CN109637968B - Wafer anti-drop device - Google Patents
Wafer anti-drop device Download PDFInfo
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- CN109637968B CN109637968B CN201811617047.7A CN201811617047A CN109637968B CN 109637968 B CN109637968 B CN 109637968B CN 201811617047 A CN201811617047 A CN 201811617047A CN 109637968 B CN109637968 B CN 109637968B
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- limiting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a wafer anti-falling device, and relates to the technical field of wafer cleaning equipment. The wafer anti-falling device comprises a wafer box fixing frame, a rotating assembly and a driving assembly; the wafer box fixing frame is used for fixing a wafer to be cleaned; the film box fixing frame is connected to one end of the rotating assembly, and the driving assembly is connected to the other end of the rotating assembly; the driving assembly can drive the rotating assembly to rotate, so that the rotating assembly drives the film box fixing frame to incline, and the rotating assembly controls the baffle part at the opening end of the film box fixing frame to open and close. The problem of wafer damage is solved because the wafer is fixed in the tank type equipment and is easy to separate from the wafer box under the action of self-buoyancy when being cleaned and soaked. The wafer box fixing frame is convenient for placing a wafer into the wafer box fixing frame by driving the rotating assembly through the driving assembly, and the rotating assembly controls the baffle plate part to seal the opening end, so that the position of the wafer is ensured to be firm.
Description
Technical Field
The invention relates to the technical field of wafer cleaning equipment, in particular to a wafer anti-falling device.
Background
Wafers are used as basic materials for manufacturing semiconductor chips, and play an important role in the development of the semiconductor industry. The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and various circuit element structures can be processed and manufactured on the silicon wafer to form an integrated circuit product with characteristic electrical functions.
In the process of manufacturing the semiconductor wafer, in order to improve the production efficiency and save the labor cost, full-automatic cleaning equipment is adopted to clean the wafer. In the whole wafer cleaning process, a manipulator is mainly used for grabbing the wafer so as to transmit the wafer.
In the prior art, before the wafer is cleaned, the wafer is usually cleaned and soaked by groove type equipment, and because the weight of the wafer is light, when the wafer is soaked in a solution, the wafer can be separated from a wafer box due to the buoyancy of the wafer, and even the wafer can fall out of the wafer box, the wafer is damaged, and the cost of the wafer is high, so that great loss can be caused.
Disclosure of Invention
The invention aims to provide a wafer anti-falling device, which aims to solve the technical problem that wafers are fixed in a groove type device and are easy to separate from a wafer box under the action of self-buoyancy when being cleaned and soaked, so that the wafers are damaged in the prior art.
The invention provides a wafer anti-falling device, which comprises a wafer box fixing frame, a rotating assembly and a driving assembly, wherein the wafer box fixing frame is provided with a plurality of fixing holes;
the wafer box fixing frame is used for fixing a wafer to be cleaned;
the film box fixing frame is connected to one end of the rotating assembly, and the driving assembly is connected to the other end of the rotating assembly;
the driving assembly can drive the rotating assembly to rotate, so that the rotating assembly drives the film box fixing frame to incline, and the rotating assembly controls the baffle part at the opening end of the film box fixing frame to open and close.
Further, the wafer box fixing frame comprises a wafer fixing frame and a wafer end limiting frame;
the wafer fixing frame is used for mounting a wafer to be cleaned, and the baffle part is connected to the opening end of the wafer fixing frame;
the wafer end limiting frame is connected to the end face of the wafer fixing frame corresponding to the opening end.
Furthermore, the inner peripheral wall of the wafer fixing frame is provided with a first limiting groove and a second limiting groove, the first limiting groove is used for fixing small-sized wafers, and the second limiting groove is used for fixing large-sized wafers.
Furthermore, the wafer end limiting frame comprises a first limiting portion and a second limiting portion, the first limiting portion is connected with the second limiting portion, the first limiting portion is arranged on the end face of the first limiting groove, and the second limiting portion is arranged on the end face of the second limiting groove.
