TWI492812B - Grinding equipment and grinding method - Google Patents

Description

Grinding device and grinding method

The present invention relates to a polishing apparatus and a polishing method, and more particularly to a plurality of conveying rollers including a flexible plate-shaped workpiece and a plate shape in the middle of conveying the conveying rollers A polishing device and a polishing method for a polishing roller that grinds a workpiece.

It is known that a printed substrate which is one of a plate-like workpiece is manufactured by a photolitho process, which is a metal formed of copper foil or the like formed on one or both sides of an insulating substrate. A photoresist film is formed on the surface of the layer, followed by exposure, development, etching, and the like. At this time, in the previous stage in which the photoresist film is formed on the surface of the metal layer of the insulating substrate, the metal layer is usually polished, and the polishing is performed even if the printed substrate is an extremely thin flexible substrate. Grinding.

As a polishing apparatus for performing such polishing, for example, according to Patent Document 1 (Fig. 10 of the document) and Patent Document 2 (Fig. 8 of the document), there is disclosed a configuration in which a polishing apparatus includes a polishing polishing roll and polishing polishing A backup roller in which the rollers are opposed to each other, and a polishing roller that polishes the printed substrate which is a plate-like workpiece between the two rollers, and conveys the printed substrate forward.

In addition, since the printed circuit board disclosed in these documents is a thin-walled substrate having flexibility, it is necessary to guide the two rollers while being guided by the pair of upper and lower guiding members to maintain linear advanceability. The polishing process is performed between the two, and after the polishing process, the guide member is guided to carry forward and further conveyed forward by the transfer roller.

[Previous Technical Literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2004-268249

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2003-062745

However, the polishing apparatus disclosed in the above-mentioned Patent Documents 1 and 2 is configured such that the printed substrate is conveyed in the horizontal direction and is held between the polishing roller and the backup roller while maintaining the horizontal posture. A thin flexible substrate causes a problem that the warpage of the substrate causes a decrease in quality.

Specifically, when polishing such a printed substrate, for example, when the upper surface side of the printed substrate is polished, the leading end of the printed substrate polishing region in the transport direction is displaced toward the lower side, and, for example, when the lower surface of the printed substrate is When the side is polished, the leading end of the printing substrate polishing region in the transport direction is displaced upward, in other words, the printed substrate is convexly curved toward the polishing roller side. Further, since the warpage caused by the bending is not removed, the printed circuit board is carried out from the polishing apparatus, and thus the subsequent steps such as the photolithography step cannot be appropriately performed on the polished printed substrate, resulting in deterioration of the quality of the final product. .

Further, since the printed substrate is in a horizontal posture before the printing substrate is fed between the polishing roller and the backup roller, the front end thereof is bent and sagged due to its own weight, which not only causes the printed substrate to be improperly sandwiched between the rolls. In other cases, if the arrangement pitch of the transport rollers on the upstream side or the downstream side is not extremely small, the tip end of the printed circuit board may be caught in the gap between the transfer rollers due to its own weight.

Further, in the polishing apparatuses disclosed in Patent Documents 1 and 2, since the polishing substrate is polished by the polishing roller between the polishing roller and the backup roller, when a foreign matter is interposed between the rollers, The printed circuit board is scratched due to the high rigidity of the peripheral surface of the backup roll, etc., and the quality of the printed circuit board is also lowered.

In view of the above circumstances, it is a technical object of the present invention to make it possible to appropriately feed a flexible plate-like workpiece into an arrangement position of a polishing roller, and to suppress the occurrence of scratches on a plate-shaped workpiece due to the presence of a backup roller. A condition that causes a decline in quality.

The apparatus of the present invention developed to solve the above-described problems is a polishing apparatus configured to convey a flexible plate-like workpiece by a conveying mechanism, and to polish by a polishing roller during conveyance of the conveying mechanism In the above-described plate-shaped workpiece, the polishing apparatus is characterized in that a pair of nip rolls for sandwiching the plate-like workpiece are disposed opposite each other in the middle of the conveying path formed by the conveying mechanism, and the nip rolls are The plate-like workpiece is conveyed in the up-and-down direction, and both sides of the conveyed plate-like workpiece are simultaneously ground by the polishing polishing rolls between the pair of polishing polishing rolls disposed opposite each other. Here, the "transport mechanism" may be constituted by a plurality of transport rollers or conveyors or a combination of the above.

