JP2006060213A - Wafer carrying device - Google Patents

Wafer carrying device Download PDF

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Publication number
JP2006060213A
JP2006060213A JP2005234778A JP2005234778A JP2006060213A JP 2006060213 A JP2006060213 A JP 2006060213A JP 2005234778 A JP2005234778 A JP 2005234778A JP 2005234778 A JP2005234778 A JP 2005234778A JP 2006060213 A JP2006060213 A JP 2006060213A
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wafer
insertion groove
separation preventing
button
main body
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Jong Sok Choi
ソク チョイ ジョン
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DongbuAnam Semiconductor Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
  • Details Of Rigid Or Semi-Rigid Containers (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wafer carrying device which can prevent a wafer from being broken by a fall in such a way that release preventing equipment is provided to the wafer carrying device used for storing and carrying a wafer during wafer conveyance in a semiconductor manufacturing line. <P>SOLUTION: The device comprises a main body 100, in which a plurality of wafer inserting groove are formed in an internal side surface, and an opening is formed in a front surface so that a wafer 102 can enter/exit, release preventing equipment 120 for opening/closing the inserting groove in such a way that it is mounted in a front surface of the body 100 so that it can move perpendicularly, and that a relative location to the inserting groove may differ, and a means 130 connected with the release preventing equipment 120 for changing a relative location of the release preventing equipment 120 with respect to the inserting groove. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明はウェーハ運搬装置に関し、より具体的には半導体生産ラインでウェーハの運搬時にウェーハを保管及び運搬するに用いられるウェーハ運搬装置に離脱防止装置を取り付けることで、墜落などでウェーハが破損されることを未然に防止することのできるウェーハ運搬装置に関する。   The present invention relates to a wafer transport device, and more specifically, by attaching a separation prevention device to a wafer transport device used for storing and transporting a wafer when transporting a wafer in a semiconductor production line, the wafer is damaged due to a crash or the like. The present invention relates to a wafer conveyance device that can prevent this from occurring.

一般に、ウェーハ運搬装置は、前面にウェーハの出入が可能なように開口部が形成されており、内部の側面にはウェーハを保管できる挿入溝が形成されており、その上部にはウェーハ運搬のための取っ手が形成されている。   In general, an opening is formed on the front surface of the wafer transport device so that the wafer can be taken in and out, and an insertion groove for storing the wafer is formed on the inner side surface. The handle is formed.

しかし、何らの安全装置が前記開口部に備えられていないため、作業者間の衝突などによって運搬中にウェーハが運搬装置から離脱して墜落するなどの事故の危険があった。   However, since no safety device is provided at the opening, there is a risk of an accident such as the wafer falling off the transport device during transportation due to a collision between workers or the like.

このような問題点を解決するための方案として、図１に示した大韓民国登録実用新案第１２１６４２号のウェーハ運搬装置が提案された。前記ウェーハ運搬装置は、側面板８の挿入側の上下部に形成された挿入孔９、前記挿入孔９に回転可能に設置され、側面板の内側と外側に選択的に位置する離脱防止環１０、前記挿入孔９と通ずるように形成され、離脱防止環の下端部が嵌め込まれる解除溝１１及び制御溝１２、前記側面板に形成された挿入孔９のうち、上部挿入孔に設置され、離脱防止環を上方向に押し上げるスプリングで構成されている。   As a method for solving such a problem, a wafer transfer apparatus of the Korean registered utility model No. 121642 shown in FIG. 1 has been proposed. The wafer carrying device is provided with an insertion hole 9 formed at the upper and lower portions of the side plate 8 on the insertion side, and is rotatably installed in the insertion hole 9, and a separation preventing ring 10 that is selectively positioned inside and outside the side plate. The release groove 11 and the control groove 12 which are formed so as to communicate with the insertion hole 9 and into which the lower end of the separation preventing ring is fitted, and the insertion hole 9 formed in the side plate are installed in the upper insertion hole and are detached. It consists of a spring that pushes the prevention ring upward.

