JP2006080273A - 炭化珪素半導体装置及びその製造方法 - Google Patents
炭化珪素半導体装置及びその製造方法 Download PDFInfo
- Publication number
- JP2006080273A JP2006080273A JP2004262165A JP2004262165A JP2006080273A JP 2006080273 A JP2006080273 A JP 2006080273A JP 2004262165 A JP2004262165 A JP 2004262165A JP 2004262165 A JP2004262165 A JP 2004262165A JP 2006080273 A JP2006080273 A JP 2006080273A
- Authority
- JP
- Japan
- Prior art keywords
- silicon carbide
- carbide semiconductor
- insulating film
- gate insulating
- semiconductor substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 132
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims abstract description 122
- 229910010271 silicon carbide Inorganic materials 0.000 title claims abstract description 120
- 238000004519 manufacturing process Methods 0.000 title claims description 30
- 230000003647 oxidation Effects 0.000 claims abstract description 30
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 30
- 239000000463 material Substances 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims description 39
- 125000005842 heteroatom Chemical group 0.000 claims description 37
- 238000000034 method Methods 0.000 claims description 35
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 29
- 238000000151 deposition Methods 0.000 claims description 18
- 238000005530 etching Methods 0.000 claims description 10
- 229910052760 oxygen Inorganic materials 0.000 claims description 9
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 7
- 239000007772 electrode material Substances 0.000 claims description 7
- 239000001301 oxygen Substances 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- 239000012298 atmosphere Substances 0.000 claims description 5
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 4
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 35
- 239000012535 impurity Substances 0.000 description 9
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 7
- 229910052698 phosphorus Inorganic materials 0.000 description 7
- 239000011574 phosphorus Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 230000004888 barrier function Effects 0.000 description 5
- 230000005684 electric field Effects 0.000 description 5
- 239000011229 interlayer Substances 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000005468 ion implantation Methods 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- RLOWWWKZYUNIDI-UHFFFAOYSA-N phosphinic chloride Chemical compound ClP=O RLOWWWKZYUNIDI-UHFFFAOYSA-N 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0843—Source or drain regions of field-effect devices
- H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate
- H01L29/0852—Source or drain regions of field-effect devices of field-effect transistors with insulated gate of DMOS transistors
- H01L29/0856—Source regions
- H01L29/0865—Disposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
- H01L29/1608—Silicon carbide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
- H01L29/161—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System including two or more of the elements provided for in group H01L29/16, e.g. alloys
- H01L29/165—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System including two or more of the elements provided for in group H01L29/16, e.g. alloys in different semiconductor regions, e.g. heterojunctions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66053—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide
- H01L29/66068—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
Abstract
【解決手段】炭化珪素エピタキシャル層3表面に熱酸化処理を施すことによりゲート絶縁膜5a,5bを形成し、ゲート電極6a,6b表面に熱酸化処理を施すことによりゲート絶縁膜7a,7bを形成する。これにより、半導体材料との間の酸化速度の差の影響を受けることなく、均一で膜質のよい熱酸化膜から成るゲート絶縁膜を形成することができる。また、炭化珪素エピタキシャル層3とゲート絶縁膜5a,5bの界面には、未結合手に起因する界面準位が少ないので、炭化珪素半導体装置1の駆動力を向上させることができる。
【選択図】図1
