which shows the structure of the conventional single-side polish apparatus. Explanatory drawing which shows an example of the conventional double-side polish apparatus. Explanatory drawing which shows the example of a malfunction which generate | occur | produces with the apparatus of FIG. Explanatory drawing which shows the example of a malfunction which generate | occur | produces with the apparatus of FIG. Explanatory drawing which shows another example of the conventional double-side polish apparatus.

Explanation of symbols

  1, 11, 12 buff, 2, 21, 22 belt, 4 printed circuit board, 5, 51, 52, 53, 54 guide roll, 6, 61, 62 guide roller, 101 slot, 102.

Claims (4)

In an apparatus for polishing while conveying a printed circuit board formed of a flexible material,
A transport unit having a mechanism for moving the belt, and transporting the printed circuit board along the predetermined path by adhering the printed circuit board on the belt with water;
A first polishing means disposed on an inlet side portion of the predetermined path and polishing one surface of the printed circuit board;
A first guide roll that sends the belt while bending the printed circuit board in a range that can be conveyed while maintaining the state where the printed circuit board is attached to the belt via water;
A second guide roll that bends the belt so as to peel the printed circuit board from the belt through the first guide roll;
A second polishing means for polishing the other surface of the printed circuit board through the second guide roll;
An apparatus for polishing a printed circuit board, comprising: In the printed circuit board polishing apparatus according to claim 1,
The printed circuit board polishing apparatus, wherein the first guide roll has a larger diameter than the second guide roll. In the printed circuit board polishing apparatus according to claim 1,
An apparatus for polishing a printed circuit board, comprising: a guide roller row that holds the printed circuit board against the belt along a conveyance path between the first guide roll and the second guide roll. In the printed circuit board polishing apparatus according to claim 2,
The printed circuit board polishing apparatus according to claim 1, wherein the guide roller row is configured by rollers arranged in a distributed manner so as to hold the entire surface of the printed circuit board.

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