しかしながら、前記ウェーハ運搬装置は、ウェーハが離脱することを予防する効果があるものの、構造が複雑で多くの製造費用がかかるばかりでなく、使用時別途の操作過程、即ち、前記離脱防止環１０を前記挿入孔９に移動及び回転させた後、前記制御溝１２に嵌め込まなければならない複雑な過程が必要であった。   However, although the wafer transport device has an effect of preventing the wafer from being detached, the structure is complicated and a lot of manufacturing costs are required, and a separate operation process at the time of use, that is, the separation prevention ring 10 is provided. After moving and rotating into the insertion hole 9, a complicated process that must be fitted into the control groove 12 is required.

大韓民国登録実用新案第１２１６４２号公報Republic of Korea Registered Utility Model No. 121642

本発明は上記のような従来技術の問題点を解決するために案出されたもので、ウェーハ挿入溝の開閉のための離脱防止装置の位置を変更するための手段が備えられることで、単純な操作だけでもウェーハ運搬時にその離脱を防止することのできるウェーハ運搬装置を提供することにその目的がある。   The present invention has been devised to solve the above-mentioned problems of the prior art, and is simply provided with means for changing the position of the separation preventing device for opening and closing the wafer insertion groove. It is an object of the present invention to provide a wafer transport apparatus that can prevent the wafer from being detached when transporting the wafer by simple operation.

他の目的として、ウェーハが収容されたウェーハ運搬装置を移動させるために、前記運搬装置の上部に位置した取っ手を持つだけでも自然に前記離脱防止装置の位置を変更して、前記ウェーハ挿入溝を閉鎖させることのできるウェーハ運搬装置を提供することにある。   As another object, in order to move the wafer transfer device in which the wafer is accommodated, the position of the separation prevention device can be naturally changed by simply holding the handle located at the upper portion of the transfer device, and the wafer insertion groove can be formed. An object of the present invention is to provide a wafer conveyance device that can be closed.

また他の目的として、構成が簡単で製作費用が最小化され、既存のウェーハ運搬装置にも適用することのできるウェーハ運搬装置を提供することにある。   It is another object of the present invention to provide a wafer conveyance device that has a simple configuration, minimizes manufacturing costs, and can be applied to existing wafer conveyance devices.

上記目的を達成するために、本発明に係るウェーハ運搬装置は、内部の側面に複数のウェーハ挿入溝が形成されており、前面にウェーハの出入が可能なように開口部が形成された本体と、前記本体の前面に上下に移動可能に装着され、前記挿入溝との相対的な位置が異なるようにすることで、前記挿入溝を開閉させるための離脱防止装置と、前記離脱防止装置に連結されて、前記挿入溝に対する前記離脱防止装置の相対的な位置を変更させる手段とを含むことを特徴とする。   In order to achieve the above object, a wafer conveyance device according to the present invention includes a main body having a plurality of wafer insertion grooves formed on an inner side surface and an opening formed on the front surface so that a wafer can be taken in and out. A detachment prevention device for opening and closing the insertion groove by being mounted on the front surface of the main body so as to be movable up and down and having a different relative position to the insertion groove, and connected to the detachment prevention device And means for changing a relative position of the separation preventing device with respect to the insertion groove.

前記変更手段として、ボタン及び前記ボタンの動きによって前記離脱防止装置の位置を変更させるメカニズムを含むことが好ましい。   Preferably, the changing means includes a button and a mechanism for changing the position of the detachment preventing device by movement of the button.

本発明のウェーハ運搬装置は、前記本体の上部に形成された取っ手をさらに含み、前記ボタンは前記取っ手に位置することが好ましい。   The wafer conveyance device of the present invention preferably further includes a handle formed on an upper portion of the main body, and the button is located on the handle.

前記変更手段の前記位置変更メカニズムは、前記ボタンと前記離脱防止装置とを連結する連結口、及び前記ウェーハ挿入溝が開放されるように、前記離脱防止装置の相対的な位置を維持させるためのスプリングを含むことが好ましい。   The position changing mechanism of the changing means is for maintaining a relative position of the separation preventing device so that the connection port connecting the button and the separation preventing device and the wafer insertion groove are opened. It is preferable to include a spring.

前記離脱防止装置は、前記ウェーハ挿入溝が開放された状態となるように前記スプリングによってその位置が維持され、前記ボタンが押される間には、前記連結口を介してその位置が変わることで、前記ウェーハ挿入溝を閉鎖させることが好ましい。   The position of the separation preventing device is maintained by the spring so that the wafer insertion groove is opened, and the position is changed through the connection port while the button is pressed. The wafer insertion groove is preferably closed.