According to this configuration, the flexible plate-shaped workpiece is placed at an arrangement position in the vertical direction by the pair of nip rolls, and the front end of the plate-shaped workpiece is not bent by its own weight. The plate-like workpiece can be appropriately advanced straight to the position where the polishing roller is disposed. Further, since the plate-like workpiece conveyed in the vertical direction is simultaneously polished by the pair of polishing rolls arranged in the opposite direction, the occurrence of warpage can be avoided, and the deterioration of the quality of the plate-like workpiece can be suppressed. Further, when the plate-shaped workpiece is polished, since the previous backup roll is not used, it is possible to avoid problems such as scratches on the plate-shaped workpiece due to the intervention of foreign matter, and to further reliably suppress the plate in addition to the suppression of the warpage. The quality of the workpiece is reduced.

In the above configuration, the transport path is formed by transporting the plate-shaped workpiece in the horizontal direction by the transport mechanism, and the pair of buffing is disposed below the pair of nip rolls in the middle of the transport path. Roller.

In this manner, although the transport path itself transports the plate-shaped workpiece in the horizontal direction, the plate-shaped workpiece is transported in the vertical direction during the polishing. Therefore, in addition to the above advantages, the plate-like workpiece can be horizontally oriented to the polishing apparatus. Move in and out. Thereby, the full height of the polishing apparatus can be kept low to achieve compactness, and can be smoothly performed between the apparatus for performing other steps provided on the upstream side and the downstream side of the polishing apparatus. The transfer of the plate-like workpiece.

Further, in the above-described configuration, the plate-like workpiece is fed downward while being sandwiched by the pair of nip rolls, and then fed upward, whereby both surfaces are simultaneously polished by the pair of polishing rolls.

In this manner, a pair of nip rolls are rotated forward in a state in which the plate-like workpiece is held, and the plate-like workpiece is fed downward while the both sides of the plate-shaped workpiece are simultaneously polished by a pair of polishing rolls. Subsequently, the plate-like workpiece is fed upward by a pair of nip rolls, and both sides of the plate-like workpiece are simultaneously polished by a pair of polishing rolls. As a result, the same region on both surfaces of the plate-like workpiece is polished twice by applying the bidirectional conveyance to the lower and upper sides of the plate-like workpiece, so that the polishing efficiency is improved.

Further, in the above configuration, the pair of nip rolls and the pair of buffing rolls are disposed at least at two places on the upstream side and the downstream side in the middle of the transport path.

Thus, the two sides of the plate-like workpiece are simultaneously ground by at least two places by a pair of polishing rolls, and thus only one side of the plate-like workpiece is polished at each place by polishing the grinding roll and the backup roll as before. In comparison with the case, the arrangement of the polishing and polishing rolls can be halved to achieve compactness of the polishing apparatus.

In such a configuration, it is preferable that a part of the plate-shaped workpiece including one end in the conveying direction is performed by a pair of nip rolls and a pair of buffing rolls disposed on the upstream side in the middle of the transport path. Grinding is performed by polishing a region including the unpolished portion of the plate-shaped workpiece in the reverse direction in the transport direction by a pair of nip rolls and a pair of buffing rolls disposed on the downstream side.

In this way, in addition to the compactness of the polishing apparatus as described above, it is possible to perform appropriate polishing on the entire area of the plate-like workpiece, and to perform grinding in a state in which the downstream side is opposite to the upstream side in the conveying direction. Therefore, even if a change or the like is formed on both surfaces or a single surface of the plate-like workpiece, the change or the like can be appropriately removed.

Further, in the above configuration, the plate-shaped workpiece receives fluid in the periphery of the pair of nip rolls when the transfer of the transfer mechanism in the horizontal direction and the transfer of the pair of buffing rolls are performed. Jet supply.

In this way, when the flexible plate-shaped workpiece (the tip end of the plate-shaped workpiece) reaches the arrangement position of the nip roller, it receives the injection supply of the fluid and enters between the pair of nip rolls, and changes the direction to the orientation. a pair of polishing rollers in the direction of the grinding roller, and at the time when the plate-shaped workpiece (the rear end of the plate-like workpiece) which has been finished by the polishing of the pair of polishing rollers is separated from each other by the pair of nip rollers The supply is injected to change the direction into the horizontal transport direction of the transport mechanism. Thereby, the direction change of the flexible plate-shaped workpiece on the nip roller can be performed smoothly and reliably.

