JP2009291907A - Polishing apparatus and roller positioning method for polishing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To avoid various adverse effects that may be caused if a method is adopted which is devised by the inventor and the like and polishes both sides of a sheet-like workpiece simultaneously by a pair of buffing rollers. <P>SOLUTION: This polishing apparatus comprises the pair of buffing rollers 14 (15) which are disposed along a transport path 3B formed by a plurality of transport rollers 6, 9 and simultaneously polish both sides of the sheet-like workpiece P with the sheet-like workpiece P interposed therebetween. The polishing apparatus further comprises a positioning means 30 for positioning the pair of buffing rollers 14 (15) in such a manner that the polishing position of the sheet-like workpiece P between the pair of buffing rollers 14 (15) matches a pre-identified polishing reference position 38 irrespective of whether the diameters of the buffing rollers 14 (15) are different or same. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a polishing apparatus and a roller positioning method of the polishing apparatus, and more specifically, a plurality of transfer rollers that transfer a plate-shaped workpiece, and a buff polishing roller that polishes the plate-shaped workpiece during transfer by these transfer rollers. The present invention relates to a polishing apparatus provided and a roller positioning method of the polishing apparatus.

  As is well known, a printed circuit board, which is a kind of plate-shaped workpiece, forms a photoresist film on the surface of a metal layer made of copper foil or the like formed on one or both sides of an insulating substrate, and performs exposure, development, etching, and the like. It is manufactured through a photolithographic process. In this case, it is customary to buff the metal layer before the photoresist film is formed on the surface of the metal layer of the insulating substrate.

  As a polishing apparatus for performing this type of buffing, for example, according to Patent Document 1 (FIG. 10 of the same document) and Patent Document 2 (FIG. 8 of the same document), a buffing roller and a buffing roller are arranged to face each other. And a back-up roller, and a configuration is disclosed in which a buffing roller carries out a polishing process on a printed circuit board as a plate-like work fed between the two rollers and conveys the printed circuit board forward. Yes.

  Since the printed circuit boards disclosed in these documents are thin flexible boards, they are fed between the above two rollers while being guided by a pair of upper and lower guide members so as to maintain straightness. Then, after the polishing process, it is further conveyed forward by the conveying roller while being guided by the guide member in the same manner.

JP 2004-268249 A JP 2003-062745 A

  By the way, according to the polishing apparatus disclosed in Patent Documents 1 and 2, the printed circuit board is sent between the buffing roller and the backup roller. If the printed circuit board is a thin substrate, There arises a problem that the occurrence of warping due to polishing only leads to deterioration in quality. Moreover, as in these polishing apparatuses, when the printed circuit board is polished by the buffing roller between the buffing roller and the backup roller, if a foreign object intervenes between the two rollers, the backup is performed. Due to the high rigidity of the peripheral surface of the roller, dents are made on the printed circuit board, and this also leads to deterioration of the quality of the printed circuit board.

  Therefore, as a result of intensive research, the present inventors abolished the use of the backup roller, arranged a pair of buffing rollers facing each other, and arranged a printed circuit board or the like between the pair of buffing rollers. It came to devise a method of feeding a plate-like workpiece and polishing both surfaces of the plate-like workpiece simultaneously with their buffing rollers. According to this method, it can be expected to solve the problems caused by warping and dents of the printed circuit board at the same time.

  However, according to the method of simultaneously polishing both surfaces of the plate-like workpiece with the pair of buffing rollers as described above, the diameters of the two buffing rollers are different due to the difference in wear amount between the two buffing rollers. As a result, the polishing position of the plate-like workpiece is shifted from the normal position. Such a situation appears remarkably when only one buffing roller is replaced and replaced to perform simultaneous double-side polishing of a plate-like workpiece.

  And when such a situation occurs, not only the plate-shaped workpiece is not properly sandwiched between the pair of buffing rollers, but also bending stress acts on the plate-shaped workpiece subjected to double-side polishing, and the above-mentioned This causes a warp different from the case where the backup roller is used, and the problem of deterioration in quality cannot be removed.

  In view of the circumstances described above, the present invention is directed to avoiding various adverse effects in the case of adopting the method proposed by the present inventors that simultaneously polishes both surfaces of a plate-like workpiece with a pair of buffing rollers. And

  An apparatus according to the present invention, which has been made to solve the above technical problem, is a polishing device including a conveying unit that conveys a plate-like workpiece and a buffing roller that grinds the plate-like workpiece during conveyance by the conveying unit. In the apparatus, provided with a pair of buffing rollers disposed in the middle of the conveyance path formed by the conveying means and simultaneously polishing both surfaces of the plate-shaped workpiece with the plate-shaped workpiece interposed therebetween, The pair of buffing rollers is arranged so that the polishing position of the plate-like workpiece between the pair of buffing rollers is a previously determined polishing reference position regardless of the difference in diameter of each of the buffing rollers. It is characterized by having positioning means for positioning. Here, the above “positioning means” is for positioning the pair of buffing rollers every time a predetermined number of plate-like workpieces are polished by the pair of buffing rollers or every time a predetermined time elapses. Alternatively, the pair of buffing rollers may be continuously positioned during polishing, or may be positioned when the buffing roller is replaced or replaced. . Further, the “conveying means” may be configured by a plurality of conveying rollers, a conveying conveyor, or a combination thereof.