Further, the baffle part comprises a first rotating bearing frame, a first baffle, a second rotating bearing frame and a second baffle;
the first rotating bearing frame is connected to one side of the opening end, and the first baffle plate is connected to the first rotating bearing frame;
the second rotating bearing frame is connected to the other side of the opening end, and the second baffle plate is connected to the second rotating bearing frame;
the first rotating bearing frame and the second rotating bearing frame are respectively connected to two ends of the rotating assembly.
Furthermore, the rotating assembly comprises a sliding part, a baffle push rod, a rotating part, an inclined connecting frame and a wafer box limiting frame;
the sliding part is connected to the output end of the driving assembly, the sliding part is connected to the baffle push rod, the baffle push rod is connected to the inclined connecting frame through the rotating part, the inclined connecting frame is connected to the wafer fixing frame, and the first rotating bearing frame and the second rotating bearing frame are respectively connected with the rotating part;
the inclined connecting frame is connected to one end of the wafer box limiting frame, and the other end of the wafer box limiting frame is connected to the driving assembly.
Further, the sliding part comprises a sliding block, a guide shaft and a sliding block limiting plate;
the sliding block is connected to the output end of the driving assembly and is connected to the baffle push rod;
the number of the guide shafts is two, and the outer side ends of the two guide shafts are respectively and fixedly connected to the slide block limiting plate; the side surface of the sliding block is provided with two limiting holes, and the inner side ends of the two guide shafts are respectively connected in the two limiting holes in a sliding manner.
Further, the rotating part comprises a first connecting rod, a first baffle rotating arm, a second connecting rod and a second baffle rotating arm;
the outer side end of the first connecting rod is connected with one end of the baffle push rod, the inner side end of the first connecting rod is connected with a first baffle rotating arm, and the first baffle rotating arm is connected with a first rotating bearing frame;
the outer side end of the second connecting rod is connected with the other end of the baffle push rod, the inner side end of the second connecting rod is connected with the second baffle rotating arm, and the second baffle rotating arm is connected with the second rotating bearing frame.
Further, the driving assembly comprises a cylinder fixing plate, a cylinder, a driving rod and a fixing rod;
the air cylinder fixing plate is used for being connected to the electric actuator, the air cylinder is connected to the air cylinder fixing plate, one end of the driving rod is connected with the output end of the air cylinder, and the other end of the driving rod is connected to the sliding block;
the dead lever cup joints in the outside of actuating lever, and the spacing frame of spool box is connected on the dead lever.
Further, the cylinder is connected with the cylinder connecting plate, and the one end and the cylinder connecting plate of actuating lever are connected.
The wafer anti-drop device provided by the invention is characterized in that a wafer box fixing frame is internally used for fixing a wafer to be cleaned so as to fix the position of the wafer; the film box fixing frame is connected to one end of the rotating assembly so as to fix one end of the rotating assembly, and the driving assembly is connected to the other end of the rotating assembly so as to fix the other end of the rotating assembly; when the driving component is started, the rotating component can be driven to rotate, so that the rotating component can drive the wafer box fixing frame to be in an inclined state, and wafers can be conveniently placed in the wafer box fixing frame; and the rotating assembly can also control the opening and closing of the baffle part of the opening end of the wafer box fixing frame, so that after the wafer is placed into the wafer box fixing frame, the opening end is closed by the baffle part, the position of the wafer is fixed, and the position of the wafer is firmly fixed.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic structural diagram of a wafer anti-drop device according to an embodiment of the present invention;
FIG. 2 is an enlarged view of portion A of FIG. 1;
FIG. 3 is an enlarged view of portion B of FIG. 1;
FIG. 4 is a front view of the wafer anti-drop apparatus according to the embodiment of the present invention;
fig. 5 is a schematic structural view of the front side of a wafer holder according to an embodiment of the present invention;
fig. 6 is a schematic structural view of a rear side of a wafer holder according to an embodiment of the present invention;
fig. 7 is a front view of the backside of a wafer holder according to an embodiment of the present invention.