前記離脱防止装置は、前記挿入溝が形成された前記本体の内部側面の側端面と実質的に同一の形状を有することが好ましい。   The separation preventing device preferably has substantially the same shape as a side end surface of the inner side surface of the main body in which the insertion groove is formed.

前記離脱防止装置は、複数の梯形の突出部を有することが好ましい。   The separation preventing device preferably has a plurality of trapezoidal protrusions.

本発明のウェーハ運搬装置は、単純な操作だけによってもウェーハ運搬時にその離脱を防止することができ、例えば、ウェーハが収容されたウェーハ運搬装置を移動させるために、前記運搬装置の上部に位置した取っ手を持つだけでも前記ウェーハ挿入溝を閉鎖させ、ウェーハの離脱を防止することができる。   The wafer conveyance device of the present invention can prevent the wafer from being detached during simple wafer operation, for example, in order to move the wafer conveyance device in which the wafer is accommodated. Even with the handle, the wafer insertion groove can be closed to prevent the wafer from being detached.

また、本発明のウェーハ運搬装置は、その構成が簡単で製作費用が最小化され、既存のウェーハ運搬装置にも適用することができるという長所がある。   In addition, the wafer conveyance device of the present invention has an advantage that its configuration is simple, the manufacturing cost is minimized, and it can be applied to an existing wafer conveyance device.

以下、本発明の好適な実施の形態について、添付の図面に基づいて詳細に説明する。   DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described in detail with reference to the accompanying drawings.

図２は本発明に係るウェーハ運搬装置の斜視図である。図面を参照してその構成を説明すると、内部の側面に多数のウェーハ挿入溝が形成されており、前面にウェーハの出入が可能なように開口部が形成された本体１００、前記本体１００の前面に上下に移動可能に装着され、前記挿入溝との相対的な位置が異なるようにすることで、前記挿入溝を開閉させるための離脱防止装置１２０、及び前記離脱防止装置１２０に連結されて、前記挿入溝に対する前記離脱防止装置１２０の相対的な位置を変更させる手段を備えてなる。   FIG. 2 is a perspective view of the wafer conveyance device according to the present invention. The structure will be described with reference to the drawings. A main body 100 in which a large number of wafer insertion grooves are formed on the inner side surface and an opening is formed on the front surface so that a wafer can be taken in and out, and the front surface of the main body 100. The detachment prevention device 120 for opening and closing the insertion groove and the detachment prevention device 120 are connected to the insertion groove so that the position relative to the insertion groove is different. Means for changing the relative position of the detachment preventing device 120 with respect to the insertion groove is provided.

本発明の好適な実施の形態によるウェーハ運搬装置は、前記位置変更手段としてボタン１３０、前記ボタン１３０の動きによって前記離脱防止装置１２０の位置が変更するようにこれらを連結させる連結口１４０（図３及び図４に示す）、及び前記ウェーハ挿入溝が開放状態で維持されるように、前記離脱防止装置１２０の相対的な位置を維持させるためのスプリング１５０を含む。   The wafer conveyance device according to a preferred embodiment of the present invention includes a button 130 as the position changing means, and a connection port 140 (FIG. 3) for connecting them so that the position of the separation preventing device 120 is changed by the movement of the button 130. And a spring 150 for maintaining the relative position of the separation preventing device 120 so that the wafer insertion groove is maintained in an open state.

本発明の好適な実施の形態において、前記スプリング１５０は、前記本体１００の下端に位置して、前記離脱防止装置１２０に連結されているが、前記本体１００の上端に位置しても良い。また、前記本体１００の上部には取っ手１１０が形成されており、前記ボタン１３０が前記取っ手１１０の下部に装着されている。使用上の便宜のため、前記ボタン１３０は前記取っ手１１０の何れの部分にも装着され得ることは勿論である。   In the preferred embodiment of the present invention, the spring 150 is located at the lower end of the main body 100 and connected to the separation preventing device 120, but may be located at the upper end of the main body 100. A handle 110 is formed on the upper portion of the main body 100, and the button 130 is attached to the lower portion of the handle 110. Of course, the button 130 may be attached to any part of the handle 110 for convenience of use.