  According to such a configuration, even if the actual polishing position of the plate-like workpiece between the pair of buffing rollers is the same or different, the positioning means is both By appropriately positioning the position of the buffing roller, the ideal position known in advance, that is, the polishing reference position is maintained. As a result, the plate-like workpiece fed along the conveyance path designed in relation to the polishing reference position enters the pair of buffing rollers while moving straightly between them and acts such as bending stress. Since the simultaneous polishing of both surfaces is smoothly performed without being subjected to the above, deterioration of the quality of the plate-like workpiece is effectively suppressed. In addition, since both sides of the plate-like workpiece are simultaneously polished by the pair of buffing rollers, the occurrence of warpage is avoided, and the backup roller is not used as in the prior art. Inconveniences such as dents on the plate-like workpiece are avoided, and in combination with the absence of bending stress and the suppression of the occurrence of warpage, the deterioration of the plate-like workpiece is more reliably prevented.

  In such a configuration, the positioning means moves the pair of buffing rollers closer to each other from the retracted position separated by equal distances on both sides with the polishing reference position as a boundary while maintaining the same moving distance between them. A rotation driving means for rotating only one buffing roller of the pair of buffing rollers, a first rotation speed sensor for detecting a rotation speed of the one buffing roller, and an approaching movement by the moving means Accordingly, it is preferable to include a second rotational speed sensor that detects the rotational speed of the other buffing roller that rotates in contact with the one buffing roller. Here, the operation of the above “rotation driving means” will be described. When a pair of buffing rollers polish a plate-shaped workpiece, both the buffing rollers are rotated by the rotation driving means. When positioning the buffing rollers by the means, only one of the buffing rollers is rotationally driven by the rotation driving means, and the other buffing roller is held idle.

  In this way, the moving means makes the pair of buffing rollers have the same moving distance from both retreat positions that are separated by an equal distance on both sides of the polishing reference position (for example, the movement of both buffing rollers). The two buffing rollers (specifically, the outer peripheral surfaces of the two buffing rollers) are brought into contact with each other by being moved close to each other at the same speed. In this case, since only one of the buffing rollers is rotationally driven by the operation of the rotation driving means, the other buffing roller is rotated in contact with the one buffing roller. become. If the rotational speed of one buffing roller detected by the first rotational speed sensor at this time is equal to the rotational speed of the other buffing roller detected by the second rotational speed sensor, both buffing rollers are polished. Since the diameters of the rollers are equal, the polishing position between the two rollers is present at a polishing reference position that is known in advance. Therefore, in this case, it is not necessary to correct or correct the position of both buffing rollers. On the other hand, when the rotation speed of one buffing roller is lower than the rotation speed of the other buffing roller, the diameter of one buffing roller is larger than that of the other buffing roller. Therefore, the polishing position between the two rollers is deviated from the previously determined polishing reference position toward the center axis of the other buffing roller. Therefore, in this case, it is only necessary to shift the actual polishing position toward the central axis side of one of the buffing rollers by an amount corresponding to the ratio (or difference) between the rotational speeds of both rollers. When the rotational speed of the pair of buffing rollers is opposite to the above, the actual polishing position is set to the center axis of the other buffing roller by an amount corresponding to the ratio (or difference) of the rotational speeds of the two rollers. You can just shift it to the side. By performing such an operation, the actual polishing position between the two buffing rollers is accurately positioned at a previously determined polishing reference position.

  In addition, a method according to the present invention made to solve the above technical problem includes a conveying unit that conveys a plate-like workpiece, and a buffing roller that polishes the plate-like workpiece during conveyance by the conveying unit. In the roller positioning method of the polishing apparatus for positioning the buffing roller, both surfaces of the plate-like workpiece are disposed in the middle of the conveyance path formed by the conveyance means and the plate-like workpiece is interposed between them. A pair of buffing rollers that simultaneously polish the plate-like workpiece, and the polishing position of the plate-like workpiece between the pair of buffing rollers is known in advance regardless of the difference in diameter of the buffing rollers. It is characterized by positioning the pair of buffing rollers so as to be a reference position.

  According to such a method, substantially the same operation as that described for the basic configuration of the above-described polishing apparatus can be performed, and the same effect can be obtained.

  Further, in such a method, the pair of buffing rollers are moved closer to each other from the retreat positions separated by equal distances on both sides with the polishing reference position as a boundary, while maintaining the same moving distance between them. Of the two buffing rollers of the two buffing rollers is brought into contact with the other buffing roller that is not driven to rotate, causing the other buffing roller to rotate. It is preferable to compare the rotational speeds and position the pair of buffing rollers based on the comparison result.

  In this way, substantially the same operation as that described for the positioning means of the polishing apparatus described above can be performed, and the same effect can be enjoyed.

