JP2006062011A - Micro-structure and manufacturing method for it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a micro-structure and a manufacturing method for it, simply forming a structure having a deformed part such as a bent part or a twist part, which has been considered to be difficult in the conventional lamination. <P>SOLUTION: A releasing layer 12 is formed on a substrate 11, and after a closely contacting force lowering region 12a for lowering the closely contacting force to a thin film pattern 14 is partially formed, a plurality of thin film patterns 14a, 14b, 14c are formed. The substrate 11 and a target substrate 22 are pressed to sequentially transfer the plurality of thin film patterns 14a, 14b to the target substrate 22 side. After the thin film pattern 14b of the second layer and the thin film pattern 14c of the third layer are joined to each other, when an upper stage 21 is raised, the thin film patter 14c of the third layer causes plastic deformation. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a heat exchange element such as a microreactor, an elastic body such as a microhoneycomb structure, a microstructure such as an optical element such as a concave mirror and a convex mirror, and a method for manufacturing the same, and in particular, it has been considered difficult by conventional additive manufacturing methods. The present invention relates to a microstructure capable of easily forming a structure having a deformed portion such as a bent portion or a twisted portion, and a manufacturing method thereof.

  The additive manufacturing method has been rapidly spreading in recent years as a method of forming a complicated-shaped three-dimensional object designed by a computer with a short delivery time.

  As a device that is expected to be manufactured or manufactured by the additive manufacturing method, in a flow element such as a microreactor or a micro heat dissipation system that has been attracting attention in recent years, the larger the area on which a refrigerant or the like operates, the higher the effect. It has been devised to increase the specific surface area by making the surface uneven.

  16 (a) and 16 (b) show a conventional method of manufacturing a flow channel element that increases its specific surface area (see, for example, Patent Document 1).

  This flow path element introduces different types of fluids, mixes them, and discharges them. As shown in FIG. 16A, the mixing elements 50A and 50B having the small chambers 51 are formed by lithography or stereolithography. After being formed by the method or the like, the first and second chips 52A and 52B are stacked so as to be arranged on the inner surfaces of the grooves 52a of the first and second chips 52A and 52B, respectively, so that the mixing elements 50A and 50B face each other. Formed. The shape of the small chamber 51 may be a honeycomb shape as shown in FIG.

  As shown in FIG. 16 (a), a projection having a high aspect ratio is formed on the working wall surface, or as shown in FIG. 16 (b), a honeycomb structure is formed in the flow path, thereby disturbing the fluid flow. The fluid can be mixed in a short time.

  As a conventional manufacturing method of a microstructure in which a minute structure is formed by such a layered modeling method, for example, a modeling method by bonding, peeling, and transfer of a thin film has been proposed (for example, see Patent Document 2). .

  In this microstructure manufacturing method, first, a release layer made of a thermal oxide film, a fluororesin, or the like is formed on a first substrate made of SiC, a glass substrate or the like, and a thin film made of metal, ceramics, or the like is formed thereon. Is uniformly formed with a thickness of 0.5 μm, for example, and then the thin film is patterned using a photolithographic method, a focused ion beam (FIB) method, or the like to form a plurality of thin film patterns corresponding to each cross section of the microstructure. Form.

  Next, a second substrate is disposed immediately above the first substrate on which the thin film pattern is formed, and the first thin film is pressed by pressing the first substrate and the second substrate for a predetermined time at room temperature. After joining the pattern and the second substrate, when the first and second substrates are separated, the first thin film pattern is peeled off from the release layer and transferred to the second substrate side.

  Next, the second substrate is positioned on the second thin film pattern, and similarly, the first substrate and the second substrate are pressed and transferred onto the second thin film pattern and the second substrate. When the first and second substrates are separated after bonding the first thin film pattern, the second thin film pattern is peeled off from the release layer and transferred to the second substrate side.

  By repeating the above bonding, peeling, and transfer, a plurality of thin film patterns are stacked to form a microstructure on the second substrate.

