JP2000100921A - Semiconductor substrate carrier and manufacturing semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a semiconductor substrate from sliding out, hitting the floor and being broken if a pickup hole of a semiconductor substrate carrier is directed to the floor by a mistake by inserting/taking out the semiconductor substrate in the semiconductor substrate carrier only when the semiconductor substrate carrier is mounted on a manufacturing apparatus. SOLUTION: When a semiconductor substrate carrier 1 is set in a semiconductor manufacturing apparatus, part of a stopper 3 out of the bottom is pushed up and a valley of the stopper 3 comes to a valley between guides 7. Only when the semiconductor substrate carrier 1 is set in the semiconductor manufacturing apparatus, a semiconductor substrate 11 held in the semiconductor substrate carrier 1 can be taken in/out. If a pickup hole of the semiconductor substrate carrier 1 is directed to the floor by a mistake during handling of the semiconductor substrate carrier 1, the semiconductor substrate 11 is slid out to hit the stopper 3 and stop, thereby preventing it from getting out to hit the floor and being broken.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a semiconductor substrate carrier used for transporting and storing semiconductor substrates.

[0002]

2. Description of the Related Art FIG.

[0003] The structure of the semiconductor substrate carrier is such that the semiconductor substrates 11 are opposed to each other in the semiconductor substrate carrier 1 so that they do not touch each other in the semiconductor substrate carrier 1.
The semiconductor substrates are inserted one by one in parallel so that the outer peripheral portion of the semiconductor substrate is placed between the upper and lower sides of the comb-shaped guides 7 provided on the surface.

A semiconductor substrate 11 in a semiconductor substrate carrier 1
Is moved in and out by the manufacturing apparatus. At this time, the width between the upper and lower guides must be
Is set sufficiently wide with respect to the thickness of the semiconductor substrate 11, but does not have a structure for fixing the semiconductor substrate 11 inserted between the guides.

[0005] The semiconductor substrate is held in a semiconductor substrate carrier in such a state, and is transported and stored.

[0006]

In the current semiconductor manufacturing apparatus, almost all the semiconductor substrate carriers are set in the manufacturing apparatus and when the processing is started, the manufacturing apparatus takes out the semiconductor substrate in the semiconductor substrate carrier. I have.

At this time, the take-out opening of the semiconductor substrate carrier set in the manufacturing apparatus is oriented in the horizontal direction,
The semiconductor substrate held therein is taken out horizontally and horizontally with respect to the floor.

The semiconductor substrate carrier is transported and set by a worker to a manufacturing apparatus. Usually, the outlet of the semiconductor substrate carrier is transported facing the ceiling.

[0009] However, when the semiconductor substrate carrier is set in the manufacturing apparatus, the take-out port must be directed sideways.

At this time, if the operator inadvertently tilts the semiconductor substrate carrier too much and turns the take-out port toward the floor, the semiconductor substrate held in the semiconductor substrate carrier slides out along the guide. And hits the floor and breaks.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a semiconductor substrate carrier capable of taking in and out a semiconductor substrate only when the semiconductor substrate carrier is mounted on a manufacturing apparatus. There.

[0012]

A semiconductor substrate carrier according to the present invention is characterized in that the semiconductor substrate in the semiconductor substrate carrier can be taken in and out only when the semiconductor substrate carrier is mounted on a manufacturing apparatus.

A method of manufacturing a semiconductor device according to the present invention is characterized in that the semiconductor substrate carrier is used when transporting and storing a semiconductor substrate.

[0014]

FIG. 1 is a front view of an embodiment of the present invention.

The semiconductor substrate carrier 1 has two opposite
A guide 7 is formed in a comb-like shape so as to correspond to the surface.

By inserting the outer peripheral portion of the semiconductor substrate 11 into the facing guide 7 and the valley portion of the guide 7,
Each semiconductor substrate 11 is held in the semiconductor substrate carrier 1 so as not to touch each other.

In the direction opposite to the entrance of the semiconductor substrate,
There is a stop pin 9 which prevents the semiconductor substrate 11 from falling out on the side opposite to the access port.

The shape of the stopper 3 is such that peaks and valleys are arranged on one of the long sides of the stopper 3 in the same manner as the pitch of the guides 7 of the semiconductor substrate carrier 1, and the width of the peaks and valleys is
The dimensions are the same.

The stopper 3 is fitted in the groove provided at the outlet of the semiconductor substrate carrier 1 so as to be able to move up and down.

The groove is provided at a position about 1 cm from the take-out opening so that the stopper 3 does not hit the semiconductor substrate 11 in the semiconductor substrate carrier 1 when the stopper 3 is fitted into the groove.

The stopper 9 fitted into the holding plate 6
And it is held down by the stop plate 8 so as not to come off the groove. The holding plate 6 and the stop plate 8 are attached to the semiconductor substrate carrier 1 by screws 10.

When the stopper 3 is fitted in the groove, a part thereof protrudes from the bottom surface opposite to the surface on which the handle 2 of the semiconductor substrate carrier 1 is mounted.

Further, a portion protruding from the surface of the handle 2 on the opposite side is held by a spring retainer 4.

The portion of the spring 5 protruding from the surface of the stopper 3 on which the handle 2 is mounted passes through the inside, and the spring 3 is held by the shoulder portion where the stopper 3 does not protrude and the spring retainer 4.

For this reason, the stopper 3 is pushed down by the spring 5.

At this time, the peak of the stopper 3 comes to the valley between the guides 7, so that the semiconductor substrate 11 held in the semiconductor substrate carrier 1 is formed.
Can not be put in and out.

The amount of protrusion of the stopper 3 protruding from the bottom surface corresponds to the pitch of the guide of the stopper 3.

When the semiconductor substrate carrier 1 is set in the manufacturing apparatus, the valley portion of the stopper 3 comes to the valley portion between the guides 7 by pushing up the portion of the stopper 3 protruding from the bottom. The semiconductor substrate 11 held in the semiconductor substrate carrier 1
Can be put in and out.

From the above, even when the semiconductor substrate carrier 1 is handled and the entrance is erroneously turned toward the floor, the semiconductor substrate 11 that has slid out comes into contact with the stopper 3 and stops. It can be prevented from jumping out of the outlet and hitting the floor and being damaged.

Further, when the semiconductor carrier 1 is set in the manufacturing apparatus, the stopper 3 is pushed up, so that the semiconductor substrate 11 is not hindered.

Although the present invention has been described with reference to an actual example, the present invention is also effective for carriers other than semiconductor manufacturing as long as the carrier carries and stores substrates.

[0032]

As described above, according to the present invention, the semiconductor substrate in the semiconductor substrate carrier can be taken in and out only when the semiconductor substrate carrier is mounted on the manufacturing apparatus.

When the semiconductor substrate is transported and stored, the semiconductor substrate carrier is used.

Accordingly, in handling the semiconductor substrate carrier, even if the operator inadvertently tilts the semiconductor substrate carrier too much and turns the take-out port toward the floor, the semiconductor held in the semiconductor substrate carrier can be prevented. It is possible to prevent the substrate from sliding out and colliding with the floor to be damaged.

From the above, the present invention is an excellent invention which has a very high safety margin and a very high reliability.

[Brief description of the drawings]

FIG. 1 is a front view of an embodiment of the present invention.

FIG. 2 is a front view of a conventional technique.

[Explanation of symbols]

 Reference Signs List 1 semiconductor substrate carrier 2 handle 3 stopper 4 spring retainer 5 spring 6 retainer plate 7 guide 8 stop plate 9 stop pin 10 screw 11 semiconductor substrate

Claims (2)

[Claims] 1. A semiconductor substrate carrier used when transporting and storing a semiconductor substrate, wherein the semiconductor substrate held in the semiconductor substrate carrier is taken in and out only when the semiconductor substrate carrier is mounted on a semiconductor manufacturing apparatus. A semiconductor substrate carrier characterized in that it can be made. 2. A method of manufacturing a semiconductor device, comprising using the semiconductor substrate carrier according to claim 1 when transporting and storing a semiconductor substrate.