Description
始めに、図1を参照して、本発明の実施形態となる炭化珪素半導体装置の構成について説明する。なお、図1は、本発明の実施形態となる炭化珪素半導体装置の断面構成図を示し、2つの構成単位(セル)が連続的に形成されている状態を表している。
次に、図2を参照して、上記炭化珪素半導体装置1の製造方法について説明する。
次に、上記炭化珪素半導体装置1のスイッチ動作について説明する。
2:炭化珪素半導体基板
3:炭化珪素エピタキシャル層
4:炭化珪素半導体基体
5:絶縁膜
5a,5b:ゲート絶縁膜(第1のゲート絶縁膜)
6:多結晶シリコン
6a,6b:ゲート電極
7a,7b:ゲート絶縁膜(第2のゲート絶縁膜)
8:ヘテロ半導体領域
10a,10b:層間絶縁膜
11:ソース電極
12:ドレイン電極
13:リン
D:ドレイン端子
G:ゲート端子
S:ソース端子
Claims (6)
- 炭化珪素半導体基体と、
前記炭化珪素半導体基体表面の所定領域に形成された第1のゲート絶縁膜と、
前記第1のゲート絶縁膜上に形成されたゲート電極と、
前記ゲート電極上に形成された第2のゲート絶縁膜と、
前記炭化珪素半導体基体表面の所定領域に形成された、炭化珪素半導体基体と異なるバンドキャップ幅を有する半導体材料から成るヘテロ半導体領域と、
前記ヘテロ半導体領域に接続されたソース電極と、
前記炭化珪素半導体基体に接続されたドレイン電極とを備え、
前記第1及び第2のゲート絶縁膜はそれぞれ、炭化珪素半導体基体表面及びゲート電極表面に熱酸化処理を施すことにより形成されていること
を特徴とする炭化珪素半導体装置。 - 炭化珪素半導体基体と、炭化珪素半導体基体表面の所定領域に形成された、炭化珪素半導体基体と異なるバンドキャップ幅を有する半導体材料から成るヘテロ半導体領域と、ゲート絶縁膜を介して炭化珪素半導体基体とヘテロ半導体領域のヘテロ接合界面に隣接して配置されたゲート電極と、ヘテロ半導体領域に接続されたソース電極と、炭化珪素半導体基体に接続されたドレイン電極とを備える炭化珪素半導体装置の製造方法であって、
前記炭化珪素半導体基体表面に熱酸化処理を施すことにより絶縁膜を形成する工程と、
前記絶縁膜上に前記ゲート電極を形成するゲート電極材料を堆積する工程と、
前記絶縁膜と前記ゲート電極材料をエッチングすることにより第1のゲート絶縁膜と前記ゲート電極を形成する工程と、
前記ゲート電極表面に熱酸化処理を施すことにより第2のゲート絶縁膜を形成する工程と
を有することを特徴とする炭化珪素半導体装置の製造方法。 - 請求項2に記載の炭化珪素半導体装置の製造方法であって、
前記ゲート電極表面の熱酸化処理は、酸素分圧が5%未満の水蒸気と酸素の混合雰囲気下で行われることを特徴とする炭化珪素半導体装置の製造方法。 - 請求項2又は請求項3に記載の炭化珪素半導体装置の製造方法であって、
前記ゲート電極材料は、少なくともシリコンを含むことを特徴とする炭化珪素半導体装置の製造方法。 - 請求項4に記載の炭化珪素半導体装置の製造方法であって、
前記ゲート電極材料は、多結晶シリコンであることを特徴とする炭化珪素半導体装置の製造方法。 - 請求項2乃至請求項5のうち、いずれか1項に記載の炭化珪素半導体装置の製造方法であって、
前記半導体材料は、多結晶シリコン、単結晶シリコン、及びアモルファスシリコンのうちのいずれかであることを特徴とする炭化珪素半導体装置の製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004262165A JP4742545B2 (ja) | 2004-09-09 | 2004-09-09 | 炭化珪素半導体装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004262165A JP4742545B2 (ja) | 2004-09-09 | 2004-09-09 | 炭化珪素半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006080273A true JP2006080273A (ja) | 2006-03-23 |
JP4742545B2 JP4742545B2 (ja) | 2011-08-10 |
Family
ID=36159492
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004262165A Expired - Fee Related JP4742545B2 (ja) | 2004-09-09 | 2004-09-09 | 炭化珪素半導体装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4742545B2 (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1876638A2 (en) * | 2006-07-06 | 2008-01-09 | Nissan Motor Company, Ltd. | Method of manufacturing semiconductor device with a heterojunction |
JP2008004680A (ja) * | 2006-06-21 | 2008-01-10 | Nissan Motor Co Ltd | 半導体装置及び半導体装置の製造方法 |
WO2008018432A1 (fr) * | 2006-08-08 | 2008-02-14 | Toyota Jidosha Kabushiki Kaisha | Dispositif semi-conducteur au carbure de silicium et procédé pour le fabriquer |
JP2008235331A (ja) * | 2007-03-16 | 2008-10-02 | Nissan Motor Co Ltd | 炭化珪素半導体装置及びその製造方法 |
WO2015126575A3 (en) * | 2014-02-18 | 2015-10-29 | General Electric Company | Silicon carbide semiconductor device, and methods for manufacturing thereof |
US20160218188A1 (en) * | 2013-09-25 | 2016-07-28 | Sumitomo Electric Industries, Ltd. | Silicon carbide semiconductor device and method for manufacturing the same |
CN111542914A (zh) * | 2017-12-27 | 2020-08-14 | 株式会社半导体能源研究所 | 半导体装置以及半导体装置的制造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000022137A (ja) * | 1998-07-07 | 2000-01-21 | Fuji Electric Co Ltd | 炭化けい素mos半導体素子の製造方法および炭化けい素mos半導体素子 |
JP2003318398A (ja) * | 2002-04-26 | 2003-11-07 | Nissan Motor Co Ltd | 炭化珪素半導体装置 |
-
2004
- 2004-09-09 JP JP2004262165A patent/JP4742545B2/ja not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000022137A (ja) * | 1998-07-07 | 2000-01-21 | Fuji Electric Co Ltd | 炭化けい素mos半導体素子の製造方法および炭化けい素mos半導体素子 |
JP2003318398A (ja) * | 2002-04-26 | 2003-11-07 | Nissan Motor Co Ltd | 炭化珪素半導体装置 |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008004680A (ja) * | 2006-06-21 | 2008-01-10 | Nissan Motor Co Ltd | 半導体装置及び半導体装置の製造方法 |