In the above configuration, the plate-shaped workpiece can be a flexible printed circuit board.

In this way, it is possible to surely enjoy the various advantages described above, and it is possible to further enjoy the advantages described above in the case of a flexible printed circuit board having a metal layer such as a copper foil formed on both sides. Further, the object to be polished is not limited to the flexible printed circuit board, and may of course be a flexible thin-walled substrate and other flexible plate-shaped workpieces.

On the other hand, the method of the present invention developed to solve the above-described technical problems is a polishing method in which a flexible plate-like workpiece is conveyed by a conveying mechanism, and a polishing roller is used in the middle of conveying of the conveying mechanism. The polishing method is characterized in that a pair of nip rolls for sandwiching the plate-like workpiece are disposed opposite each other in a middle of a conveying path formed by the conveying mechanism by the holding means Rolling the sheet-like workpiece in the up-and-down direction, and simultaneously polishing the two sides of the conveyed sheet-like workpiece by the pair of polishing-polishing rolls disposed opposite each other by the pair of polishing rolls

According to this method, it is possible to obtain substantially the same operational effects as those obtained by the basic configuration of the above apparatus.

[Effects of the Invention]

As described above, according to the present invention, the flexible plate-like workpiece is held in the vertical position by the pair of nip rolls and transported to the polishing roller in the vertical direction, so that the front end of the plate-shaped workpiece is not caused by its own weight. In the curved state, the plate-shaped workpiece can be appropriately linearly advanced to the position where the polishing roller is disposed, and both sides of the plate-shaped workpiece are simultaneously ground by a pair of polishing rollers, thereby preventing warpage and suppressing the plate. The quality of the workpiece is reduced. Further, since the previous backup roll is not required, it is possible to avoid problems such as scratching of the plate-shaped workpiece due to the intervention of the foreign matter, and it is possible to further reliably suppress the deterioration of the quality of the plate-shaped workpiece in addition to the suppression of the warpage.

The above described features and advantages of the present invention will be more apparent from the following description.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 is a schematic front view showing an overall configuration of a polishing apparatus according to a first embodiment of the present invention, and FIG. 2 is a schematic plan view showing an overall configuration of the polishing apparatus. 3 is an enlarged cross-sectional view taken along line A-A of FIG. 1. 4 is an enlarged schematic perspective view showing a main part of the polishing apparatus, and FIG. 5 is an enlarged schematic front view showing a main part of the polishing apparatus.

As shown in FIG. 1, the polishing apparatus 1 of the present embodiment has a transport path 3 for transporting a thin-walled substrate (hereinafter simply referred to as a printed circuit board) P in the horizontal direction inside the casing 2, and the thin-walled substrate P includes a thickness smaller than that. A flexible printed circuit board having a flexible plate-like workpiece of 0.1 mm (for example, 0.084 mm). The transport path 3 is divided into a transport transport path 3A that communicates with the carry-in port 4 into which the printed circuit board P is carried, a polishing transport path 3B that transports the printed circuit board P while polishing the printed circuit board P, and the printed circuit board P is carried out. The transporting path 3C for the carry-out of the 5th exit.

In the loading/unloading path 3A, a plurality of printed boards P are transported from the upstream side (the left side in FIG. 1) to the downstream side (the right side in FIG. 1) in the horizontal direction while the printed substrate P is placed. Lower conveying roller 6. Further, the inlet sensor 7 is disposed at the downstream end of the loading/unloading path 3A, and the leading end (the right end of FIG. 1) of the printed circuit board P conveyed by the lower conveying roller 6 is detected at the initial position, and The substrate stopper portion 8 stops the printed substrate P by falling in accordance with a signal from the inlet sensor 7.