Icon: 100-cassette holder; 200-a rotating assembly; 300-a drive assembly; 101-open end; 102-a baffle portion; 103-wafer holder; 104-wafer end limiting frame; 105-a first limiting groove; 106-a second limiting groove; 107-a first limiting part; 108-a second stop; 109-a first rotating bearing frame; 110-a first baffle; 111-a second rotating bearing frame; 112-a second baffle; 201-a sliding part; 202-baffle push rod; 203-a rotating part; 204-oblique connecting frame; 205-a wafer cassette limit shelf; 206-a slider; 207-guide shaft; 208-a slide block limiting plate; 209-a first link; 210-a first flipper tumbler; 211-a second link; 212-second baffle tumbler; 301-cylinder fixing plate; 302-a cylinder; 303-a drive rod; 304-a fixation rod; 305-cylinder connection plate.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Fig. 1 is a schematic structural diagram of a wafer anti-drop device according to an embodiment of the present invention; FIG. 2 is an enlarged view of portion A of FIG. 1; FIG. 3 is an enlarged view of portion B of FIG. 1; fig. 4 is a front view of the wafer anti-drop apparatus according to the embodiment of the present invention.
As shown in fig. 1 to 4, the wafer falling off prevention apparatus provided by the present invention comprises a wafer cassette holder 100, a rotation assembly 200 and a driving assembly 300;
the wafer box fixing frame 100 is used for fixing a wafer to be cleaned;
the film box fixing frame 100 is connected with one end of the rotating assembly 200, and the driving assembly 300 is connected with the other end of the rotating assembly 200;
the driving assembly 300 can drive the rotating assembly 200 to rotate, so that the rotating assembly 200 drives the cassette holder 100 to incline, and the rotating assembly 200 controls the opening and closing of the baffle portion 102 of the opening end 101 of the cassette holder 100.
In fig. 1, a cassette holder 100 is used for holding a wafer to be cleaned, so as to fix the position of the wafer.
The cassette holder 100 is connected to the lower end of the rotating assembly 200, and the driving assembly 300 is connected to the upper end of the rotating assembly 200, so that the cassette holder 100 and the driving assembly 300 are connected by the rotating assembly 200.
In one embodiment of the present invention, the driving assembly 300 is started, the driving assembly 300 moves downward and drives the rotating assembly 200 to rotate, the rotating assembly 200 drives the cassette holder 100 to rotate, the baffle portion 102 opens the open end 101 of the cassette holder 100, the driving assembly 300 stops, and at this time, the bottom surface of the cassette holder 100 is horizontally arranged; wafers to be cleaned are sequentially placed into a wafer box fixing frame 100 along an opening end 101; after the wafer is placed, the driving assembly 300 is started again, the driving assembly 300 moves upwards, the driving assembly 300 drives the rotating assembly 200 to rotate, the rotating assembly 200 drives the wafer box fixing frame 100 to rotate, a certain included angle is formed between the bottom surface of the wafer box fixing frame 100 and the horizontal plane, meanwhile, the rotating assembly 200 drives the baffle portion 102 to close the opening end 101, the fixing process of the wafer is completed, and the connection position of the wafer is ensured to be stable.
Fig. 5 is a schematic structural view of the front side of a wafer holder according to an embodiment of the present invention; fig. 6 is a schematic structural view of a rear side of a wafer holder according to an embodiment of the present invention; fig. 7 is a front view of the backside of a wafer holder according to an embodiment of the present invention.
As shown in fig. 5-7, further, the cassette holder 100 includes a wafer holder 103 and a wafer end stop 104;
the wafer fixing frame 103 is used for mounting a wafer to be cleaned, and the baffle part 102 is connected with the opening end 101 of the wafer fixing frame 103;
the wafer end limiting frame 104 is connected to the end surface of the wafer fixing frame 103 corresponding to the opening end 101.
In fig. 5, the wafer fixing frame 103 is a n-shaped frame, and the wafer is mounted on an inner side surface of the n-shaped frame such that left and right sides of the wafer are respectively engaged with left and right sides of the n-shaped frame.
The front end of the II-shaped frame is an open end 101, so that wafers can be conveniently placed into the II-shaped frame along the open end 101.
Spacing frame 104 of wafer tip is connected at the rear end of II shape frame to it is fixed to utilize spacing frame 104 of wafer tip to carry out the butt to the rear end of wafer, avoids the wafer along the rear end roll-off of II shape frame.
Further, the inner peripheral wall of the wafer holder 103 is provided with a first retaining groove 105 and a second retaining groove 106, the first retaining groove 105 is used for fixing small-sized wafers, and the second retaining groove 106 is used for fixing large-sized wafers.
In fig. 6, a first limiting groove 105 is formed at the upper end of the inner peripheral wall of the wafer holder 103, the first limiting groove 105 is a plurality of elongated grooves formed on the inner peripheral wall of the wafer holder 103, the plurality of elongated grooves are symmetrically arranged on the left and right sides of the upper portion of the inner peripheral wall of the wafer holder 103, and the symmetrically arranged elongated grooves are used for clamping and fixing the left and right sides of the wafer.
The distance between the elongated grooves on the left and right sides of the upper part of the inner peripheral wall of the wafer fixing frame 103 is short, and the wafer fixing frame is suitable for clamping small-size wafers with short length.
In fig. 6, a second limiting groove 106 is formed at the lower end of the inner peripheral wall of the wafer holder 103, the second limiting groove 106 is a plurality of elongated grooves formed on the inner peripheral wall of the wafer holder 103, the plurality of elongated grooves are symmetrically arranged on the left and right sides of the lower portion of the inner peripheral wall of the wafer holder 103, and the symmetrically arranged elongated grooves are used for clamping and fixing the left and right sides of the wafer.
The distance between the elongated grooves on the left and right sides of the lower part of the inner peripheral wall of the wafer fixing frame 103 is longer, and the wafer fixing frame is suitable for clamping large-size wafers with longer length.
The upper part of the inner peripheral wall of the wafer fixing frame 103 is clamped with the wafer with smaller size, and the lower part of the inner peripheral wall of the wafer fixing frame 103 is clamped with the wafer with larger size, so that the whole wafer fixing frame 103 can be simultaneously clamped with the wafer with smaller size and larger size, and the use mode is flexible.
Compared with the prior art, the manipulator is adopted to grab the wafers with different sizes, the size of the manipulator needs to be continuously adjusted, the size of the manipulator is inconvenient to adjust, and the operation is laborious; and the wafers are fixed in the groove type equipment, the groove type equipment has the same size, the wafers with different sizes cannot be clamped simultaneously, and the use is inconvenient. The wafer fixing frame 103 can fix wafers of different sizes at the same time, and fixing efficiency of the wafers is improved.
Further, the wafer end limiting frame 104 includes a first limiting portion 107 and a second limiting portion 108, the first limiting portion 107 is connected to the second limiting portion 108, the first limiting portion 107 is disposed on an end surface of the first limiting groove 105, and the second limiting portion 108 is disposed on an end surface of the second limiting groove 106.
In fig. 6, the second limiting portion 108 includes an upper connecting plate at an upper end, a lower connecting plate at a lower end, and two longer connecting columns on a side surface, the upper connecting plate is connected to the rear end of the upper end surface of the wafer fixing frame 103, two ends of the lower connecting plate are respectively connected to the left and right sides of the wafer fixing frame 103, the upper ends of the two connecting columns are connected to the upper connecting plate, and the lower ends of the two connecting columns are connected to the lower connecting plate; when the wafer fixing frame is used, the two connecting columns are abutted against the rear side of the wafer in the second limiting groove 106, so that the wafer is prevented from sliding out along the rear end of the wafer fixing frame 103.
The first position-limiting portion 107 is disposed inside the second position-limiting portion 108, so that the rear end of the wafer with smaller size can be limited in the first position-limiting portion 107, and the rear end of the wafer with larger size can be limited in the second position-limiting portion 108.
Further, the baffle plate portion 102 includes a first rotating bearing frame 109, a first baffle plate 110, a second rotating bearing frame 111, and a second baffle plate 112;
a first rotating bearing bracket 109 is connected to one side of the opening end 101, and a first baffle plate 110 is connected to the first rotating bearing bracket 109;
the second rotating bearing bracket 111 is connected to the other side of the open end 101, and the second baffle plate 112 is connected to the second rotating bearing bracket 111;
the first rotating bearing bracket 109 and the second rotating bearing bracket 111 are respectively connected to two ends of the rotating assembly 200.