  Further, as a conventional manufacturing method for deforming a flat plate portion, there are methods described in Patent Document 3 and Patent Document 4.

  In the manufacturing method described in Patent Document 3, a plate-like member is bonded to a plate-like member by arranging the magnetic anisotropic material in a magnetic field, and the plate-like member is interacted with the magnetic anisotropic material. It is something to bend.

In the manufacturing method described in Patent Document 4, a recess is formed on the back surface of a metal plate by etching, and an indenter is pressed on the surface corresponding to the recess of the metal plate to form a recess, thereby manufacturing an optical element molding die. To do.
JP 2004-016870 A Japanese Patent No. 3161362 Japanese Patent Laid-Open No. 2003-211398 JP-A-2003-340832

  However, in the manufacturing method of Patent Document 1, it is difficult to form the structure of FIG. 16 over a wide range of the entire flow path by an optical modeling method, and it is difficult to perform precise processing, and productivity is inferior. In addition, since the aspect ratio is high in the stacking direction even in the layered manufacturing method, the number of stacking is very large and not realistic.

  FIG. 17 shows a schematic diagram of a Y-shaped protrusion produced by the additive manufacturing method of Patent Document 2. In order to increase the specific surface area efficiently, a Y-shaped protrusion in which a plurality of thin films 53 are laminated as shown in FIG. 17 is better than a simple unevenness as shown in FIG.

  However, the Y-shaped projection as shown in FIG. 17 has a very large number of laminations, and is difficult in terms of accuracy. In this example, it is an example of 10 layers, but when forming a complex protruding structure by the layered manufacturing method, the number of times of lamination increases, and the effect of increasing the specific surface area is small with respect to the increase in the process, which is impractical. It is. Even if it can be realized, it is impossible to manufacture a structure having an overhang portion having a large spread as shown in FIG. 18A or a structure having a spiral shape as shown in FIG.

  In addition, since the manufacturing method shown in Patent Document 3 requires an action by an electric field or a magnetic field, the materials that can be processed are limited, and the degree of freedom in mechanical design such as conventional mechanical bending is lost.

  Furthermore, the manufacturing method shown in Patent Document 4 has a problem that the concave surfaces must be processed one by one after forming the thin film.

  Accordingly, an object of the present invention is to provide a microstructure capable of easily forming a structure having a deformed portion such as a bent portion or a twisted portion, which has been considered difficult by the conventional additive manufacturing method, and a method for manufacturing the same. There is.

  In order to achieve the above object, the present invention forms a release layer on a substrate, forms a plurality of thin films on the release layer, and joins the thin film to another substrate side different from the substrate. In the method of manufacturing the microstructure comprising the plurality of thin films by sequentially separating the plurality of thin films from the release layer and laminating them on the other substrate, among the plurality of thin films Provided is a method for manufacturing a microstructure, wherein when a predetermined thin film is peeled from the release layer, the shape of the predetermined thin film is changed by peeling while controlling a peeling speed.

  The change of the shape of the predetermined thin film includes not only generating a bent portion, a twisted portion, etc. in the predetermined thin film, but also separating into a plurality of portions by shearing.

  An adhesive force change region can be formed on the surface of the release layer, and a difference in the peeling speed can be caused in the predetermined thin film to change the shape of the predetermined thin film. Even without forming an adhesive force change region, by controlling the peeling start position and peeling speed of a predetermined thin film, the shape of the predetermined thin film can be changed by causing a difference in peeling speed in the predetermined thin film. Can do.

  In order to achieve the above object, in the structure formed by sequentially peeling and laminating a plurality of thin films formed on a predetermined surface, at least one thin film of the plurality of thin films includes: Provided is a microstructure which is deformed by being subjected to mechanical processing such as bending, shearing or twisting when peeling from the predetermined surface.

  According to the present invention, since the shape of the predetermined thin film is changed when the predetermined thin film is peeled from the release layer, a structure having a deformed portion such as a bent portion or a twisted portion can be easily formed.