In the polishing transport path 3B, a plurality of lower transport rollers 6 and a plurality of upper transport rollers 9 that are transported by sandwiching the printed circuit board P with a small force are arranged in the horizontal direction, and the polishing transport path 3B is disposed in the polishing transport path 3B. The upper end and the downstream end are respectively provided with a pair of upper and lower nip rolls 10 and 11 sandwiching the entire area of the printed substrate P to remove the liquid from the printed circuit board P. In addition, the arrangement pitch of the upper conveyance rollers 9 is twice the arrangement pitch of the lower conveyance rollers 6, and the upper conveyance rollers 9 are disposed opposite to each other above the lower conveyance rollers 6. In this case, the arrangement pitch of the upper conveyance rollers 9 may be the same as the arrangement pitch of the lower conveyance rollers 6. Further, at the upstream side and the downstream side of the intermediate portion of the polishing transfer path 3B, a pair of left and right nip rollers 12 and 13 that sandwich the printed substrate P with a large force are disposed facing each other, and A pair of left and right polishing polishing rolls 14, 15 are disposed opposite each other directly under the nip rolls 12, 13 at the two places. Further, on the upstream side of the nip rolls 12 and 13 at the two polishing transfer paths 3B, initial position detecting sensors 18 and 19 that detect the leading end of the printed board P and the initial position for polishing are disposed. Further, in each of the pair of nip rollers 12 and 13 disposed at the two positions, the direction changing guide rollers 16 and 17 are disposed to face each other obliquely to the upper right of the nip rollers 12 and 13 on the upstream side. In the same manner, the fluid ejection mechanisms 20 and 21 that eject a fluid such as water or air (water in the present embodiment) toward the lower right side of the nip rollers 12 and 13 on the upstream side are disposed in the same manner. . Further, the corresponding nip rolls 12 and 13 and the buffing rolls 14 and 15 are disposed on the left and right sides of the respective positions of the pair of buffing rolls 14 and 15 disposed below the polishing transfer path 3B. And the printing substrate P jets the polishing liquid supply mechanism 22 that supplies the polishing liquid.

In the carry-out transport path 3C, a plurality of lower conveyance rollers 6 and an upper conveyance roller 9 that sandwich the printed circuit board P with a small force are arranged in the horizontal direction, and at the downstream end of the carry-out transport path 3C, An exit sensor 23 that detects the vicinity of the front end of the printed circuit board P and the transfer port 5 is disposed.

At this time, as shown in FIG. 2 and FIG. 3, the lower conveyance roller 6 has a plurality of roller bodies 6b arranged in parallel on the roller shaft 6a orthogonal to the upstream and downstream directions (transport direction). Specifically, the lower conveying roller 6 is fixed to the roller shaft 6a by 10 or more roller bodies 6b having a thickness equal to or less than 1/2 of the diameter, on one roller shaft 6a of the adjacent roller shafts 6a. Each of the roller bodies 6b on the other roller shaft 6a enters the gap between the respective roller bodies 6b. Further, as shown in FIG. 3, the upper transfer roller 9 has a plurality of roller bodies 9b which are similarly arranged in parallel on the roller shaft 9a orthogonal to the upstream and downstream directions.

On the other hand, as shown in Fig. 2, the nip rollers 10 and 11 at the upstream end and the downstream end are cylindrical surfaces whose outer peripheral surfaces are continuously extended in the axial direction orthogonal to the upstream and downstream directions, and the cylindrical surface The axial direction length is set to a length that can sandwich the entire area of the printed substrate P. Further, as shown in Fig. 4, the outer circumferential surface of each of the nip rolls 12 (13) and the outer circumferential surface of each polishing polishing roll 14 (15) are also continuously extended in the axial direction orthogonal to the upstream and downstream directions. The cylindrical surface, and the axial length of the cylindrical surfaces is set to a length that can sandwich the entire area of the printed substrate P. Further, the direction changing guide roller 16 (17) is also a cylindrical surface having the same axial length as described above.

FIG. 5 shows the peripheral structure of the pair of nip rolls 12 on the upstream side and the pair of buffing rolls 14. Further, since the peripheral structures of the pair of nip rolls 13 and the pair of buffing rolls 15 on the downstream side are also substantially the same, the components are denoted by brackets in FIG. 5, and the description thereof will be omitted. As shown in FIG. 5, the upstream side of the polishing conveyance path 3B is conveyed to the printing substrate P on the downstream side in the horizontal direction as the lower conveying roller 6 and the upper conveying roller 9 rotate in the direction of the arrow a, and reaches the pair at the front end. When the upstream side nip roller 12 of the nip roller 12 is in contact with the outer peripheral surface of the upstream nip roller 12 by the flow W1 of the fluid (water) supplied from the fluid ejecting mechanism 20, it is clamped. A pair of nip rollers 12 are interposed between each other. Then, the two nip rolls 12 are rotated forward in the direction of the arrow b, and the printed board P sandwiched between the nip rolls 12 is fed downward, and is fed between the pair of buffing rolls 14. The fed-back printed substrate P is simultaneously polished by a pair of polishing rolls 14 on both front and back sides, and the polishing is performed until the rear end of the printed substrate P is about to leave the pair of nip rolls 12.