一方、本発明の好適な実施の形態による前記離脱防止装置１２０は、前記挿入溝が形成された前記本体１００の側面の側端面と実質的に同一の形状を有する。即ち、前記離脱防止装置１２０は、多数の梯形の突出部１２１（図３及び図４に示す）を含む。   Meanwhile, the detachment preventing device 120 according to a preferred embodiment of the present invention has substantially the same shape as the side end surface of the side surface of the main body 100 in which the insertion groove is formed. That is, the separation preventing device 120 includes a number of trapezoidal protrusions 121 (shown in FIGS. 3 and 4).

図３は本発明に係るウェーハ運搬装置の平常時の状態を示す作動状態図で、図４は本発明に係るウェーハ運搬装置の運搬時の状態を示す作動状態図である。   FIG. 3 is an operation state diagram showing a normal state of the wafer conveyance device according to the present invention, and FIG. 4 is an operation state diagram showing a state during conveyance of the wafer conveyance device according to the present invention.

図３を参照して説明すると、前記離脱防止装置１２０が前記スプリング１５０によって下降した状態である。拡大した部分を見てみると、前記離脱防止装置１２０の突出部１２１と、前記ウェーハ挿入溝の山１０１とが重なっており、前記ウェーハ挿入溝が開放された状態で維持されている。この際、ウェーハ１０２の挿入／搬出が可能となる。   Referring to FIG. 3, the separation preventing device 120 is lowered by the spring 150. Looking at the enlarged portion, the protrusion 121 of the separation preventing device 120 and the crest 101 of the wafer insertion groove overlap, and the wafer insertion groove is maintained in an open state. At this time, the wafer 102 can be inserted / unloaded.

図４を参照して説明すると、ユーザーが前記取っ手１１０を取り、本発明のウェーハ運搬装置を運搬する状態である。前記取っ手１１０の下部には前記ボタン１３０が位置しており、ユーザーが前記取っ手１１０を取ってウェーハ運搬装置を運搬する場合、前記ボタン１３０に力が加えられつつ押される。前記ボタン１３０が押される間、前記連結口１４０を介して前記離脱防止装置１２０が上昇する。このために通常的な機械的メカニズムが用いられる。   Referring to FIG. 4, the user takes the handle 110 and transports the wafer transport apparatus of the present invention. The button 130 is positioned below the handle 110, and when the user takes the handle 110 and carries the wafer transfer device, the button 130 is pressed with force applied. While the button 130 is pressed, the separation preventing device 120 is raised through the connection port 140. A conventional mechanical mechanism is used for this purpose.

拡大した部分を見てみると、前記離脱防止装置１２０の前記突出部１２１が前記ウェーハ挿入溝の山１０１とずれて位置し、前記ウェーハ挿入溝を閉鎖させる。従って、内部に挿入されたウェーハ１０２は前記ウェーハ運搬装置の外部に離脱しなくなる。   Looking at the enlarged portion, the protruding portion 121 of the separation preventing device 120 is positioned so as to be shifted from the crest 101 of the wafer insertion groove, and the wafer insertion groove is closed. Accordingly, the wafer 102 inserted inside does not leave the outside of the wafer conveyance device.

運搬が完了して、前記ウェーハ運搬装置を下ろしながら前記取っ手１１０から手を離すと、前記離脱防止装置１２０がそれに連結されたスプリング１５０の復元力によって下降し、これによって前記ウェーハ挿入溝は開放され、ウェーハ１０２の挿入／搬出が再び可能となる。   When the transportation is completed and the hand is released from the handle 110 while lowering the wafer transportation device, the separation prevention device 120 is lowered by the restoring force of the spring 150 connected thereto, thereby opening the wafer insertion groove. The wafer 102 can be inserted / unloaded again.