[First embodiment]
FIG. 1 shows a method for manufacturing a microstructure according to a first embodiment of the present invention. In this manufacturing method, an L-shaped microstructure is obtained by “bending”. First, as shown in FIG. 1A, a release layer 12 made of polyimide, SiO ₂ thermal oxide film or the like is formed on a substrate 11 made of SiC, glass substrate or the like by spin coating.

Next, as shown in FIG.1 (b), the adhesive force fall area | region 12a which reduces the adhesive force with the thin film pattern 14 formed later among the mold release layers 12 is partially formed. The adhesion reduction region 12a is formed by subjecting the surface of the release layer 12 to fluorination treatment with CF ₄ gas, CHF ₃ gas, or the like.

  Next, as shown in FIG. 1C, a thin film 13 made of metal, ceramics, or the like is deposited on the release layer 12 to a thickness of 0.5 to 20 μm by sputtering.

  Next, as shown in FIG. 1D, the thin film 13 is patterned by using a photolithography method, a focused ion beam (FIB) method, or the like, and a plurality of thin film patterns 14 (14a) corresponding to the respective cross sections of the microstructure. , 14b, 14c). Hereinafter, the substrate 11 on which the thin film pattern 14 is formed is referred to as a donor substrate 10.

Next, as shown in FIG. 2A, after the donor substrate 10 is arranged in a vacuum chamber (not shown), the inside of the vacuum chamber is exhausted to 10 ⁻⁶ P. A relatively movable lower stage 20 and upper stage 21 are disposed in the vacuum chamber. That is, the lower stage 20 is configured to be movable in the horizontal x-axis and y-axis directions and rotatable in the θ direction around the vertical z-axis. The upper stage 21 is configured to be movable in the z-axis direction. The donor substrate 10 is disposed on the lower stage 20.

  Next, the lower stage 20 and the upper stage 21 are relatively moved so that the target substrate 22 is positioned on the first thin film pattern 14a. The surface of the target substrate 22 and the surface of the first thin film pattern 14a are cleaned by irradiation with an argon atom beam.

Next, as shown in FIG. 2B, the upper stage 21 is lowered, the donor substrate 10 and the target substrate 22 are pressed with a predetermined load force (for example, 5 kgf / cm ² ), and the target substrates 22 and 1 The thin film pattern 14a of the sheet is joined.

  Next, as shown in FIG. 2C, when the upper stage 21 is raised, the first thin film pattern 14a is peeled from the release layer 12 and transferred to the target substrate 22 side. This is because the adhesion between the thin film pattern 14 a and the target substrate 22 is greater than the adhesion between the thin film pattern 14 a and the release layer 12.

  Next, the lower stage 20 is moved to position the target substrate 22 on the second thin film pattern 14b. The surface of the first thin film pattern 14a and the surface of the second thin film pattern 14b transferred to the upper stage 21 side are cleaned as described above.

  Next, as shown in FIG. 2 (d), the upper stage 21 is lowered to join the first thin film pattern 14a and the second thin film pattern 14b, and as shown in FIG. 2 (e), When the upper stage 21 is raised, the second thin film pattern 14b is peeled off from the release layer 12 and transferred to the target substrate 22 side.

  Next, the lower stage 20 is moved to position the target substrate 22 on the third thin film pattern 14c. The surface of the second thin film pattern 14b and the surface of the third thin film pattern 14c transferred to the upper stage 21 are cleaned as described above.

  Next, as shown in FIG. 3A, the upper stage 21 is lowered to join the second thin film pattern 14b and the third thin film pattern 14c.

  Next, as shown in FIG. 3B, when the upper stage 21 is raised, one end 15a side of the third thin film pattern 14c is peeled off from the release layer 12, but the other end 15b. Still remains in close contact with the release layer 12. Directly below the one end 15a side of the thin film pattern 14c is the adhesion decreasing region 12a, and therefore it is easy to peel off, and peeling starts from the one end 15a. On the other hand, since the portion immediately below the other end 15b of the thin film pattern 14c that has not been subjected to the fluorination treatment is relatively difficult to peel off, when peeling proceeds while remaining on the substrate 11 side, the thin film pattern 14c becomes as shown in FIG. As shown in b), plastic deformation occurs.