EP1876638A3 (en) * | 2006-07-06 | 2008-10-22 | Nissan Motor Company, Ltd. | Method of manufacturing semiconductor device with a heterojunction |
JP2008016650A (ja) * | 2006-07-06 | 2008-01-24 | Nissan Motor Co Ltd | 半導体装置の製造方法 |
US7989295B2 (en) | 2006-07-06 | 2011-08-02 | Nissan Motor Co., Ltd. | Method of manufacturing semiconductor device |
EP1876638A2 (en) * | 2006-07-06 | 2008-01-09 | Nissan Motor Company, Ltd. | Method of manufacturing semiconductor device with a heterojunction |
US7902025B2 (en) | 2006-07-06 | 2011-03-08 | Nissan Motor Co., Ltd. | Method of manufacturing semiconductor device |
JP2008042018A (ja) * | 2006-08-08 | 2008-02-21 | Toyota Motor Corp | 炭化珪素半導体装置及びその製造方法 |
WO2008018432A1 (fr) * | 2006-08-08 | 2008-02-14 | Toyota Jidosha Kabushiki Kaisha | Dispositif semi-conducteur au carbure de silicium et procédé pour le fabriquer |
US8053784B2 (en) | 2006-08-08 | 2011-11-08 | Toyota Jidosha Kabushiki Kaisha | Silicon carbide semiconductor device and method for manufacturing the same |
US7772058B2 (en) | 2007-03-16 | 2010-08-10 | Nissan Motor Co., Ltd. | Method of manufacturing silicon carbide semiconductor device |
JP2008235331A (ja) * | 2007-03-16 | 2008-10-02 | Nissan Motor Co Ltd | 炭化珪素半導体装置及びその製造方法 |
US20160218188A1 (en) * | 2013-09-25 | 2016-07-28 | Sumitomo Electric Industries, Ltd. | Silicon carbide semiconductor device and method for manufacturing the same |
US9741799B2 (en) * | 2013-09-25 | 2017-08-22 | Sumitomo Electric Industries, Ltd. | Silicon carbide semiconductor device and method for manufacturing the same |
WO2015126575A3 (en) * | 2014-02-18 | 2015-10-29 | General Electric Company | Silicon carbide semiconductor device, and methods for manufacturing thereof |
CN106030757A (zh) * | 2014-02-18 | 2016-10-12 | 通用电气公司 | 碳化硅半导体装置和用于制造碳化硅半导体装置的方法 |
CN111542914A (zh) * | 2017-12-27 | 2020-08-14 | 株式会社半导体能源研究所 | 半导体装置以及半导体装置的制造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP4742545B2 (ja) | 2011-08-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9490338B2 (en) | Silicon carbide semiconductor apparatus and method of manufacturing same | |
CN101604691B (zh) | 半导体器件和半导体器件的制造方法 | |
EP1876638B1 (en) | Method of manufacturing a semiconductor device with a heterojunction | |
JP2010171417A (ja) | 半導体装置 | |
JPWO2009050871A1 (ja) | 半導体装置およびその製造方法 | |
JP2020145483A (ja) | 半導体装置の製造方法 | |
JP5366521B2 (ja) | 炭化珪素半導体装置及びその製造方法 | |
JP4742545B2 (ja) | 炭化珪素半導体装置の製造方法 | |
JPS62156873A (ja) | 半導体装置 | |
JPH10214906A (ja) | 半導体装置及びその製造方法 | |
US20090152670A1 (en) | Semiconductor device and method of fabricating the same | |
JP2010141028A (ja) | 半導体装置の製造方法 | |
US6528404B2 (en) | Semiconductor device and fabrication method thereof | |
JPH10125904A (ja) | 炭化珪素半導体装置 | |
JP5036399B2 (ja) | 炭化珪素半導体装置の製造方法 | |
JP5107027B2 (ja) | ダイアモンド状のカーボンチャネルを有する電界効果トランジスタの製造方法 | |
JP5151076B2 (ja) | 半導体装置及び半導体装置の製造方法 | |
US20090026497A1 (en) | Method for Producing Semiconductor Device | |
CN101320688B (zh) | 制造半导体器件的方法及所制造出的半导体器件 | |
JP2007234942A (ja) | 半導体装置の製造方法 | |
JP2014241426A (ja) | 半導体装置 | |
JP2002203912A (ja) | 半導体装置 | |
JP2005101148A (ja) | 半導体装置及びその製造方法 | |
JP4982960B2 (ja) | 半導体装置の製造方法 | |
JP4950810B2 (ja) | 半導体装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20061025 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20101028 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20101130 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110121 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110301 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110325 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110412 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110425 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140520 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4742545 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |