JP2006057007A - Liquid resin composition for sealing - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid resin composition for sealing which has a low dielectric constant and a small dielectric loss even in a high-frequency region and is also suitable for flip chip sealing. <P>SOLUTION: The resin composition for sealing contains (A) a dihydrobenzoxazine ring-containing compound, (B) one or more kinds of compounds selected from a group consisting of a cyanate ester resin, an oxetane ring-containing compound, a divinylbenzene compound and a vinyl ether compound and (C) a cationic curing catalyst. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a liquid sealing resin composition. More specifically, the present invention relates to a liquid sealing resin composition having a low dielectric constant and suitable for flip chip sealing, and in particular, a liquid sealing resin composition having low dielectric loss even in a high frequency region of 1 GHz or higher. About. Furthermore, this invention relates to the semiconductor device sealed with this resin composition.

  In recent years, there has been a need for miniaturization, high density, and high speed of integrated circuits (ICs) against the backdrop of further miniaturization and high frequency of electronic devices. For this reason, IC sealing is also required that can cope with miniaturization and weight reduction, such as flip chip sealing for directly sealing a semiconductor chip to a circuit board.

  In flip chip sealing, a resin composition for sealing is usually injected from the side into a gap between a connected semiconductor chip and a substrate using a dispenser or the like, but since this gap is generally as narrow as 30 to 100 μm, A fluid liquid sealing resin composition that can be poured is required. As such a liquid sealing resin composition, conventionally, a resin composition containing an epoxy resin and a carboxylic acid anhydride or the like as a curing agent has been used.

  However, the sealing resin composition containing such an epoxy resin has a problem that the dielectric loss of the resin composition increases and the waveform becomes dull, particularly in a high frequency region. There is a need for a sealing resin composition having a low dielectric constant.

  As a technique for solving the above problem, for example, a technique is disclosed in which a hollow inorganic filler is blended in a sealing resin composition containing an epoxy resin to lower the dielectric constant of the resin composition ( For example, see Patent Document 1). However, this technique has a small specific gravity of the filler, and since the filler has a certain size or more in order to make it hollow, it is difficult to apply to a liquid sealing resin composition, Moreover, when this filler is mix | blended with the liquid sealing resin composition, there exists a problem that a filler will isolate | separate in the step of hardening by heating.

  Therefore, in order to reduce the dielectric constant, a resin composition in which a phenol resin is combined with a cyanate ester resin having a low dielectric constant has been proposed (for example, see Patent Document 2). However, since cyanate ester resins are poor in fluidity, sealing resin compositions based on these combinations are inferior in workability, and usually require a solvent to obtain appropriate fluidity.

Moreover, in order to ensure the fluidity | liquidity of a resin composition, the resin composition for sealing containing an oxetane compound is proposed (for example, refer patent document 3). However, a resin composition using only an oxetane compound as a resin-forming component as described therein has a problem that the mechanical strength is weak when cured. Further, the combined use of an oxetane compound and a curing agent having a large polarity has a problem that dielectric loss is large.
JP-A-5-9270 JP 2001-89654 A JP-A-11-17074

  An object of the present invention is to provide a liquid sealing resin composition having a low dielectric constant and suitable for flip chip sealing, and particularly a liquid sealing resin composition having a low dielectric loss even in a high frequency region of 1 GHz or higher. Is to provide things. Furthermore, the objective of this invention is related with the semiconductor device which can respond to size reduction, high density, and high speed | velocity sealed by this resin composition.

  As a result of intensive studies in order to solve the above problems, the present inventors have selected a dihydrobenzoxazine ring-containing compound from the group consisting of a cyanate ester resin, an oxetane ring-containing compound, a divinylbenzene compound, and a vinyl ether compound. It has been found that a liquid encapsulating resin composition having a low dielectric constant can be obtained by blending one or more compounds, and the present invention has been completed. In addition, in this specification, liquid means that it has fluidity | liquidity at 25-40 degreeC.