In fig. 4, the first rotating bearing frame 109 is a left rotating bearing frame, the lower end of the left rotating bearing frame is connected with a left bearing seat, the first baffle 110 is a left baffle, and the left baffle is connected with the left bearing seat.
The second rotating bearing frame 111 is a right rotating bearing frame, the lower end of the right rotating bearing frame is connected with a right bearing seat, the second baffle plate 112 is a right baffle plate, and the right baffle plate is connected with the right bearing seat.
The left rotary bearing frame is connected to the left end of the rotary component 200, and the left baffle plate is connected to the left side of the opening end 101; the right rotary bearing frame is connected to the right end of the rotary assembly 200, and the right baffle is connected to the right side of the opening end 101; when the rotating assembly 200 rotates, the left baffle and the right baffle can be driven to open the open end 101 through the left rotating bearing frame and the right rotating bearing frame respectively, or the left baffle and the right baffle can be driven to close the open end 101 through the left rotating bearing frame and the right rotating bearing frame respectively.
Further, the rotating assembly 200 comprises a sliding part 201, a baffle push rod 202, a rotating part 203, an inclined connecting frame 204 and a cassette limiting frame 205;
the sliding part 201 is connected with the output end of the driving assembly 300, the sliding part 201 is connected with the baffle push rod 202, the baffle push rod 202 is connected with the inclined connecting frame 204 through the rotating part 203, the inclined connecting frame 204 is connected with the wafer fixing frame 103, and the first rotating bearing frame 109 and the second rotating bearing frame 111 are respectively connected with the rotating part 203;
one end of the cassette holder 205 is connected to the inclined connecting frame 204, and the other end of the cassette holder 205 is connected to the driving assembly 300.
In fig. 1, the sliding portion 201 is connected to an output end of the lower end of the driving unit 300 by an inverting connecting shaft so that the driving unit 300 can rotate around the lower end as a rotation center when it is started.
The number of the rotation portions 203 is two.
The sliding part 201 is connected with the baffle push rod 202 in a sliding way, the left end of the baffle push rod 202 is connected with the left end of the inclined connecting frame 204 through the rotating part 203 at the left end, and the right end of the baffle push rod 202 is connected with the right end of the inclined connecting frame 204 through the rotating part 203 at the right end.
The first rotating bracket 109 is connected to the left rotating portion 203, and the second rotating bracket 111 is connected to the right rotating portion 203.
The outer side end of the cassette limiting frame 205 is fixedly connected with the inclined connecting frame 204, the inner side end of the cassette limiting frame 205 is provided with a circular groove, and the lower end of the driving assembly 300 is sleeved in the circular groove, so that the inner side end of the cassette limiting frame 205 is fixedly connected with the lower end of the driving assembly 300.
Further, the sliding portion 201 includes a slider 206, a guide shaft 207, and a slider stopper plate 208;
the slide block 206 is connected to the output end of the driving assembly 300, and the slide block 206 is connected to the baffle push rod 202;
the number of the guide shafts 207 is two, and the outer ends of the two guide shafts 207 are respectively and fixedly connected to the slider limiting plate 208; the side surface of the sliding block 206 is provided with two limiting holes, and the inner side ends of the two guide shafts 207 are respectively connected in the two limiting holes in a sliding manner.
In fig. 2, the upper end of the slider 206 is connected to the output end of the lower end of the driving assembly 300 through an overturning connecting shaft, so that the lower end of the driving assembly 300 and the slider 206 can rotate; the lower end of the sliding block 206 is provided with a through groove which is sleeved on the baffle push rod 202.
When the sliding device is used, the sliding block 206 moves close to the sliding block limiting plate 208, or the sliding block 206 moves away from the sliding block limiting plate 208, so that the inner side ends of the two guide shafts 207 slide along the two limiting holes, and the sliding positions of the two guide shafts 207 are limited by the two limiting holes, so that the sliding position of the sliding block 206 relative to the sliding block limiting plate 208 is limited.
The slider stopper plate 208 defines a maximum distance by which the slider 206 slides outward.