従来技術に係るウェーハ運搬装置の分解斜視図である。It is a disassembled perspective view of the wafer conveyance apparatus which concerns on a prior art. 本発明に係るウェーハ運搬装置の斜視図である。It is a perspective view of the wafer conveyance apparatus which concerns on this invention. 本発明に係るウェーハ運搬装置の平常時の状態を示す作動状態図である。It is an operation state figure which shows the normal state of the wafer conveyance apparatus which concerns on this invention. 本発明に係るウェーハ運搬装置の運搬時の状態を示す作動状態図である。It is an operation state figure showing the state at the time of conveyance of the wafer conveyance device concerning the present invention.

符号の説明Explanation of symbols

１００ 本体
１０１ ウェーハ挿入溝の山
１０２ ウェーハ
１１０ 取っ手
１２０ 離脱防止装置
１３０ ボタン
１４０ 連結口 DESCRIPTION OF SYMBOLS 100 Main body 101 Wafer insertion groove crest 102 Wafer 110 Handle 120 Detachment prevention device 130 Button 140 Connection port

Claims (7)

ウェーハ運搬装置において、
内部の側面に複数のウェーハ挿入溝が形成されており、前面にウェーハの出入が可能なように開口部が形成された本体と、
前記本体の前面に上下に移動可能に装着され、前記挿入溝との相対的な位置が異なるようにすることで、前記挿入溝を開閉させるための離脱防止装置と、
前記離脱防止装置に連結されて、前記挿入溝に対する前記離脱防止装置の相対的な位置を変更させる手段と
を含むことを特徴とするウェーハ運搬装置。 In wafer transport equipment,
A plurality of wafer insertion grooves are formed on the inner side surface, and a main body having an opening formed on the front surface so that the wafer can be taken in and out,
A detachment prevention device for opening and closing the insertion groove by being mounted on the front surface of the main body so as to be movable up and down, and by making the relative position of the insertion groove different.
And a means for changing the relative position of the separation preventing device with respect to the insertion groove. 前記変更手段は、ボタン及び前記ボタンの動きによって前記離脱防止装置の位置を変更させるメカニズムを含むことを特徴とする請求項１に記載のウェーハ運搬装置。   The wafer transfer apparatus according to claim 1, wherein the changing unit includes a button and a mechanism for changing a position of the detachment preventing apparatus by movement of the button. 前記本体の上部に形成された取っ手をさらに含み、前記ボタンは前記取っ手に位置することを特徴とする請求項２に記載のウェーハ運搬装置。   The wafer conveyance device according to claim 2, further comprising a handle formed on an upper portion of the main body, wherein the button is located on the handle. 前記変更手段の前記メカニズムは、前記ボタンと前記離脱防止装置とを連結する連結口、及び前記ウェーハ挿入溝が開放されるように、前記離脱防止装置の相対的な位置を維持させるためのスプリングを含むことを特徴とする請求項２に記載のウェーハ運搬装置。   The mechanism of the changing means includes a connection port for connecting the button and the separation preventing device, and a spring for maintaining a relative position of the separation preventing device so that the wafer insertion groove is opened. The wafer conveyance device according to claim 2, wherein the wafer conveyance device is included. 前記離脱防止装置は、前記ウェーハ挿入溝が開放された状態となるように前記スプリングによってその位置が維持され、前記ボタンが押される間には、前記連結口を介してその位置が変わることで、前記ウェーハ挿入溝を閉鎖させることを特徴とする請求項４に記載のウェーハ運搬装置。   The position of the separation preventing device is maintained by the spring so that the wafer insertion groove is opened, and the position is changed through the connection port while the button is pressed. The wafer conveyance device according to claim 4, wherein the wafer insertion groove is closed. 前記離脱防止装置は、前記挿入溝が形成された前記本体の内部側面の側端面と実質的に同一の形状を有することを特徴とする請求項１乃至５の何れかに記載のウェーハ運搬装置。   6. The wafer conveyance device according to claim 1, wherein the separation preventing device has substantially the same shape as a side end surface of an inner side surface of the main body in which the insertion groove is formed. 前記離脱防止装置は、複数の梯形の突出部を有することを特徴とする請求項１乃至５の何れかに記載のウェーハ運搬装置。   6. The wafer conveyance device according to claim 1, wherein the separation preventing device has a plurality of trapezoidal protrusions.
JP2005234778A 2004-08-16 2005-08-12 Wafer carrying device Pending JP2006060213A (en)

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US7500564B2 (en) 2009-03-10

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