Subsequently, the pair of nip rolls 12 are reversed in the direction of the arrow c, and the printed substrate P is fed upward, and the same region of the printed substrate P is polished by the pair of buffing rolls 14 while being rubbed on both sides in the opposite direction. . At this time, immediately after the conveyance of the printed substrate P upward, the rear end of the printed substrate P contacts the outer periphery of the downstream side nip roller 12 by the flow W2 of the fluid (water) sprayed from the fluid ejection mechanism 20 . The surface is sandwiched between the lower conveyance roller 6 and the upper conveyance roller 9 on the downstream side thereof, and then the printed substrate P is conveyed to the downstream side in the horizontal direction. Further, the pair of polishing polishing rolls 14 maintain the rotation in the direction of the arrow d.

Next, the operation of polishing the printed substrate P by the polishing apparatus 1 of the present embodiment will be described in time series.

As shown in Fig. 6 (a), the printed circuit board P carried in by the carry-in port 4 is transported toward the downstream side by the lower transport roller 6 of the carry-in transport path 3A, and the printed circuit board P is detected by the entrance sensor 7. When the front end has reached the initial position, the substrate stopper portion 8 is lowered to the illustrated state.

As a result, as shown in FIG. 6(b), the front end of the printed circuit board P is stopped by the substrate stopper portion 8 and stopped immediately before the nip roller 10. However, at this time, the substrate stopper portion 8 is used. The operation is such that the leading end of the printed substrate P is aligned in a direction orthogonal to the upstream and downstream directions, so that the printed substrate P maintains the correct posture.

Then, as shown in FIG. 6(c), the printed circuit board P is conveyed to the downstream side by the lower conveyance roller 6 and the upper conveyance roller 9 in a state of being sandwiched by the pair of upper and lower nip rolls 10, and the upstream side is The initial position detecting sensor 18 detects that the leading end of the printed substrate P reaches the initial position for polishing. At this time, based on the signal from the initial position detecting sensor 18, the timing of the forward rotation and the reverse rotation of the nip roller 12 corresponding to the length and the conveying speed of the printed circuit board P, and the fluid from the fluid are controlled by the control means outside the drawing. The period of the injection of water by the injection mechanism 20 or the like.

Then, the printed circuit board P is further conveyed to the downstream side, whereby the printed circuit board P is changed in direction by the flow direction guide roller 16 and the flow W1 of the water from the fluid ejecting mechanism 20, and as shown in FIG. 7(a) In a state in which the pair of nip rollers 12 are rotated, the front portion of the printed circuit board P is fed downward, and the front end thereof smoothly enters between the pair of polishing rollers 14.

In this manner, after the leading end of the printed substrate P enters between the pair of polishing rolls 14, the printed substrate P is sent downward while the both sides of the printed substrate P are simultaneously polished by the pair of polishing rolls 14. Further, as shown in FIG. 7(b), the conveyance of the printed substrate P in the downward direction is stopped until the rear end of the printed substrate P is separated from the pair of nip rolls 12. At this time, the subsequent printed substrate P1 passes through the entrance sensor 7 and is stopped by the substrate stopper portion 8, thereby being in a standby state.

Thereafter, the pair of nip rolls 12 are reversed to feed the preceding printed substrate P upward, but at this time, both sides of the printed substrate P are simultaneously subjected to substantially the same as described above by the pair of polishing rolls 14 rotating in the same direction. Grinding of the direction. Then, immediately after the printing substrate P is transported upward, the rear end of the printed circuit board P serves as a front end, and the front end is changed in direction by the direction changing guide roller 16 and the flow W2 of the water from the fluid ejecting mechanism 20. On the downstream side in the horizontal direction, at the time when the rear end of the printed circuit board P is the front end of the initial stage and is separated from the pair of polishing roller 14 by the upward conveyance, as shown in FIG. 7(c), the printed substrate P is used. The lower conveyance roller 6 and the upper conveyance roller 9 are further conveyed to the downstream side. Further, the front side region (the initial rear side region) of the printed substrate P becomes an unpolished region. At this time, the subsequent printed substrate P1 can be transported to the downstream side by the rise of the substrate stopper portion 8.