Further, the rotating portion 203 includes a first link 209, a first barrier rotation arm 210, a second link 211, and a second barrier rotation arm 212;
the outer side end of the first connecting rod 209 is connected with one end of the baffle push rod 202, the inner side end of the first connecting rod 209 is connected with a first baffle rotating arm 210, and the first baffle rotating arm 210 is connected with the first rotating bearing frame 109;
the outer end of the second link 211 is connected to the other end of the baffle push rod 202, the inner end of the second link 211 is connected to the second baffle rotating arm 212, and the second baffle rotating arm 212 is connected to the second rotary bearing bracket 111.
In fig. 1, 3, and 6, an outer end of the first link 209 is connected to a left end of the baffle push rod 202, an inner end of the first link 209 is connected to a first baffle pivot arm 210, and the first baffle pivot arm 210 is connected to an upper end of the first swivel bracket 109.
The outer end of the second link 211 is connected to the right end of the baffle push rod 202, the inner end of the second link 211 is connected to the second baffle rotating arm 212, and the second baffle rotating arm 212 is connected to the upper end of the second rotary bearing bracket 111.
In an embodiment of the present invention, when the driving assembly 300 is started, the driving assembly 300 moves downward, the bottom surface of the wafer fixing frame 103 is horizontally disposed, the driving assembly 300 drives the slider 206 to slide along the guiding shaft 207, the slider 206 slides to the slider limiting plate 208, at this time, the slider 206 drives the baffle push rod 202 to slide inward, the left end of the baffle push rod 202 drives the first baffle 110 to open through the first connecting rod 209, the first baffle rotating arm 210 and the first rotating bearing frame 109, meanwhile, the right end of the baffle push rod 202 drives the second baffle 112 to open through the second connecting rod 211, the second baffle rotating arm 212 and the second rotating bearing frame 111, at this time, the open end 101 is opened; wafers of different sizes are sequentially placed into the wafer fixing frame 103 to be fixed, after the wafers are placed, the driving assembly 300 is started again, the driving assembly 300 moves upwards, an acute angle is gradually formed between the bottom surface of the wafer fixing frame 103 and the horizontal plane, the driving assembly 300 slides along the guide shaft 207 through the slider 206, the slider 206 is gradually far away from the slider limiting plate 208, at the moment, the slider 206 drives the baffle push rod 202 to slide outwards, the left end of the baffle push rod 202 drives the first baffle 110 to close through the first connecting rod 209, the first baffle rotating arm 210 and the first rotating bearing frame 109, meanwhile, the right end of the baffle push rod 202 drives the second baffle 112 to close through the second connecting rod 211, the second baffle rotating arm 212 and the second rotating bearing frame 111, at the moment, the opening end 101 is closed, and the wafers can be cleaned and soaked.
Further, the driving assembly 300 includes a cylinder fixing plate 301, a cylinder 302, a driving rod 303, and a fixing rod 304;
the air cylinder fixing plate 301 is used for being connected to an electric actuator, the air cylinder 302 is connected to the air cylinder fixing plate 301, one end of the driving rod 303 is connected with the output end of the air cylinder 302, and the other end of the driving rod 303 is connected to the sliding block 206;
the fixing rod 304 is sleeved outside the driving rod 303, and the cassette limiting frame 205 is connected to the fixing rod 304.
In fig. 1, the cylinder fixing plate 301 is a rectangular plate, and the left end of the cylinder fixing plate 301 is connected to the electric actuator, so that the electric actuator can drive the left end of the cylinder fixing plate 301 to move along the vertical direction.
The cylinder 302 is bolted to the upper right end of the cylinder fixing plate 301.
The upper end of the driving rod 303 is connected with the output end of the air cylinder 302, and the lower end of the driving rod 303 is connected to the sliding block 206 through a pin shaft.
The fixing rod 304 is a hollow pipe, and the fixing rod 304 is sleeved outside the driving rod 303 so that the driving rod 303 can move in the fixing rod 304 along the vertical direction; the upper end of the fixed rod 304 is connected to the lower end face of the right end of the cylinder fixed plate 301 through a bolt, and the inner side end of the wafer box limiting frame 205 is sleeved at the lower end of the fixed rod 304.