  In the state of FIG. 3A, when there is little difference in adhesion between one end 15a and the other end 15b of the thin film pattern 14c with respect to the release layer 12, the thin film pattern is as shown in FIG. Peeling ends before plastic deformation occurs in 14c, resulting in the state shown in FIG.

  If the adhesive force difference of the release layer 12 is moderate, as shown in FIG. 3 (d), the other end 15b side of the thin film pattern 14c is completely peeled while being plastically deformed in the peeling process, and the thin film The bending process is completed simultaneously with the transfer of the pattern 14.

  In the state of FIG. 3B, when the adhesion between the other end 15b of the thin film pattern 14c and the release layer 12 is sufficiently strong, that is, the adhesion between the other end 15b and the release layer 12 is reduced. When 14c exceeds the breaking stress required for shearing, as shown in FIG. 3E, the thin film pattern 14c is obtained as a microstructure that is broken at the boundary with the other end 15b.

  According to the first embodiment, by forming the adhesion reducing region 12a in the release layer 12, the aspect ratio, which has been considered difficult in the conventional additive manufacturing method, is very V-shaped and L-shaped. Thus, a complicated overhang-like microstructure can be obtained.

[Second Embodiment]
A second embodiment of the present invention will be described. In the second embodiment, the thin film pattern 14 is bent without forming the adhesion reducing region 12 a in the release layer 12.

  That is, the bending angle θ of the thin film pattern 14 can be controlled by the adhesive force of the release layer 12, the shape of the thin film pattern 14, and the peeling speed. For example, an AlCu (2%) alloy thin film (film thickness 8.5 μm, the length a of the thin film pattern 14 a laminated in the previous step in FIG. 3A = 200 μm, as a thin film on the polyimide of the release layer 12, a thin film In the case of laminating the pattern 14c (length b = 900 μm), a peeling speed (moving speed in the z-axis direction of the target substrate 22): when peeling at 1.5 cm / sec, a result of θ = 40 ° was obtained. In this experiment, the adhesion reduction region 12 a is not formed in the release layer 12. That is, if the thin film pattern 14 to be laminated next is joined at a part and the peeling speed is appropriately controlled, it is possible to bend the thin film pattern even if the adhesion reducing region 12a is not formed. .

  According to the second embodiment, since it is possible to perform machining such as bending on the thin film pattern without forming the adhesion reduction region, the manufacturing process can be simplified. In addition, ferroelectric materials such as barium strontium titanate, which are difficult to etch and patterning in the thin film additive manufacturing method, special electrodes such as Au (gold), Pt (platinum), Ru (lutetium), and Ir (iridium) A laminated pattern can be formed without patterning a thin film made of a material on the thin film itself.

[Third embodiment]
FIG. 4 shows a part of the manufacturing process of the microstructure according to the third embodiment of the present invention. First, as shown in FIG. 4A, a release layer 12 in which an adhesion reducing region 12a is formed is deposited on a substrate 11, and a thin film 13 is formed thereon. To place. Next, as shown in FIG. 4B, when the upper stage 21 is lowered, the thin film 13 and the target substrate 22 are joined, and as shown in FIG. 4C, the upper stage 21 is raised, the thin film The thin film 13 is cut at the boundary between the central portion of 13 and the end portions at both ends, and only the central portion of the thin film 13 is transferred to the target substrate 22 side.

  According to the third embodiment, an arbitrary thin film pattern can be transferred by providing an adhesive force distribution in the release layer 12 without patterning the thin film by etching or the like.

  In the thin film peeling step in the above embodiment, by changing the relative position of the donor substrate 10 and the target substrate 22 during the peeling, in addition to the “bending” as shown in FIG. And complicated processing such as “twisting”. Further, the thin film can be twisted by rotating the donor substrate 10 and the target substrate 22 relatively.