  The present invention includes (A) one or more compounds selected from the group consisting of (A) a dihydrobenzoxazine ring-containing compound, (B) a cyanate ester resin, an oxetane ring-containing compound, a divinylbenzene compound, and a vinyl ether compound, and (C) cationic curing. The present invention relates to a sealing resin composition containing a catalyst, and further relates to a sealing resin composition containing (D) silica in addition to the sealing resin composition. Moreover, this invention is a semiconductor device sealed using these resin compositions for sealing.

  The sealing resin composition of the present invention has a low dielectric constant, a low dielectric loss even in a high frequency region, and is suitable for flip chip sealing. Taking advantage of such advantages, a semiconductor such as IC, LSI, VLSI, etc. It can be widely applied to sealing devices including

  In the following, the present invention is described in more detail, but these do not limit the present invention in any way.

  The sealing resin composition of the present invention comprises (A) a dihydrobenzoxazine ring-containing compound. The dihydrobenzoxazine ring-containing compound is not particularly limited as long as it is a compound containing a dihydrobenzoxazine ring, but is preferably a compound containing 1 to 3 dihydrobenzoxazine rings, preferably a compound containing 1 or 2 It is.

  (A) As the dihydrobenzoxazine ring-containing compound, the formula (1):

(Wherein R ₁ is an alkyl group or an aryl group) and formula (2):

(Wherein R ₂ may be the same or different and each represents an alkyl group or an aryl group;
R ₃ is an alkylene group which may be substituted with an oxo group, and a dihydrobenzoxazine ring-containing compound.

When R ₁ is an alkyl group, it is preferably a linear or branched alkyl group having 1 to 6 carbon atoms, and more preferably a linear or branched alkyl group having 1 to 4 carbon atoms. When R ₁ is an aryl group, it is preferably a phenyl group which is unsubstituted or substituted by a linear or branched alkyl group having 1 to 6 carbon atoms, and more preferably is an unsubstituted group. Or it is the phenyl group substituted by the C1-C4 linear or branched alkyl group, Especially preferably, it is a phenyl group.

When R ₂ is an alkyl group, it is preferably a linear or branched alkyl group having 1 to 6 carbon atoms, more preferably a linear or branched alkyl group having 1 to 4 carbon atoms, such as methyl. is there. When R ₂ is an aryl group, it is preferably unsubstituted or a phenyl group substituted with a linear or branched alkyl group having 1 to 6 carbon atoms, more preferably unsubstituted, Or it is the phenyl group substituted by the C1-C4 linear or branched alkyl group, Especially preferably, it is a phenyl group. R ₂ is preferably the same.

R ₃ is preferably a linear or branched alkylene group having 1 to 3 carbon atoms, and examples thereof include —CH ₂ — and —C (CH ₃ ) ₂ —. R ₃ may be substituted with an oxo group, and examples thereof include —C (O) —.

  As the component (A), specifically, 6,6 ′-(1-methylethylidene) bis (3,4-dihydro-3-phenyl-2H-1,3-benzoxazine), 6,6′- (Methylidene) bis (3,4-dihydro-3-phenyl-2H-1,3-benzoxazine), 3,4-dihydro-3-phenyl-2H-1,3-benzoxazine. These can be used alone or in combination of two or more.

  The present invention contains (B) one or more compounds selected from the group consisting of a cyanate ester resin, an oxetane ring-containing compound, a divinylbenzene compound, and a vinyl ether compound.

Although cyanate ester resin is not specifically limited, For example, Formula (3):
N≡C—O—R ₅ —R ₄ —R ₆ —O—C≡N (3)
(In the formula, R ₄ is an unsubstituted or fluorine-substituted divalent hydrocarbon group,
R ₅ and R ₆ are each independently an unsubstituted or 1 to 4 methyl group, preferably a unsubstituted or substituted phenylene group having 2 to 4 methyl groups) Can be mentioned. A prepolymer in which a part of the cyanate group of the compound of the formula (3) forms a triazine ring can also be used as the cyanate ester resin. Examples of the prepolymer include those in which all or part of the compound of the formula (3) is trimerized.

