JP2006053451A5 - - Google Patents

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Publication number
JP2006053451A5
JP2006053451A5 JP2004236368A JP2004236368A JP2006053451A5 JP 2006053451 A5 JP2006053451 A5 JP 2006053451A5 JP 2004236368 A JP2004236368 A JP 2004236368A JP 2004236368 A JP2004236368 A JP 2004236368A JP 2006053451 A5 JP2006053451 A5 JP 2006053451A5
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JP
Japan
Prior art keywords
surface energy
conductive layer
high surface
layer
wettability changing
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JP2004236368A
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English (en)
Japanese (ja)
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JP4707345B2 (ja
JP2006053451A (ja
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Priority to JP2004236368A priority Critical patent/JP4707345B2/ja
Priority claimed from JP2004236368A external-priority patent/JP4707345B2/ja
Publication of JP2006053451A publication Critical patent/JP2006053451A/ja
Publication of JP2006053451A5 publication Critical patent/JP2006053451A5/ja
Application granted granted Critical
Publication of JP4707345B2 publication Critical patent/JP4707345B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2004236368A 2004-08-16 2004-08-16 配線の修正方法 Expired - Fee Related JP4707345B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004236368A JP4707345B2 (ja) 2004-08-16 2004-08-16 配線の修正方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004236368A JP4707345B2 (ja) 2004-08-16 2004-08-16 配線の修正方法

Publications (3)

Publication Number Publication Date
JP2006053451A JP2006053451A (ja) 2006-02-23
JP2006053451A5 true JP2006053451A5 (zh) 2007-10-04
JP4707345B2 JP4707345B2 (ja) 2011-06-22

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ID=36030953

Family Applications (1)

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JP2004236368A Expired - Fee Related JP4707345B2 (ja) 2004-08-16 2004-08-16 配線の修正方法

Country Status (1)

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JP (1) JP4707345B2 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5207163B2 (ja) * 2007-03-30 2013-06-12 Ｎｌｔテクノロジー株式会社 埋込配線の形成方法、表示装置用基板及び当該基板を有する表示装置
JP5293267B2 (ja) 2009-02-26 2013-09-18 株式会社リコー 表示装置
JP2016058460A (ja) * 2014-09-07 2016-04-21 ＡｇＩＣ株式会社 導電パターン消去方法および消去具

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2796575B2 (ja) * 1989-03-31 1998-09-10 株式会社リコー 記録方法
JP3978754B2 (ja) * 1997-12-29 2007-09-19 チッソ株式会社 ポリアミド酸組成物、液晶配向膜、及び液晶表示素子
JP3978755B2 (ja) * 1997-12-29 2007-09-19 チッソ株式会社 ポリアミド酸組成物、液晶配向膜、および液晶表示素子
JP4029452B2 (ja) * 1997-12-29 2008-01-09 チッソ株式会社 ポリアミド酸組成物、液晶配向膜及び液晶表示素子
JP2002162630A (ja) * 2000-11-29 2002-06-07 Chisso Corp ジアミン化合物およびこれを用いた高分子材料、該高分子材料を用いた液晶配向膜、および該配向膜を具備した液晶表示素子
JP2003059940A (ja) * 2001-08-08 2003-02-28 Fuji Photo Film Co Ltd ミクロファブリケーション用基板、その製造方法および像状薄膜形成方法
JP4894120B2 (ja) * 2001-09-27 2012-03-14 Ｊｎｃ株式会社 フェニレンジアミン誘導体、液晶配向膜および液晶表示素子
JP4140252B2 (ja) * 2002-03-13 2008-08-27 チッソ株式会社 シロキサン部位を有するフェニレンジアミン、これを用いたポリマーを含む液晶配向材および該液晶配向材を含む液晶表示素子

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