[Other embodiments]
In addition, this invention is not limited to the said embodiment, A various deformation | transformation implementation is possible within the range of the summary. For example, in the above embodiment, the adhesive force change region is formed by partially exposing the release layer to a gas having fluorine atoms, but is formed by depositing a thin film containing fluorine on the substrate or the release layer. May be. Alternatively, the substrate may be formed by being partially exposed to a gas having fluorine atoms.

  In addition, the formation of the adhesive force changing region is accompanied by a process of changing the elastic modulus of the release layer, thereby mitigating or promoting non-uniformity of the bonding stress at the time of bonding, and a place where a predetermined thin film starts to start peeling. You may control.

  FIG. 5 shows a microstructure according to Example 1 of the present invention. This Example 1 is a Y-shaped structure, in which an adhesion reduction region is formed in the part of the release layer 12 that is in close contact with both ends of the fifth thin film pattern 14e, and four thin film patterns are formed. After laminating 14a to 14d, both ends of the thin film pattern 14e are bent when the fifth thin film pattern 14e is transferred. Thus, as shown in FIG. 6, a structure having a function equivalent to that of a Y-shaped structure formed by bending a metal plate 16 can be manufactured by stacking thin films.

  FIG. 7 shows a microstructure according to Embodiment 2 of the present invention. This Example 2 is a structure having a curved surface, and an adhesion strength decreasing region in which the adhesion force gradually changes is formed in the part of the release layer 12 that has adhered to the center part of the fifth thin film pattern 14e. The thin film pattern 14e is curved with a radius r when the fifth thin film pattern 14e is transferred after the four thin film patterns 14a to 14d are stacked. In addition, even when the adhesion force reduction region with a constant adhesion force is formed, or even when the adhesion force reduction region is not formed, by moving the lower stage and the upper stage in parallel in the curvature direction of the thin film pattern, It is also possible to produce a curved shape.

  FIG. 8 shows a microstructure according to Embodiment 3 of the present invention. The third embodiment is a Y-shaped heat sink made of a member having high thermal conductivity such as Cu or A1. Forming a minute heat sink as shown in the figure by forming an adhesion reduction region in the release layer and bending the thin film pattern 14b having a plurality of recesses 17 in the longitudinal direction into a Y shape. Is possible. Moreover, the reaction area of the inner surface of the channel can be efficiently increased by arranging a plurality of the structures in the channel.

  FIG. 9 shows a microstructure according to Embodiment 4 of the present invention. The fourth embodiment is an L-shaped heat sink made of a member having high thermal conductivity such as Cu or A1. In Example 4, the thin film pattern 14b can be bent in a substantially L shape as shown in the figure by forming an adhesion decreasing region on one side of the release layer.

  FIG. 10 shows a microstructure according to Example 5 of the present invention. Example 5 is a V-shaped structure having a thin film pattern 14b bent in a V-shape. By utilizing the V-shaped portion of the V-shaped structure as a flow path, a linear flow path as shown in the figure can be formed without requiring a special etching step as in the prior art.

  FIG. 11 shows a microstructure according to Example 6 of the present invention. The sixth embodiment is a micro convex mirror 18A made of a material having high ductility, for example, aluminum. In Example 6, both ends of the upper thin film pattern 14c are joined to the lower thin film patterns 14a and 14b, and the central portion of the upper thin film pattern 14c is curved in a convex shape.

  FIG. 12 shows a microstructure according to Example 7 of the present invention. The seventh embodiment is a micro concave mirror 18B made of a material having high ductility, for example, aluminum. In the seventh embodiment, the central portion of the upper thin film pattern 14b is joined to the lower thin film pattern 14a, and both ends of the upper thin film pattern 14b are placed at a high position and the central portion is curved in a concave shape.

  FIG. 13 shows a microstructure according to Example 8 of the present invention. Example 8 is a pantograph spring 18C formed by laminating thin film patterns 14a to 14f as shown in FIG. 13 (b).