  As described above, according to the present invention, the actual polishing position of the plate-like workpiece between the pair of buffing rollers may be the same regardless of whether the diameters of both the buffing rollers are the same or different. By properly positioning the buffing roller, it is maintained at a previously known polishing reference position, so that it is sent along a conveyance path designed in relation to the polishing reference position. The plate-like workpiece is properly moved straight between the pair of buffing rollers, and both sides of the plate-like workpiece are smoothly polished without being affected by bending stress. Reduction is effectively suppressed.

  Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a schematic front view showing the overall configuration of the polishing apparatus according to the first embodiment of the present invention, and FIG. 2 is a schematic plan view showing the overall configuration of the polishing apparatus. FIG. 3 is an enlarged sectional view taken along line AA of FIG. Further, FIG. 4 is an enlarged schematic perspective view showing the main part of the polishing apparatus, and FIG. 5 is an enlarged schematic front view showing the main part of the polishing apparatus.

  As shown in FIG. 1, the polishing apparatus 1 according to this embodiment includes a flexible print as a plate-like workpiece having flexibility with a plate thickness of 0.1 mm or less (for example, 0.084 mm) inside a housing 2. It has the conveyance path | route 3 which conveys the thin board | substrate (henceforth a printed circuit board only) P containing a board | substrate along a horizontal direction. The conveyance path 3 includes a carry-in conveyance path 3A leading to the carry-in entrance 4 through which the printed board P is carried in, a polishing conveyance path 3B through which the printed board P is polished and carried, and a carry-out exit 5 through which the printed board P is carried out. It is roughly divided into a carrying path 3C for carrying out.

  A plurality of lower transport rollers 6 that transport from the upstream side (left side in the figure) to the downstream side (right side in the figure) in a state where the printed circuit board P is placed are arranged in the carry-in transport path 3A along the horizontal direction. Has been. An inlet sensor 7 that detects that the front end (right end in the figure) of the printed circuit board P transported by the lower transport roller 6 has reached the initial position at the downstream end of the transport path 3A for loading, A board stopper 8 that stops the printed board P by being lowered based on a signal from the inlet sensor 7 is provided.

  In the polishing transport path 3B, a plurality of lower transport rollers 6 and a plurality of upper transport rollers 9 that sandwich and transport the printed circuit board P with a small force are arranged along the horizontal direction, A pair of upper and lower clamping rollers 10 and 11 for clamping the entire area of the printed circuit board P and draining the printed circuit board P are disposed at the downstream ends. Note that the arrangement pitch of the upper conveyance rollers 9 is twice the arrangement pitch of the lower conveyance rollers 6, and the upper conveyance rollers 9 are disposed above the other lower conveyance rollers 6. In this case, the arrangement pitch of the upper conveyance rollers 9 and the arrangement pitch of the lower conveyance rollers 6 may be the same. Furthermore, a pair of left and right grip rollers 12 and 13 for holding the printed circuit board P with a greater force are disposed opposite to each other at two locations on the upstream side and the downstream side in the intermediate portion of the polishing transport path 3B. In addition, a pair of left and right buffing rollers 14 and 15 are arranged oppositely below the two grip rollers 12 and 13, respectively. In this case, the two buffing rollers 14 and 15 on the upstream side and the downstream side are each configured to be positioned at accurate positions by the operation of the positioning means 30 at a predetermined time. Further, on the upstream side of the two grip rollers 12 and 13 in the polishing transport path 3B, initial position detection sensors 18 and 19 for detecting that the front end of the printed circuit board P has reached the initial polishing position are arranged. It is installed. Furthermore, of each of the pair of grip rollers 12 and 13 disposed at two locations, the direction changing guide rollers 16 and 17 are disposed opposite to each other at the upper right side of the grip rollers 12 and 13 existing on the upstream side. In addition, fluid ejecting means 20 and 21 for ejecting a fluid such as water or air (water in the present embodiment) obliquely downward to the right are respectively provided on the upper left of the grip rollers 12 and 13 on the upstream side. It is arranged. Further, on the left and right sides of the respective positions where the pair of buffing rollers 14 and 15 are disposed below the polishing conveyance path 3B, the corresponding grip rollers 12 and 13 and the buffing rollers 14 and 15 and the printed circuit board P are provided. A polishing liquid supply means 22 is provided for spraying and supplying the polishing liquid toward the surface.

  A plurality of lower transport rollers 6 and upper transport rollers 9 that sandwich the printed circuit board P with a small force are arranged along the horizontal direction in the transport path 3C for unloading, and at the downstream end of the printed circuit board P, An outlet sensor 23 for detecting that the front end has reached the vicinity of the carry-out port 5 is provided.

  In this case, as shown in FIGS. 2 and 3, the lower transport roller 6 is formed by fixing a plurality of roller bodies 6b in parallel on a roller shaft 6a orthogonal to the upstream / downstream direction (transport direction). . More specifically, ten or more roller bodies 6b having a thickness of ½ or less of the diameter are fixed on the roller shaft 6a, and each roller body 6b on one roller shaft 6a among the adjacent roller shafts 6a. Each roller body 6b on the other roller shaft 6a enters a gap therebetween. Further, as shown in FIG. 3, the upper conveying roller 9 is also formed by fixing a plurality of similar roller bodies 9b in parallel on a roller shaft 9a orthogonal to the upstream and downstream directions.