Further, the preceding printed circuit board P is transported to the downstream side, and the front end (the initial rear end) is detected by the downstream initial position detecting sensor 19 as shown in FIG. 8(a), thereby designating one downstream side. The timing of the normal rotation and the reverse rotation of the nip roller 13 and the operation of the fluid ejecting mechanism 21 are performed, and at this time, the subsequent printed circuit board P1 is sandwiched and transported to the downstream side by the pair of nip rollers 10 on the upstream side.

Then, as shown in FIG. 8(b), the preceding printed substrate P and the subsequent printed substrate P1 are transported to the downstream side, and as shown in FIG. 8(c), the leading end of the printed substrate P reaches the downstream side of the clip. At the time before the holding of the roller 13, the front end of the subsequent printed substrate P1 is detected by the initial position detecting sensor 18 on the upstream side, thereby specifying the period of forward and reverse rotation of the pair of nip rolls 12 on the upstream side and the fluid. The operation of the injection mechanism 20.

Then, as shown in FIG. 9(a), the leading end of the printed circuit board P is shifted in the direction and then sent downward, and at the time of entering between the pair of polishing rollers 15 on the downstream side, the front end of the subsequent printed substrate P1 is The direction change is performed in the vicinity of the nip roller 12 on the upstream side. The nip roller 12 and the polishing roller 14 on the upstream side have the same operations as the rotation directions of the nip roller 13 and the polishing roller 15 on the downstream side.

Then, as shown in FIG. 9(b), the preceding printed circuit board P is further conveyed downward, and the front side region, which is the unpolished region of the printed circuit board P, is ground by a pair of polishing polishing rolls 15 on the downstream side. At this time, the subsequent printed substrate P1 starts to enter between the pair of polishing rolls 14 on the upstream side. Further, as shown in FIG. 9(c), at the time when the trailing end of the preceding printed circuit board P is stopped before being separated from the pair of nip rolls 13, the subsequent printed circuit board P1 is in the middle of the polishing accompanied by the downward conveyance. . Therefore, in the polishing apparatus 1, a plurality of (two in the illustrated example) printed substrates P and P1 are simultaneously subjected to a polishing process.

Then, as shown in FIG. 10(a), when the preceding printed circuit board P is in the middle of the polishing in the upward direction, the rear end of the subsequent printed substrate P1 is stopped from the pair of nip rolls 13 The state before the detachment is released, but at this time, the subsequent (third) printed circuit board P2 passes through the entrance sensor 7 and is stopped by the substrate stopper portion 8. Therefore, in the polishing apparatus 1, a plurality of (three in the illustrated example) printed boards P, P1, and P2 are simultaneously subjected to processing such as conveyance and polishing. Further, the preceding printed substrate P is polished in the opposite direction when the polishing polishing roll 15 on the downstream side is used to receive the polishing roller 14 on the upstream side.

Then, as shown in FIG. 10(b), in a state in which the preceding printed circuit board P is sandwiched by the pair of upper and lower nip rollers 11 on the downstream side, the front end thereof passes through the exit sensor 23 and is slightly moved from the outlet 5 At the time of projecting to the outside, the subsequent printed substrate P1 and the subsequent printed substrate P2 are the same as those shown in FIG. 7(c) above. Further, in the state shown in FIG. 10(c), the leading end of the printed circuit board P is gradually protruded from the outlet 5 in accordance with the modification shown in FIGS. 11(a), (b), and (c). The subsequent printed substrate P1 and the subsequent printed substrate P2 are the same as those shown in the above-described FIGS. 8(a), (b), and (c). Then, at the timing when the trailing end of the preceding printed substrate P passes the exit sensor, the processing of the printed substrate P in the polishing apparatus 1 is completed.

In the above-described embodiment, all of the transporting transport path 3A, the polishing transport path 3B, and the transport transport path 3C are configured to be horizontal, but at least one of the paths 3A, 3B, and 3C is opposite. It is also possible to tilt the predetermined angle in the horizontal direction.

In the polishing apparatus 1 according to the second embodiment of the present invention, the conveyance roller or the like is omitted for convenience of explanation, and the movement locus of the printed substrate P is shown by a one-dot chain line. As shown in FIG. 12, the polishing apparatus 1 is configured such that all or part of the path 3A1 of the transport path from the entrance to the upstream side nip roller 12 is in the vertical direction, and the nip roller 13 is moved from the downstream side to the carry-out port. All or part of the path 3C1 of the transport path up to the up and down direction. The other configuration is substantially the same as that of the polishing apparatus 1 of the above-described first embodiment. Therefore, the same components are denoted by the same reference numerals, and the description of the operation and the like is omitted.

