JP2006060254A - 発光ダイオード - Google Patents
発光ダイオード Download PDFInfo
- Publication number
- JP2006060254A JP2006060254A JP2005317711A JP2005317711A JP2006060254A JP 2006060254 A JP2006060254 A JP 2006060254A JP 2005317711 A JP2005317711 A JP 2005317711A JP 2005317711 A JP2005317711 A JP 2005317711A JP 2006060254 A JP2006060254 A JP 2006060254A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- light
- compound semiconductor
- gallium nitride
- wavelength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
Abstract
【解決手段】発光ダイオードは、n型及びp型に積層されてなる窒化ガリウム系化合物半導体発光素子と、前記窒化ガリウム系化合物半導体発光素子からの可視光により励起されて、励起波長よりも長波長の可視光を出して前記窒化ガリウム系化合物半導体発光素子の色補正をする蛍光染料又は蛍光顔料とを有する。
【選択図】図2
Description
2・・・メタルステム
3・・・メタルポスト
4・・・樹脂モールド
5・・・蛍光染料
Claims (1)
- n型及びp型に積層されてなる窒化ガリウム系化合物半導体発光素子と、前記窒化ガリウム系化合物半導体発光素子からの可視光により励起されて、励起波長よりも長波長の可視光を出して前記窒化ガリウム系化合物半導体発光素子の色補正をする蛍光染料又は蛍光顔料と、を有することを特徴とする発光ダイオード。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005317711A JP3995011B2 (ja) | 2005-10-31 | 2005-10-31 | 発光ダイオード |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005317711A JP3995011B2 (ja) | 2005-10-31 | 2005-10-31 | 発光ダイオード |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005158166A Division JP3808892B2 (ja) | 2005-05-30 | 2005-05-30 | 発光ダイオード |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007102120A Division JP2007184655A (ja) | 2007-04-09 | 2007-04-09 | 発光ダイオード |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006060254A true JP2006060254A (ja) | 2006-03-02 |
JP3995011B2 JP3995011B2 (ja) | 2007-10-24 |
Family
ID=36107405
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005317711A Expired - Lifetime JP3995011B2 (ja) | 2005-10-31 | 2005-10-31 | 発光ダイオード |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3995011B2 (ja) |
Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5079379A (ja) * | 1973-11-13 | 1975-06-27 | ||
JPS5270783A (en) * | 1975-12-10 | 1977-06-13 | Toshiba Corp | Semiconductor luminescent unit |
JPS5482988A (en) * | 1977-12-15 | 1979-07-02 | Toshiba Corp | Luminous display unit |
JPS5441660Y1 (ja) * | 1970-02-18 | 1979-12-05 | ||
JPS6417484A (en) * | 1987-07-13 | 1989-01-20 | Nippon Telegraph & Telephone | Semiconductor light emitting element |
JPH0367462A (ja) * | 1989-08-07 | 1991-03-22 | Toshiba Battery Co Ltd | 非水溶媒二次電池 |
JPH03133164A (ja) * | 1989-10-19 | 1991-06-06 | Mitsui Petrochem Ind Ltd | 発光または受光装置 |
JPH03152897A (ja) * | 1989-11-09 | 1991-06-28 | Idemitsu Kosan Co Ltd | エレクトロルミネッセンス素子 |
JPH03179787A (ja) * | 1989-12-07 | 1991-08-05 | Mitsui Petrochem Ind Ltd | 発光ダイオード |
JPH05152609A (ja) * | 1991-11-25 | 1993-06-18 | Nichia Chem Ind Ltd | 発光ダイオード |
JPH1093146A (ja) * | 1997-10-20 | 1998-04-10 | Nichia Chem Ind Ltd | 発光ダイオード |
JPH11261114A (ja) * | 1998-12-28 | 1999-09-24 | Nichia Chem Ind Ltd | 発光ダイオ―ド |
JP2002158378A (ja) * | 2001-09-03 | 2002-05-31 | Nichia Chem Ind Ltd | 発光ダイオード |
JP2003234513A (ja) * | 2003-02-04 | 2003-08-22 | Nichia Chem Ind Ltd | 蛍光染料又は蛍光顔料が添加された波長変換発光ダイオード用樹脂 |
JP2004363635A (ja) * | 2004-09-27 | 2004-12-24 | Nichia Chem Ind Ltd | 発光ダイオード |
JP2005252311A (ja) * | 2005-05-30 | 2005-09-15 | Nichia Chem Ind Ltd | 発光ダイオード |
-
2005
- 2005-10-31 JP JP2005317711A patent/JP3995011B2/ja not_active Expired - Lifetime
Patent Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5441660Y1 (ja) * | 1970-02-18 | 1979-12-05 | ||
JPS5079379A (ja) * | 1973-11-13 | 1975-06-27 | ||
JPS5270783A (en) * | 1975-12-10 | 1977-06-13 | Toshiba Corp | Semiconductor luminescent unit |
JPS5482988A (en) * | 1977-12-15 | 1979-07-02 | Toshiba Corp | Luminous display unit |
JPS6417484A (en) * | 1987-07-13 | 1989-01-20 | Nippon Telegraph & Telephone | Semiconductor light emitting element |
JPH0367462A (ja) * | 1989-08-07 | 1991-03-22 | Toshiba Battery Co Ltd | 非水溶媒二次電池 |
JPH03133164A (ja) * | 1989-10-19 | 1991-06-06 | Mitsui Petrochem Ind Ltd | 発光または受光装置 |
JPH03152897A (ja) * | 1989-11-09 | 1991-06-28 | Idemitsu Kosan Co Ltd | エレクトロルミネッセンス素子 |
JPH03179787A (ja) * | 1989-12-07 | 1991-08-05 | Mitsui Petrochem Ind Ltd | 発光ダイオード |
JPH05152609A (ja) * | 1991-11-25 | 1993-06-18 | Nichia Chem Ind Ltd | 発光ダイオード |
JPH1093146A (ja) * | 1997-10-20 | 1998-04-10 | Nichia Chem Ind Ltd | 発光ダイオード |
JP2900928B2 (ja) * | 1997-10-20 | 1999-06-02 | 日亜化学工業株式会社 | 発光ダイオード |
JPH11261114A (ja) * | 1998-12-28 | 1999-09-24 | Nichia Chem Ind Ltd | 発光ダイオ―ド |
JP2002158378A (ja) * | 2001-09-03 | 2002-05-31 | Nichia Chem Ind Ltd | 発光ダイオード |
JP2003234513A (ja) * | 2003-02-04 | 2003-08-22 | Nichia Chem Ind Ltd | 蛍光染料又は蛍光顔料が添加された波長変換発光ダイオード用樹脂 |
JP2004363635A (ja) * | 2004-09-27 | 2004-12-24 | Nichia Chem Ind Ltd | 発光ダイオード |
JP2005252311A (ja) * | 2005-05-30 | 2005-09-15 | Nichia Chem Ind Ltd | 発光ダイオード |
Also Published As
Publication number | Publication date |
---|---|
JP3995011B2 (ja) | 2007-10-24 |
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