Further, the cylinder 302 is connected to a cylinder connection plate 305, and one end of the driving rod 303 is connected to the cylinder connection plate 305.
In fig. 1, the cylinder connecting plate 305 is a vertically disposed square plate, and the cylinder connecting plate 305 is connected to the cylinder 302 by bolts.
The upper end of the driving rod 303 is connected with a cylinder connecting plate 305 by a pin shaft.
According to the wafer anti-falling device provided by the invention, the inclination speed of the wafer fixing frame 103 is controlled by changing the pressure of the gas in the cylinder 302 according to the process requirements, so that the wafer is stably placed in the wafer fixing frame 103, and the wafer is prevented from sliding and being damaged; the slide block 206 slides along the guide shaft 207 to change the inclination angle of the wafer fixing frame 103, so that the wafer is stably connected in the wafer fixing frame 103; by changing the lengths of the baffle push rod 202 and the two connecting rods, the opening and closing angles of the two baffles at the opening end 101 can be changed, and the wafer can be ensured to be fixed in the wafer fixing frame 103. The invention is mainly applied to the stripping machine, can also be applied to other single-chip automatic cleaning equipment in an expanded way, and has wide application market prospect.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (7)
1. A wafer anti-drop device is characterized by comprising a wafer box fixing frame (100), a rotating assembly (200) and a driving assembly (300);
the wafer box fixing frame (100) is used for fixing a wafer to be cleaned;
the film box fixing frame (100) is connected to one end of the rotating assembly (200), and the driving assembly (300) is connected to the other end of the rotating assembly (200);
the driving assembly (300) can drive the rotating assembly (200) to rotate, so that the rotating assembly (200) drives the magazine fixing frame (100) to incline, and the rotating assembly (200) controls the opening and closing of the baffle part (102) of the opening end (101) of the magazine fixing frame (100);
the wafer box fixing frame (100) comprises a wafer fixing frame (103) and a wafer end limiting frame (104);
the wafer fixing frame (103) is used for mounting a wafer to be cleaned, and the baffle part (102) is connected to the opening end (101) of the wafer fixing frame (103);
the wafer end limiting frame (104) is connected to the end face of the wafer fixing frame (103) corresponding to the opening end (101);
the inner peripheral wall of the wafer fixing frame (103) is provided with a first limiting groove (105) and a second limiting groove (106), the first limiting groove (105) is used for fixing small-sized wafers, and the second limiting groove (106) is used for fixing large-sized wafers;
the wafer end limiting frame (104) comprises a first limiting portion (107) and a second limiting portion (108), the first limiting portion (107) is connected with the second limiting portion (108), the first limiting portion (107) is arranged on the end face of the first limiting groove (105), and the second limiting portion (108) is arranged on the end face of the second limiting groove (106).
2. The wafer dropout prevention apparatus of claim 1, wherein the baffle portion (102) comprises a first rotary bearing bracket (109), a first baffle plate (110), a second rotary bearing bracket (111) and a second baffle plate (112);
the first rotating bearing frame (109) is connected to one side of the opening end (101), and the first baffle plate (110) is connected to the first rotating bearing frame (109);
the second rotating bearing frame (111) is connected to the other side of the opening end (101), and the second baffle plate (112) is connected to the second rotating bearing frame (111);
the first rotating bearing frame (109) and the second rotating bearing frame (111) are respectively connected to two ends of the rotating assembly (200).
3. The wafer anti-drop device according to claim 2, wherein the rotating assembly (200) comprises a sliding part (201), a baffle push rod (202), a rotating part (203), an inclined connecting frame (204) and a wafer box limiting frame (205);
the sliding part (201) is connected to the output end of the driving assembly (300), the sliding part (201) is connected to the baffle push rod (202), the baffle push rod (202) is connected to the inclined connecting frame (204) through the rotating part (203), the inclined connecting frame (204) is connected to the wafer fixing frame (103), and the first rotating bearing frame (109) and the second rotating bearing frame (111) are respectively connected to the rotating part (203);
one end of the wafer box limiting frame (205) is connected with the inclined connecting frame (204), and the other end of the wafer box limiting frame (205) is connected to the driving assembly (300).
