JP2006080383A - 発光装置及びその温度検出方法 - Google Patents

発光装置及びその温度検出方法 Download PDF

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Publication number
JP2006080383A
JP2006080383A JP2004264339A JP2004264339A JP2006080383A JP 2006080383 A JP2006080383 A JP 2006080383A JP 2004264339 A JP2004264339 A JP 2004264339A JP 2004264339 A JP2004264339 A JP 2004264339A JP 2006080383 A JP2006080383 A JP 2006080383A
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Japan
Prior art keywords
temperature
light emitting
emitting device
light
temperature measurement
Prior art date
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Pending
Application number
JP2004264339A
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English (en)
Japanese (ja)
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JP2006080383A5 (https=
Inventor
Hideo Nagai
秀男 永井
Noriyasu Tanimoto
憲保 谷本
Nobuyuki Matsui
伸幸 松井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2004264339A priority Critical patent/JP2006080383A/ja
Publication of JP2006080383A publication Critical patent/JP2006080383A/ja
Publication of JP2006080383A5 publication Critical patent/JP2006080383A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips

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  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2004264339A 2004-09-10 2004-09-10 発光装置及びその温度検出方法 Pending JP2006080383A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004264339A JP2006080383A (ja) 2004-09-10 2004-09-10 発光装置及びその温度検出方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004264339A JP2006080383A (ja) 2004-09-10 2004-09-10 発光装置及びその温度検出方法

Publications (2)

Publication Number Publication Date
JP2006080383A true JP2006080383A (ja) 2006-03-23
JP2006080383A5 JP2006080383A5 (https=) 2007-09-27

Family

ID=36159578

Family Applications (1)

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JP2004264339A Pending JP2006080383A (ja) 2004-09-10 2004-09-10 発光装置及びその温度検出方法

Country Status (1)

Country Link
JP (1) JP2006080383A (https=)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007294838A (ja) * 2006-04-26 2007-11-08 Yiguang Electronic Ind Co Ltd 発光ダイオードのパッケージ構造
JP2007300010A (ja) * 2006-05-02 2007-11-15 Nichia Chem Ind Ltd 発光装置及び照明装置
JP2008166412A (ja) * 2006-12-27 2008-07-17 Koito Mfg Co Ltd 発光素子駆動回路及び車両用灯具
KR20130063421A (ko) * 2011-12-06 2013-06-14 엘지이노텍 주식회사 발광 소자 패키지
JP2016092183A (ja) * 2014-11-04 2016-05-23 豊田合成株式会社 発光装置及びその製造方法
CN105810795A (zh) * 2016-04-14 2016-07-27 宏齐光电子(深圳)有限公司 一种芯片级封装 led 的封装结构
US9607970B2 (en) 2009-11-13 2017-03-28 Sharp Kabushiki Kaisha Light-emitting device having a plurality of concentric light transmitting areas
US9679942B2 (en) 2010-01-22 2017-06-13 Sharp Kabushiki Kaisha Light emitting device
JP2017167222A (ja) * 2016-03-14 2017-09-21 マイクロネット株式会社 顕微鏡用照明装置、顕微鏡用照明装置を備える顕微鏡、顕微鏡用照明装置を備える顕微鏡システム
WO2022040632A1 (en) * 2020-08-21 2022-02-24 Lumileds Llc Multi-color lighting device, system and method of manufacture

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61154192A (ja) * 1984-12-27 1986-07-12 Nec Corp 半導体レ−ザの温度特性測定装置
JPH06237013A (ja) * 1991-05-27 1994-08-23 Mitsubishi Kasei Corp 発光スペクトル制御システム
JPH06331151A (ja) * 1993-05-21 1994-11-29 Toshiba Corp 卓上こんろ
JPH0982379A (ja) * 1995-09-18 1997-03-28 Kitagawa Ind Co Ltd ケーブル接続具
JP2001043728A (ja) * 1999-07-30 2001-02-16 Fujitsu Takamisawa Component Ltd 発光ダイオード照明装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61154192A (ja) * 1984-12-27 1986-07-12 Nec Corp 半導体レ−ザの温度特性測定装置
JPH06237013A (ja) * 1991-05-27 1994-08-23 Mitsubishi Kasei Corp 発光スペクトル制御システム
JPH06331151A (ja) * 1993-05-21 1994-11-29 Toshiba Corp 卓上こんろ
JPH0982379A (ja) * 1995-09-18 1997-03-28 Kitagawa Ind Co Ltd ケーブル接続具
JP2001043728A (ja) * 1999-07-30 2001-02-16 Fujitsu Takamisawa Component Ltd 発光ダイオード照明装置

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007294838A (ja) * 2006-04-26 2007-11-08 Yiguang Electronic Ind Co Ltd 発光ダイオードのパッケージ構造
JP2007300010A (ja) * 2006-05-02 2007-11-15 Nichia Chem Ind Ltd 発光装置及び照明装置
JP2008166412A (ja) * 2006-12-27 2008-07-17 Koito Mfg Co Ltd 発光素子駆動回路及び車両用灯具
US9607970B2 (en) 2009-11-13 2017-03-28 Sharp Kabushiki Kaisha Light-emitting device having a plurality of concentric light transmitting areas
US9966367B2 (en) 2010-01-22 2018-05-08 Sharp Kabushiki Kaisha Light emitting device
US9679942B2 (en) 2010-01-22 2017-06-13 Sharp Kabushiki Kaisha Light emitting device
KR20130063421A (ko) * 2011-12-06 2013-06-14 엘지이노텍 주식회사 발광 소자 패키지
KR101949150B1 (ko) * 2011-12-06 2019-02-18 엘지이노텍 주식회사 발광 소자 패키지
JP2016092183A (ja) * 2014-11-04 2016-05-23 豊田合成株式会社 発光装置及びその製造方法
JP2017167222A (ja) * 2016-03-14 2017-09-21 マイクロネット株式会社 顕微鏡用照明装置、顕微鏡用照明装置を備える顕微鏡、顕微鏡用照明装置を備える顕微鏡システム
CN105810795A (zh) * 2016-04-14 2016-07-27 宏齐光电子(深圳)有限公司 一种芯片级封装 led 的封装结构
WO2022040632A1 (en) * 2020-08-21 2022-02-24 Lumileds Llc Multi-color lighting device, system and method of manufacture
CN116420046A (zh) * 2020-08-21 2023-07-11 亮锐有限责任公司 多色照明设备、系统和制造方法
JP2023538102A (ja) * 2020-08-21 2023-09-06 ルミレッズ リミテッド ライアビリティ カンパニー 多色照明装置、システム及び製造方法
JP7797773B2 (ja) 2020-08-21 2026-01-14 ルミレッズ リミテッド ライアビリティ カンパニー 多色照明装置、システム及び製造方法

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