More preferred is
Formula (5):

(Where
R ₇ is a group:

(here,
R ₁₂ and R ₁₃ are each independently a hydrogen atom, an unsubstituted or fluorine-substituted methyl group) or a group:

And
R ₈ , R ₉ , R ₁₀ and R ₁₁ are each independently a compound represented by hydrogen or a methyl group and a prepolymer thereof, in particular, 1,1-bis (4-cyanatophenyl) ) Ethane and 2,2-bis (4-cyanatophenyl) propane are preferred.

  Further, as the cyanate ester resin, the formula (4):

And a prepolymer in which a part of the cyanate group of the compound represented by formula (4) forms a triazine ring can also be used.

These cyanate ester resins can be used alone or in combination of two or more. From the viewpoint of ensuring fluidity, the cyanate ester resin is preferably used in combination with one or more of an oxetane ring-containing compound, a divinylbenzene compound, and a vinyl ether compound. This is because these are excellent in fluidity, and therefore, when blended with a dihydrobenzoxazine ring-containing compound, the liquid part and the solid part can be easily separated into a liquid resin composition. However, the cyanate ester resin (for example, 1,1-bis (4-cyanatophenyl) ethane) in which R ₇ is —CH (CH ₃ ) — in the formula (5) is excellent in fluidity, and can be used alone. It can be preferably used.

  The oxetane ring-containing compound is not particularly limited, but is a monooxetane compound such as 3-ethyl-3-hydroxymethyloxetane, 3-ethyl-3-hexyloxymethyloxetane, 3-ethyl-3-allyloxymethyloxetane, 3 -Ethyl-3-benzyloxymethyloxetane, 3-ethyl-3-methacryloxymethyloxetane, 3-ethyl-3-carboxyoxetane, 3-ethyl-3-phenoxymethyloxetane; dioxetane compounds such as bis (3-ethyl -3-oxetanylmethyl) ether, 1,4-bis [(3-ethyl-3-oxetanylmethoxy) methylbenzene], carbonate bis {[ethyl (3-oxetanyl)] methyl}, bis (adipate {[ethyl (3 -Oxetanyl)] ethyl}, biterephthalate {[Ethyl (3-oxetanyl)] methyl}, 1,4-cyclohexanecarboxylic acid bis {[ethyl (3-oxetanyl)] methyl}, bis {4- [ethyl (3-oxetanyl) methoxycarbonylamino] phenyl} methane , Α, ω-bis- {3- [1-ethyl (3-oxetanyl) methoxy] propyl (polydimethylsiloxane); and polyoxetane compounds such as oligo (glycidyloxetane-co-phenylglycidyl ether). These are all liquid compounds excellent in hygiene and safety, but in particular, 1,4-bis [ethyl (3-oxetanyl) because of low viscosity, easy handling and high reactivity. Methoxymethyl] benzene, xylylene bisoxetane and bis {[ethyl (3-oxetanyl)] methyl} ether are preferred. These can be used alone or in combination of two or more.

  The divinylbenzene compound is divinylbenzene having an unsubstituted or substituted group. Divinylbenzene may be 1,2-, 1,3- or 1,4-divinylbenzene, but 1,4-divinylbenzene is preferred. Examples of the divinylbenzene having a substituent include those in which the benzene ring of divinylbenzene is substituted with 1 to 4 fluorine atoms and / or alkyl groups. Examples of the alkyl group include linear or branched alkyl groups having 1 to 10 carbon atoms, preferably 1 to 3 carbon atoms. From the viewpoint of ease of polymerization, a methyl group is preferred. A specific example is 1,4-divinyl-2-methylbenzene. These can be used alone or in combination of two or more.

  The vinyl ether compound refers to a compound containing a vinyl ether group, preferably a compound containing two or more vinyl ether groups, and more preferably a divinyl ether compound containing two vinyl ether groups. Specifically, equation (6):

_{CH 2 = CH-O-R} 15 -R 14 -R 16 -O-CH = CH 2 (6)
(Where
R ₁₄ is a divalent aromatic group or alicyclic group,
R ₁₅ and R ₁₆ are each independently an alkylene group having 1 to 4 carbon atoms)
The divinyl ether compound shown by these is mentioned.