4. The wafer dropout prevention apparatus of claim 3, wherein the sliding part (201) comprises a slider (206), a guide shaft (207) and a slider stopper plate (208);
the sliding block (206) is connected to the output end of the driving assembly (300), and the sliding block (206) is connected to the baffle push rod (202);
the number of the guide shafts (207) is two, and the outer side ends of the two guide shafts (207) are respectively and fixedly connected to the slide block limiting plate (208); the side surface of the sliding block (206) is provided with two limiting holes, and the inner side ends of the two guide shafts (207) are respectively connected in the two limiting holes in a sliding manner.
5. The wafer dropout prevention apparatus of claim 4, wherein the rotation part (203) comprises a first link (209), a first shutter rotational arm (210), a second link (211) and a second shutter rotational arm (212);
the outer side end of the first connecting rod (209) is connected with one end of the baffle push rod (202), the inner side end of the first connecting rod (209) is connected with the first baffle rotating arm (210), and the first baffle rotating arm (210) is connected with the first rotating bearing frame (109);
the outer side end of the second connecting rod (211) is connected with the other end of the baffle push rod (202), the inner side end of the second connecting rod (211) is connected with the second baffle rotating arm (212), and the second baffle rotating arm (212) is connected with the second rotating bearing frame (111).
6. The wafer dropout prevention apparatus of claim 5, wherein the driving assembly (300) comprises a cylinder fixing plate (301), a cylinder (302), a driving rod (303) and a fixing rod (304);
the air cylinder fixing plate (301) is used for being connected to an electric actuator, the air cylinder (302) is connected to the air cylinder fixing plate (301), one end of the driving rod (303) is connected with the output end of the air cylinder (302), and the other end of the driving rod (303) is connected to the sliding block (206);
the fixing rod (304) is sleeved outside the driving rod (303), and the box limiting frame (205) is connected to the fixing rod (304).
7. The wafer fall preventing device according to claim 6, wherein the cylinder (302) is connected with a cylinder connecting plate (305), and one end of the driving rod (303) is connected with the cylinder connecting plate (305).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811617047.7A CN109637968B (en) | 2018-12-27 | 2018-12-27 | Wafer anti-drop device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811617047.7A CN109637968B (en) | 2018-12-27 | 2018-12-27 | Wafer anti-drop device |
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| CN109637968B true CN109637968B (en) | 2020-12-01 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109860087B (en) * | 2019-04-18 | 2020-11-24 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer box suspension mechanism |
| CN110379733A (en) * | 2019-06-03 | 2019-10-25 | 厦门通富微电子有限公司 | Remove the cleaning device of photoresist on wafer |
| CN112750737A (en) * | 2021-01-06 | 2021-05-04 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Substrate soaking mechanism and substrate soaking device |
| CN115274514A (en) * | 2022-09-29 | 2022-11-01 | 智程半导体设备科技(昆山)有限公司 | Semiconductor soaking device |
| CN116504687B (en) * | 2023-06-29 | 2023-12-22 | 北京芯士联半导体科技有限公司 | Wafer soaking device of metal stripping machine |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6474734A (en) * | 1987-09-17 | 1989-03-20 | Matsushita Electronics Corp | Semiconductor wafer housing case |
| KR100469169B1 (en) * | 2002-08-14 | 2005-02-02 | 삼성전자주식회사 | Apparatus for bonding stack chip using insulating adhesive tape |
| KR100573896B1 (en) * | 2004-08-16 | 2006-04-26 | 동부일렉트로닉스 주식회사 | Apparatus and method for preventing wafer separation in a carrier box |
| CN103811374B (en) * | 2012-11-06 | 2016-03-23 | 沈阳芯源微电子设备有限公司 | A kind of wafer infuser device |
| CN105336650B (en) * | 2014-08-13 | 2018-05-08 | 北京北方华创微电子装备有限公司 | Film magazine positioner and semiconductor processing equipment |
| CN204481014U (en) * | 2015-02-03 | 2015-07-15 | 北京七星华创电子股份有限公司 | Wafer carrier and annealing device |
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