  On the other hand, as shown in FIG. 2, the upstream end roller and the downstream end sandwiching rollers 10 and 11 each have a cylindrical surface whose outer peripheral surface extends continuously in an axial direction perpendicular to the upstream / downstream direction. The length in the direction is a length that can sandwich the entire area of the printed circuit board P. Furthermore, as shown in FIG. 4, the outer peripheral surface of each grip roller 12 (13) and the outer peripheral surface of each buffing roller 14 (15) are also cylindrical surfaces extending continuously in the axial direction orthogonal to the upstream and downstream directions. None, the axial lengths of these cylindrical surfaces are such that the entire area of the printed circuit board P can be sandwiched. The direction changing guide roller 16 (17) is also a cylindrical surface having the same axial length as described above.

  FIG. 5 shows the peripheral structure of the pair of grip rollers 12 and the pair of buffing rollers 14 on the upstream side. Since the peripheral structure of the pair of grip rollers 13 and the pair of buffing rollers 15 on the downstream side is substantially the same, the components are denoted by parenthesized symbols in FIG. To do. As shown in the figure, the printed circuit board P transported from the upstream side of the polishing transport path 3B to the downstream side in the horizontal direction as the lower transport roller 6 and the upper transport roller 9 rotate in the direction of arrow a At the time of reaching the upstream grip roller 12 of the pair of grip rollers 12, the fluid (water) flow W1 supplied from the fluid ejecting means 20 is in contact with the outer peripheral surface of the upstream grip roller 12. It is clamped between the pair of grip rollers 12. When both the grip rollers 12 are rotated forward in the direction of the arrow b, the printed circuit board P sandwiched between the grip rollers 12 is sent downward and sent between the pair of buffing rollers 14. It is. The printed board P thus fed is ground on both the front and back surfaces by the pair of buffing rollers 14 so that the polishing is performed until just before the rear end of the printed board P is separated from the pair of grip rollers 12. It has become.

  Thereafter, when the pair of grip rollers 12 are reversed in the direction of the arrow c, the printed board P is sent upward, and the pair of buffing rollers 14 perform simultaneous polishing on both sides in the opposite direction to the above. This is performed for the same region of the substrate P. In this case, immediately after the upward feeding of the printed circuit board P is started, the rear end of the printed circuit board P is connected to the grip roller 12 on the downstream side by the flow W2 of the fluid (water) ejected from the fluid ejecting means 20. Is sandwiched between the lower transport roller 6 and the upper transport roller 9 on the downstream side while contacting the outer peripheral surface, and then the printed circuit board P is transported downstream in the horizontal direction. Note that the pair of buffing rollers 14 maintains rotation in the direction of the arrow d.

  FIG. 6 shows the configuration of the positioning means 30 for positioning the pair of upstream buffing rollers 14 at accurate positions. The positioning means for the pair of downstream buffing rollers 15 has substantially the same configuration. As shown in the figure, the positioning means 30 includes a first moving means 31 for moving one (left side in the figure) buffing roller 14 along the horizontal direction and a buffing roller on the other side (right side in the figure). A second moving means 32 for moving the polishing roller 14 along the horizontal direction, a rotation driving means 33 for rotating only the one buffing roller 14 with the other buffing roller 14 in an idle state, A first rotation speed sensor 34 that detects the rotation speed of the buffing roller 14 and a second rotation speed sensor 35 that detects the rotation speed of the other buffing roller 14 are provided.

  As shown in FIG. 7, the position setting for positioning the pair of buffing rollers 14 includes a first retraction position 36 where one buffing roller 14 retracts to the left and stops, and the other buffing roller 14 stops. A second retraction position 37 where the polishing roller 14 retracts to the right and stops is set in advance. Further, between the pair of buffing rollers 14, a polishing reference position 38 that is a reference (ideal position) of the polishing position of the printed circuit board P determined by the relationship with the pair of grip rollers 12 is known in advance. ing. Then, with this polishing reference position 38 as a boundary, the distance X1 to the first retraction position 36 and the distance X2 to the second retraction position 37 are equal.

  Under such a configuration, the positioning means 30 positions the pair of buffing rollers 14 as described below. In the following description, the case where the distance X1 and the distance X2 are both 75 mm is taken as an example. First, as shown in FIG. 8A, the first moving unit 31 and the second moving unit 32 move one buffing roller 14 and the other buffing roller 14 to a first retracted position 36 and a second retracted position, respectively. Move to 37 and stop. From this state, as shown in FIG. 8 (b), only one buffing roller 14 is rotationally driven in the direction indicated by the arrow, and each moving means 31, 32 is connected to one buffing roller 14 and the other. The buffing roller 14 is moved toward the polishing reference position 38 at the same speed. Then, as shown in FIG. 8 (c), when one buffing roller 14 and the other buffing roller 14 move 5 mm and the outer peripheral surfaces thereof come into contact with each other, both the buffing rollers 14 are rotated together. At this time, both moving means 31 and 32 stop both the buffing rollers 14 to detect that the distance between the centers of both the buffing rollers 14 is 140 mm. Further, while this rotation occurs, the first rotational speed sensor 34 detects the rotational speed of one buffing roller 14 and the second rotational speed sensor 35 determines the rotational speed of the other buffing roller 14. Then, the ratio between the two rotational speeds is calculated by a calculation means (not shown). In this case, since the pair of buffing rollers 14 shown in the figure have the same diameter, the rotational speeds thereof are also the same, and the ratio of the rotational speeds is 1: 1. Therefore, in this case, the actual polishing position between the buffing rollers 14 and the polishing reference position 38 coincide with each other, and it is not necessary to correct the positions of the buffing rollers 14.