Fig. 13 shows a polishing apparatus 1 according to a third embodiment of the present invention. In this case, for convenience of explanation, a conveyance roller or the like is omitted, and a movement locus of the printed substrate P is shown by a one-dot chain line. As shown in FIG. 13 , the polishing apparatus 1 is configured to be conveyed in the horizontal direction (upward and downward direction) to reach the printed circuit board P of the upstream nip roller 12, and is only sent downward by the upstream side. After the polishing polishing rolls 14 are simultaneously polished on both sides, the direction is changed and then transferred, thereby reaching the polishing polishing roll 15 on the downstream side, and further, the direction is changed, and only the upper side is sent upward and the downstream side is polished. The polishing roll 15 simultaneously polishes both surfaces, and then passes through the nip roller 13 on the downstream side and reaches the discharge port in the horizontal direction (upper and lower directions). At this time, the nip roller 12 and the downstream nip roller 13 that sandwich the printed circuit board P are disposed above and below the polishing polishing roller 14 on the upstream side and above the polishing polishing roller 15 on the downstream side. Below, the nip rolls 12, 13 and the respective polishing rolls 14, 15 are rotated in the direction of the arrows indicated by the respective rolls. The other configuration is substantially the same as that of the polishing apparatus 1 of the above-described first embodiment. Therefore, the same components are denoted by the same reference numerals, and their description will be omitted.

Further, in the above embodiment, the transport roller is used as the transport mechanism for transporting the printed substrate P. However, the transport mechanism may be a conveyor or a combination of a transport roller and a conveyor.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

1. . . Grinding device

2. . . framework

3. . . Transport path

3A. . . Transport route (transportation path)

3A1, 3C1. . . Part of the path

3B. . . Transport path (polishing transport path)

3C. . . Transport route (transfer route)

4. . . Move in

5. . . Move out

6. . . Transport mechanism (lower transport roller)

6a, 9a. . . Roller shaft

6b, 9b. . . Roll body

7. . . Entrance sensor

8. . . Substrate stop

9. . . Transfer mechanism (upper transfer roller)

10, 11. . . Clamping roller

12. . . Clamping roller (grip roller on the upstream side)

13. . . Clamping roller (nip roller on the downstream side)

14. . . Polishing grinding roller (polishing grinding roller on the upstream side)

15. . . Polishing grinding roller (polishing grinding roller on the downstream side)

16. . . Guide roller for direction change (guide roller for direction change on the upstream side)

17. . . Guide roller for direction change (guide roller for direction change on the downstream side)

18, 19. . . Initial position detection sensor

20. . . Fluid ejection mechanism (fluid ejection mechanism on the upstream side)

twenty one. . . Fluid ejection mechanism (fluid ejection mechanism on the downstream side)

twenty two. . . Slurry supply mechanism

twenty three. . . Exit sensor

a, b, c, d. . . arrow

P. . . Printed substrate (thin-wall substrate)

P1. . . Printed substrate (thin-wall substrate)

P2. . . Printed substrate (thin-wall substrate)

W1. . . Fluid (water) flow

W2. . . Fluid (water) flow

Fig. 1 is a schematic front view showing an overall configuration of a polishing apparatus according to a first embodiment of the present invention.

Fig. 2 is a schematic plan view showing the overall configuration of a polishing apparatus according to a first embodiment of the present invention.

Fig. 3 is an enlarged cross-sectional view taken along line A-A of Fig. 1;

Fig. 4 is an enlarged schematic perspective view showing a main part of a polishing apparatus according to a first embodiment of the present invention.

Fig. 5 is an enlarged schematic front view showing a main part of a polishing apparatus according to a first embodiment of the present invention.

6(a), 6(b) and 6(c) are schematic front views each showing the operation of the polishing apparatus according to the first embodiment of the present invention.

7(a), 7(b) and 7(c) are schematic front views each showing the operation of the polishing apparatus according to the first embodiment of the present invention.

8(a), 8(b) and 8(c) are schematic front views each showing the operation of the polishing apparatus according to the first embodiment of the present invention.

9(a), 9(b) and 9(c) are schematic front views each showing the operation of the polishing apparatus according to the first embodiment of the present invention.

Figs. 10(a), (b) and (c) are schematic front views each showing the operation of the polishing apparatus according to the first embodiment of the present invention.