  In order to manufacture such a pantograph spring 18C, first, the lower pillar 14f is closely attached to the part of the release layer 12 where the thin film pattern 14f is closely attached, so that the adhesive force with the lower pillar 14f is higher than the other parts. A force increasing region 12b is formed. Next, thin film patterns 14 a to 14 f corresponding to the upper column, the upper spring portion, the connecting portion, and the lower spring portion are formed on the release layer 12. Next, the first to fifth thin film patterns 14a to 14e are stacked on the target substrate 22 side, and the upper pillar, the upper spring portion, the connecting portion, and the lower spring portion are transferred. When the fifth thin film pattern 14e and the sixth thin film pattern 14f are joined as shown in FIG. 13A and the upper stage 21 is raised as shown in FIG. The part (14b) and the upper spring part (14e) are plastically deformed and curved. The pantograph spring 18C can be manufactured by peeling the pantograph spring 18C formed in this way from the target substrate 22.

  According to the eighth embodiment, a special spring can be manufactured like a pantograph spring 18C which is a kind of leaf spring. In addition, a normal leaf spring can be formed by the method of this embodiment to cope with a microelement or the like.

  FIG. 14 shows a microstructure according to Example 9 of the present invention. Example 9 is a pantograph spring having a honeycomb structure in which a plurality of pantograph springs 18C shown in FIG. In order to form such a shape with the conventional MEMS (Micro Electro Mechanical System) technology, it is necessary to remove all the cavities in the honeycomb shape by etching, and in this embodiment, it is almost the same as the creation of a normal size honeycomb structure. A honeycomb structure can be formed with a small number of steps.

  FIG. 15 shows a microstructure according to Example 10 of the present invention. The tenth embodiment is a spring washer 18D, and a spring shape as shown in the figure can be obtained by applying torsional deformation while transferring a ring pattern that is partially cut. As a result, the spring washer, which conventionally required a sacrificial layer, can be easily formed without the need for a sacrificial layer.

  In addition to the structures of the above-described embodiments, the present invention includes a microreactor in which protrusions formed by mechanical processing are arranged on the working surface, a heat exchange element such as a flow channel device and a radiator, and an elastic property such as a leaf spring. The present invention can be applied to various microstructures such as optical elements such as a body, a diffraction grating, and a lens.

(A)-(d) is sectional drawing which shows the manufacturing process of the microstructure based on the 1st Embodiment of this invention. (A)-(e) is sectional drawing which shows the manufacturing process of the microstructure based on the 1st Embodiment of this invention. (A)-(e) is sectional drawing which shows the manufacturing process of the microstructure based on the 1st Embodiment of this invention. (A)-(c) is sectional drawing which shows the manufacturing process of the microstructure based on the 3rd Embodiment of this invention. It is a front view which shows the microstructure of Example 1 of this invention. It is a front view which shows the conventional microstructure corresponding to the microstructure of Example 1 of this invention. It is a front view which shows the microstructure of Example 2 of this invention. It is a perspective view which shows the microstructure of Example 3 of this invention. It is a perspective view which shows the microstructure of Example 4 of this invention. It is a perspective view which shows the microstructure of Example 5 of this invention. It is a front view which shows the microstructure of Example 6 of this invention. It is a front view which shows the microstructure of Example 7 of this invention. (A), (b) is sectional drawing which shows the manufacturing process of the microstructure of Example 8 of this invention. It is a front view which shows the microstructure of Example 9 of this invention. It is a perspective view which shows the microstructure of Example 10 of this invention. 10 is a schematic diagram of a microstructure manufactured by the method of Patent Document 2. FIG. (A) is a schematic diagram of the structure which has the overhang part which has a big breadth, (b) is a perspective view of the structure which has a spiral shape.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Donor board | substrate 11 Substrate 12a Adhesion power fall area | region 12b Adhesion power increase area | region 12 Release layer 13 Thin film 14, 14a-14e Thin film pattern 15a One edge part 15b The other edge part 16 Metal plate 17 Recessed part 18A Micro convex mirror 18B Micro concave mirror 18C Pantograph spring 18D Spring washer 20 Lower stage 21 Upper stage 22 Target substrate 50A, 50B Mixing element 51 Small chamber 52A, 52B Chip 52a Groove 53 Thin film

