JP2006066677A - 半導体製造システムおよびその異常検出方法 - Google Patents
半導体製造システムおよびその異常検出方法 Download PDFInfo
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- JP2006066677A JP2006066677A JP2004247922A JP2004247922A JP2006066677A JP 2006066677 A JP2006066677 A JP 2006066677A JP 2004247922 A JP2004247922 A JP 2004247922A JP 2004247922 A JP2004247922 A JP 2004247922A JP 2006066677 A JP2006066677 A JP 2006066677A
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- semiconductor
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 130
- 230000005856 abnormality Effects 0.000 title claims abstract description 55
- 238000001514 detection method Methods 0.000 title claims description 40
- 238000004519 manufacturing process Methods 0.000 title claims description 32
- 238000001312 dry etching Methods 0.000 claims abstract description 68
- 235000012431 wafers Nutrition 0.000 claims abstract description 39
- 230000002159 abnormal effect Effects 0.000 claims abstract description 18
- 230000000694 effects Effects 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 44
- 238000004140 cleaning Methods 0.000 claims description 35
- 238000005530 etching Methods 0.000 abstract description 52
- 230000002950 deficient Effects 0.000 abstract description 5
- 238000005259 measurement Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
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- Drying Of Semiconductors (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004247922A JP2006066677A (ja) | 2004-08-27 | 2004-08-27 | 半導体製造システムおよびその異常検出方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004247922A JP2006066677A (ja) | 2004-08-27 | 2004-08-27 | 半導体製造システムおよびその異常検出方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006066677A true JP2006066677A (ja) | 2006-03-09 |
| JP2006066677A5 JP2006066677A5 (enExample) | 2007-07-19 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004247922A Withdrawn JP2006066677A (ja) | 2004-08-27 | 2004-08-27 | 半導体製造システムおよびその異常検出方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2006066677A (enExample) |
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2004
- 2004-08-27 JP JP2004247922A patent/JP2006066677A/ja not_active Withdrawn
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