  On the other hand, as shown in FIG. 9A, both buffing rollers 14 (one diameter is 150 mm and the other diameter is 130 mm) having different diameters are stopped at the first and second retraction positions 36 and 37, respectively. From the state, as shown in FIG. 9B, one buffing roller 14 having a large diameter is driven to rotate while the two buffing rollers 14 are brought into close contact with each other, as shown in FIG. 9C. At the time when the revolving is started, it is detected that the distance between the centers of the buffing rollers 14 is 140 mm as in the above case. In this case, the ratio of the rotational speeds of both is 13:15. Thus, the ratio of the diameters of the buffing rollers 14 is found to be 15:13. Therefore, as shown in FIG. 9 (d), the calculation means calculates that the distance from the contact point of both buffing rollers 14 to one buffing roller 14 is 140 × 15 / (13 + 15) = 75 mm. At the same time, the calculation means calculates that the distance from the contact point of both the buffing rollers 14 to the other buffing roller 14 is 140 × 13 / (13 + 15) = 65 mm. As a result, the contact point of both the buffing rollers 14, that is, the actual polishing position, is (75−65) / 2 = 5 mm from the previously known polishing reference position 38 to the center axis side of the other buffing roller 14. Therefore, if both the buffing rollers 14 are moved to the central axis side of one buffing roller 14 by 5 mm, the actual polishing position will coincide with the polishing reference position 38. Become. Thereby, both the buffing rollers 14 are positioned at accurate positions.

  FIG. 10A shows a state in which the two buffing rollers 14 having different diameters (one diameter is 108 mm and the other diameter is 140 mm) are stopped at the first and second retraction positions 36 and 37, respectively. 10 (b) shows a state in which one of the buffing rollers 14 having a small diameter is rotationally driven and both of them are moved closer to each other, and FIG. 10 (c) shows a state in which both the buffing rollers 14 are in contact with each other and start rotating together. Is shown. In this case, at the start of rotation, it is detected that the distance between the centers of both buffing rollers 14 is 124 mm, and the ratio of the rotational speeds of both is 35:27. Is found to be 27:35. Therefore, as shown in FIG. 10 (d), the calculation means calculates that the distance from the contact point of both buffing rollers 14 to one buffing roller 14 is 124 × 27 / (35 + 27) = 54 mm. At the same time, the calculation means calculates that the distance from the contact point of both the buffing rollers 14 to the other buffing roller 14 is 124 × 35 / (35 + 27) = 70 mm. As a result, the contact point of both the buffing rollers 14, that is, the actual polishing position, is (70−54) / 2 = 8 mm from the polishing reference position 38, which is known in advance, to the central axis side of one buffing roller 14. Therefore, if both the buffing rollers 14 are moved to the center axis side of the other buffing roller 14 by 8 mm, the actual polishing position matches the polishing reference position 38. Become. Thereby, both the buffing rollers 14 are positioned at accurate positions.

  The positioning operation as described above is executed when the diameters of the two buffing rollers 14 are different due to the difference in wear amount between the two buffing rollers 14 or when one of the buffing rollers 14 is replaced and replaced. . Such a positioning operation is performed not only on the pair of buffing rollers 14 on the upstream side but also on the pair of buffing rollers 15 on the downstream side.

  Next, the operation of polishing the printed circuit board P by the polishing apparatus 1 according to this embodiment will be described in time series.

  As shown in FIG. 11A, the printed circuit board P carried in through the carry-in entrance 4 is carried downstream by the lower carrying roller 6 in the carry-in carrying path 3A, and the front end of the printed board P by the inlet sensor 7 When it is detected that has reached the initial position, the substrate stopper 8 is lowered to the state shown in the figure.

  As a result, as shown in FIG. 11B, the printed circuit board P stops at the front end of the printed circuit board P just before the clamping roller 10 in contact with the printed circuit board stopper 8. The front ends of the printed circuit boards P are aligned in a direction orthogonal to the upstream and downstream directions, and the printed circuit board P is maintained in an accurate posture.

  After that, as shown in FIG. 11C, the printed circuit board P is conveyed downstream by the lower conveyance roller 6 and the upper conveyance roller 9 while being sandwiched between the pair of upper and lower clamping rollers 10, and the upstream side initial stage The position detection sensor 18 detects that the front end of the printed circuit board P has reached the initial polishing position. In this case, based on the signal from the initial position detection sensor 18, the normal rotation and reverse rotation timing of the grip roller 12 according to the length and the conveyance speed of the printed circuit board P and the water injection supply timing from the fluid ejection means 20. Etc. are controlled by a control means (not shown).

  Then, as the printed circuit board P is conveyed further downstream, the direction of the printed circuit board P is changed by the flow W1 of water from the direction changing guide roller 16 and the fluid ejecting means 20, and FIG. As shown in the figure, the front part is fed downward while being sandwiched between the pair of normally rotating grip rollers 12, and the front end smoothly enters between the pair of buffing rollers 14.

  As described above, after the front end of the printed circuit board P enters between the pair of buffing rollers 14, the printed circuit board P is sent downward while the both surfaces of the printed circuit board P are simultaneously polished by the pair of buffing rollers 14. Then, the downward feeding accompanying the polishing of the printed circuit board P is stopped immediately before the rear end of the printed circuit board P is separated from between the pair of grip rollers 12, as shown in FIG. At this time, the succeeding printed circuit board P1 passes through the inlet sensor 7 and is stopped by the board stopper 8 and is in a standby state.

  After this, the pair of grip rollers 12 are reversed and the preceding printed circuit board P is sent upward. At this time, the pair of buffing rollers 14 rotating in the same direction is used to rotate the printed circuit board P. Both sides are simultaneously polished in substantially the same direction as above. Immediately after the start of feeding upward of the printed circuit board P, the rear end of the printed circuit board P becomes the front end, and the front end is driven by the direction changing guide roller 16 and the water flow W2 from the fluid ejecting means 20. As shown in FIG. 12C, when the direction is changed so as to go to the downstream side in the horizontal direction and the rear end, which is the initial front end of the printed circuit board P, is separated from between the pair of buffing rollers 14 by feeding upward. In addition, the printed circuit board P is further conveyed downstream by the lower conveyance roller 6 and the upper conveyance roller 9. Note that the front region (initial rear region) of the printed circuit board P is an unpolished region. At this point, the succeeding printed circuit board P1 can be transported toward the downstream side by raising the substrate stopper 8.

  Further, the preceding printed circuit board P is transported to the downstream side, and its front end (initial rear end) is detected by the downstream initial position detection sensor 19 as shown in FIG. The time of forward and reverse rotation of the grip roller 13 and the operation of the fluid ejecting means 21 are specified. At this time, the subsequent printed circuit board P1 is sandwiched by the pair of upstream-side sandwiching rollers 10 and conveyed downstream. Is done.

  Then, as shown in FIG. 13B, the preceding printed circuit board P and the succeeding printed circuit board P1 are transported to the downstream side, and as shown in FIG. However, when it reaches immediately before the downstream grip roller 13, the front end of the subsequent printed circuit board P1 is detected by the upstream initial position detection sensor 18, and the forward rotation of the pair of upstream grip rollers 12 is performed. And the timing of reverse rotation and the operation of the fluid ejecting means 20 are specified.

  Thereafter, as shown in FIG. 14 (a), when the front end of the preceding printed circuit board P changes direction and is sent downward and enters between the pair of downstream buffing rollers 15, The front end of the printed circuit board P1 is changing its direction in the vicinity of the grip roller 12 on the upstream side. The upstream grip roller 12 and buffing roller 14 and the downstream grip roller 13 and buffing roller 15 have the same operation in the rotational direction and the like.

  And as shown in FIG.14 (b), when the preceding printed circuit board P is further sent below, the front area | region which is an unpolished area | region of the printed circuit board P is made into a pair of downstream buffing rollers 15. At this point, the subsequent printed circuit board P1 starts to penetrate between the pair of buffing rollers 14 on the upstream side. Furthermore, as shown in FIG. 14C, when the trailing edge of the preceding printed board P stops just before the pair of grip rollers 13 are separated, the subsequent printed board P1 is polished with feeding downward. On the way. Therefore, in this polishing apparatus 1, a plurality of (two in the illustrated example) printed circuit boards P and P1 are subjected to the polishing process simultaneously.

  Then, as shown in FIG. 15A, when the preceding printed circuit board P is in the middle of polishing accompanied by upward feeding, the rear end of the subsequent printed circuit board P1 is just before the separation between the pair of grip rollers 13. At this point, the subsequent (third) printed circuit board P2 passes through the inlet sensor 7 and is stopped by the substrate stopper 8. Therefore, in this polishing apparatus 1, a plurality of (three in the illustrated example) printed circuit boards P, P1, and P2 are simultaneously subjected to processing such as conveyance and polishing. The preceding printed circuit board P is polished by the downstream buffing roller 15 in the opposite direction to that by the upstream buffing roller 14.

  Thereafter, as shown in FIG. 15B, the front end of the printed circuit board P is sandwiched between the pair of upper and lower sandwiching rollers 11 on the downstream side, and the front end thereof passes through the exit sensor 23 and slightly passes from the carry-out exit 5. At the time of projecting to the outside, the subsequent printed circuit board P1 and the subsequent printed circuit board P2 are in the same state as shown in FIG. In addition, after the state shown in FIG. 15C, the front end of the preceding printed circuit board P gradually moves from the carry-out port 5 in accordance with the changing modes shown in FIGS. 16A, 16B, and 16C. By projecting, the succeeding printed circuit board P1 and the succeeding printed circuit board P2 become the same as the change modes shown in FIGS. 13A, 13B, and 13C. Then, when the rear end of the preceding printed circuit board P passes through the exit sensor, the processing in the polishing apparatus 1 for the printed circuit board P is completed.

  When the above-described processing is repeatedly executed, the pair of upstream buffing rollers 14 or the pair of downstream buffing rollers 15 are worn, and the diameters of the pair can be varied. Thus, the positioning means 30 described above positions each buffing roller 14 (15).

  In the above-described embodiment, all of the carry-in transport path 3A, the polishing transport path 3B, and the carry-out transport path 3C are configured along the horizontal direction, but at least one of these paths 3A, 3B, and 3C. One may be inclined at a predetermined angle with respect to the horizontal direction.

  FIG. 17 illustrates the polishing apparatus 1 according to the second embodiment of the present invention. For convenience, the conveyance roller and the like are omitted, and the movement locus of the printed circuit board P is illustrated by a one-dot chain line. . As shown in the figure, the polishing apparatus 1 is configured such that all or a part of the conveying path from the carry-in port to the upstream grip roller 12 is partially or along the vertical path 3A1 and from the downstream grip roller 13. All or part of the path 3C1 of the conveyance path leading to the carry-out port is configured to be along the vertical direction. Since other configurations are substantially the same as those of the polishing apparatus 1 according to the first embodiment described above, the same reference numerals are given to common components, and descriptions of operations and the like are omitted.

  FIG. 18 illustrates the polishing apparatus 1 according to the third embodiment of the present invention. In this case as well, for the sake of convenience, the conveyance roller and the like are omitted, and the movement trace of the printed circuit board P is illustrated by a one-dot chain line. Is. As shown in the figure, the polishing apparatus 1 is configured such that the printed circuit board P that has been transported along the horizontal direction (may be in the vertical direction) from the carry-in entrance and has reached the upstream grip roller 12 is sent only downward. After both surfaces are simultaneously polished by the upstream buffing roller 14, the direction is changed and conveyed to reach directly below the downstream buffing roller 15, and further the direction is changed and sent only upward. Both surfaces are simultaneously polished by the buffing roller 15 on the side, and thereafter, the buffing roller 15 passes through the grip roller 13 on the downstream side and reaches the carry-out port along the horizontal direction (may be the vertical direction). In this case, the upstream grip roller 12 and the downstream grip roller 13 that sandwich the printed circuit board P are above and below the upstream buff polishing roller 14 and above and below the downstream buff polishing roller 15, respectively. The grip rollers 12 and 13 and the buffing rollers 14 and 15 are rotated in a direction in which an arrow is attached to the corresponding rollers. Other configurations are substantially the same as those of the polishing apparatus 1 according to the first embodiment described above, and therefore, common constituent elements are denoted by the same reference numerals and description thereof is omitted.

  In the above first, second, and third embodiments, the object to be polished by the polishing apparatus 1 is a flexible thin substrate, but the present invention is not limited to this, and the flexibility is not limited to this. It may be a plate-shaped workpiece that does not have a thickness (for example, a plate thickness of more than 1 mm or more than 2 mm). A specific example will be described below. That is, FIG. 19 illustrates the polishing apparatus 1 according to the fourth embodiment of the present invention, and the object to be polished by this apparatus 1 is higher in rigidity or thicker than the above-described printed circuit board. It is the printed circuit board P as a plate-shaped workpiece of meat. The printed circuit board P fed in the horizontal direction by the lower transport roller 6 and the upper transport roller 9 is polished at the same time by a pair of upper and lower buffing rollers 40 in a horizontal posture. Thus, even when the pair of buffing rollers 40 are vertically arranged, it is possible to perform the positioning operation substantially the same as the operation shown in FIGS. 8, 9 and 10 described above. is there.

  In the above embodiment, the transport roller is used as the transport means for transporting the printed circuit board P. However, the transport means may be a transport conveyor or a combination of the transport roller and the transport conveyor. Good.