Claims (19)

Forming a release layer on the substrate,
Forming a plurality of thin films on the release layer;
By repeatedly joining / separating the thin film with another substrate side different from the substrate, the plurality of thin films are sequentially peeled from the release layer and stacked on the other substrate, In a method for manufacturing a microstructure,
A method for manufacturing a microstructure, wherein when a predetermined thin film is peeled from the release layer among the plurality of thin films, the shape of the predetermined thin film is changed by peeling while controlling a peeling speed. .   2. The method of manufacturing a microstructure according to claim 1, wherein the change of the shape of the predetermined thin film is performed by applying mechanical processing such as bending, shearing, and twisting to the predetermined thin film.   The manufacturing method for controlling a microstructure according to claim 1, wherein the change of the shape of the predetermined thin film is performed by relatively moving the substrate and the other substrate.   2. The method of manufacturing a microstructure according to claim 1, wherein the change of the shape of the predetermined thin film is performed by controlling a peeling start position and the peeling speed of the predetermined thin film.   The method for manufacturing a microstructure according to claim 4, wherein a bending angle of the predetermined thin film is controlled by controlling the peeling speed.   The method for manufacturing a microstructure according to claim 1, wherein the joining / separation is performed in a predetermined atmosphere or the substrate is heated to easily change the shape of the predetermined thin film. The formation of the release layer involves the formation of an adhesive force change region in which the adhesive force with the predetermined thin film has changed on the surface of the release layer,
The change in the shape of the predetermined thin film deforms the predetermined thin film using an adhesion force difference caused by the adhesion force changing region when the predetermined thin film is peeled from the release layer. Manufacturing method of the micro structure.   8. The method for manufacturing a microstructure according to claim 7, wherein the formation of the adhesive force changing region is performed by strengthening or reducing the adhesive force with the predetermined thin film as compared with the other surface of the release layer.   The method for manufacturing a microstructure according to claim 7, wherein the adhesion changing region is formed in a part of the release layer that contacts a part of the predetermined thin film.   The formation of the adhesive force change region is accomplished by depositing a thin film containing fluorine on the substrate or the release layer, or by partially exposing the substrate or the release layer to a gas containing fluorine atoms. The manufacturing method of the microstructure of Claim 7 performed by doing.   The method of manufacturing a microstructure according to claim 7, wherein the formation of the adhesive force changing region is performed by gradually changing the adhesive force with the predetermined thin film.   The change of the shape of the predetermined thin film is performed between the predetermined thin film portion formed on the release layer having a low adhesive force and the predetermined thin film portion on the release layer having a high adhesive force. The method for manufacturing a microstructure according to claim 7, wherein the method is performed by mechanical fracture.   The formation of the adhesive force changing region is accompanied by a process of changing the elastic modulus of the release layer, thereby reducing or promoting non-uniformity of bonding stress during bonding and controlling the peeling start position of the predetermined thin film. The manufacturing method of the microstructure according to claim 7. In a structure formed by sequentially peeling and laminating a plurality of thin films formed on a predetermined surface,
At least one thin film among the plurality of thin films is deformed by being subjected to mechanical processing such as bending, shearing or twisting when being peeled from the predetermined surface.   The microstructure according to claim 14, wherein the plurality of thin films are bonded by room temperature bonding.   The microstructure according to claim 14, wherein an overhang portion or a hollow structure portion is formed by the machining of the at least one thin film.   The microstructure according to claim 14, wherein the structure is a heat exchange element such as a microreactor, a heat pipe, a flow channel device, and a radiator having a protrusion formed by the mechanical processing on an action surface.   15. The microstructure according to claim 14, wherein the structure is an elastic body such as a micro honeycomb structure, a pantograph structure, a leaf spring, or a spring washer. The microstructure according to claim 14, wherein the structure is an optical element such as a concave mirror, a convex mirror, a diffraction grating, or a lens.