JP2006054302A5 - - Google Patents

Download PDF

Info

Publication number
JP2006054302A5
JP2006054302A5 JP2004234544A JP2004234544A JP2006054302A5 JP 2006054302 A5 JP2006054302 A5 JP 2006054302A5 JP 2004234544 A JP2004234544 A JP 2004234544A JP 2004234544 A JP2004234544 A JP 2004234544A JP 2006054302 A5 JP2006054302 A5 JP 2006054302A5
Authority
JP
Japan
Prior art keywords
substrate
component
inverted
backup pin
unevenness data
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004234544A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006054302A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004234544A priority Critical patent/JP2006054302A/ja
Priority claimed from JP2004234544A external-priority patent/JP2006054302A/ja
Publication of JP2006054302A publication Critical patent/JP2006054302A/ja
Publication of JP2006054302A5 publication Critical patent/JP2006054302A5/ja
Pending legal-status Critical Current

Links

JP2004234544A 2004-08-11 2004-08-11 部品実装装置 Pending JP2006054302A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004234544A JP2006054302A (ja) 2004-08-11 2004-08-11 部品実装装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004234544A JP2006054302A (ja) 2004-08-11 2004-08-11 部品実装装置

Publications (2)

Publication Number Publication Date
JP2006054302A JP2006054302A (ja) 2006-02-23
JP2006054302A5 true JP2006054302A5 (enExample) 2007-09-06

Family

ID=36031585

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004234544A Pending JP2006054302A (ja) 2004-08-11 2004-08-11 部品実装装置

Country Status (1)

Country Link
JP (1) JP2006054302A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4887205B2 (ja) * 2007-04-26 2012-02-29 株式会社日立ハイテクインスツルメンツ 電子部品装着方法及び電子部品装着装置
SE542377C2 (en) * 2012-06-28 2020-04-21 Universal Instruments Corp Pick and place machine, and method of assembly
JP6706732B2 (ja) * 2016-03-15 2020-06-10 パナソニックＩｐマネジメント株式会社 下受けピン配置支援システムおよび下受けピン配置支援方法ならびに下受けピン配置支援管理装置
CN108337873B (zh) * 2018-05-08 2024-03-19 苏州瑞周电子科技有限公司 一种相机真空吸机构
JP7022824B2 (ja) * 2018-06-05 2022-02-18 株式会社Fuji バックアップ部材設定装置
JP7612307B2 (ja) * 2021-07-21 2025-01-14 ヤマハ発動機株式会社 基板作業装置および基板作業方法

Similar Documents

Publication Publication Date Title
JP2008218706A5 (enExample)
US20110228082A1 (en) Measuring system for a 3D Object
JP2006053147A5 (enExample)
CN102200431B (zh) 测量立体物件的系统
JP2005228102A5 (enExample)
TW200621512A (en) Liquid drop ejector, method for manufacturing electrooptical device, electrooptical device and electronic apparatus
JP2010121969A5 (enExample)
WO2014201719A1 (zh) 一种检测装置及检测方法
US10147174B2 (en) Substrate inspection device and method thereof
TW200639492A (en) Visual inspection apparatus and method of inspecting display panel using the visual inspection apparatus
TWI253887B (en) Method for optically inspecting appearance, and apparatus for optically inspecting appearance
JP2004102009A5 (enExample)
JP2006054302A5 (enExample)
JP2004226129A (ja) 外観検査装置
KR101977305B1 (ko) 셀 얼라인을 통한 디스플레이 패널의 열화상 검사장치
JP2009076633A (ja) 基板処理装置、表面実装機、印刷機、検査機、及び塗布機
KR20050028847A (ko) 결함검출기 및 결함검출방법
JP2000013097A5 (enExample)
JP2012137323A (ja) 計測装置
JP3162472U (ja) 自動光学検査システム
JP2000077502A (ja) 電子部品検査装置及び電子部品検査方法
CN101995680A (zh) Lcd检测设备的校准台
KR20030018265A (ko) 액정디스플레이 패널 검사장치
TWM328164U (en) Automated optical inspection system for printed circuited boards
JP2006240124A (ja) スクリーン印刷機の版枠位置決め方法及びスクリーン印刷機