In the formula (6), R ₁₄ is preferably a phenylene group or a cyclohexylene group which is unsubstituted or substituted with 1 to 4 alkyl groups having 1 to 4 carbon atoms. The phenylene group may be 1,4-, 1,3-, 1,2-, and the cyclohexylene group may be 1,4-, 1,3-, 1,2-, 1,4-phenylene group or 1,4-cyclohexylene group is preferable.

In the formula (6), R ₁₅ and R ₁₆ are preferably methylene groups.

  Specific examples of the divinyl ether compound include 1,4-cyclohexanedimethanol divinyl ether:

Is mentioned. The vinyl ether compounds can be used alone or in combination of two or more. In addition, when using the monovinyl ether compound which contains only one vinyl ether group, it is preferable to use so that a monovinyl ether compound may be within 10 weight% of a vinyl ether compound.

  The resin composition for sealing of the present invention comprises (B) a cyanate ester resin, an oxetane ring-containing compound, a divinylbenzene compound, and a vinyl ether compound with respect to 100 parts by weight of the (A) dihydrobenzoxazine ring-containing compound. It is preferable that the selected compound is contained in a proportion of 20 to 200 parts by weight. When the blending ratio is within this range, a preferable fluid resin composition is obtained, and a cured product having a preferable mechanical strength is obtained by heating or the like. (B) The more preferable compounding quantity of a component is 30-180 weight part, Most preferably, it is 40-150 weight part. However, when silica is used, it is preferably 80 parts by weight or more.

  The encapsulating resin composition of the present invention includes (C) a cationic curing catalyst, but is not particularly limited as long as it functions as a catalyst for cationic polymerization and forms a network structure of the resin composition. For example, Lewis acid salt, onium salt, fatty acid metal and the like can be mentioned. In particular, it can be used by being blended in the composition as a latent catalyst, and the resin composition can be cured in a short time by heating. An onium salt is preferred.

  The onium salt is, for example, the formula (7):

And / or formula (8):

(Where
R ₁₇ is an unsubstituted or substituted monovalent hydrocarbon group, each of which may be the same or different,
E ¹ is an iodine atom, a sulfur atom, a nitrogen atom, a phosphorus atom, a diazo group or an unsubstituted or ring-substituted pyridinio group;
E ² is a sulfur atom or a nitrogen atom,
Z is a counter ion that is BF ₄ , PF ₄ , AsF ₆ , SbF ₆ or (C ₆ F ₅ ) ₄ B;
a is 2 when E ¹ is an iodine atom, 3 when a sulfur atom, 4 when a nitrogen atom or a phosphorus atom, 1 when a diazo group or an unsubstituted or ring-substituted pyridinio group,
b is 1 when E ² is a sulfur atom, 2 when it is a nitrogen atom, and c is an integer of 4 or 5, and the iodonium salt, sulfonium salt, ammonium salt, phosphonium salt, diazonium salt or pyridinium salt Is mentioned. These can be used alone or in combination of two or more.

In the formulas (7) and (8), R ₁₇ is specifically an alkyl group having 1 to 15 carbon atoms such as methyl or ethyl; a cycloalkyl group having 3 to 10 carbon atoms such as cyclohexyl; phenyl, Aryl groups such as 4-tolyl, 2,4-xylyl and 1-naphthyl; aralkyl groups such as benzyl, 2- or 4-methylbenzyl and 2-phenylethyl; alkenyl groups having 2 to 10 carbon atoms such as vinyl and allyl And 4-hydroxyphenyl, 4-methoxyphenyl, 4-cyanophenyl, 4-chlorophenyl, 4-acetoxyphenyl, 4-propanoylphenyl, 4-methoxycarbonylphenyl, 4-ethoxycarbonylphenyl, 4-methoxybenzyl, 4; -Ethoxybenzyl, 4-t-butoxybenzyl, 4-nitrobenzyl, 4-cyanobenzyl, etc. Serial-substituted monovalent hydrocarbon group derived from a hydrocarbon group and the like. Among them, because they exhibit excellent curability, it is preferable that at least one R ₁₇ in a molecule is an aryl group or an aralkyl group, and more preferably all of R ₁₇ is such a group.

E ¹ or E ² is preferably an iodine atom or a sulfur atom because an excellent curing rate can be obtained.

Specific examples of the unsubstituted or ring-substituted pyridinio group for E ¹ include pyridinio, 2- or 4-methylpyridinio, 2,4-dimethylpyridinio, 2- or 4-cyanopyridinio, 2- or 4-methoxy. Examples include ring-substituted pyridinium groups such as carbonylpyridinio, 2- or 4-ethoxycarbonylpyridinio.

Z shows excellent curability when heated for a short time, so SbF ₆ or B (C ₆ F ₅ ) ₄ is preferable, does not show toxicity, and does not need to consider the effects on hygiene and the environment Therefore, B (C ₆ F ₅ ) ₄ is particularly preferable.

  Examples of such preferable onium salts include diaryliodonium such as diphenyliodonium; substituted aryl group-containing iodonium such as phenyl (4-methoxyphenyl) iodonium; aralkyl group-containing iodonium such as phenylbenzyliodonium; triphenylsulfonium, diphenyl (4- triarylsulfonium such as t-butylphenyl) sulfonium; substituted aryl group-containing sulfonium such as tris (4-hydroxyphenyl) sulfonium, tris (4-methoxyphenyl) sulfonium, tris (acetoxyphenyl) sulfonium; methyl (4-hydroxyphenyl) ) Hexafluoro such as benzyl structure-containing sulfonium such as benzylsulfonium and methyl (4-methoxyphenyl) -1-naphthylmethylsulfonium Oro antimonate and tetrakis (pentafluorophenyl) boron salts. Tetrakis (pentafluorophenyl) boron salt is preferable from the viewpoint of hygiene and environmental conservation, and an appropriate curing rate can be obtained. Particularly, 4-methylphenyl [4- (1-methylethyl) phenyl] iodonium tetrakis (pentafluorophenyl) Particularly preferred are diaryliodonium tetrakis (pentafluorophenyl) boron salts such as boron salts.

  Fatty acid metals can also be preferably used as the (C) cation curing catalyst. Specific examples include metal octoate and metal naphthenate. Specific examples include ferric octoate, cobalt octoate, tin octoate, calcium octoate, zinc octoate, copper octoate, and octane. Examples thereof include zirconium acid, magnesium octoate, and naphthenate salts corresponding thereto.

  (C) The cationic curing catalyst is preferably contained in an amount of 0.1 to 8 parts by weight, more preferably 0.5 to 6 parts by weight, based on a total of 100 parts by weight of the component (A) and the component (B). is there. When the blending ratio is within this range, the reactivity and curability are appropriate.

  The sealing resin composition of the present invention preferably contains (D) silica as a filler in order to adjust the linear expansion coefficient of the resin composition and bring it close to the linear expansion coefficient of the substrate. As the silica, any silica used in the art such as fused silica, crystalline silica, pulverized silica and the like can be used, but fused silica is preferable from the viewpoint of lowering the dielectric constant. Silica is preferably contained at 30 to 70% by weight, more preferably 40 to 60% by weight, based on the total weight of the encapsulating resin composition of the present invention. You may make the resin composition for sealing of this invention contain fillers other than silica, such as an alumina and a silicon nitride.

  The sealing resin composition of the present invention contains an epoxy resin such as a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a novolac epoxy resin, an alicyclic epoxy resin or the like within a range not impairing the object of the present invention. You may let them.

  The sealing resin composition of the present invention may contain a colorant such as carbon black, an inorganic fiber, a flame retardant, an ion trap agent, an internal mold release agent, and a sensitizer as necessary. In order to improve the adhesion to the substrate, a silane coupling agent such as vinyltriethoxysilane, 3-methacryloxypropyltrimethoxysilane, or 3-glycidoxypropyltrimethoxysilane may be included.

  The method for producing the sealing resin composition of the present invention is not particularly limited. For example, the raw materials are mixed into a mixing machine such as a likai machine, a pot mill, a three-roll mill, a rotary mixer, a twin-screw mixer, etc. with a predetermined composition. It can be charged and mixed to produce.

  The sealing resin composition of the present invention can be used as a semiconductor sealing material. For example, in a flip chip method, the sealing resin composition of the present invention can be injected from the side into a gap between the connected semiconductor chip and the substrate and cured. Also, using a dispenser or the like on the substrate, the resin composition for sealing of the present invention is applied in accordance with the size of the semiconductor chip, heated and soldered using a Philip chip bonder or the like, and then cured. You can also.

  The present invention can be widely applied to the sealing of semiconductors such as IC, LSI, VLSI and devices including them.

  Hereinafter, the present invention will be described in more detail by way of examples. The present invention is not limited by these examples. In the examples, the unit of the blending amount is parts by weight unless otherwise specified.

Examples and Comparative Examples The ingredients shown in Table 1 were kneaded with a roll mill to prepare a sealing resin composition. The measurement results for each example are shown in Table 1.

〔viscosity〕
The viscosity at 25 ° C. was measured at 10 rpm using a Brookfield rotational viscometer (Brookfield HBT viscometer).
[Dielectric constant, dielectric loss]
On the board | substrate, the resin composition for sealing of Examples 1-3 and Comparative Examples 1-2 was apply | coated by each, and was hardened at 120 degreeC for 1 hour and then 150 degreeC for 2 hours. Thereafter, the substrate was peeled off to obtain a cured film, which was used as a dielectric property measurement sample. This sample was measured by the perturbation method under conditions of 5 GHz and room temperature.

[Solder reflow, heat cycle, moisture resistance]
Using a flip chip bonder on a substrate (BT substrate, 0.8 mm thickness), 10 semiconductors (7 mm each eutectic solder bump, area array 225 bump, but 10 mm each eutectic solder bump, area array 625 bump only in Comparative Example 1) Each was mounted, washed with pure water, and dried at 150 ° C. for 1 hour. Next, about the resin composition for sealing of Examples 1-3 and Comparative Examples 1-2, it inject | poured into the clearance gap between a board | substrate and a semiconductor, respectively at 80 degreeC using the dispenser. Then, it heat-hardened at 150 degreeC for 1 hour. Next, the substrate on which the semiconductor was mounted was left for 192 hours under the conditions of 60% humidity and 30 ° C. Then, it passed through 230 degreeC solder reflow furnace 3 times, and it sealed, and obtained the semiconductor device.
Evaluation of solder reflow: About the obtained sealing body, delamination was observed with an ultrasonic flaw detector (SAT), and the presence or absence of delamination was observed. Table 1 shows the number of delamination.
Evaluation of heat cycle: About the obtained sealing body, -45 degreeC 30 minutes and 125 degreeC 30 minutes were implemented as 1 cycle, and 500 cycles were implemented. Table 1 shows the number of cracks.
Humidity resistance test: About the obtained sealing body, 3V was applied for 500 hours on 85 degreeC and the conditions of 85% of relative humidity (RH), and the disconnection time was measured. Table 1 shows the number of abnormalities.

  As shown in Table 1, all of Examples 1 to 3 had a dielectric constant as low as 4 or less and a dielectric loss as small as 0.009 in a high frequency region of 5 GHz. Moreover, it was confirmed from the viscosity that all were liquid. Moreover, it was confirmed that the semiconductor device sealed with the sealing resin composition of Examples 1 to 3 has no problem in terms of solder reflow, heat cycle, and moisture resistance. On the other hand, Comparative Example 1 corresponding to a sealing resin composition combining a conventional epoxy resin and a curing agent such as an acid anhydride had a high dielectric constant of 4.2 and a dielectric loss of 0.05. . Further, the sealed semiconductor device has a problem in terms of solder reflow. Moreover, the comparative example 2 in which the dihydrobenzoxazine ring-containing compound is not blended has a high dielectric loss and is inferior in moisture resistance.

  According to the present invention, a liquid sealing resin composition having a low dielectric constant, low dielectric loss even in a high frequency region, and suitable for flip chip sealing can be obtained. The sealing resin composition of the present invention can be widely applied to sealing of devices including semiconductors such as IC, LSI, VLSI and the like by taking advantage of such advantages.