Figs. 11(a), (b) and (c) are schematic front views each showing the operation of the polishing apparatus according to the first embodiment of the present invention.

Fig. 12 is a schematic front view showing a main part of a polishing apparatus according to a second embodiment of the present invention.

Fig. 13 is a schematic front view showing a main part of a polishing apparatus according to a third embodiment of the present invention.

1. . . Grinding device

2. . . framework

3. . . Transport path

3A. . . Transport route (transportation path)

3B. . . Transport path (polishing transport path)

3C. . . Transport route (transfer route)

4. . . Move in

5. . . Move out

6. . . Transport mechanism (lower transport roller)

7. . . Entrance sensor

8. . . Substrate stop

9. . . Transfer mechanism (upper transfer roller)

10, 11. . . Clamping roller

12. . . Clamping roller (grip roller on the upstream side)

13. . . Clamping roller (nip roller on the downstream side)

14. . . Polishing grinding roller (polishing grinding roller on the upstream side)

15. . . Polishing grinding roller (polishing grinding roller on the downstream side)

16. . . Guide roller for direction change (guide roller for direction change on the upstream side)

17. . . Guide roller for direction change (guide roller for direction change on the downstream side)

18, 19. . . Initial position detection sensor

20. . . Fluid ejection mechanism (fluid ejection mechanism on the upstream side)

twenty one. . . Fluid ejection mechanism (fluid ejection mechanism on the downstream side)

twenty two. . . Slurry supply mechanism

twenty three. . . Exit sensor

P. . . Printed substrate (thin-wall substrate)

W1. . . Fluid (water) flow

W2. . . Fluid (water) flow

Claims (8)

A polishing apparatus configured to convey a flexible plate-shaped workpiece by a conveying mechanism, and to polish the plate-shaped workpiece by polishing a polishing roll during conveyance of the conveying mechanism, wherein the polishing apparatus is characterized in that In the middle of the conveyance path formed by the conveyance mechanism, a pair of nip rolls for sandwiching the plate-like workpiece are disposed to face each other, and the plate-shaped workpieces are conveyed in the vertical direction by the nip rollers, and are opposed to each other A pair of the above-mentioned polishing rolls are disposed between each other, and the polishing plate is used to simultaneously polish both sides of the conveyed plate-like workpiece. The polishing apparatus according to claim 1, wherein the transport path is formed by transporting the plate-shaped workpiece in a horizontal direction by the transport mechanism, and the pair of grips in the middle of the transport path The pair of polishing abrasive rolls described above are disposed under the roller. The polishing apparatus according to claim 1 or 2, wherein the plate-shaped workpiece is sent downward while being sandwiched by the pair of nip rolls, and then sent upward. The two sides are simultaneously polished by the above-mentioned pair of polishing rolls. The polishing apparatus according to claim 1 or 2, wherein the pair of nip rolls and the pair of polishing are disposed at at least two places on the upstream side and the downstream side in the middle of the transport path. Grinding roller. A polishing apparatus according to claim 4, characterized in that the pair of holders disposed on the upstream side in the middle of the transport path The roller and the pair of polishing polishing rolls grind a part of the plate-shaped workpiece including one end of the conveying direction, and a pair of nip rolls and a pair of polishing rolls disposed on the downstream side are opposite to each other in the conveying direction The region of the above-mentioned plate-like workpiece including the unpolished portion is ground. The polishing apparatus according to claim 2, wherein the plate-shaped workpiece is changed in a direction in which the conveying mechanism is conveyed in a horizontal direction and a direction in which the pair of polishing rollers are conveyed. The periphery of the pair of nip rolls receives the supply of the fluid. The polishing apparatus according to claim 1 or 2, wherein the plate-shaped workpiece is a flexible printed substrate. In a polishing method, a flexible plate-shaped workpiece is conveyed by a conveying mechanism, and the plate-shaped workpiece is polished by a polishing roller during conveyance of the conveying mechanism, and the polishing method is characterized in that the conveying is performed by the conveying In the middle of the transport path formed by the mechanism, a pair of nip rolls for sandwiching the plate-like workpiece are disposed to face each other, and the plate-shaped workpieces are transported in the vertical direction by the nip rolls, and are disposed to face each other A pair of the above-mentioned polishing rolls are simultaneously polished on both sides of the conveyed plate-like workpiece by the polishing polishing rolls.