It is a schematic front view which shows the whole structure of the grinding | polishing apparatus which concerns on 1st embodiment of this invention. 1 is a schematic plan view showing an overall configuration of a polishing apparatus according to a first embodiment of the present invention. It is an AA line expanded sectional view of FIG. It is an expansion schematic perspective view which shows the principal part of the grinding | polishing apparatus which concerns on 1st embodiment of this invention. It is an expansion schematic front view which shows the principal part of the grinding | polishing apparatus which concerns on 1st embodiment of this invention. It is the schematic which shows the structure of the positioning means which is a component of the grinding | polishing apparatus which concerns on 1st embodiment of this invention. It is a schematic front view which shows a state when the buffing roller which is a component of the grinding | polishing apparatus which concerns on 1st embodiment of this invention exists in a retracted position. FIGS. 8A, 8B and 8C are schematic views showing the operation of the positioning means which is a component of the polishing apparatus according to the first embodiment of the present invention. FIGS. 9A, 9B and 9C are schematic views showing the operation of the positioning means which is a component of the polishing apparatus according to the first embodiment of the present invention. FIGS. 10A, 10B and 10C are schematic views showing the operation of the positioning means which is a component of the polishing apparatus according to the first embodiment of the present invention. 11A, 11B, and 11C are schematic front views showing the operation of the polishing apparatus according to the first embodiment of the present invention. FIGS. 12A, 12B, and 12C are schematic front views showing the operation of the polishing apparatus according to the first embodiment of the present invention. FIGS. 13A, 13B, and 13C are schematic front views showing the operation of the polishing apparatus according to the first embodiment of the present invention. 14A, 14B, and 14C are schematic front views showing the operation of the polishing apparatus according to the first embodiment of the present invention. FIGS. 15A, 15B, and 15C are schematic front views showing the operation of the polishing apparatus according to the first embodiment of the present invention. FIGS. 16A, 16B, and 16C are schematic front views showing the operation of the polishing apparatus according to the first embodiment of the present invention. It is a schematic front view which shows typically the principal part of the grinding | polishing apparatus which concerns on 2nd embodiment of this invention. It is a schematic front view which shows typically the principal part of the grinding | polishing apparatus which concerns on 3rd embodiment of this invention. It is a schematic front view which shows the principal part of the grinding | polishing apparatus which concerns on 4th embodiment of this invention.

Explanation of symbols

1 Polishing device 3A Conveyance route (conveyance route for loading)
3B transfer path (polishing transfer path)
3C transport route (transport route for unloading)
6 Transport means (lower transport roller)
9 Transport means (upper transport roller)
12 Grip roller (upstream grip roller)
13 Grip roller (downstream grip roller)
14 Buffing roller (upstream buffing roller)
15 Buffing roller (downstream buffing roller)
16 Direction changing guide roller (Upstream direction changing guide roller)
17 Direction changing guide roller (downstream direction changing guide roller)
20 Fluid ejecting means (upstream fluid ejecting means)
21 Fluid ejecting means (downstream fluid ejecting means)
30 Positioning means 31 Moving means (first moving means)
32 Moving means (second moving means)
33 Rotation drive means 34 First rotation speed sensor 35 Second rotation speed sensor 36 Retraction position (first retraction position)
37 Retraction position (second retraction position)
38 Polishing reference position 40 Buffing roller P Printed circuit board (thin substrate)
P1 Printed circuit board (thin substrate)
P2 Printed circuit board (thin substrate)
W1 Fluid (water) flow W2 Fluid (water) flow

Claims (4)

In a polishing apparatus comprising a conveying means for conveying a plate-like workpiece, and a buffing roller for polishing the plate-like workpiece during conveyance by the conveying means,
A pair of buffing rollers disposed in the middle of the conveying path formed by the conveying means and configured to simultaneously polish both surfaces of the plate-like workpiece with the plate-like workpiece interposed therebetween; Positioning for positioning the pair of buffing rollers so that the polishing position of the plate-like workpiece between the polishing rollers becomes a predetermined polishing reference position regardless of the difference in diameter of each of the buffing rollers. A polishing apparatus comprising means.   The positioning means includes a moving means that moves the pair of buffing rollers closer from a retreat position that is spaced by an equal distance on both sides with the polishing reference position as a boundary, and a pair of buffing rollers that maintain the same moving distance between them. Rotation driving means for rotating only one buffing roller among the polishing rollers, a first rotation speed sensor for detecting the rotation speed of the one buffing roller, and the one of the one buffing rollers as the moving means approaches. The polishing apparatus according to claim 1, further comprising a second rotation speed sensor that detects a rotation speed of the other buffing roller that rotates in contact with the buffing roller. In a roller positioning method for a polishing apparatus, comprising: a conveying unit that conveys a plate-like workpiece; and a buffing roller that polishes the plate-like workpiece in the middle of conveyance by the conveying unit, and positioning the buffing roller.
A pair of buffing rollers disposed in the middle of the conveying path formed by the conveying means and configured to simultaneously polish both surfaces of the plate-like workpiece with the plate-like workpiece interposed between each other; Positioning the pair of buffing rollers so that the polishing position of the plate-like workpiece between the rollers is a predetermined polishing reference position regardless of the difference in diameter of each of the buffing rollers. A roller positioning method for a polishing apparatus.   The pair of buffing rollers is driven to rotate out of the pair of buffing rollers by moving the pair of buffing rollers closer to each other from the retreat position separated by an equal distance on both sides with the polishing reference position as a boundary, while maintaining the same moving distance between the two. One buffing roller to be brought into contact with the other buffing roller that is not rotationally driven to cause the other buffing roller to rotate, and the rotational speeds of the two buffing rollers at this time are compared. The roller positioning method for a polishing apparatus according to claim 3, wherein the pair of buffing rollers are positioned based on a comparison result.

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