Claims (13)

(A) a dihydrobenzoxazine ring-containing compound,
A sealing resin composition comprising (B) one or more compounds selected from the group consisting of a cyanate ester resin, an oxetane ring-containing compound, a divinylbenzene compound and a vinyl ether compound, and (C) a cation curing catalyst. The component (B) is 20 to 200 parts by weight relative to 100 parts by weight of the component (A), and the component (C) is based on 100 parts by weight of the total of the components (A) and (B). 0.1 to 8 parts by weight,
The resin composition for sealing according to claim 1.   (D) The resin composition for sealing according to claim 1 or 2, further comprising silica.   The resin composition for sealing of Claim 3 whose (D) component is 30 to 70 weight% based on the total weight of the resin composition for sealing. The component (A) is represented by the formula (1):

(Wherein R ₁ is an alkyl group or an aryl group) and formula (2):

(Wherein R ₂ may be the same or different and each represents an alkyl group or an aryl group;
R ₃ is at least one dihydrobenzoxazine ring-containing compound represented by the following formula: R ₃ is an alkylene group optionally substituted with an oxo group.
The sealing resin composition according to claim 4. (B) component is Formula (3):
N≡C—O—R ₅ —R ₄ —R ₆ —O—C≡N (3)
(Wherein R ₄ is an unsubstituted or fluorine-substituted divalent hydrocarbon group, and R ₅ and R ₆ are each independently unsubstituted or substituted with 1 to 4 methyl groups. A compound represented by formula (4):

The resin composition for sealing of any one of Claims 1-5 which is 1 or more types of the cyanate ester resin chosen from the group which consists of the compound shown by these, and those prepolymers. (B) component is Formula (5):

Wherein R ₇ is a group:

(Wherein R ₁₂ and R ₁₃ are each independently a hydrogen atom, an unsubstituted or fluorine-substituted methyl group) or a group:

And R ₈ , R ₉ , R ₁₀ and R ₁₁ are each independently hydrogen or a methyl group) and one or more cyanate ester resins selected from the group consisting of prepolymers thereof The resin composition for sealing according to any one of claims 1 to 6, wherein   (B) The resin composition for sealing of any one of Claims 1-7 in which a component contains a dioxetane compound.   The resin composition for sealing according to any one of claims 1 to 8, wherein the component (B) comprises 1,2-, 1,3-, or 1,4-divinylbenzene. (B) component is Formula (6):
_{CH 2 = CH-O-R} 15 -R 14 -R 16 -O-CH = CH 2 (6)
(Wherein R ₁₄ is a divalent aromatic group or alicyclic group,
R ₁₅ and R ₁₆ are each independently an alkylene group having 1 to 4 carbon atoms)
The resin composition for sealing of any one of Claims 1-9 containing the divinyl ether compound shown by these. The component (C) is a cationic curing catalyst represented by the formula (7):

And / or formula (8):

(Where
R ₁₇ is an unsubstituted or substituted monovalent hydrocarbon group, each of which may be the same or different;
E ¹ is an iodine atom, a sulfur atom, a nitrogen atom, a phosphorus atom, a diazo group or an unsubstituted or ring-substituted pyridinio group;
E ² is a sulfur atom or a nitrogen atom,
Z is a counter ion that is BF ₄ , PF ₄ , AsF ₆ , SbF ₆ or (C ₆ F ₅ ) ₄ B;
a is 2 when E ¹ is an iodine atom, 3 when a sulfur atom, 4 when a nitrogen atom or a phosphorus atom, 1 when a diazo group or an unsubstituted or ring-substituted pyridinio group,
b is 1 when E ² is a sulfur atom, and 2 when it is a nitrogen atom,
The sealing resin composition according to claim 1, wherein c is an onium salt represented by 4 or 5.   The component (C) is a fatty acid metal, the fatty acid is octanoic acid or naphthenic acid, and the metal species is one selected from the group consisting of iron, cobalt, tin, calcium, zinc, copper, zirconium, and magnesium. The resin composition for sealing according to any one of claims 1 to 11.   The semiconductor device sealed using the resin composition for sealing of any one of Claims 1-12.